AUIRB24427S_15 [INFINEON]

Matched propagation delay for both channels;
AUIRB24427S_15
型号: AUIRB24427S_15
厂家: Infineon    Infineon
描述:

Matched propagation delay for both channels

文件: 总20页 (文件大小:796K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AUIRB24427S  
Features  
Product Summary  
Topology  
Very low output resistance  
Dual Low Side Driver  
12.5 V 24 V  
> 6 A  
Extended supply voltage range: 12.5V to 24V  
TTL/CMOS compatible inputs  
CMOS Schmitt-triggered inputs  
Matched propagation delay for both channels  
Outputs in phase with inputs  
Enable function  
Under Voltage Lock Out function  
Automotive Qualified  
Leadfree, RoHS compliant  
VOUT  
Io+ & I o- (VCC=15V)  
Output Resistance  
(max)  
0.65 Ohm  
55ns  
tON & tOFF (max)  
Typical Applications  
Package  
Automotive General Purpose Dual  
Low Side Driver  
Gate transformer driver  
Bridge Tied Gate Transformer Driver  
DC-DC converters secondary side driver  
Hybrid Power Train Driver  
PSOIC-8N  
Typical Connection Diagram  
Logic level  
Rg  
Rg  
EN  
NC  
OUTA  
VCC  
input  
TO  
INA  
LOAD  
COM  
INB  
+
-
Vbatt  
OUTB  
Standard Pack  
Note  
Orderable Part Number  
AUIRB24427STR  
Package Type  
PSOIC8-N  
Form  
Tape & Reel  
Quantity  
2500  
Sept 29nd, 2014  
1
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Absolute Maximum Ratings  
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage  
parameters are absolute voltages referenced to COM lead. Stresses beyond those listed under "  
Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only; and  
functional operation of the device at these or any other condition beyond those indicated in the ―Recommended  
Operating Conditions‖ is not implied. Exposure to absolute-maximum-rated conditions for extended periods may  
affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted  
and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Symbol  
Definition  
Min.  
Max.  
Units  
Vcc  
Fixed supply voltage  
-0.3  
24  
VO  
VIN  
VEN  
RthJc  
TJ  
Output voltage  
-0.3  
-0.3  
-0.3  
24  
5.5  
5.5  
4
V
Logic input voltage  
Logic enable voltage  
Thermal resistance, junction to case  
Junction temperature  
°C/W  
°C  
150  
150  
300  
Storage temperature  
TS  
-55  
Lead temperature (soldering, 10 seconds)  
TL  
Recommended Operating Conditions  
For proper operation the device should be used within the recommended conditions.  
All voltage parameters are absolute voltage referenced to COM.  
Symbol  
Definition  
Min.  
Max.  
Units  
Vcc  
VO  
VIN  
VEN  
TA  
Fixed supply voltage  
Output voltage  
5
0
20  
VCC  
5
V
Logic input voltage  
Logic enable voltage  
Ambient temperature  
External gate resistance  
0
0
5
-40  
2.5  
125  
°C  
Rg  
  
VCC to COM bypass capacitance X7R  
dielectric type.  
CBP  
1
F  
Sept 29nd, 2014  
2
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Static Electrical Characteristics  
Unless otherwise specified, these specifications apply for an operating junction temperature range  
of -40°CTa125°C and power supply VCC=15 V. The VIN and IIN parameters are referenced to COM and are  
applicable to input leads: INA and INB. The VO and IO parameters are referenced to COM and are applicable to the  
output leads: OUTA and OUTB.  
