IS61LV12816-8TI [ISSI]

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY; 128K ×16高速CMOS静态RAM与3.3V电源
IS61LV12816-8TI
型号: IS61LV12816-8TI
厂家: INTEGRATED SILICON SOLUTION, INC    INTEGRATED SILICON SOLUTION, INC
描述:

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY
128K ×16高速CMOS静态RAM与3.3V电源

文件: 总11页 (文件大小:90K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
IS61LV12816  
128K x 16 HIGH-SPEED CMOS STATIC RAM  
WITH 3.3V SUPPLY  
ISSI  
NOVEMBER 2000  
FEATURES  
DESCRIPTION  
The ISSI IS61LV12816 is a high-speed, 2,097,152-bit static  
RAM organized as 131,072 words bꢂ 16 bits. It is fabricated  
ꢁsingISSI'shigh-performanceCMOStechnologꢂ. Thishighlꢂ  
reliable process coꢁpled with innovative circꢁit design  
techniqꢁes, ꢂields access times as fast as 8 ns with low power  
consꢁmption.  
• High-speed access time: 8, 10, 12, and 15 ns  
• CMOS low power operation  
• TTL and CMOS compatible interface levels  
• Single 3.3V 10ꢀ power sꢁpplꢂ  
• Fꢁllꢂ static operation: no clock or refresh  
reqꢁired  
When CE is HIGH (deselected), the device assꢁmes a  
standbꢂ mode at which the power dissipation can be redꢁced  
down with CMOS inpꢁt levels.  
• Three state oꢁtpꢁts  
• Data control for ꢁpper and lower bꢂtes  
• Indꢁstrial temperatꢁre available  
EasmemorexpansionisprovidedbsingChipEnableand  
Oꢁtpꢁt Enable inpꢁts, CE and OE. The active LOW Write  
Enable (WE) controls both writing and reading of the memorꢂ.  
A data bꢂte allows Upper Bꢂte (UB) and Lower Bꢂte (LB)  
access.  
The IS61LV12816 is packaged in the JEDEC standard 44-pin  
400-mil SOJ, 44-pin TSOP, 44-pin LQFP, and 48-pin mini  
BGA (6mm x 8mm).  
FUNCTIONAL BLOCK DIAGRAM  
128K x 16  
MEMORY ARRAY  
A0-A16  
DECODER  
VCC  
GND  
I/O0-I/O7  
Lower Byte  
I/O  
DATA  
COLUMN I/O  
CIRCUIT  
I/O8-I/O15  
Upper Byte  
CE  
OE  
WE  
CONTROL  
CIRCUIT  
UB  
LB  
ISSI reserves the right to make changes to its prodꢁcts at anꢂ time withoꢁt notice in order to improve design and sꢁpplꢂ the best possible prodꢁct. We assꢁme no responsibilitꢂ for anꢂ errors  
which maꢂ appear in this pꢁblication. © Copꢂright 2000, Integrated Silicon Solꢁtion, Inc.  
Integrated Silicon Solution, Inc. — 11--880000--337799--44777744  
1
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
PIN CONFIGURATIONS  
44-Pin SOJ (K)  
44-Pin TSOP (T)  
A4  
A3  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A5  
A4  
A3  
A2  
A1  
A0  
1
2
3
4
5
6
7
8
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A5  
A6  
A7  
OE  
UB  
LB  
2
A6  
A2  
3
A7  
A1  
4
OE  
A0  
5
UB  
CE  
CE  
6
LB  
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A16  
A15  
A14  
A13  
A12  
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
A8  
A9  
A10  
A11  
NC  
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A16  
A15  
A14  
A13  
A12  
7
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
8
9
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
A8  
A9  
A10  
A11  
NC  
48-Pin mini BGA (B)  
44-Pin LQFP (LQ)  
1
2
3
4
5
6
44 43 42 41 40 39 38 37 36 35 345  
1
2
3
4
5
6
7
8
