IKW20N60T [INFINEON]

IGBT in Trench and Fieldstop technology with soft,fast recovery anti-parallel EmCon HE diode; IGBT的沟槽场终止和技术,柔软,快速恢复反并联EMCON何二极管
IKW20N60T
型号: IKW20N60T
厂家: Infineon    Infineon
描述:

IGBT in Trench and Fieldstop technology with soft,fast recovery anti-parallel EmCon HE diode
IGBT的沟槽场终止和技术,柔软,快速恢复反并联EMCON何二极管

晶体 二极管 晶体管 功率控制 双极性晶体管 栅 PC 局域网
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IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
Low Loss DuoPack : IGBT in Trench and Fieldstop technology  
with soft, fast recovery anti-parallel EmCon HE diode  
C
E
Very low VCE(sat) 1.5 V (typ.)  
Maximum Junction Temperature 175 °C  
Short circuit withstand time – 5µs  
Designed for :  
G
- Frequency Converters  
- Uninterrupted Power Supply  
Trench and Fieldstop technology for 600 V applications offers :  
- very tight parameter distribution  
- high ruggedness, temperature stable behavior  
- very high switching speed  
P-TO-247-3-1  
(TO-220AC)  
- low VCE(sat)  
Positive temperature coefficient in VCE(sat)  
Low EMI  
P-TO-220-3-1  
(TO-220AB)  
P-TO-263-3-2 (D²-PAK)  
(TO-263AB)  
Low Gate Charge  
Very soft, fast recovery anti-parallel EmCon HE diode  
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/  
Type  
VCE  
IC  
VCE(sat),Tj=25°C  
1.5V  
Tj,max  
175°C  
175°C  
175°C  
Marking Code  
K20T60  
Package Ordering Code  
TO-220 Q67040S4715  
TO-263 Q67040S4713  
TO-247 Q67040S4716  
IKP20N60T  
IKB20N60T  
IKW20N60T  
600V  
600V  
600V  
20A  
20A  
20A  
1.5V  
K20T60  
1.5V  
K20T60  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Collector-emitter voltage  
DC collector current, limited by Tjmax  
TC = 25°C  
VCE  
IC  
600  
V
A
40  
20  
TC = 100°C  
Pulsed collector current, tp limited by Tjmax  
ICpuls  
-
IF  
60  
60  
Turn off safe operating area (VCE 600V, Tj 175°C)  
Diode forward current, limited by Tjmax  
TC = 25°C  
40  
20  
TC = 100°C  
Diode pulsed current, tp limited by Tjmax  
Gate-emitter voltage  
IFpuls  
VGE  
tSC  
60  
±20  
5
V
Short circuit withstand time1)  
µs  
V
GE = 15V, VCC 400V, Tj 150°C  
Ptot  
Tj  
Tstg  
-
166  
W
Power dissipation TC = 25°C  
Operating junction temperature  
Storage temperature  
Soldering temperature, 1.6mm (0.063 in.) from case for 10s  
-40...+175  
-55...+175  
260  
°C  
1) Allowed number of short circuits: <1000; time between short circuits: >1s.  
1
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
Thermal Resistance  
Parameter  
Symbol  
Conditions  
Max. Value  
Unit  
Characteristic  
IGBT thermal resistance,  
junction – case  
RthJC  
TO-220-3-1  
TO-247-3-1  
0.9  
K/W  
TO-263-3-2  
Diode thermal resistance,  
junction – case  
RthJCD  
TO-220-3-1  
TO-247-3-1  
1.5  
TO-263-3-2  
Thermal resistance,  
junction – ambient  
RthJA  
TO-220-3-1  
TO-247-3-1  
TO-263-3-2 (6cm² Cu)  
62  
40  
40  
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified  
Value  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Static Characteristic  
Collector-emitter breakdown voltage V(BR)C ES  
V
GE=0V, IC=0.2mA  
