PTFC262808FVV1R250XTMA1 [INFINEON]

RF Power Field-Effect Transistor,;
PTFC262808FVV1R250XTMA1
型号: PTFC262808FVV1R250XTMA1
厂家: Infineon    Infineon
描述:

RF Power Field-Effect Transistor,

文件: 总8页 (文件大小:199K)
中文:  中文翻译
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PTFC262808FV  
Thermally-Enhanced High Power RF LDMOS FET  
280 W, 28 V, 2620 – 2690 MHz  
Description  
The PTFC262808FV is a 280-watt LDMOS FET intended for use in  
multi-standard cellular power amplifier applications in the 2620 to  
2690 MHz frequency band. Features include input and output match-  
ing, high gain and thermally-enhanced package. Manufactured with  
Infineon's advanced LDMOS process, this device provides excellent  
thermal performance and superior reliability.  
PTFC262808FV  
Package H-37275G-6/2  
Features  
Two-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 1800 mA, ƒ = 2690 MHz, 3GPP  
WCDMA signal, 8 dB PAR,  
Broadband internal matching  
Typical 1-carrier WCDMA performance, 2655 MHz,  
28 V, 10 dB PAR  
10 MHz carrier spacing, 3.84 MHz BW  
- Output power at P  
- Efficiency = 24%  
- Gain = 18 dB  
= 56 W avg.  
1dB  
20  
19  
18  
17  
16  
15  
50  
40  
30  
20  
10  
0
Efficiency  
- ACPR = –33 dBc @ 3.84 MHz  
Integrated ESD protection: Human Body Model,  
Class 1C (per JESD22-A114)  
Gain  
Low thermal resistance  
RoHS-compliant  
Capable of handling 10:1 VSWR at 28 V, 280 W  
(CW) ouput power  
c262808fv-gr1  
30  
34  
38  
42  
46  
50  
54  
Output Power (dBm)  
RF Characteristics  
Single-carrier WCDMA Specifications (tested in Infineon production test fixture)  
= 28 V, I = 1800 mA, P = 56 W average, ƒ = 2655 MHz, 3GPP WCDMA signal, channel bandwidth = 3.84 MHz,  
V
DD  
DQ  
OUT  
peak/average = 10 dB @ 0.01% CCDF  
Characteristic  
Symbol  
Min  
16.5  
22  
Typ  
18.0  
24  
Max  
Unit  
dB  
Gain  
G
ps  
Drain Efficiency  
Adjacent Channel Power Ratio  
ηD  
%
ACPR  
–33  
–30  
dBc  
All published data at T  
= 25°C unless otherwise indicated  
CASE  
ESD: Electrostatic discharge sensitive device—observe handling precautions!  
Data Sheet 1 of 8  
Rev. 02.2, 2013-08-06  
PTFC262808FV  
DC Characteristics (single side)  
Characteristic  
Conditions  
Symbol  
Min  
65  
Typ  
Max  
Unit  
V
Drain-Source Breakdown Voltage  
Drain Leakage Current  
V
GS  
= 0 V, I = 10 mA  
V
(BR)DSS  
DS  
V
V
V
= 28 V, V = 0 V  
I
I
1.0  
10.0  
µA  
µA  
Ω
DS  
GS  
DSS  
DSS  
= 63 V, V = 0 V  
GS  
DS  
On-State Resistance  
Operating Gate Voltage  
Gate Leakage Current  
= 10 V, V = 0.1 V  
DS  
R
DS(on)  
0.05  
2.6  
GS  
V
DS  
= 28 V, I  
= 1.45 A  
V
GS  
V
DQ  
V
GS  
= 10 V, V = 0 V  
I
GSS  
1
µA  
DS  
Maximum Ratings  
Parameter  
Symbol  
Value  
65  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Operating Voltage  
V
DSS  
V
–6 to +10  
0 to +32  
200  
V
GS  
DD  
V
V
Junction Temperature  
Storage Temperature Range  
T
°C  
J
T
–65 to +150  
0.20  
°C  
STG  
Thermal Resistance (T  
= 70°C, 200 W CW)  
R
θ
°C/W  
CASE  
JC  
Ordering Information  
Type and Version  
Order Code  
Package and Description  
Shipping  
Tray  
PTFC 262808FV V1  
PTFC262808FVV1XWSA1  
H-37275G-6/2, ceramic open-cavity, earless  
H-37275G-6/2, ceramic open-cavity, earless  
