IS61LV12816L-10LQ [ISSI]

Standard SRAM, 128KX16, 10ns, CMOS, PQFP44, MS-026, LQFP-44;
IS61LV12816L-10LQ
型号: IS61LV12816L-10LQ
厂家: INTEGRATED SILICON SOLUTION, INC    INTEGRATED SILICON SOLUTION, INC
描述:

Standard SRAM, 128KX16, 10ns, CMOS, PQFP44, MS-026, LQFP-44

静态存储器 内存集成电路
文件: 总12页 (文件大小:58K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
IS61LV12816L  
IS61LV12816LL  
ISSI  
128K x 16 HIGH-SPEED CMOS STATIC RAM  
WITH 3.3V SUPPLY  
PRELIMINARYINFORMATION  
JULY2002  
FEATURES  
DESCRIPTION  
TheISSIIS61LV12816L/IS61LV12816LLisahigh-speed,  
2,097,152-bit static RAM organized as 131,072 words by  
16 bits. It is fabricated using ISSI's high-performance  
CMOS technology. This highly reliable process coupled  
with innovative circuit design techniques, yields access  
times as fast as 8 ns with low power consumption.  
• High-speed access time:  
IS61LV12816L: 8, 10 ns  
IS61LV12816LL: 12, 15 ns  
• Operating Current:  
IS61LV12816L: 50mA (typ.)  
IS61LV12816LL: 25mA (typ.)  
• Stand by Current:  
When CE is HIGH (deselected), the device assumes a  
standby mode at which the power dissipation can be  
reduced down with CMOS input levels.  
IS61LV12816L: 500µA (typ.)  
IS61LV12816LL: 250µA(typ.)  
• TTL and CMOS compatible interface levels  
• Single 3.3V power supply  
EasymemoryexpansionisprovidedbyusingChipEnable  
and Output Enable inputs, CE and OE. The active LOW  
WriteEnable(WE)controlsbothwritingandreadingofthe  
memory. A data byte allows Upper Byte (UB) and Lower  
Byte (LB) access.  
• Fully static operation: no clock or refresh  
required  
The IS61LV12816L/IS61LV12816LL is packaged in the  
JEDEC standard 44-pin TSOP, 44-pin LQFP, and 48-pin  
mini BGA (6mm x 8mm).  
• Three state outputs  
• Data control for upper and lower bytes  
• Industrial temperature available  
FUNCTIONAL BLOCK DIAGRAM  
128Kx16  
MEMORY ARRAY  
A0-A16  
DECODER  
VCC  
GND  
I/O0-I/O7  
Lower Byte  
I/O  
DATA  
CIRCUIT  
COLUMN I/O  
I/O8-I/O15  
Upper Byte  
CS2  
CS1  
OE  
WE  
UB  
CONTROL  
CIRCUIT  
LB  
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability  
arisingoutoftheapplicationoruseofanyinformation, productsorservicesdescribedherein. Customersareadvisedtoobtainthelatestversionofthisdevicespecificationbeforerelyingonany  
publishedinformationandbeforeplacingordersforproducts.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev. 00B  
1
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
TRUTH TABLE  
I/O PIN  
Mode  
WE  
CE  
OE  
LB  
UB  
I/O0-I/O7  
I/O8-I/O15  
VccCurrent  
Not Selected  
X
H
X
X
X
High-Z  
High-Z  
ISB1, ISB2  
ICC  
OutputDisabled  
H
X
L
L
H
X
X
H
X
H
High-Z  
High-Z  
High-Z  
High-Z  
Read  
Write  
H
H
H
L
L
L
L
L
L
L
H
L
H
L
L
DOUT  
High-Z  
DOUT  
High-Z  
DOUT  
DOUT  
ICC  
ICC  
L
L
L
L
L
L
X
X
X
L
H
L
H
L
L
DIN  
High-Z  
DIN  
High-Z  
DIN  
DIN  
PIN CONFIGUREATION  
44-Pin TSOP (T)  
PIN DESCRIPTIONS  
A0-A16  
I/O0-I/O15  
CE  
Address Inputs  
DataInputs/Outputs  
Chip Enable Input  
Output Enable Input  
Write Enable Input  
A4  
A3  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A5  
2
A6  
A2  
3
A7  
OE  
A1  
4
OE  
A0  
5
UB  
WE  
CE  
6
LB  
LB  
Lower-byteControl(I/O0-I/O7)  
Upper-byteControl(I/O8-I/O15)  
NoConnection  
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A16  
A15  
A14  
A13  
A12  
7
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
8
UB  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
NC  
Vcc  
Power  
GND  
Ground  
A8  
