IXFH36N55Q2 [IXYS]

HiPerFET Power MOSFETs; HiPerFET功率MOSFET
IXFH36N55Q2
型号: IXFH36N55Q2
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

HiPerFET Power MOSFETs
HiPerFET功率MOSFET

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HiPerFETTM  
Power MOSFETs  
IXFH36N55Q2 VDSS  
= 550 V  
ID25  
=
36 A  
RDS(on) = 0.18 Ω  
N-Channel Enhancement Mode  
Avalanche Rated, Low Qg  
Low Rg, High dv/dt, Low trr  
trr 250 ns  
Preliminary Data Sheet  
TO-247 AD (IXFH)  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
T
= 25°C to 150°C  
550  
550  
V
V
TJJ = 25°C to 150°C; RGS = 1 MΩ  
(TAB)  
VGS  
VGSM  
Continuous  
Transient  
30  
40  
V
V
ID25  
IDM  
IAR  
T
= 25°C  
36  
144  
36  
A
A
A
TC = 25°C, pulse width limited by TJM  
G = Gate  
S = Source  
TCC = 25°C  
TAB = Drain  
Features  
EAR  
EAS  
T
= 25°C  
50  
2.5  
mJ  
J
TCC = 25°C  
z
Double metal process for low gate  
resistance  
International standard packages  
Epoxy meet UL 94 V-0, flammability  
classification  
Low RDS (on), low Qg  
Avalanche energy and current rated  
Fast intrinsic rectifier  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
,
20  
V/ns  
z
z
PD  
TC = 25°C  
560  
W
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
z
z
z
TL  
1.6 mm (0.063 in) from case for 10 s  
Mounting torque  
300  
°C  
Applications  
Md  
1.13/10 Nm/lb.in.  
0.9/6 Nm/lb.in.  
z
DC-DC converters  
Switched-mode and resonant-mode  
power supplies, >500kHz switching  
DC choppers  
Pulse generation  
Laser drivers  
z
Weight  
Symbol  
6
g
z
z
z
Advantages  
TestConditions  
Characteristic Values  
z
Easy to mount  
Space savings  
High power density  
(TJ = 25°C, unless otherwise specified)  
z
min. typ. max.  
z
VDSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 4 mA  
550  
2.5  
V
V
VGS(th)  
5.0  
IGSS  
IDSS  
VGS = 30 VDC, VDS = 0  
100 nA  
VDS = V  
T = 25°C  
25 µA  
VGS = 0DVSS  
TJJ = 125°C  
1
mA  
RDS(on)  
V
= 10 V, ID = 0.5 • I  
0.18  
PuGSlse test, t 300 µs,Dd25uty cycle d 2 %  
© 2004 IXYS All rights reserved  
DS99074A(04/04)  
IXFH36N55Q2  
TO-247 AD (IXFH) Outline  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
VDS = 10 V; ID = 0.5 • ID25, pulse test  
15  
26  
S
1
2
3
Terminals:  
1 - Gate  
Ciss  
Coss  
Crss  
4100  
660  
pF  
pF  
pF  
2 - Drain  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
3 - Source  
Tab - Drain  
160  
td(on)  
tr  
td(off)  
tf  
17  
13  
42  
8
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25  
Dim.  
Millimeter  
Inches  
RG = 2 (External),  
Min.  
Max.  
Min.  
Max.  
A
4.7  
2.2  
2.2  
5.3  
2.54  
2.6  
.185  
.087  
.059  
.209  
.102  
.098  
A
A12  
Qg(on)  
Qgs  
110  
23  
nC  
nC  
nC  
b
b12  
1.0  
1.65  
2.87  
1.4  
2.13  
3.12  
.040  
.065  
.113  
.055  
.084  
.123  
b
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25  
Qgd  
52  
C
D
E
.4  
20.80  
15.75  
.8  
21.46  
16.26  
.016  
.819  
.610  
.031  
.845  
.640  
RthJC  
RthCK  
0.22 K/W  
e
5.20  
19.81  
5.72  
20.32  
4.50  
0.205  
.780  
0.225  
.800  
.177  
L
L1  
0.25  
K/W  
P  
Q
3.55  
5.89  
3.65  
6.40  
.140  
0.232  
.144  
0.252  
R
S
4.32  
5.49  
