ISL14011 [INTERSIL]

Low Jitter Clock Generators for Set-Top Box; 低抖动时钟发生器用于机顶盒
ISL14011
型号: ISL14011
厂家: Intersil    Intersil
描述:

Low Jitter Clock Generators for Set-Top Box
低抖动时钟发生器用于机顶盒

时钟发生器
文件: 总5页 (文件大小:117K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ISL14011  
®
Data Sheet  
January 30, 2007  
FN6427.0  
Low Jitter Clock Generators for Set-Top  
Box  
Features  
• LVTTL Outputs  
The ISL14011 series of devices are general purpose  
integrated Clock Synthesizers and Generators suited for  
consumer applications such as Set-top Box, and various  
other consumer applications.  
• Selectable Crystal or Ref. Clock for Inputs  
• Period Jitter ~50ps RMS  
• Single Supply; 3.3V nominal  
The selectable reference input accepts 30MHz signal either  
from crystal or an external source. It is specified to operate  
with a nominal 3.3V supply and is offered in 16 Ld QFN  
package.  
• Extended Temperature Range: -40°C to +85°C  
• Available in small foot print package  
- 16 Ld QFN 3mmx3mm  
• Pb-Free plus anneal available (RoHS Compliant)  
Contact Factory for other output frequency options.  
Applications  
Ordering Information  
• Set-Top Boxes  
PART  
PART  
TEMP.  
PKG.  
NUMBER  
MARKING RANGE (°C) PACKAGE DWG. #  
Pinout  
ISL14011IRZ* 11IZ  
-40 to +85 16 Ld QFN L16.3x3  
ISL14011  
(16 LD QFN)  
TOP VIEW  
*Add "-T" suffix for tape and reel.  
NOTE: Intersil Pb-free plus anneal products employ special Pb-free  
material sets; molding compounds/die attach materials and 100% matte  
tin plate termination finish, which are RoHS compliant and compatible  
with both SnPb and Pb-free soldering operations. Intersil Pb-free  
products are MSL classified at Pb-free peak reflow temperatures that  
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.  
16 15 14 13  
VCC  
X1  
1
2
3
4
12 NC  
11 CLK3  
Selection Table  
10  
9
X2  
CLK2  
NC  
NUMBER  
PART  
INPUT  
OF  
OUTPUT  
GND  
OPTIONS FREQUENCY OUTPUTS FREQUENCY PACKAGE  
5
6
7
8
ISL14011 30MHz 4 LVTTL 25, 30, 24, 27 16 Ld QFN  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright Intersil Americas Inc. 2007. All Rights Reserved  
1
All other trademarks mentioned are the property of their respective owners.  
ISL14011  
Functional Block Diagram  
CLK1  
CLK2  
M1  
PHASE FREQ DET.  
VCO1  
OSC.  
30MHz  
CRYSTAL  
N1  
CLK3  
CLK4  
M2  
PHASE FREQ DET.  
VCO2  
N2  
Pin Description  
16 LD QFN  
SYMBOLS  
VCC  
X1  
PIN DESCRIPTION  
1,14,16  
Supply Voltage  
2
The X1 pin is the terminal 1 of an external 30MHz crystal. This pin is grounded for external CK input.  
3
X2  
The X2 pin is the terminal 2 of external 30MHz crystal, or external clock input.  
4, 5, 7  
GND  
CLK1  
CLK2  
CLK3  
CLK4  
NC  
Ground  
8
10  
CLK1 Output: 25MHz  
CLK2 Output: 30MHz  
CLK3 Output: 24MHz  
CLK4 Output: 27MHz  
No Connect  
11  
13  
6, 9,12,15  
FN6427.0  
January 30, 2007  
2
ISL14011  
Absolute Maximum Ratings  
Thermal Information  
Voltage on VCC, CLK pins (respect to Gnd) . . . . . . . . -0.3V to 4.0V  
Voltage on X1, X2 pins (respect to Gnd) . . . . . . . . . . . -0.3V to 2.5V  
ESD Rating  
MIL STD-883, Method 3014. . . . . . . . . . . . . . . . . . . . . . . . .>±5kV  
Machine Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>500V  
Thermal Resistance (Typical, Note 1)  
16 Ld QFN Package. . . . . . . . . . . . . . .  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65ºC to +150ºC  
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300ºC  
θ
(°C/W)  
59  
θ
(°C/W)  
JA  
JC  
11.5  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See  
JA  
Tech Brief TB379.  
DC Electrical Specifications  
V