A9  
A10  
A11  
NC  
2
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
PIN CONFIGUREATION  
48-Pin mini BGA (B)  
44-Pin LQFP (LQ)  
1
2
3
4
5
6
44 43 42 41 40 39 38 37 36 35 345  
1
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
CE  
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
2
A0  
A3  
A1  
A4  
A2  
LB  
I/O  
OE  
UB  
NC  
I/O  
A
B
C
D
E
F
3
4
CE  
8
0
5
I/O  
I/O  
I/O  
A5  
A6  
I/O  
I/O  
I/O  
2
9
10  
1
TOP VIEW  
6
GND  
Vcc  
NC  
NC  
A14  
A12  
A7  
Vcc  
7
11  
3
4
5
8
I/O  
I/O  
GND  
I/O  
I/O  
A16  
A15  
A13  
A10  
12  
9
I/O  
14  
I/O  
6
13  
10  
11  
I/O8  
NC  
I/O  
15  
NC  
A8  
WE  
I/O  
7
G
H
12 13 14 15 16 17 18 19 20 21 22  
NC  
A9  
A11  
NC  
PIN DESCRIPTIONS  
A0-A16  
I/O0-I/O15  
CE  
Address Inputs  
DataInputs/Outputs  
Chip Enable Input  
Output Enable Input  
Write Enable Input  
OE  
WE  
LB  
Lower-byteControl(I/O0-I/O7)  
Upper-byteControl(I/O8-I/O15)  
NoConnection  
UB  
NC  
Vcc  
Power  
GND  
Ground  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
3
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
ABSOLUTE MAXIMUM RATINGS(1)  
Symbol  
VCC  
Parameter  
Value  
–0.5 to 4.0V  
–0.5 to Vcc + 0.5  
–65 to + 150  
1.0  
Unit  
V
Power Supply Voltage Relative to GND  
Terminal Voltage with Respect to GND  
StorageTemperature  
VTERM  
TSTG  
PT  
V
°C  
W
PowerDissipation  
IOUT  
DCOutputCurrent  
±20  
mA  
Note:  
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is  
a stress rating only and functional operation of the device at these or any other conditions above those indicated in the opera-  
tional sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may  
affect reliability.  
OPERATING RANGE  
Range  
AmbientTemperature  
0°C to + 70°C  
VCC  
Commercial  
Industrial  
3.3V + 10%, -5%  
3.3V + 10%, -5%  
–40°C to + 85°C  
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)  
Symbol Parameter  
TestConditions  
Min.  
2.4  
Max.  
Unit  
V
VOH  
VOL  
VIH  
VIL  
ILI  
OutputHIGHVoltage  
VCC = Min., IOH = –4.0 mA  
VCC = Min., IOL = 8.0 mA  
OutputLOWVoltage  
InputHIGHVoltage(1)  
InputLOWVoltage(1)  
InputLeakage  
0.4  
V
2
VCC + 0.3  
V
–0.3  
–1  
0.8  
1
V
GND - VIN - VCC  
µA  
µA  
ILO  
OutputLeakage  
GND - VOUT - VCC, Outputs Disabled  
–1  
1
Note:  
1.  
VIL (min.) = –0.3V DC; VIL (min.) = –2.0V AC (pulse width - 2.0 ns).  
VIH (max.) = VCC + 0.3V DC; VIH (max.) = VCC + 2.0V AC (pulse width - 2.0 ns).  
4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)  
IS61LV12816L  
-8 ns  
Min. Max.  
-10 ns  
Min. Max.  
Symbol  
Parameter  
Test Conditions  
Unit  
ICC  
Vcc Operating  
Supply Current  
VCC = Max., CE = VIL  
IOUT = 0 mA, f = Max.  
Com.  
Ind.  
65  
70  
60  
65  
mA  
ISB1  
ISB2  
TTL Standby  
Current  
(TTL Inputs)  
VCC = Max.,  
VIN = VIH or VIL  
CE • VIH, f = max  
Com.  
Ind.  
30  
35  
25  
30  
mA  
CMOS Standby  
Current  
(CMOS Inputs)  
VCC = Max.,  
Com.  
Ind.  
3
4
3
4
mA  
mA  
CE - VCC – 0.2V,  
VIN > VCC – 0.2V, or  
VIN - 0.2V, f = 0  
Note:  
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.  
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)  
IS61LV12816LL  
-12 ns  
-15 ns  
Symbol Parameter  
Test Conditions  
Min. Max.  
Min. Max.  
Unit  
ICC  
Vcc Operating  
Supply Current  
VCC = Max., CE = VIL  
IOUT = 0 mA, f = Max.  
Com.  
Ind.  
50  
60  
45  
50  
mA  
ISB1  
TTL Standby  
Current  
(TTL Inputs)  
VCC = Max.,  
VIN = VIH or VIL  
CE • VIH, f = max  
Com.  