600  
-
-
V
Collector-emitter saturation voltage  
VC E(sa t) VGE = 15V, IC=20A  
Tj=25°C  
-
-
1.5  
1.9  
2.05  
-
Tj=175°C  
Diode forward voltage  
VF  
VGE=0V, IF=20A  
-
-
1.65  
1.6  
2.05  
-
Tj=25°C  
Tj=175°C  
Gate-emitter threshold voltage  
Zero gate voltage collector current  
VGE(th )  
IC ES  
IC=290µA,VCE=VGE  
4.1  
4.9  
5.7  
V
C E=600V,  
µA  
V
GE=0V  
Tj=25°C  
Tj=175°C  
-
-
-
-
-
-
-
11  
-
40  
1000  
100  
-
Gate-emitter leakage current  
Transconductance  
IGES  
gfs  
V
V
C E=0V,VGE=20V  
C E=20V, IC=20A  
nA  
S
Integrated gate resistor  
RGint  
2
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
IKW20N60T  
TrenchStop Series  
Dynamic Characteristic  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Gate charge  
Ciss  
Coss  
Crss  
V
V
C E=25V,  
GE=0V,  
-
-
-
-
-
-
-
-
pF  
1100  
71  
32  
f=1MHz  
V
V
TO-220-3-1  
TO-247-3-1  
TO-263-3-2  
QGa te  
CC=480V, IC=20A  
GE=15V  
120  
nC  
nH  
Internal emitter inductance  
measured 5mm (0.197 in.) from case  
LE  
-
-
7
-
-
Short circuit collector current1)  
IC (SC)  
183.3  
A
V
GE=15V,tSC 5µs  
VCC = 400V,  
Tj 150°C  
Switching Characteristic, Inductive Load, at Tj=25 °C  
Value  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Turn-off delay time  
Fall time  
Turn-on energy  
Turn-off energy  
Total switching energy  
Anti-Parallel Diode Characteristic  
Diode reverse recovery time  
Diode reverse recovery charge  
td (on)  
tr  
td (off)  
tf  
Eon  
Eo ff  
Ets  
-
-
-
-
-
-
-
18  
14  
199  
42  
0.31  
0.46  
0.77  
-
-
-
-
-
-
-
ns  
Tj=25°C,  
V
V
CC=400V,IC=20A,  
GE=0/15V,  
RG=12 ,  
Lσ 2)=131nH,  
Cσ 2)=31pF  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery.  
trr  
Qrr  
-
-
-
-
41  
-
-
-
-
ns  
µC  
A
Tj=25°C,  
VR=400V, IF=20A,  
diF/dt=880A/µs  
0.31  
13.3  
711  
Diode peak reverse recovery current Irrm  
Diode peak rate of fall of reverse  
dirr/dt  
A/µs  
recovery current during tb  
1) Allowed number of short circuits: <1000; time between short circuits: >1s.  
2) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.  
3
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
Switching Characteristic, Inductive Load, at Tj=175 °C  
Value  
Unit  
Parameter  
Symbol  
Conditions  
min.  
Typ.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Turn-off delay time  
Fall time  
Turn-on energy  
Turn-off energy  
Total switching energy  
Anti-Parallel Diode Characteristic  
Diode reverse recovery time  
Diode reverse recovery charge  
td (on)  
tr  
td (off)  
tf  
Eon  
Eo ff  
Ets  
-
-
-
-
-
-
-
18  
18  
223  
76  
0.51  
0.64  
1.15  
-
-
-
-
-
-
-
ns  
Tj=175°C,  
V
V
CC=400V,IC=20A,  
GE=0/15V,  
RG= 12 Ω  
Lσ 1)=131nH,  
Cσ 1)=31pF  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery.  
trr  
Qrr  
-
-
-
-
176  
1.46  
18.9  
467  
-
-
-
-
ns  
µC  
A
Tj=175°C  
VR=400V, IF=20A,  
diF/dt=880A/µs  
Diode peak reverse recovery current Irrm  
Diode peak rate of fall of reverse  
dirr/dt  
A/µs  
recovery current during tb  
1) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.  