= 3.3V ±10%, T = -40ºC to +85ºC, Typical values are at T = +25ºC and V  
= 3.3V,  
CC  
A
A
CC  
Unless otherwise noted  
SYMBOL  
Supply Voltage  
SYMBOL  
CONDITIONS  
Supply Voltage  
Supply Current CL = 5pF on all outputs  
MIN  
TYP  
3.3  
11  
MAX  
3.6  
UNIT  
V
V
3.0  
CC  
Supply Current  
I
15  
mA  
CC  
CLOCK INPUT X (X GROUNDED) FOR EXTERNAL CLOCK MODE  
2
1
Input High Level  
Input Level Low  
Input Current  
V
1.5  
2.4  
0.5  
V
V
IH  
V
IL  
IIL, IIH  
V
to Ground  
0.5  
mA  
X2  
CLOCK OUTPUTS (CLK)  
Output High Level  
V
I
I
I
I
I
I
= -100µA  
= -4mA  
= -6mA  
= 100µA  
= 4mA  
V
-0.2  
V
V
OH  
OH  
OH  
OH  
OL  
OL  
OL  
CC  
2.4  
2.1  
V
Output Low Level  
V
0.2  
0.4  
0.75  
30  
V
OL  
V
= 6mA  
V
Output Short Circuit Current  
IOSC  
CLK = V  
or Gnd  
6
13  
mA  
CC  
AC Electrical Specifications CL= 5pF on all outputs  
SYMBOL  
Crystal Frequency  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
fin  
30  
MHz  
CLOCK OUTPUTS  
Rise Time  
t
20% to 80% V  
1.8  
1.8  
ns  
ns  
%
R
CC  
CC  
Fall Time  
t
80% to 20% V  
F
Duty Cycle  
40  
60  
Period Jitter  
Power Up Time  
J
RMS  
50  
2
ps  
ms  
P
t
V
>2.7V  
CC  
PO  
FN6427.0  
January 30, 2007  
3
ISL14011  
Typical Performance Curves (Period Jitter)  
70  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
V
= 3.3V  
SUPPLY  
TEMPERATURE +23ºC  
CK1  
CK2  
CK4  
CK3  
0
2
4
6
8
10  
12  
14  
LOAD CAPACITANCE (pF)  
FIGURE 1. STANDARD DEVIATION vs LOAD CAPACITANCE  
FN6427.0  
January 30, 2007  
4
ISL14011  
Quad Flat No-Lead Plastic Package (QFN)  
L16.3x3  
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE  
Micro Lead Frame Plastic Package (MLFP)  
2X  
MILLIMETERS  
0.15  
C A  
D
A
SYMBOL  
MIN  
NOMINAL  
MAX  
1.00  
0.05  
1.00  
NOTES  
9
D/2  
A
A1  
A2  
A3  
b
0.80  
0.90  
-
D1  
-
-
-
-
-
9
D1/2  
2X  
N
0.15  
C B  
0.20 REF  
9
6
INDEX  
AREA  
0.18  
1.35  
1.35  
0.23  
0.30  
1.65  
1.65  
5, 8  
1
2
3
E1/2  
E/2  
9
D
3.00 BSC  
-
E1  
E
D1  
D2  
E
2.75 BSC  
9
1.50  
7, 8, 10  
2X  
3.00 BSC  
-
0.15  
C
B
B
2X  
E1  
E2  
e
2.75 BSC  
9
TOP VIEW  
0.15  
4X  
C
0
A
1.50  
7, 8, 10  
A2  
0.50 BSC  
-
A
/ /  
0.10  
C
C
C
k
0.20  
0.30  
-
0.40  
16  
4
-
-
0.08  
L
0.50  
8
SEATING PLANE  
A3 A1  
SIDE VIEW  
N
2
9
Nd  
Ne  
P
3
5
NX b  
4
3
0.10 M C A B  
4X P  
-
-
-
0.60  
12  
9
D2  
D2  
8
7
NX k  
θ
-
9
(DATUM B)  
2
N
Rev. 1 6/04  
4X P  
NOTES:  
1
(DATUM A)  
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.  
2. N is the number of terminals.  
2
3
(Ne-1)Xe  
REF.  
E2  
6
INDEX  
AREA  
7
8
3. Nd and Ne refer to the number of terminals on each D and E.  
4. All dimensions are in millimeters. Angles are in degrees.  
E2/2  
NX L  
8
5. Dimension b applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
N
e
9
CORNER  
OPTION 4X  
(Nd-1)Xe  
REF.  
6. The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
BOTTOM VIEW  
A1  
7. Dimensions D2 and E2 are for the exposed pads which provide  
improved electrical and thermal performance.  
NX b  
5
8. Nominal dimensions are provided to assist with PCB Land  
Pattern Design efforts, see Intersil Technical Brief TB389.  
SECTION "C-C"  
9. Features and dimensions A2, A3, D1, E1, P & θ are present when  
Anvil singulation method is used and not present for saw  
singulation.  
C
L
C
L
10. Compliant to JEDEC MO-220VEED-2 Issue C, except for the E2  
and D2 MAX dimension.  
L
L
10  
10  
L1  
L1  
e
e
C
C
TERMINAL TIP  
FOR ODD TERMINAL/SIDE  
FOR EVEN TERMINAL/SIDE  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN6427.0  
January 30, 2007  
5

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