Ind.  
15  
20  
15  
20  
mA  
ISB2  
CMOS Standby  
Current  
(CMOS Inputs)  
VCC = Max.,  
Com.  
Ind.  
200  
300  
200  
300  
µA  
µA  
CE - VCC – 0.2V,  
VIN > VCC – 0.2V, or  
VIN - 0.2V, f = 0  
Note:  
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.  
CAPACITANCE(1)  
Symbol  
CIN  
Parameter  
Conditions  
VIN = 0V  
Max.  
Unit  
pF  
InputCapacitance  
Input/OutputCapacitance  
6
8
COUT  
VOUT = 0V  
pF  
Note:  
1. Tested initially and after any design or process changes that may affect these parameters.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
5
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
AC TEST CONDITIONS  
Parameter  
Unit  
0V to 3.0V  
3 ns  
Input Pulse Level  
Input Rise and Fall Times  
Input and Output Timing  
andReferenceLevel  
1.5V  
OutputLoad  
See Figures 1 and 2  
AC TEST LOADS  
319  
3.3V  
ZO = 50  
50Ω  
1.5V  
OUTPUT  
OUTPUT  
30 pF  
Including  
jig and  
scope  
353 Ω  
5 pF  
Including  
jig and  
scope  
Figure 1.  
Figure 2.  
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)  
IS61LV12816L  
-8 ns -10 ns  
Min. Min.  
IS61LV12816LL  
-12 ns -15 ns  
Min. Max.  
Symbol Parameter  
Max  
Max.  
10  
10  
4
Min.  
12  
3
Max.  
12  
12  
5
Unit  
tRC  
Read Cycle Time  
8
3
10  
3
15  
3
15  
15  
6
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tAA  
Address Access Time  
Output Hold Time  
8
tOHA  
tACE  
tDOE  
CE Access Time  
8
0
0
0
OE Access Time  
0
3.5  
3.5  
(2)  
tHZOE  
OE to High-Z Output  
OE to Low-Z Output  
CE to High-Z Output  
CE to Low-Z Output  
LB, UB Access Time  
LB, UB to High-Z Output  
LB, UB to Low-Z Output  
4
5
6
(2)  
tLZOE  
tHZCE  
4
5
0
8
(2)  
0
3.5  
0
0
0
(2)  
tLZCE  
3.5  
0
3
4
3
5
3
6
tBA  
3.5  
3.5  
0
0
0
(2)  
tHZB  
4
5
6
(2)  
tLZB  
0
0
0
0
Notes:  
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to  
3.0V and output loading specified in Figure 1.  
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.  
6
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
AC WAVEFORMS  
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL, UB or LB = VIL)  
t
RC  
ADDRESS  
t
AA  
t
OHA  
t
OHA  
DATA VALID  
DOUT  
PREVIOUS DATA VALID  
READ1.eps  
READ CYCLE NO. 2(1,3)  
t
RC  
ADDRESS  
OE  
t
AA  
t
OHA  
t
HZOE  
t
DOE  
t
t
LZOE  
ACE  
CE  
t
HZCE  
t
LZCE  
LB, UB  
t
BA  
t
HZB  
t
LZB  
HIGH-Z  
DOUT  
DATA VALID  
UB_CEDR2.eps  
Notes:  
1. WE is HIGH for a Read Cycle.  
2. The device is continuously selected. OE, CE, UB, or LB = VIL.  
3. Address is valid prior to or coincident with CE LOW transition.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
7
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)  
IS61LV12816L  
-8 ns -10 ns  
Min. Max.  
IS61LV12816LL  
-12 ns  
Min. Max.  
-15 ns  
Min. Max.  
Symbol Parameter  
Min.  
Max  
Unit  
tWC  
tSCE  
tAW  
Write Cycle Time  
8
7
7
10  
8
12  
8
15  
10  
10  
ns  
ns  
ns  
CE to Write End  
Address Setup Time  
to Write End  
8
8
tHA  
Address Hold from Write End  
Address Setup Time  
0
0
3
0
0
4
0
0
5
0
0
6
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSA  
tPWB  
tPWE1  
tPWE2  
tSD  
LB, UB Valid to End of Write  
WE Pulse Width (OE = HIGH)  
WE Pulse Width (OE = LOW)  
Data Setup to Write End  
6.5  
6
8
9
10  
10  
11  
7
7
8
6.5  
4
8
10  
6
5
tHD  
Data Hold from Write End  
WE LOW to High-Z Output  
WE HIGH to Low-Z Output  
0
0
0
0
(3)  
tHZWE  
0
0
0
0
(3)  
tLZWE  
Notes:  
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V  
and output loading specified in Figure 1.  
2. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to  
initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the  
rising or falling edge of the signal that terminates the write.  
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.  