4
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
tp=2µs  
60A  
50A  
40A  
30A  
20A  
10A  
0A  
10µs  
10A  
1A  
TC=80°C  
TC=110°C  
50µs  
1ms  
Ic  
Ic  
10ms  
DC  
0.1A  
1V  
10Hz  
100Hz  
1kHz  
10kHz 100kHz  
10V  
100V  
1000V  
f, SWITCHING FREQUENCY  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 1. Collector current as a function of  
Figure 2. Safe operating area  
switching frequency  
(D = 0, TC = 25°C, Tj 175°C;  
(Tj 175°C, D = 0.5, VCE = 400V,  
VGE=15V)  
V
GE = 0/+15V, RG = 12)  
160W  
140W  
120W  
100W  
80W  
60W  
40W  
20W  
0W  
30A  
25A  
20A  
15A  
10A  
5A  
0A  
25°C  
75°C  
125°C  
25°C  
50°C  
75°C 100°C 125°C 150°C  
TC, CASE TEMPERATURE  
TC, CASE TEMPERATURE  
Figure 3. Power dissipation as a function of  
case temperature  
Figure 4. Collector current as a function of  
case temperature  
(Tj 175°C)  
(VGE 15V, Tj 175°C)  
5
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
50A  
40A  
30A  
20A  
10A  
0A  
50A  
V
GE=20V  
V
GE=20V  
15V  
40A  
30A  
20A  
10A  
0A  
15V  
13V  
13V  
11V  
9V  
11V  
9V  
7V  
7V  
0V  
1V  
2V  
3V  
0V  
1V  
2V  
3V  
4V  
VCE, COLLECTOR-EMITTER VOLTAGE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 5. Typical output characteristic  
Figure 6. Typical output characteristic  
(Tj = 25°C)  
(Tj = 175°C)  
35A  
30A  
25A  
20A  
15A  
2.5V  
IC=40A  
2.0V  
1.5V  
1.0V  
0.5V  
0.0V  
IC=20A  
IC=10A  
10A  
TJ=175°C  
5A  
0A  
25°C  
0°C  
50°C  
100°C  
150°C  
0V  
2V  
4V  
6V  
8V  
V
GE, GATE-EMITTER VOLTAGE  
Figure 7. Typical transfer characteristic  
TJ, JUNCTION TEMPERATURE  
Figure 8. Typical collector-emitter  
(VCE=10V)  
saturation voltage as a function of  
junction temperature  
(VGE = 15V)  
6
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
td(off)  
td(off)  
100ns  
10ns  
1ns  
tf  
tf  
100ns  
td(on)  
td(on)  
tr  
tr  
10ns  
0A  
5A 10A 15A 20A 25A 30A 35A  
10Ω  
20Ω  
30Ω  
40Ω  
50Ω  
60Ω  
70Ω  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 9. Typical switching times as a  
function of collector current  
(inductive load, TJ=175°C,  
Figure 10. Typical switching times as a  
function of gate resistor  
(inductive load, TJ = 175°C,  
V
CE = 400V, VGE = 0/15V, RG = 12,  
VCE= 400V, VGE = 0/15V, IC = 20A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
7V  
6V  
5V  
4V  
3V  
2V  
1V  
0V  
td(off)  
max.  
typ.  
100ns  
min.  
tf  
td(on)  
tr  
10ns  
25°C  
50°C  
75°C 100°C 125°C 150°C  
-50°C  
0°C  
50°C  
100°C  
150°C  
TJ, JUNCTION TEMPERATURE  
TJ, JUNCTION TEMPERATURE  
Figure 11. Typical switching times as a  
Figure 12. Gate-emitter threshold voltage as  
a function of junction temperature  
(IC = 0.29mA)  
function of junction temperature  
(inductive load, VCE = 400V,  
V
GE = 0/15V, IC = 20A, RG=12,  
Dynamic test circuit in Figure E)  
7
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
IKW20N60T  
TrenchStop Series  
*) Eon and Ets include losses  
*) Eon and Ets include losses  
due to diode recovery  
2.4mJ  
2.0mJ  
1.6mJ  
1.2mJ  
0.8mJ  
0.4mJ  
0.0mJ  
Ets*  
2.4mJ  
2.0mJ  
1.6mJ  
1.2mJ  
0.8mJ  
0.4mJ  
0.0mJ  
due to diode recovery  
Ets*  
Eoff  
Eoff  
Eon  
*
Eon*  
0A  
5A 10A 15A 20A 25A 30A 35A  
0Ω  
15Ω  
30Ω  
45Ω  
60Ω  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 13. Typical switching energy losses  
as a function of collector current  
(inductive load, TJ = 175°C,  
Figure 14. Typical switching energy losses  
as a function of gate resistor  
(inductive load, TJ = 175°C,  
V
CE = 400V, VGE = 0/15V, RG = 12,  
VCE = 400V, VGE = 0/15V, IC = 20A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
2.0mJ  
1.8mJ  
1.6mJ  
1.4mJ  
1.2mJ  
1.0mJ  
0.8mJ  
0.6mJ  
0.4mJ  
0.2mJ  
0.0mJ  
*) Eon and Ets include losses  
*) Eon and Ets include losses  
due to diode recovery  
Ets*  
due to diode recovery  
1.0mJ  
0.8mJ  
0.6mJ  
0.4mJ  
0.2mJ  
0.0mJ  
Ets*  
Eoff  
Eoff  
Eon*  
Eon  
*
25°C 50°C  
75°C 100°C 125°C 150°C  
300V 350V 400V 450V 500V 550V  