Symbol  
Definition  
Min  
Typ  
Max Units Test Conditions  
VIL  
Logic ―0‖ input voltage  
0.8  
VIH  
VHYS-IN  
VENL  
Logic ―1‖ input voltage  
Input voltage hysteresis  
Logic ―0‖ enable voltage  
Logic ―1‖ enable voltage  
Enable voltage hysteresis  
2.5  
0.8  
V
0.8  
VENH  
2.5  
0.8  
VHYS-EN  
ROH+25  
ROL+25  
ROH+125  
ROL+125  
VOH+25  
VOL+25  
VOH+125  
VOL+125  
IIN+  
Source Output resistance  
Sink Output resistance  
450  
Ta=+25C  
450  
m  
Source Output resistance  
Sink Output resistance  
650  
Ta=+125C  
650  
Output high level voltage Vcc-Vo  
Output low level voltage Vo  
Output high level voltage Vcc-Vo  
Output low level voltage Vo  
Logic ―1‖ input bias current  
Logic ―0‖ input bias current  
Quiescent supply current  
450  
Ta=+25C, Iout=100mA  
450  
mV  
650  
Ta=+125C, Iout=100mA  
650  
25  
50  
1
VIN=5V, VCC=15V  
VIN=0V, VCC=15V  
µA  
IIN-  
VCC=15V, INA & INB  
not switching  
IQB  
0.5  
1.2  
1.5  
2.5  
mA  
VCCUVHYS Vcc supply undervoltage hysteresis  
VCCUV+  
Vcc supply undervoltage turn on threshold  
Vcc supply undervoltage turn off threshold  
10.5  
11.5  
10.0  
12.6  
11  
V
A
VCCUV-  
IO+  
9.0  
6
†)  
Output high short circuit pulsed current(  
Output high short circuit pulsed current(  
VCC=15V, PW<10us  
VCC=15V, PW<10us  
†)  
IO-  
6
†) Guaranteed by design  
(
Sept 29nd, 2014  
3
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Dynamic Electrical Characteristics  
Unless otherwise noted, these specifications apply for an operating junction temperature range of -40°CTa125°C  
with bias conditions of VCC = 15 V, CL = 4700pF. Refer to Figure T2 for switching time definition and to Figure T3 for  
switching time test circuit (page 15).  
Symbol  
Definition  
Min Typ Max Units Test Conditions  
Propagation delay characteristics  
TON  
TOFF  
TON-EN  
TOFF-EN  
tr  
Turn-on propagation delay  
Turn-off propagation delay  
Enable Turn-on propagation delay  
Enable Turn-off propagation delay  
Turn-on rise time  
40  
55  
40  
55  
33  
33  
ns  
CBP=10uF  
tf  
Turn-off fall time  
Input/Output table  
EN  
L
INA  
INB  
OUTA  
OUTB  
X
X
L
L
L
H
L
L
L
H
L
H
L
L
H
H
H
This table is held true in the voltages ranges defined in the recommended conditions section.  
See also Fig. T1 on page 14.  
Sept 29nd, 2014  
4
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Functional Block Diagram:  
Sept 29nd, 2014  
5
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Input/Output/Enable Pin Equivalent Circuit Diagrams  
VCC  
ESD  
Diode  
OUTA  
OUTB  
24V  
ESD  
Diode  
COM  
Lead Definitions  
PIN Symbol  
Description  
1
2
3
4
5
6
7
8
EN  
INA  
COM  
INB  
OUTB  
VCC  
OUTA  
NC  
Enable pin  
Logic input for gate driver output (OUTA), in phase  
Ground  
Logic input for gate driver output (OUTB), in phase  
Gate drive output B  
Supply voltage  
Gate drive output A  
No connection  
Sept 29nd, 2014  
6
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Package Information  
Sept 29nd, 2014  
7
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Dimensions  
Millimiter  
Inches  
MIN  
MAX  
1.70  
0.10  
---  
MIN  
---  
MAX  
.067  
.004  
---  
A
A1  
A2  
b
---  
0
0
1.25  
0.31  
0.17  
.049  
.012  
.007  
0.51  
0.25  
.020  
.010  
c
D
4.90  
.193  
D1  
E
3.20  
3.40  
.126  
.134  
---  
6.00 BSC  
3.90 BSC  
.236 BSC  
.153 BSC  
E1  
E2  
e
1.00  
---  
.039  
1.27 BSC  
.050 BSC  
.010  
h
0.25  
0.40  
0.50  
1.27  
.020  
.050  
L
.016  
L1  
L2  
Θ
1.04 REF  
0.25 BSC  
.041 REF  
.010 BSC  
0
8
0
8
Recommended PCB footprint  
Sept 29nd, 2014  
8
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Part Marking Information  
Sept 29nd, 2014  
9
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Application Information  
1. Gate Driver  
The AUIRB24427S has been designer as a high current gate driver for single ended applications.  
