BAS125-05WE6327 [INFINEON]

Rectifier Diode, Schottky, 2 Element, 0.1A, Silicon;
BAS125-05WE6327
型号: BAS125-05WE6327
厂家: Infineon    Infineon
描述:

Rectifier Diode, Schottky, 2 Element, 0.1A, Silicon

光电二极管
文件: 总8页 (文件大小:99K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BAS125...  
Silicon Schottky Diodes  
For low-loss, fast-recovery, meter protection,  
bias isolation and clamping application  
Integrated diffused guard ring  
Low forward voltage  
1)  
Pb-free (RoHS compliant) package  
Qualified according AEC Q101  
BAS125-04W  
BAS125-05W  
BAS125-06W  
BAS125-07W  
3
3
3
4
3
D
1
D
2
D
2
D
2
D
1
D
1
D
1
D
2
1
2
1
2
1
2
1
2
ESD (Electrostatic discharge) sensitive device, observe handling precaution!  
Type  
Package  
SOT323  
SOT323  
SOT323  
SOT343  
Configuration  
series  
L (nH) Marking  
S
BAS125-04W  
BAS125-05W  
BAS125-06W  
BAS125-07W  
1.4  
1.4  
1.4  
1.6  
14s  
15s  
16s  
17s  
common cathode  
common anode  
parallel pair  
Maximum Ratings at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Value  
Unit  
V
25  
Diode reverse voltage  
Forward current  
V
R
100  
500  
mA  
I
I
F
Non-repetitive peak surge forward current  
Total power dissipation  
FSM  
mW  
°C  
P
tot  
BAS125-04W, BAS125-06W, T 84°C  
250  
250  
250  
S
BAS125-05W, T 76°C  
S
BAS125-07W, T 96°C  
S
150  
Junction temperature  
Storage temperature  
T
T
j
-55 ... 150  
stg  
1Pb-containing package may be available upon special request  
2007-04-19  
1
BAS125...  
Thermal Resistance  
Parameter  
Symbol  
Value  
Unit  
1)  
K/W  
Junction - soldering point  
R
thJS  
BAS125-04W, BAS125-06W  
BAS125-05W  
365  
295  
215  
BAS125-07W  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
DC Characteristics  
Reverse current  
I
nA  
R
V = 20 V  
-
-
-
-
100  
150  
R
V = 25 V  
R
mV  
Forward voltage  
V
F
I = 1 mA  
-
-
-
385  
530  
800  
400  
650  
950  
F
I = 10 mA  
F
I = 35 mA  
F
2)  
-
-
20  
Forward voltage matching  
V  
F
I = 10 mA  
F
AC Characteristics  
-
-
-
1.1 pF  
Diode capacitance  
C
R
T
F
V = 0 , f = 1 MHz  
R
Differential forward resistance  
15  
-
I = 5 mA, f = 10 kHz  
F
1For calculation of R  
please refer to Application Note Thermal Resistance  
thJA  
2V is the difference between lowest and highestV in a multiple diode component.  
F
F
2007-04-19  
2
BAS125...  
Diode capacitance C = ƒ (V )  
Forward resistance r = ƒ (I )  
f F  
T
R
f = 1MHz  
f = 10 kHz  
BAS 125...  
EHD07117  
BAS 125...  
EHD07118  
104  
1.0  
pF  
C T  
r f  
0.8  
103  
102  
101  
100  
0.6  
0.4  
0.2  
0.0  
10-2  
10-1  
100  
101 mA 102  
0
10  
V
20  
Ι F  
VR  
Reverse current I = ƒ(V )  
Forward current I = ƒ (V )  
F F  
R
R
T = Parameter  
T = Parameter  
A
A
BAS 125...  
EHD07115  
BAS 125...  
EHD07116  
102  
101  
Ι F  
Ι R  
TA = 125 C  
TA = 85 C  
mA  
µA  
101  
100  
10-1  
10-2  
TA = -40C  
25 C  
85 C  
150 C  
100  
10-1  
TA = 25 C  
10-3  
0
10-2  
0.0  
10  
V
20  
0.5  
V
1.0  
VR  
VF  
2007-04-19  
3
BAS125...  
Forward current I = ƒ (T )  
Forward current I = ƒ (T )  
F S  
F
S
BAS125-04W, BAS125-06W  
BAS125-05W  
120  
mA  
120  
mA  
80  
60  
40  
20  
0
80  
60  
40  
20  
0
°C  
°C  
0
15 30 45 60 75 90 105 120  
150  
0
15 30 45 60 75 90 105 120  
150  
T
T
S
S
Forward current I = ƒ (T )  
F
S
BAS125-07W  
120  
mA  
80  
60  
40  
20  
0
°C  
0
15 30 45 60 75 90 105 120  
150  
T
S
2007-04-19  
4
BAS125...  
Permissible Puls Load R  
= ƒ (t )  
Permissible Pulse Load  
I / I = ƒ (t )  
Fmax FDC  
thJS  
p
BAS125-04W, BAS125-06W  
p
BAS125-04W, BAS125-06W  
10 2  
10 3  
K/W  
-
D = 0  
10 2  
0.005  
0.01  
0.02  
0.05  
0.1  
10 1  
0.5  
0.2  
0.1  
0.2  
0.5  
10 1  
0.05  
0.02  
0.01  
0.005  
D = 0  
10 0  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
10 0  
s
s
t
t
p
p
Permissible Puls Load R  
= ƒ (t )  
Permissible Pulse Load  
I / I = ƒ (t )  
Fmax FDC  
thJS  
p
BAS125-05W  
p
BAS125-05W  
10 1  
10 3  
10 2  
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
-
0.5  
0.2  
0.5  
0.2  
0.1  
10 1  
0.05  
0.02  
0.01  
0.005  
D = 0  
10 0  
10 -6  
10 0  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
t
t
p
p
2007-04-19  
5
Package SOT323  
BAS125...  
Package Outline  
±0.1  
0.9  
±0.2  
2
0.1 MAX.  
0.1  
+0.1  
3x  
0.3  
-0.05  
M
0.1  
A
3
1
2
+0.1  
0.15  
-0.05  
0.65 0.65  
M
0.2  
A
Foot Print  
0.6  
0.65  
0.65  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
BCR108W  
Type code  
Pin 1  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
Pin 1  
2.15  
1.1  
2007-04-19  
6
Package SOT343  
BAS125...  
Package Outline  
±0.1  
0.9  
±0.2  
2
0.1 MAX.  
0.1  
1.3  
A
4
1
3
2
0.15  
+0.1  
+0.1  
-0.05  
0.3  
0.15  
-0.05  
+0.1  
0.6  
4x  
-0.05  
M
0.2  
A
M
0.1  
Foot Print  
0.6  
1.15  
0.9  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
BGA420  
Type code  
Pin 1  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
2.15  
Pin 1  
1.1  
2007-04-19  
7
BAS125...  
Edition 2006-02-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2007.  
All Rights Reserved.  
Attention please!  
The information given in this dokument shall in no event be regarded as a guarantee  
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any  
examples or hints given herein, any typical values stated herein and/or any information  
regarding the application of the device, Infineon Technologies hereby disclaims any  
and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest  
Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that  
device or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons  
may be endangered.  
2007-04-19  
8

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