AUIRLR2908 [INFINEON]

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET;
AUIRLR2908
型号: AUIRLR2908
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

文件: 总13页 (文件大小:238K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 97734  
AUTOMOTIVEGRADE  
AUIRLR2908  
Features  
HEXFET® Power MOSFET  
l AdvancedPlanarTechnology  
l Logic-LevelGateDrive  
l LowOn-Resistance  
l 175°COperatingTemperature  
l Fast Switching  
D
V(BR)DSS  
80V  
RDS(on) typ.  
max  
ID (Silicon Limited)  
22.5m  
28m  
39A  
G
l FullyAvalancheRated  
l RepetitiveAvalancheAllowed  
up to Tjmax  
S
ID (Package Limited)  
30A  
l Lead-Free,RoHSCompliant  
l AutomotiveQualified*  
D
Description  
Specifically designed for Automotive applications,  
this Stripe Planar design of HEXFET® Power  
MOSFETs utilizes the latest processing techniques  
to achieve low on-resistance per silicon area. This  
benefit combined with the fast switching speed and  
ruggedized device design that HEXFET power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in Automotive and a wide variety of other applications.  
S
G
D-Pak  
AUIRLR2908  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
39  
Parameter  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
@ T = 25°C  
C
I
I
I
I
D
D
D
28  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
A
@ T = 100°C  
C
30  
@ T = 25°C  
C
150  
DM  
120  
0.77  
± 16  
P
@T = 25°C Power Dissipation  
W
W/°C  
V
D
C
Linear Derating Factor  
Gate-to-Source Voltage  
V
GS  
EAS  
AS (tested )  
180  
250  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
E
IAR  
See Fig. 12a, 12b, 15, 16  
A
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
mJ  
2.3  
V/ns  
-55 to + 175  
T
T
J
Storage Temperature Range  
°C  
STG  
300  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.3  
Units  
RJC  
RJA  
RJA  
Junction-to-Case  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
40  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
10/17/11  
AUIRLR2908  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
80 ––– –––  
Conditions  
VGS = 0V, ID = 250μA  
V(BR)DSS  
V
V(BR)DSS/ TJ  
Breakdown Voltage Temp. Coefficient ––– 0.085 ––– V/°C Reference to 25°C, ID = 1mA  
RDS(on)  
Static Drain-to-Source On-Resistance  
–––  
–––  
1.0  
22.5  
25  
28  
30  
VGS = 10V, ID = 23A  
GS = 4.5V, ID = 20A  
VDS = VGS, ID = 250μA  
DS = 25V, ID = 23A  
m  
V
VGS(th)  
Gate Threshold Voltage  
–––  
–––  
–––  
–––  
–––  
2.5  
–––  
20  
V
S
gfs  
IDSS  
Forward Transconductance  
Drain-to-Source Leakage Current  
35  
V
–––  
–––  
–––  
–––  
μA VDS = 80V, VGS = 0V  
VDS = 80V, VGS = 0V, TJ = 125°C  
nA VGS = 16V  
250  
200  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
––– -200  
VGS = -16V  
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter Min. Typ. Max. Units Conditions  
Total Gate Charge  
Qg  
Qgs  
Qgd  
td(on)  
tr  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
22  
6.0  
11  
12  
95  
36  
55  
4.5  
33  
9.1  
17  
ID = 23A  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
nC VDS = 64V  
V
V
GS = 4.5V  
DD = 40V  
–––  
–––  
–––  
–––  
–––  
ID = 23A  
ns RG = 8.3  
VGS = 4.5V  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
LD  
D
S
Internal Drain Inductance  
Between lead,  
nH 6mm (0.25in.)  
