BSP88_09 [INFINEON]
SIPMOS Small-Signal-Transistor; SIPMOS小信号三极管![BSP88_09](http://pdffile.icpdf.com/pdf1/p00143/img/icpdf/BSP88_794394_icpdf.jpg)
型号: | BSP88_09 |
厂家: | ![]() |
描述: | SIPMOS Small-Signal-Transistor |
文件: | 总8页 (文件大小:376K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Rev. 2.1
BSP88
ꢀ
SIPMOS ꢁSmall-Signal-Transistor
Product Summary
Feature
V
240
6
V
ꢀ
A
DS
S N-Channel
S Enhancement mode
S Logic Level
R
I
0.35
D
PG-SOT223
S dv/dt rated
Pb-free lead plating; RoHS compliant
4
•
•
2.8V rated
3
x Qualified according to AEC Q101
2
1
VPS05163
Marking Packaging
BSP88
Non dry
Type
BSP88
Package
PG-SOT223
Tape and Reel Information
L6327: 1000 pcs/reel
Maximum Ratings, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Value
Unit
A
Continuous drain current
I
D
T =25°C
0.35
0.28
1.4
A
T =70°C
A
Pulsed drain current
I
D puls
T =25°C
A
6
kV/µs
V
Reverse diode dv/dt
dv/dt
I =0.35A, V =192V, di/dt=200A/µs, T
=150°C
S
DS jmax
Gate source voltage
ESD class (JESD22-A114-HBM)
Power dissipation
V
P
±20
1A (>250V, <500V)
1.8
GS
tot
W
T =25°C
A
°C
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
T
,
T
-55... +150
55/150/56
Page 1
2009-08-18
Rev. 2.1
BSP88
Thermal Characteristics
Parameter
Symbol
Values
typ. max.
Unit
min.
Characteristics
-
-
25
K/W
Thermal resistance, junction - soldering point
(Pin 4)
SMD version, device on PCB:
R
R
thJS
thJA
@ min. footprint
-
-
-
-
115
70
2
@ 6 cm cooling area 1)
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
min.
240
0.6
typ. max.
Static Characteristics
Drain-source breakdown voltage
-
-
V
V
V
(BR)DSS
GS(th)
V
=0, I =250µA
GS
D
1
1.4
Gate threshold voltage, V = V
GS
DS
I =108µA
D
µA
Zero gate voltage drain current
I
DSS
V
=240V, V =0, T =25°C
-
-
-
-
-
1
0.1
10
10
DS
DS
GS
j
V
=240V, V =0, T =150°C
GS
j
nA
Gate-source leakage current
I
GSS
V
=20V, V =0
GS DS
Drain-source on-state resistance
R
-
-
-
4.9
4.6
4
15
7.5
6
ꢀ
DS(on)
DS(on)
DS(on)
V
=2.8V, I =0.014A
GS
D
Drain-source on-state resistance
R
R
V
=4.5V, I =0.32A
GS
D
Drain-source on-state resistance
V
=10V, I =0.35A
GS
D
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2009-08-18
Rev. 2.1
Electrical Characteristics, at T = 25 °C, unless otherwise specified
BSP88
Parameter
Symbol
Conditions
Values
Unit
min.
typ. max.
Dynamic Characteristics
V
O2*I *R ,
DS(on)max
0.19
0.38
-
S
Transconductance
g
DS
D
fs
I =0.28A
D
V
=0, V =25V,
GS DS
-
-
-
-
-
-
-
76
12
6
3.6
3.5
17.9
18.9
95
15
9
5.4 ns
5.2
pF
Input capacitance
Output capacitance
Reverse transfer capacitance C
Turn-on delay time
Rise time
Turn-off delay time
Fall time
C
C
iss
f=1MHz
oss
rss
V
=120V, V =4.5V,
DD GS
t
d(on)
I =0.35A, R =15ꢀ
t
D
G
r
26.8
28.3
t
t
Gate Charge Characteristics
Gate to source charge
Gate to drain charge
V
=192V, I =0.35A
-
-
-
0.2
2
4.5
0.3 nC
3
6.8
Q
Q
Q
DD
D
gs
gd
g
V
V
=192V, I =0.35A,
Gate charge total
DD
GS
D
=0 to 10V
V
=192V, I = 0.35 A