TJ, JUNCTION TEMPERATURE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 15. Typical switching energy losses  
as a function of junction  
temperature  
Figure 16. Typical switching energy losses  
as a function of collector emitter  
voltage  
(inductive load, VCE = 400V,  
(inductive load, TJ = 175°C,  
V
GE = 0/15V, IC = 20A, RG = 12,  
VGE = 0/15V, IC = 20A, RG = 12,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
8
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
1nF  
Ciss  
15V  
10V  
5V  
120V  
480V  
100pF  
10pF  
Coss  
Crss  
0V  
0V  
10V  
20V  
30V  
40V  
0nC  
30nC  
60nC  
90nC  
120nC  
Q
GE, GATE CHARGE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 17. Typical gate charge  
Figure 18. Typical capacitance as a function  
(IC=20 A)  
of collector-emitter voltage  
(VGE=0V, f = 1 MHz)  
12µs  
10µs  
8µs  
300A  
250A  
200A  
150A  
100A  
50A  
6µs  
4µs  
2µs  
0µs  
10V  
11V  
12V  
13V  
14V  
0A  
12V  
14V  
16V  
18V  
V
GE, GATE-EMITTETR VOLTAGE  
VGE, GATE-EMITETR VOLTAGE  
Figure 19. Typical short circuit collector  
current as a function of gate-  
emitter voltage  
Figure 20. Short circuit withstand time as a  
function of gate-emitter voltage  
(VCE=600V, start at TJ=25°C,  
T
Jmax<150°C)  
(VCE 400V, Tj 150°C)  
9
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
100K/W  
D=0.5  
D=0.5  
0.2  
0.2  
0.1  
R , ( K / W )  
0.13483  
0.58146  
0.44456  
0.33997  
τ , ( s )  
9.207*10-2  
1.821*10-2  
1.47*10-3  
1.254*10-4  
R2  
10-1K/W  
0.1  
6
R , ( K / W )  
0.18715  
0.31990  
0.30709  
0.07041  
τ , ( s )  
6.925*10-2  
1.085*10-2  
6.791*10-4  
9.59*10-5  
R2  
0.05  
10-1K/W  
R1  
0.05  
0.02  
0.02  
0.01  
R1  
C1=τ1/R1 C2=τ2/R2  
0.01  
10-2K/W  
single pulse  
C1=τ1/R1 C2=τ2/R2  
single pulse  
10-2K/W  
1µs  
1µs 10µs 100µs 1ms 10ms 100ms  
10µs 100µs 1ms 10ms 100ms  
tP, PULSE WIDTH  
tP, PULSE WIDTH  
Figure 21. IGBT transient thermal resistance  
Figure 22. Diode transient thermal  
(D = tp / T)  
impedance as a function of pulse  
width  
(D=tP/T)  
1.8µC  
1.6µC  
1.4µC  
1.2µC  
1.0µC  
0.8µC  
0.6µC  
0.4µC  
0.2µC  
TJ=175°C  
TJ=25°C  
250ns  
200ns  
150ns  
TJ=175°C  
100ns  
50ns  
TJ=25°C  
0ns  
600A/µs  
900A/µs  
1200A/µs  
600A/µs  
900A/µs  
1200A/µs  
diF/dt, DIODE CURRENT SLOPE  
diF/dt, DIODE CURRENT SLOPE  
Figure 23. Typical reverse recovery time as  
a function of diode current slope  
(VR=400V, IF=20A,  
Figure 24. Typical reverse recovery charge  
as a function of diode current  
slope  
Dynamic test circuit in Figure E)  
(VR = 400V, IF = 20A,  
Dynamic test circuit in Figure E)  
10  
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
TJ=175°C  
TJ=25°C  
24A  
20A  
16A  
12A  
8A  
-750A/µs  
-600A/µs  
-450A/µs  
-300A/µs  
-150A/µs  
TJ=25°C  
TJ=175°C  
4A  
0A/µs  
0A  
600A/µs  
900A/µs  
1200A/µs  
600A/µs  
900A/µs  
1200A/µs  
diF/dt, DIODE CURRENT SLOPE  
diF/dt, DIODE CURRENT SLOPE  
Figure 25. Typical reverse recovery current  
as a function of diode current  
slope  
Figure 26. Typical diode peak rate of fall of  
reverse recovery current as a  
function of diode current slope  
(VR=400V, IF=20A,  
(VR = 400V, IF = 20A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
TJ=25°C  
IF=40A  
50A  
2.0V  
1.5V  
1.0V  
0.5V  
0.0V  
175°C  
40A  
20A  
10A  
30A  
20A  
10A  
0A  
0°C  
50°C  
100°C  
150°C  
0V  
1V  
2V  
VF, FORWARD VOLTAGE  
Figure 27. Typical diode forward current as  
a function of forward voltage  
TJ, JUNCTION TEMPERATURE  
Figure 28. Typical diode forward voltage as a  
function of junction temperature  
11  
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
Dimensions  
[mm]  
TO-220AB  
symbol  
[inch]  
min  
9.70  
14.88  
0.65  
3.55  
2.60  
6.00  
13.00  
4.35  
0.38  
0.95  
max  
10.30  
15.95  
0.86  
3.7  
min  
Max  
A
B
C
D
E
F
0.3819  
0.5858  
0.0256  
0.1398  
0.1024  
0.2362  
0.5118  
0.1713  
0.0150  
0.0374  
0.4055  
0.6280  
0.0339  
0.1457  
0.1181  
0.2677  
0.5512  
0.1870  
0.0256  
0.0520  
3.00  
6.80  
14.00  
4.75  
0.65  
1.32  
G
H
K
L
M
N
P
T
2.54 typ.  