.170  
.216  
6.15 BSC  
242 BSC  
Source-DrainDiode  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Symbol  
IS  
TestConditions  
min.  
typ. max.  
VGS = 0 V  
36  
A
A
ISM  
Repetitive; pulse width limited by TJM  
144  
1.5  
VSD  
IF = IS, VGS = 0 V,  
V
Pulse test, t 300 µs, duty cycle d 2 %  
trr  
250  
ns  
µC  
A
QRM  
IRM  
1
9
IF = 25A -di/dt = 100 A/µs, VR = 100 V  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered byoneormore  
ofthefollowingU.S.patents:  
4,850,072  
4,835,592  
4,931,844  
4,881,106  
5,034,796  
5,017,508  
5,063,307  
5,049,961  
5,237,481  
5,187,117  
5,381,025  
5,486,715  
6,404,065B1 6,162,665  
6,534,343  
6,583,505  
6,306,728B1 6,259,123B1 6,306,728B1 6,683,344  
IXFH36N55Q2  
Fig. 1. Output Characteristics  
Fig. 2. Extended Output Characteristics  
º
º
@ 25 C  
@ 25 C  
36  
33  
30  
27  
24  
21  
18  
15  
12  
9
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 10V  
V
GS  
= 10V  
8V  
GS  
8V  
7V  
7V  
6V  
6V  
5V  
4V  
6
5V  
3
0
0
0
0
1
2
3
4
5
6
7
16  
90  
0
3
6
9
12 15 18 21 24 27 30  
VD S - Volts  
VD S - Volts  
Fig. 3. Output Characteristics  
@ 125  
Fig. 4. RDS(on Normalized to 0.5 ID25  
Value vs. Junction Temperature  
)
º
C
36  
33  
30  
27  
24  
21  
18  
15  
12  
9
3.1  
2.8  
2.5  
2.2  
1.9  
1.6  
1.3  
1
V
= 10V  
8V  
7V  
GS  
V
= 10V  
GS  
6V  
I
= 36A  
D
5V  
4V  
I
= 18A  
D
6
0.7  
0.4  
3
0
2
4
6
8
10  
12  
14  
-50  
-25  
0
25  
50  
75  
100 125 150  
VD S - Volts  
TJ - Degrees Centigrade  
Fig. 5. RDS(on) Normalized to  
0.5 ID25 Value vs. ID  
Fig. 6. Drain Current vs. Case  
Temperature  
3.1  
2.8  
2.5  
2.2  
1.9  
1.6  
1.3  
1
40  
35  
30  
25  
20  
15  
10  
5
V
= 10V  
GS  
T = 125ºC  
J
T = 25ºC  
J
0.7  
0
10  
20  
30  
40  
50  
60  
70  
80  
-50  
-25  
0
25  
50  
75  
100 125 150  
I D - Amperes  
TC - Degrees Centigrade  
© 2004 IXYS All rights reserved  
IXFH36N55Q2  
Fig. 8. Transconductance  
Fig. 7. Input Admittance  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
T = -40ºC  
J
25ºC  
125ºC  
T = 125ºC  
J
25ºC  
-40ºC  
0
0
0
5
10 15 20 25 30 35 40 45 50 55  
3
0.4  
0
3.5  
4
4.5  
5
5.5  
6
6.5  
1.2  
40  
VG S - Volts  
I D - Amperes  
Fig. 9. Source Current vs.  
Source-To-Drain Voltage  
Fig. 10. Gate Charge  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
10  
9
8
7
6
5
4
3
2
1
0
V
= 275V  
DS  
I
I
= 18A  
D
G
= 10mA  
T = 125ºC  
J
T = 25ºC  
J
0.5  
0.6  
0.7  
0.8  
0.9  
1
1.1  
0
10 20 30 40 50 60 70 80 90 100 110  
VS D - Volts  
Q G - nanoCoulombs  
Fig. 12. Forward-Bias  
Safe Operating Area  
Fig. 11. Capacitance  
10000  
1000  
100  
1000  
100  
10  
f = 1MHz  
T = 150ºC  
J
T
C
= 25ºC  
R
Limit  
DS(on)  
C
C
iss  
25µs  
100µs  
1ms  
oss  
rss  
10ms  
C
DC  
1
5
10  
15  
20  
25  
30  
35  
10  
100  
1000  
VD S - Volts  
VD S - Volts  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXFH36N55Q2  
Fig. 13. Maximum Transient Thermal Resistance  
1.000  
0.100  
0.010  
0.001  
0.1  
1
10  
100  
1000  
10000  
Pulse Width - milliseconds  
© 2004 IXYS All rights reserved  

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