-
-
2.7
-
-
V
Gate plateau voltage
V
DD
D
Reverse Diode
Inverse diode continuous
forward current
Inv. diode direct current, pulsed I
Inverse diode forward voltage V
T =25°C
0.35 A
1.4
1.2
82
I
S
A
-
-
-
-
-
SM
V
=0, I = I
GS
0.86
66
119
V
ns
F
S
SD
t
rr
Q
rr
V =120V, I =l ,
F S
Reverse recovery time
Reverse recovery charge
R
di /dt=100A/µs
149 nC
F
Page 3
2009-08-18
Rev. 2.1
BSP88
1 Power dissipation
2 Drain current
I = f (T )
P
= f (T )
tot
A
D
A
parameter: V O 10 V
GS
BSP88
BSP88
1.9
W
0.38
A
1.6
1.4
1.2
1
0.32
0.28
0.24
0.2
0.8
0.6
0.4
0.2
0
0.16
0.12
0.08
0.04
0
0
20
40
60
80 100 120
160
0
20
40
60
80 100 120
160
°C
T
°C
T
A
A
3 Safe operating area
I = f ( V
4 Transient thermal impedance
Z = f (t )
thJA
)
D
DS
p
parameter : D = 0 , T = 25 °C
parameter : D = t /T
A
p
10 1
10 2
BSP88
BSP88
A
K/W
10 1
t
= 160.0µs
p
10 0
1 ms
10 ms
10 -1
10 -2
10 -3
10 0
D = 0.50
0.20
0.10
0.05
single pulse
10 -1
0.02
DC
0.01
10 -2
10 0
10 1
10 2
10 3
10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2
10 4
V
s
V
t
DS
p
Page 4
2009-08-18
Rev. 2.1
BSP88
5 Typ. output characteristic
I = f (V )
6 Typ. drain-source on resistance
= f (I )
R
D
DS
DS(on)
D
parameter: T = 25 °C, V
parameter: Tj = 25 °C, V
j
GS
GS
9
0.64
3.4V
3.8V
4.4V
5V
2.6V
3.2V
ꢀ
3.2V
A
3.4V
3.8V
4V
6V
7
6
5
4
3
2
1
0
0.48
7V
4.4V
10V
5V
6V
0.4
7V
10V
2.6V
0.32
0.24
0.16
0.08
0
0
0.5
1
1.5
2
2.5
3
4
0
0.08 0.16 0.24 0.32 0.4 0.48
0.64
V
A
V
I
DS
D
7 Typ. transfer characteristics
8 Typ. forward transconductance
g = f(I )
I = f ( V ); V O 2 x I x R
D
GS
DS
D
DS(on)max
fs
D
parameter: Tj = 25 °C
parameter: Tj = 25 °C
0.64
0.6
A
S
0.48
0.4
0.4
0.3
0.2
0.1
0
0.32
0.24
0.16
0.08
0
0
0.5
1
1.5
2
2.5
3.5
GS
0
0.08 0.16 0.24 0.32 0.4 0.48
0.64
V
A
V
I
D
Page 5
2009-08-18
Rev. 2.1
BSP88
9 Drain-source on-state resistance
= f (T )
10 Typ. gate threshold voltage
V = f (T )
GS(th)
parameter: V = V ; I = 108 µA
GS DS D
R
DS(on)
j
j
parameter : I = 0.35 A, V = 10 V
D
GS
BSP88
1.8
30
ꢀ
V
98%
24
22
20
18
16
14
12
10
8
1.4
1.2
1
typ.
2%
0.8
0.6
0.4
0.2
0
98%
6
typ
4
2
0
°C
°C
-60
-20
20
60
100
180
-60
-20
20
60
100
160
T
T
j
j
11 Typ. capacitances
C = f (V )
12 Forward character. of reverse diode
I = f (V )
DS
F
SD
parameter: V =0, f=1 MHz, Tj = 25 °C
parameter: T
GS
j
10 3
10 1
BSP88
pF
A
Ciss
10 2
10 0
Coss
10 1
10 -1
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
Crss
10 0
10 -2
V
0
5
10
15
20
30
DS
0
0.4
0.8
1.2
1.6
2
2.4
3
V
V
V
SD
Page 6
2009-08-18
Rev. 2.1
BSP88
13 Typ. gate charge
= f (Q ); parameter: V
14 Drain-source breakdown voltage
V
,
V
= f (T )
GS
G
DS
(BR)DSS
j
I = 0.35 A pulsed, T = 25 °C
D
j
BSP88
BSP88
16
V
291
V
276
271
266
261
256
251
246
241
236
231
226
221
216
12
10
8
0.2 VDS max
0.5 VDS max
0.8 VDS max
6
4
2
0
nC
0
1
2
3
4
5
7
-60
-20
20
60
100
180
°C
Q
T
j
G
Page 7
2009-08-18
Rev. 2.1
BSP88
Page 8
2009-08-18
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