Thanks to its very high output current and low thermal resistance vs. pcb, it is capable to drive Mosfets  
with very large input capacitance at frequencies up to fsw=200kHz or higher without the need of negative  
supply. The following figure 1 shows the typical device application schematic:  
LOAD  
Logic level  
input  
Rg  
EN  
NC  
OUTA  
VCC  
INA  
COM  
INB  
Vcc  
Cbp  
LOAD  
Rg  
OUTB  
Figure 1: typical gate driver application  
Rg values have to be selected based on the requested tr and tf of the application and may vary between  
2.5and 20while the input capacitance of the Fets can go up to 20nF or more depending on fsw.  
Since the very high peak output current, the bypass capacitor Cpb has to be mounted in the close proximity  
of the Vcc and COM pins and a ceramic type with low ESR has to be chosen.  
2. BT-GTD (Bridge Tied Gate Transformer Driver)  
This is a popular configuration that allows driving high side Fets using a low side gate driver, the Fig. 2  
shows the typical schematic for a single Fet drive:  
Logic level  
input  
Cdec  
EN  
NC  
OUTA  
VCC  
Rg,ss  
PulseTransf.  
Rg,ps  
INA  
COM  
INB  
Vcc  
Cbp  
OUTB  
Rg,ps  
Figure 2: Bridge Tied Gate Driver configuration  
In this configuration the gate transformer parameters have a very important role, most manufacturers  
indicate the following in their datasheets:  
V*s ratings: this factor must be respected, in bipolar drive application (like the one shown in  
Fig.2) a maximum of up to twice that parameter is still acceptable for most manufacturers, this  
factor then must be chosen accordingly to the following formula:  
Sept 29nd, 2014  
10  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
   ꢁꢂꢃꢄꢅꢆꢇꢈꢉꢃꢊꢀ ꢋꢌ  ꢎꢏꢐꢑꢒꢃꢀꢃꢓ  
(1)  
ꢔꢕꢖ  
where Vprim is the voltage applied to the primary, is the duty cycle and fsw the switching  
frequency of the application;  
N, turns ratio: usually 1:1, in some cases 1:2 or 1:1:1 (dual driver) this determines the voltage ratio  
between primary and secondary;  
Lp, primary inductance: this value determines the magnetizing inductance as follows:  
ꢗꢘ  ꢗꢚ    
(2)  
where K is the coupling factor between primary and secondary windings.  
LLK, leakage inductance: this parameter, usually indicated at primary, is equal to:  
ꢜꢝ  ꢗꢚ  ꢊꢞ  ꢛꢌ  
(3)  
The higher is Lm, the lower is the magnetizing current flowing into the transformer and consequent power  
losses into the driver. On the other hand the lower is LLK, the lower and shorter will be the ringing of the  
secondary LC network created by LLK, and Ciss of the Fet, damped by Rg,ss and much lower overshot will  
appear on the Vgs across the Fet during transition. Then a too high Lm requires a very good mechanical  
construction of the gate transformer to achieve high K and consequent low LLK.  
In a gate driver application running in the range of 50kHz-200kHz and using the AUIRB24427S, a good  
choice is usually a Lm between 300uH and 2mH and a LLK < 1uH. This translate for the formula (2) and (3)  
above in a coupling factor K between 0.9940 and 0.9995  
For good operation and to reduce unneeded power losses into the AUIRB24427S driver, the magnetizing  
current has to be kept ILM < 0.5A, from this then derives a minimum Lm to be calculated as follows:  
ꢗꢘꢒꢑꢠ    ꢔꢕꢖ  
(4)  
Where Vg is the gate driving voltage of the Fet  
Fig. 2.a show a good design waveform obtained with the following parameters:  
Vg=+/-15V, Lm=400uH, LLK=0.4uH, N=1, fsw=100kHz, CissFET =10nF, Rg,ps=3, Rg,ss=4Cdec=1uF  
Cdec is the AC coupling capacitor needed to reset the driver transformer flux, its value has to be calculated  
in a way that the voltage across it can be considered constant during normal operation. The higher the fsw  
the smaller will be Cdec. A ceramic capacitor is normally used.  