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
CE  
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
A0  
A3  
A1  
A4  
A2  
LB  
I/O  
OE  
UB  
N/C  
A
B
C
D
E
F
CE  
I/O  
0
8
I/O  
I/O  
A5  
A6  
I/O  
1
I/O  
2
9
10  
TOP VIEW  
GND  
Vcc  
NC  
NC  
A14  
A12  
A7  
I/O  
I/O  
I/O  
I/O  
I/O  
Vcc  
11  
3
4
5
GND  
A16  
A15  
A13  
A10  
12  
I/O  
14  
I/O  
I/O  
6
13  
9
I/O  
15  
NC  
A8  
WE  
I/O  
7
10  
11  
G
H
I/O8  
NC  
NC  
A9  
A11  
NC  
12 13 14 15 16 17 18 19 20 21 22  
2
Integrated Silicon Solution, Inc. 1-800-379-4774  
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
OPERATING RANGE  
PIN DESCRIPTIONS  
Range  
Commercial  
Industrial  
Ambient Temperature  
VCC  
3.3V 10ꢀ  
3.3V 10ꢀ  
A0-A16  
I/O0-I/O15  
CE  
Address Inputs  
0°C to + 70°C  
40°C to + 85°C  
Data Inputs/Outputs  
Chip Enable Input  
Output Enable Input  
Write Enable Input  
Lower-byte Control (I/O0-I/O7)  
Upper-byte Control (I/O8-I/O15)  
No Connection  
OE  
WE  
LB  
UB  
NC  
Vcc  
Power  
GND  
Ground  
ABSOLUTE MAXIMUM RATINGS(1)  
Symbol  
VCC  
Parameter  
Value  
0.5 to 5.0  
0.5 to Vcc + 0.5  
65 to + 150  
Unit  
V
V
Power Supply Voltage Relative to GND  
Terminal Voltage with Respect to GND  
Storage Temperature  
VTERM  
TSTG  
°C  
TBIAS  
Temperature Under Bias:  
Com.  
Ind.  
10 to + 85  
45 to + 90  
°C  
°C  
PT  
Power Dissipation  
DC Output Current  
2.0  
20  
W
mA  
IOUT  
Note:  
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent  
damage to the device. This is a stress rating only and functional operation of the device at these or  
any other conditions above those indicated in the operational sections of this specification is not  
implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.  
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)  
Symbol Parameter  
Test Conditions  
Min.  
2.4  
Max.  
Unit  
V
VOH  
VOL  
VIH  
VIL  
Output HIGH Voltage  
VCC = Min., IOH = 4.0 mA  
VCC = Min., IOL = 8.0 mA  
Output LOW Voltage  
Input HIGH Voltage(1)  
Input LOW Voltage(1)  
Input Leakage  
0.4  
V
2
VCC + 0.3  
V
0.3  
1  
0.8  
1
V
ILI  
GND - VIN - VCC  
µA  
µA  
ILO  
Output Leakage  
GND - VOUT - VCC, Outputs Disabled  
1  
1
Note:  
1. VIL (min.) = 0.3V DC; VIL (min.) = 2.0V AC (pulse width - 2.0 ns).  
VIH (max.) = VCC + 0.3V DC; VIH (max.) = VCC + 2.0V AC (pulse width - 2.0 ns).  
Integrated Silicon Solution, Inc. 1-800-379-4774  
3
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
TRUTH TABLE  
Mode  
I/O PIN  
WE  
CE  
OE  
LB  
UB  
I/O0-I/O7  
I/O8-I/O15 Vcc Current  
Not Selected  
Output Disabled  
X
H
X
H
L
L
X
H
X
X
X
H
X
X
H
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
ISB1, ISB2  
ICC  
Read  
Write  
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
X
X
X
L
H
L
L
H
L
H
L
L
H
L
L
DOUT  
High-Z  
DOUT  
High-Z  
DOUT  
DOUT  
ICC  
ICC  
DIN  
High-Z  
DIN  
High-Z  
DIN  
DIN  
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)  
-8 ns  
Min. Max.  
-10 ns  
Min. Max.  
-12 ns  
Min. Max.  
-15 ns  
Min. Max.  
Symbol  
Parameter  
Test Conditions  