from package  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
and center of die contact  
Ciss  
Input Capacitance  
––– 1890 –––  
VGS = 0V  
Coss  
Output Capacitance  
–––  
–––  
260  
35  
–––  
–––  
pF VDS = 25V  
Crss  
Reverse Transfer Capacitance  
Output Capacitance  
ƒ = 1.0MHz, See Fig. 5  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
Coss  
––– 1920 –––  
Coss  
Output Capacitance  
Effective Output Capacitance  
–––  
–––  
170  
310  
–––  
–––  
V
V
GS = 0V, VDS = 64V, ƒ = 1.0MHz  
GS = 0V, VDS = 0V to 64V  
Coss eff.  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
D
I
I
Continuous Source Current  
–––  
–––  
MOSFET symbol  
39  
S
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
G
–––  
–––  
150  
SM  
S
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
75  
1.3  
110  
310  
V
T = 25°C, I = 23A, V = 0V  
SD  
J S GS  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
ns T = 25°C, I = 23A, VDD = 25V  
J F  
rr  
di/dt = 100A/μs  
Q
t
210  
nC  
rr  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
on  
Notes:  
 Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11).  
‚ Limited by TJmax, starting TJ = 25°C, L = 0.71mH, RG = 25, IAS = 23A, VGS =10V. Part not recommended for use above  
this value.  
ƒ ISD 23A, di/dt 400A/μs, VDD V(BR)DSS, TJ 175°C.  
„ Pulse width 1.0ms; duty cycle 2%.  
Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS  
† Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive avalanche performance.  
‡ This value determined from sample failure population, starting TJ = 25°C, L = 0.71mH, RG = 25, IAS = 23A,  
VGS =10V.  
.
ˆ When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques  
refer to application note #AN-994.  
‰ Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 30A.  
Š Ris measured at TJ of approximately 90°C.  
2
www.irf.com  
AUIRLR2908  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive qualification.  
IR’s Industrial and Consumer qualification level is granted by  
extension of the higher Automotive level.  
D-Pak  
MSL1  
Class M3 (+/- 400V) †††  
Moisture Sensitivity Level  
Machine Model  
AEC-Q101-002  
Class H1C (+/- 1500V) †††  
AEC-Q101-001  
Human Body Model  
ESD  
Class C5 (+/- 2000V) †††  
AEC-Q101-005  
Yes  
Charged Device Model  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions (if any) to AEC-Q101 requirements are noted in the qualification report.  
††† Highest passing voltage.  
www.irf.com  
3
AUIRLR2908  
1000  
100  
10  
1000  
VGS  
15V  
10V  
4.5V  
4.0V  
3.5V  
3.0V  
2.7V  
2.5V  
VGS  
15V  
10V  
4.5V  
4.0V  
3.5V  
3.0V  
2.7V  
2.5V  
TOP  
TOP  
100  
10  
BOTTOM  
BOTTOM  
2.5V  
2.5V  
1
1
0.1  
0.01  
20μs PULSE WIDTH  
Tj = 175°C  
20μs PULSE WIDTH  
Tj = 25°C  
0.1  
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1000  
60  
T
= 25°C  
J
50  
40  
30  
20  
10  
0
100  
10  
1
T
= 175°C  
J
T
= 175°C  
J
T
= 25°C  
J
V
= 25V  
DS  
20μs PULSE WIDTH  
VDS = 10V  
20μs PULSE WIDTH  
2
3
4
5
0
10  
20  
30  
40  
50  
60  
V
, Gate-to-Source Voltage (V)  
GS  
I , Drain-to-Source Current (A)  
D
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
vs. Drain Current  
4
www.irf.com  
AUIRLR2908  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
100000  
10000  
1000  
100  
V
= 0V,  
f = 1 MHZ  
GS  
I = 23A  
D
C
= C + C , C SHORTED  
V
V
V
= 64V  
= 40V  
= 16V  
iss  
gs gd ds  
DS  
DS  
DS  
C
= C  
rss  
gd  
C
= C + C  
ds gd  
oss  
C
C
iss  
oss  
rss  
C
10  
0
5
10  
15  
20  
25  
1
10  
, Drain-to-Source Voltage (V)  
100  
Q
Total Gate Charge (nC)  
V
G
DS  
Fig 6. Typical Gate Charge vs.  