PTFC 262808FV V1 R250 PTFC262808FVV1R250XTMA1  
Tape & Reel, 250 pcs  
Data Sheet  
2 of 8  
Rev. 02.2, 2013-08-06  
PTFC262808FV  
Typical Performance (data taken in Infineon production test fixture)  
Two-carrier WCDMA Drive-up  
Two-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 1800 mA, ƒ = 2690 MHz, 3GPP  
WCDMA signal, 8 dB PAR,  
VDD = 28 V, IDQ = 1800 mA,  
3GPP WCDMA signal, 8 dB PAR,  
10 MHz carrier spacing, 3.84 MHz BW  
10 MHz carrier spacing, 3.84 MHz BW  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
60  
50  
40  
30  
20  
10  
0
-15  
-25  
-35  
-45  
IMD Low  
IMD Up  
ACPR  
2620 MHz  
2655 MHz  
2690 MHz  
Efficiency  
IMD Up  
IMD Low  
c262802fv-gr2  
c262802fv-gr3  
30  
34  
38  
42  
46  
50  
54  
30  
34  
38  
42  
46  
50  
54  
Output Power (dBm)  
Output Power (dBm)  
Pulsed CW Performance  
Pulsed CW Performance  
Gain & Input Return Loss, single side  
VDD = 28 V, IDQ = 1.8 A  
VDD = 28 V, IDQ = 650 mA  
20  
0
19  
18  
17  
16  
15  
14  
55  
IRL  
Gain  
19  
18  
17  
16  
15  
14  
-5  
45  
35  
25  
15  
5
-10  
-15  
-20  
-25  
-30  
2620 MHz  
2655 MHz  
2690 MHz  
Gain  
Efficiency  
c262802fv-gr6  
c262802fv-gr4  
2450  
2550  
2650  
2750  
2850  
36  
40  
44  
48  
52  
56  
Output Power (dBm)  
Frequency (MHz)  
Data Sheet  
3 of 8  
Rev. 02.2, 2013-08-06  
PTFC262808FV  
Typical Performance (cont.)  
Pulsed CW Performance  
at selected VDD  
IDQ = 1800 mA, ƒ = 2690 MHz  
VDD = 32 V  
20  
19  
18  
17  
16  
15  
14  
60  
50  
40  
30  
20  
10  
0
V
V
DD = 28 V  
DD = 24 V  
Efficiency  
Gain  
c262802fv-gr5  
36  
40  
44  
48  
52  
56  
Output Power (dBm)  
Broadband Circuit Impedance  
Z Source  
Z Load  
D
Frequency  
MHz  
Z Source  
Z Load   
R
jX  
R
jX  
S
D
G
G
2620  
2.88  
2.99  
3.10  
–1.58  
–1.55  
–1.52  
0.55  
0.53  
0.52  
–2.45  
–2.39  
–2.33  
2655  
2690  
Data Sheet  
4 of 8  
Rev. 02.2, 2013-08-06  
PTFC262808FV  
Reference Circuit, tuned for 2620 – 2690 MHz  
DUT  
PTFC262808FV  
Test Fixture Part No.  
PCB  
LTN/PTFC262808FV V1  
Rogers 4350, 0.508 mm [.020"] thick, 2 oz. copper, εr = 3.66  
Find Gerber files for this test fixture on the Infineon Web site at (http://www.infineon.com/rfpower)  
RO4350, .020 (60)  
RO4350, .020 (60)  
R802  
C801  
C802  
R803  
VDD  
S1  
C207  
C208  
C205  
R104  
S3  
R801  
R102  
R804  
R101  
C206  
C102  
C108  
C106  
C104  
C103  
C201  
RF_IN  
RF_OUT  
C107  
C101  
R103  
C209  
C105  
R105  
C202  
C204  
C203  
VDD  
PTFC262808FV_OUT_02  
2 8 2 8 0 8 f v _ c d _ 7 - 1 9 - 1 3  
PTFC262808FV_IN_02  
c
Reference circuit assembly diagram (not to scale)  
Component Information  
Component  
Description  
Suggested Manufacturer  
P/N  
Input  
C101, C102  
C103, C104  
C105, C106  
C107, C108  
C801, C802, C803  
R101, R102  
Chip capacitor, 10 pF  
Chip capacitor, 18 pF  
Chip capacitor, 0.4 pF  
Capacitor, 10 µF  
ATC  
ATC100A100JW500XB  
ATC100A180JW150XB  
ATC100B0R4CW500XB  
LLL31BC70G106MA01L  
ECJ-1VB1H102K  
ATC  
ATC  
Murata Electronics North America  
Panasonic  
Chip capacitor, 1,000 pF  
Resistor, 10 Ω  
Panasonic Electronic Components  
ERJ-3GEYJ100V  
(table cont. next page)  
Data Sheet  
5 of 8  
Rev. 02.2, 2013-08-06  
PTFC262808FV  
Reference Circuit (cont.)  