Unit  
ICC  
Vcc Operating  
Supply Current  
VCC = Max., CE = VIL  
IOUT = 0 mA, f = Max.  
Com.  
Ind.  
150  
160  
125  
135  
110  
120  
90  
100  
mA  
ISB1  
ISB2  
TTL Standby  
Current  
(TTL Inputs)  
VCC = Max.,  
VIN = VIH or VIL  
CE VIH, f = max  
Com.  
Ind.  
50  
60  
40  
50  
35  
45  
30  
40  
mA  
CMOS Standby  
Current  
(CMOS Inputs)  
VCC = Max.,  
Com.  
Ind.  
10  
20  
10  
20  
10  
20  
10  
20  
mA  
CE - VCC 0.2V,  
VIN > VCC 0.2V, or  
VIN - 0.2V, f = 0  
Note:  
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.  
4
Integrated Silicon Solution, Inc. 1-800-379-4774  
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
CAPACITANCE(1)  
Symbol  
Parameter  
Conditions  
VIN = 0V  
Max.  
Unit  
pF  
CIN  
Input Capacitance  
6
8
COUT  
Note:  
Input/Output Capacitance  
VOUT = 0V  
pF  
1. Tested initially and after any design or process changes that may affect these parameters.  
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)  
-8 ns  
Min.  
-10 ns  
Min.  
-12 ns  
Min.  
-15 ns  
Min.  
Symbol Parameter  
Max  
8
Max.  
10  
10  
4
Max.  
12  
12  
5
Max.  
15  
15  
6
Unit  
tRC  
Read Cycle Time  
8
3
10  
3
12  
3
15  
3
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tAA  
Address Access Time  
Output Hold Time  
tOHA  
tACE  
tDOE  
tHZOE  
3
CE Access Time  
8
0
0
0
OE Access Time  
0
(2)  
OE to High-Z Output  
OE to Low-Z Output  
CE to High-Z Output  
CE to Low-Z Output  
LB, UB Access Time  
LB, UB to High-Z Output  
LB, UB to Low-Z Output  
3
4
5
6
(2)  
(2)  
tLZOE  
3
4
5
0
8
tHZCE  
0
0
0
0
(2)  
tLZCE  
3
3
3
4
3
5
3
6
tBA  
0
0
0
0
(2)  
tHZB  
3
4
5
6
(2)  
tLZB  
0
0
0
0
Notes:  
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels  
of 0V to 3.0V and output loading specified in Figure 1.  
2. Tested with the load in Figure 2. Transition is measured 500 mV from steady-state voltage. Not 100ꢀ tested.  
AC TEST CONDITIONS  
Parameter  
Input Pulse Level  
Input Rise and Fall Times  
Unit  
0V to 3.0V  
3 ns  
Input and Output Timing  
and Reference Level  
1.5V  
Output Load  
See Figures 1 and 2  
AC TEST LOADS  
319  
319  
3.3V  
3.3V  
OUTPUT  
OUTPUT  
353 Ω  
353 Ω  
5 pF  
30 pF  
Including  
jig and  
scope  
Including  
jig and  
scope  
Figure 1.  
Figure 2.  
Integrated Silicon Solution, Inc. 1-800-379-4774  
5
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
AC WAVEFORMS  
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL, UB or LB = VIL)  
t
RC  
ADDRESS  
t
AA  
t
OHA  
t
OHA  
DATA VALID  
D
OUT  
PREVIOUS DATA VALID  
READ1.eps  
READ CYCLE NO. 2(1,3)  
t
RC  
ADDRESS  
OE  
t
AA  
t
OHA  
t
HZOE  
t
DOE  
t
t
LZOE  
ACE  
CE  
t
HZCE  
t
LZCE  
LB, UB  
t
BA  
t
HZB  
t
LZB  
HIGH-Z  
D
OUT  
DATA VALID  
UB_CEDR2.eps  
Notes:  
1. WE is HIGH for a Read Cycle.  
2. The device is continuously selected. OE, CE, UB, or LB = VIL.  
3. Address is valid prior to or coincident with CE LOW transition.  
6
Integrated Silicon Solution, Inc. 1-800-379-4774  
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)  
-8 ns  
Min.  
-10 ns  