Sept 29nd, 2014  
11  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Figure 3a: Bridge Tied Gate Driver waveforms  
The waveforms in Fig. 2a show that:  
The lower is LLK, the lower and shorter is the ringing on the Fets gate voltage, particular care must  
be paid to guarantee that the max Vgs voltage of the Fet is not exceeded during operation;  
The lower is LLK, the shorter is the propagation delay from the driver to the gate of the Fet and the  
higher is the peak current into its gate;  
The higher is Lm, the lower is ILM; at the primary side the gate peak current, summed to ILM,  
constitute the total current flowing out of the gate driver.  
Sept 29nd, 2014  
12  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
3. Driving circuitry design: thermal considerations  
The following design example shows how to get a proper design of the gate driving circuitry considering the following  
target application data:  
Switching frequency 150kHz.  
Load capacitance range [10-100] nF.  
Supply voltage Vcc=12V.  
The switching losses due to the charge/discharge of the capacitive load CL represent the main component of the IC  
power dissipation. These losses are proportionally shared between the IC output resistance and the external gate  
resistance Rg.  
As a consequence the thermal behavior of the IC, with the constraint of a maximum junction temperature equal to  
150°C, is one of the key points in dimensioning the system parameters. Figure 3 shows the power that is dissipated  
inside the IC as a function of load capacitance CL. The external resistance Rg has been chosen in order to keep the  
product RL*Cg as constant and equal to 300ns (refer to Figure 4 for switching circuit schematic).  
For a given parameter sizing the value of Pow allows to calculate the junction temperature Tj as:  
TJ TA Pow RthJA  
(1)  
Where TA is the ambient temperature and RthJA is the junction to ambient thermal resistance.  
IC dissipated power  
0.700  
0.600  
0.500  
0.400  
0.300  
0.200  
0.100  
0.000  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
C [nF]  
Figure 3: Simulated IC power dissipation as a function of load capacitance.  
Sept 29nd, 2014  
13  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
4. Bias and Transient Conditions  
The input pins of the IC are protected by ESD events with the circuitry shown into ―Functional block diagram‖  
section at par.: Input/Output/Enable Pin Equivalent Circuit Diagrams. This shows that an ESD diode is placed in  
between each of these pins and Vcc.  
In case Vcc voltage will be lower than one of the voltage applied to these pins the diode will conduct. Because of  
its power dissipation the junction temperature will increase. In order to avoid dangerous working conditions it is  
recommended to keep the Vcc voltage always higher or equal to the INA/INB/Enable pin voltages; it is remind  
that input voltage must respect the defined absolute maximum rating limits.  
5. System functionality with improved thermal behavior.  
The PSOIC8N package is characterized by a metal thermal pad whose functionality is to reduce the junction to  
case thermal resistance. In order to better exploit this feature it is necessary to reduce as much as possible the  
thermal pad to PCB thermal resistance (RthTP-PCB in. Fig. 4).  
Two possible ways are suggested:  
a- Foresee a footprint on layout that allows to solder the thermal pad to the PCB.  
b- Use thermal material filling the air gap in between the thermal pad and the PCB.  
J
Plastic Case  
Rthj-TP  
Solder  
Paste  
TP  
Thermal Pad  
RthTP-PCB  
PCB  
PCB  
RthPCB-a  
Ambient  
Figure 4: Steady state equivalent thermal circuit.  
6. Square input pulse distortion  
The following chapter provides a characterization of pulse width distortion. This is defined as the ratio between  
the output pulse width with respect to input pulse width. Characterization is done with no load on OUTA and  
OUTB and it is applicable to both INA, INB and EN input pulses.  
Fig. 5a and 5b show the output pulse length with respect to input pulse length. In particular, Fig. 5a describes the  
pulse distortion in case of a short turn-on input pulse (e.g. low duty cycle condition); while Fig. 5b shows the  
pulse distortion in case of a turn-off input pulse (e.g. high duty cycle condition).  
Sept 29nd, 2014  
14  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
250  
200  
150  
100  
50  
REAL  
a
IDEAL  
0
0
50  
100  
150  
200  
250  
Input pulse width [ns]  
250  
200  
150  
100  
50  
REAL  
b
IDEAL  
0
0
50  
100  
150  
200  
250  
Input pulse width [ns]  
Fig. 5 Output pulse distortion in case of a short turn-on input pulse (a) and turn-off input pulse (b).  