Component Information (cont.)  
Component  
Description  
Suggested Manufacturer  
P/N  
Input (cont.)  
R102, R103, R104, R801,  
R802  
Panasonic Electronic Components  
ERJ-8GEYJ100V  
Resistor, 10 Ω  
R803  
R804  
S1  
Panasonic Electronic Components  
Panasonic Electronic Components  
Bourns Inc.  
ERJ-3GEYJ132V  
ERJ-3GEYJ122V  
3224W-1-202E  
BCP56-10  
Resistor, 1.3k Ω  
Resistor, 1.2k Ω  
Potentiometer, 2k Ω  
Transistor  
S2  
Infineon Technologies  
S3  
Voltage regulator  
Fairchild Semiconductor  
LM7805  
Output  
C201  
C202, C206  
Chip capacitor, 18 pF  
Capacitor, 470 µF, 50 V  
ATC  
ATC100B180KW500XB  
SEK471M050ST  
Cornell Dubilier Electronics (CDE)  
Taiyo Yuden  
C203, C204, C205, C207, Capacitor, 10 µF  
C208, C209  
UMK325C7106MM-T  
Pinout Diagram (top view)  
V1  
V2  
Pin  
V1  
V2  
G1  
G2  
D1  
D2  
S
Description  
D1  
D2  
V
Device 1  
DD  
V
DD  
Device 2  
Gate Device 1  
Gate Device 2  
Drain Device 1  
Drain Device 2  
Source (flange)  
S
G1  
G2  
H-34275G-6-2_pd_10-10-2012  
Lead connections for PTFC262808FV  
Data Sheet  
6 of 8  
Rev. 02.2, 2013-08-06  
PTFC262808FV  
Package Outline Specifications  
Package H-37275G-6/2  
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6
Diagram Notes—unless otherwise specified:  
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.  
2. Primary dimensions are mm. Alternate dimensions are inches.  
3. All tolerances 0.127 [0.005].  
4. Pins: D1, D2 – drain; G1, G2 – gate; S – source; V1, V2 – V  
5. Lead thickness: 0.13 +0.051/–0.025 [0.005 +0.002/–0.001].  
.
DD  
6. Gold plating thickness: 1.14 0.38 micron [45 15 microinch] max.  
Find the latest and most complete information about products and packaging at the Infineon Internet page  
(http://www.infineon.com/rfpower)  
Data Sheet  
7 of 8  
Rev. 02.2, 2013-08-06  
PTFC262808FV V1  
Revision History: 2013-08-06  
Data Sheet  
Previous Version: 2013-07-24, Data Sheet; 2012-09-14, Advance Specification  
Page  
all  
Subjects (major changes since last revision)  
Product released to production, information complete and current.  
Order Code for Tape & Reel corrected.  
2
2
Order Code for Tray corrected.  
We Listen toYour Comments  
Any information within this document that you feel is wrong, unclear or missing at all?  
Your feedback will help us to continuously improve the quality of this document.  
Please send your proposal (including a reference to this document) to:  
(highpowerRF@infineon.com)  
To request other information, contact us at:  
+1 877 465 3667 (1-877-GO-LDMOS) USA  
or +1 408 776 0600 International  
Edition 2013-08-06  
Published by  
Infineon Technologies AG  
85579 Neubiberg, Germany  
© 2012 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.  
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the  
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com/rfpower).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in question,  
please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the express written approval of In-  
fineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device  
or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be  
implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be endangered.  
Data Sheet  
8 of 8  
Rev. 02.2, 2013-08-06  

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