-12 ns  
Min.  
-15 ns  
Min.  
Symbol Parameter  
Max  
Min.  
Max.  
Max.  
Max.  
Unit  
ns  
tWC  
tSCE  
tAW  
Write Cycle Time  
8
10  
8
12  
8
15  
10  
10  
CE to Write End  
6.5  
6.5  
ns  
Address Setup Time  
to Write End  
8
8
ns  
tHA  
Address Hold from Write End  
Address Setup Time  
0
0
3
0
0
4
0
0
5
0
0
6
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSA  
tPWB  
tPWE1  
tPWE2  
tSD  
LB, UB Valid to End of Write  
WE Pulse Width (OE = HIGH)  
WE Pulse Width (OE = LOW)  
Data Setup to Write End  
Data Hold from Write End  
WE LOW to High-Z Output  
WE HIGH to Low-Z Output  
6.5  
5
8
9
10  
10  
11  
7
7
8
6.5  
4
8
10  
6
5
tHD  
0
0
0
0
(3)  
tHZWE  
0
0
0
0
(3)  
tLZWE  
Notes:  
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V  
to 3.0V and output loading specified in Figure 1.  
2. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid  
states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing  
are referenced to the rising or falling edge of the signal that terminates the write.  
3. Tested with the load in Figure 2. Transition is measured 500 mV from steady-state voltage. Not 100ꢀ tested.  
Integrated Silicon Solution, Inc. 1-800-379-4774  
7
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)  
t
WC  
VALID ADDRESS  
SCE  
ADDRESS  
CE  
t
SA  
t
t
HA  
t
AW  
t
tPPWWEE21  
WE  
t
PBW  
UB, LB  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
D
OUT  
t
SD  
t
HD  
DATAIN VALID  
D
IN  
UB_CEWR1.eps  
8
Integrated Silicon Solution, Inc. 1-800-379-4774  
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
WRITE CYCLE NO. 2(1) (WE Controlled, OE = HIGH during Write Cycle)  
t
WC  
ADDRESS  
OE  
VALID ADDRESS  
t
HA  
LOW  
CE  
t
AW  
t
PWE1  
WE  
t
SA  
t
PBW  
UB, LB  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
D
OUT  
t
SD  
t
HD  
DATAIN VALID  
DIN  
UB_CEWR2.eps  
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)  
t
WC  
ADDRESS  
VALID ADDRESS  
t
HA  
LOW  
LOW  
OE  
CE  
t
t
AW  
t
PWE2  
WE  
t
SA  
t
PBW  
UB, LB  
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
D
OUT  
t
SD  
t
HD  
DATAIN VALID  
DIN  
UB_CEWR3.eps  
Integrated Silicon Solution, Inc. 1-800-379-4774  
9
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
WRITE CYCLE NO. 4(LB, UB Controlled, Back-to-Back Write) (1,3)  
tWC  
tWC  
ADDRESS 1  
ADDRESS 2  
ADDRESS  
OE  
CE  
tSA  
LOW  
tHA  
tSA  
tHA  
WE  
tPBW  
tPBW  
WORD 2  
UB, LB  
WORD 1  
tHZWE  
DATA UNDEFINED  
tLZWE  
HIGH-Z  
DOUT  
tHD  
tHD  
tSD  
tSD  
DATAIN  
VALID  
DATAIN  
VALID  
DIN  
UB_CEWR4.eps  
Notes:  
1. The internal Write time is defined by the overlap of CE = LOW, UB and/or LB = LOW, and WE = LOW. All signals must be  
in valid states to initiate a Write, but any can be deasserted to terminate the Write. The tSA, tHA, tSD, and tHD timing is  
referenced to the rising or falling edge of the signal that terminates the Write.  
2. Tested with OE HIGH for a minimum of 4 ns before WE = LOW to place the I/O in a HIGH-Z state.  
3. WE may be held LOW across many address cycles and the LB, UB pins can be used to control the Write function.  