0.1 typ.  
4.30  
4.50  
1.40  
2.72  
0.1693  
0.0461  
0.0906  
0.1772  
0.0551  
0.1071  
1.17  
2.30  
TO-263AB (D2Pak)  
dimensions  
symbol  
[mm]  
[inch]  
min  
9.80  
0.70  
1.00  
1.03  
max  
10.20  
1.30  
1.60  
1.07  
min  
max  
A
B
C
D
E
F
0.3858  
0.0276  
0.0394  
0.0406  
0.4016  
0.0512  
0.0630  
0.0421  
2.54 typ.  
0.65 0.85  
5.08 typ.  
0.1 typ.  
0.0256  
0.0335  
G
H
K
L
0.2 typ.  
4.30  
4.50  
1.37  
9.45  
2.50  
0.1693  
0.0461  
0.3563  
0.0906  
0.1772  
0.0539  
0.3720  
0.0984  
1.17  
9.05  
2.30  
M
N
P
Q
R
S
T
15 typ.  
0.5906 typ.  
0.00  
4.20  
0.20  
5.20  
0.0000  
0.1654  
0.0079  
0.2047  
8° max  
8° max  
2.40  
0.40  
3.00  
0.60  
0.0945  
0.0157  
0.1181  
0.0236  
U
V
W
X
Y
Z
10.80  
1.15  
6.23  
4.60  
9.40  
16.15  
0.4252  
0.0453  
0.2453  
0.1811  
0.3701  
0.6358  
12  
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
dimensions  
TO-247AC  
symbol  
[mm]  
[inch]  
min  
4.78  
2.29  
1.78  
1.09  
1.73  
2.67  
max  
5.28  
2.51  
2.29  
1.32  
2.06  
3.18  
min  
max  
A
B
C
D
E
F
0.1882 0.2079  
0.0902 0.0988  
0.0701 0.0902  
0.0429 0.0520  
0.0681 0.0811  
0.1051 0.1252  
0.0299 max  
G
H
K
L
0.76 max  
20.80  
21.16  
16.15  
5.72  
0.8189 0.8331  
0.6161 0.6358  
0.2051 0.2252  
0.7799 0.8142  
0.1402 0.1941  
0.1421  
15.65  
5.21  
M
N
19.81  
3.560  
20.68  
4.930  
3.61  
P
Q
6.12  
6.22  
0.2409 0.2449  
13  
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
TrenchStop Series  
IKW20N60T  
i,v  
tr r =tS +tF  
diF /dt  
Qr r =QS +QF  
tr r  
IF  
tS  
tF  
t
QS  
10% Ir r m  
QF  
Ir r m  
dir r /dt  
VR  
90% Ir r m  
Figure C. Definition of diodes  
switching characteristics  
τ1  
τ2  
r 2  
τn  
r1  
r n  
T (t)  
j
p(t)  
r 2  
r1  
rn  
Figure A. Definition of switching times  
T
C
Figure D. Thermal equivalent  
circuit  
Figure E. Dynamic test circuit  
Figure B. Definition of switching losses  
14  
Rev. 2.2 Dec-04  
Power Semiconductors  
IKP20N60T, IKB20N60T  
IKW20N60T  
TrenchStop Series  
Published by  
Infineon Technologies AG,  
Bereich Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 2004  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,  
descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon  
Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in question  
please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of  
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or  
systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect  
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.  
15  
Rev. 2.2 Dec-04  
Power Semiconductors  

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