8
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)  
t
WC  
VALID ADDRESS  
SCE  
ADDRESS  
CE  
t
SA  
t
t
HA  
t
AW  
t
PWE1  
PWE2  
t
WE  
t
PBW  
UB, LB  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
DOUT  
t
SD  
t
HD  
DATAIN VALID  
DIN  
UB_CEWR1.eps  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
9
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
WRITE CYCLE NO. 2(1) (WE Controlled, OE = HIGH during Write Cycle)  
t
WC  
ADDRESS  
OE  
VALID ADDRESS  
t
HA  
LOW  
CE  
t
AW  
t
PWE1  
WE  
t
SA  
t
PBW  
UB, LB  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
DOUT  
t
SD  
t
HD  
DATAIN VALID  
DIN  
UB_CEWR2.eps  
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)  
t
WC  
ADDRESS  
OE  
VALID ADDRESS  
t
HA  
LOW  
LOW  
CE  
t
t
AW  
t
PWE2  
WE  
t
SA  
t
PBW  
UB, LB  
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
DOUT  
t
SD  
t
HD  
DATAIN VALID  
DIN  
UB_CEWR3.eps  
10  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
WRITE CYCLE NO. 4(LB, UB Controlled, Back-to-Back Write) (1,3)  
t
WC  
t
WC  
ADDRESS 1  
ADDRESS 2  
ADDRESS  
OE  
CE  
t
SA  
LOW  
t
HA  
SA  
t
HA  
t
WE  
t
PBW  
t
PBW  
UB, LB  
WORD 1  
WORD 2  
t
HZWE  
t
LZWE  
HIGH-Z  
DOUT  
DATA UNDEFINED  
t
HD  
t
HD  
t
SD  
t
SD  
DATAIN  
VALID  
DATAIN  
VALID  
DIN  
UB_CEWR4.eps  
Notes:  
1. The internal Write time is defined by the overlap of CE = LOW, UB and/or LB = LOW, and WE = LOW. All signals must be  
in valid states to initiate a Write, but any can be deasserted to terminate the Write. The tSA, tHA, tSD, and tHD timing is refer  
enced to the rising or falling edge of the signal that terminates the Write.  
2. Tested with OE HIGH for a minimum of 4 ns before WE = LOW to place the I/O in a HIGH-Z state.  
3. WE may be held LOW across many address cycles and the LB, UB pins can be used to control the Write function.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
11  
07/30/02  
®
ISSI  
IS61LV12816L, IS61LV12816LL  
IS61LV12816L  
IS61LV12816L  
ORDERING INFORMATION  
Commercial Range: 0°C to +70°C  
ORDERING INFORMATION  
Industrial Range: –40°C to +85°C  
Speed(ns) OrderPartNo.  
Package  
Speed(ns) OrderPartNo.  
Package  
8
IS61LV12816L-8B  
IS61LV12816L-8LQ  
IS61LV12816L-8T  
mini BGA (6mm x 8mm)  
LQFP  
PlasticTSOP  
8
IS61LV12816L-8BI  
IS61LV12816L-8LQI  
IS61LV12816L-8TI  
mini BGA (6mm x 8mm)  
LQFP  
PlasticTSOP  
10  
IS61LV12816L-10B  
IS61LV12816L-10LQ  
IS61LV12816L-10T  
mini BGA (6mm x 8mm)  
LQFP  
PlasticTSOP  
10  
IS61LV12816L-10BI  
IS61LV12816L-10LQI  
IS61LV12816L-10TI  
mini BGA (6mm x 8mm)  
LQFP  
PlasticTSOP  
IS61LV12816LL  
IS61LV12816LL  
ORDERING INFORMATION  
ORDERING INFORMATION  
Industrial Range: –40°C to +85°C  
Commercial Range: 0°C to +70°C  
Speed(ns) OrderPartNo.  
Package  
Speed(ns) OrderPartNo.  
Package  
12  
IS61LV12816LL-12BI  
IS61LV12816LL-12LQI LQFP  
IS61LV12816LL-12TI  
mini BGA (6mm x 8mm)  
12  
IS61LV12816LL-12B  
IS61LV12816LL-12LQ  
IS61LV12816LL-12T  
mini BGA (6mm x 8mm)  
LQFP  
PlasticTSOP  
PlasticTSOP  
15  
IS61LV12816LL-15B  
IS61LV12816LL-15LQ  
IS61LV12816LL-15T  
mini BGA (6mm x 8mm)  
LQFP  
PlasticTSOP  
15  
IS61LV12816LL-15BI  
IS61LV12816LL-15LQI LQFP  
IS61LV12816LL-15TI PlasticTSOP  
mini BGA (6mm x 8mm)  
12  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARYINFORMATION Rev.00B  
07/30/02  

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