10  
Integrated Silicon Solution, Inc. 1-800-379-4774  
Rev. A  
11/30/00  
®
ISSI  
IS61LV12816  
IS61LV12816 STANDARD VERSION  
ORDERING INFORMATION  
IS61LV12816 STANDARD VERSION  
ORDERING INFORMATION  
Commercial Range: 0°C to +70°C  
Industrial Range: 40°C to +85°C  
Speed (ns) Order Part No.  
Package  
Speed (ns) Order Part No.  
Package  
8
IS61LV12816-8B  
IS61LV12816-8K  
IS61LV12816-8LQ  
IS61LV12816-8T  
mini BGA (6mm x 8mm)  
400-mil Plastic SOJ  
LQFP  
8
IS61LV12816-8BI  
IS61LV12816-8KI  
IS61LV12816-8LQI  
IS61LV12816-8TI  
mini BGA (6mm x 8mm)  
400-mil Plastic SOJ  
LQFP  
Plastic TSOP  
Plastic TSOP  
10  
12  
15  
IS61LV12816-10B  
IS61LV12816-10K  
IS61LV12816-10LQ LQFP  
mini BGA (6mm x 8mm)  
400-mil Plastic SOJ  
10  
12  
15  
IS61LV12816-10BI  
IS61LV12816-10KI  
IS61LV12816-10LQI LQFP  
mini BGA (6mm x 8mm)  
400-mil Plastic SOJ  
IS61LV12816-10T  
Plastic TSOP  
IS61LV12816-10TI  
Plastic TSOP  
IS61LV12816-12B  
IS61LV12816-12K  
IS61LV12816-12LQ LQFP  
mini BGA (6mm x 8mm)  
400-mil Plastic SOJ  
IS61LV12816-12BI  
IS61LV12816-12KI  
IS61LV12816-12LQI LQFP  
mini BGA (6mm x 8mm)  
400-mil Plastic SOJ  
IS61LV12816-12T  
Plastic TSOP  
IS61LV12816-12TI  
Plastic TSOP  
IS61LV12816-15B  
IS61LV12816-15K  
mini BGA (6mm x 8mm)  
400-mil Plastic SOJ  
IS61LV12816-15BI  
IS61LV12816-15KI  
mini BGA (6mm x 8mm)  
400-mil Plastic SOJ  
IS61LV12816-15LQ LQFP  
IS61LV12816-15T Plastic TSOP  
IS61LV12816-15LQI LQFP  
IS61LV12816-15TI Plastic TSOP  
®
ISSI  
Integrated Silicon Solution, Inc.  
2231 Lawson Lane  
Santa Clara, CA 95054  
Tel: 1-800-379-4774  
Fax: (408) 588-0806  
E-mail: sales@issi.com  
www.issi.com  
Integrated Silicon Solution, Inc. 1-800-379-4774  
11  
Rev. A  
11/30/00  

相关型号:

IS61LV12816L

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY
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IS61LV12816L-10BI

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY
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IS61LV12816L-10BLI

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IS61LV12816L-10LQ

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IS61LV12816L-10LQI

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY
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IS61LV12816L-10LQLI

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY
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IS61LV12816L-10T

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY
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IS61LV12816L-10TI

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY
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IS61LV12816L-10TL

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY
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IS61LV12816L-10TLI

128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY
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IS61LV12816L-12T

Standard SRAM, 128KX16, 12ns, CMOS, PDSO44, PLASTIC, TSOP-44
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