Fig 5. Typical Capacitance vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
1000  
100  
10  
1000.00  
100.00  
10.00  
1.00  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
T
= 175°C  
J
100μsec  
1msec  
T
= 25°C  
J
1
10msec  
Tc = 25°C  
Tj = 175°C  
V
= 0V  
Single Pulse  
GS  
0.1  
0.10  
1
10  
100  
1000  
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8  
, Source-to-Drain Voltage (V)  
V
, Drain-to-Source Voltage (V)  
V
DS  
SD  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
www.irf.com  
5
AUIRLR2908  
40  
35  
30  
25  
20  
15  
10  
5
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
I
= 38A  
D
V
= 4.5V  
GS  
0
25  
50  
75  
100  
125  
150  
175  
-60 -40 -20  
T
0
20 40 60 80 100 120 140 160 180  
T
, Case Temperature (°C)  
, Junction Temperature (°C)  
C
J
Fig 9. Maximum Drain Current vs.  
Fig 10. Normalized On-Resistance  
Case Temperature  
vs. Temperature  
10  
1
0.1  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
P
DM  
t
0.01  
0.001  
1
SINGLE PULSE  
( THERMAL RESPONSE )  
t
2
Notes:  
1. Duty factor D =  
t
/ t  
1
2
2. Peak T  
= P  
x
Z
+ T  
J
DM  
thJC  
C
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRLR2908  
15V  
400  
300  
200  
100  
0
I
D
TOP  
9.3A  
16A  
BOTTOM 23A  
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
20V  
VGS  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
I
AS  
Fig 12c. Maximum Avalanche Energy  
Fig 12b. Unclamped Inductive Waveforms  
vs. Drain Current  
Q
G
10 V  
Q
Q
GD  
GS  
2.5  
2.0  
1.5  
1.0  
0.5  
V
G
Charge  
Fig 13a. Basic Gate Charge Waveform  
I
= 250μA  
D
Current Regulator  
Same Type as D.U.T.  
50K  
.2F  
12V  
.3F  
+
V
DS  
D.U.T.  
-
-75 -50 -25  
0
25 50 75 100 125 150 175 200  
V
GS  
T
, Temperature ( °C )  
J
3mA  
I
I
D
G
Current Sampling Resistors  
Fig 14. Threshold Voltage vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRLR2908  
1000  
Duty Cycle = Single Pulse  
100  
Allowed avalanche Current vs  
avalanche pulsewidth, tav  
0.01  
assuming  
Tj = 25°C due to  
avalanche losses  
10  
0.05  
0.10  
1
0.1  
1.0E-08  
1.0E-07  
1.0E-06  
1.0E-05  
tav (sec)  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
Fig 15. Typical Avalanche Current vs.Pulsewidth  
200  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
TOP  
BOTTOM 10% Duty Cycle  
= 23A  
Single Pulse  
I
D
150  
100  
50  
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
7. T = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
0
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
vs. Temperature  
8
www.irf.com  
AUIRLR2908  
Driver Gate Drive  
P.W.  
P.W.  
D =  
Period  
D.U.T  
Period  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
 Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dtcontrolledbyRG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth µs  
Duty Factor  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
www.irf.com  
9
AUIRLR2908  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
D-Pak Part Marking Information  
PartNumber  
AULR2908  
DateCode  
Y= Year  
WW= Work Week  
A=Automotive,LeadFree  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRLR2908  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
11  
AUIRLR2908  
Ordering Information  
Base part  
number  
Package Type  
Standard Pack  
Complete Part Number  
Form  
Tube  
Tape and Reel  
Tape and Reel Left  
Tape and Reel Right  
Quantity  
75  
2000  
3000  
3000  
AUIRLR2908  
Dpak  
AUIRLR2908  
AUIRLR2908TR  
AUIRLR2908TRL  
AUIRLR2908TRR  
12  
www.irf.com  
AUIRLR2908  
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aerospace or other applications. Buyers acknowledge and agree that any use of IR products not certified by  
DLA as military-grade, in applications requiring military grade products, is solely at the Buyer’s own risk and  
that they are solely responsible for compliance with all legal and regulatory requirements in connection with  
such use.  
IR products are neither designed nor intended for use in automotive applications or environments unless  
the specific IR products are designated by IR as compliant with ISO/TS 16949 requirements and bear a part  
number including the designation “AU”. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, IR will not be responsible for any failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLDHEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
www.irf.com  
13  

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