Sept 29nd, 2014  
15  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
7. Bypass capacitor  
The bypass capacitor stores an electrical charge that is released to the power line whenever a transient voltage  
spike occurs. It provides a low-impedance supply source and it minimizes the noise generated by the switching  
of the outputs.  
It is recommended to place the bypass capacitor as close as possible to the gate driver in order to improve its  
effectiveness by reducing the effect of parasitic inductance of PCB lines.  
The value of bypass capacitor is related to:  
a- the current that the gate driver has to provide to the OUTA/B loads during turn-on switching condition;  
b- the speed at which the output pin is driven;  
c- the maximum allowed drop on power supply pins.  
For instance, if it considered that outputs OUTA and OUTB provide 6A source current with 20ns rise time and the  
maximum wished drop on VCC pin is 0.1V, then the bypass capacitance can be calculated as:  
T  
V  
20ns  
0.1V  
C n*I  
2*6A  
2.4F  
(1)  
Where n is the number of outputs that are switching at the same time. In this case it has been considered that OUTA  
and OUTB are driven in phase.  
Equation 1 does not contain the information about capacitance ESR that introduces a further drop in the power  
supply voltage. As a consequence it is recommended to use low ESR capacitances (e.g. X7R dielectric material).  
Additional Details  
Figure T1: Input/output Timing Diagram  
Sept 29nd, 2014  
16  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Figure T2: Switching Time Waveform Definitions  
VCC  
EN  
NC  
OUTA  
VCC  
EN  
CBP  
Vbatt  
IN  
IN  
+
-
INA  
COM  
INB  
VCC  
GND  
GND  
OUTB  
Cgb  
Cga  
Parameter  
TON  
Definitio  
EN  
5V  
5V  
IN  
Turn-on propagation delay  
Turn-off propagation delay  
Enable Turn-on propagation  
delay  
Pulse 0V to 5V  
Pulse 5V to 0V  
5V  
TOFF  
Pulse 0V to 5V  
TON-EN  
Enable Turn-off propagation  
delay  
Pulse 5V to 0V  
5V  
TOFF-EN  
Figure T3: Switching Time Test Circuit and test conditions  
Sept 29nd, 2014  
17  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Qualification Information  
Automotive  
(per AEC-Q100)  
Qualification Level  
Comments: This family of ICs has passed an Automotive  
qualification. IR’s Industrial and Consumer qualification level  
is granted by extension of the higher Automotive level.  
MSL3, 260°C  
PSOIC8-N  
Moisture Sensitivity Level  
(per IPC/JEDEC J-STD-020)  
Class M2 (+/-150V)  
(per AEC-Q100-003)  
Class H2 (+/-2500 V)  
(per AEC-Q100-002)  
Class C4 (+/-1000 V)  
(per AEC-Q100-011)  
Class II, Level A  
Machine Model  
ESD  
Human Body Model  
Charged Device Model  
IC Latch-Up Test  
RoHS Compliant  
(per AEC-Q100-004)  
Yes  
Qualification standards can be found at International Rectifier’s web site http://www.irf.com/  
Sept 29nd, 2014  
18  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
IMPORTANT NOTICE  
Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the  
right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any  
time and to discontinue any product or services without notice. Part numbers designated with the ―AU‖ prefix follow automotive  
industry and / or customer specific requirements with regards to product discontinuance and process change notification. All  
products are sold subject to IR’s terms and conditions of sale supplied at the time of order acknowledgment.  
IR warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with IR’s  
standard warranty. Testing and other quality control techniques are used to the extent IR deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
IR assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using IR components. To minimize the risks with customer products and applications, customers should provide  
adequate design and operating safeguards.  
Reproduction of IR information in IR data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alterations is  
an unfair and deceptive business practice. IR is not responsible or liable for such altered documentation. Information of third  
parties may be subject to additional restrictions.  
Resale of IR products or serviced with statements different from or beyond the parameters stated by IR for that product or service  
voids all express and any implied warranties for the associated IR product or service and is an unfair and deceptive business  
practice. IR is not responsible or liable for any such statements.  
IR products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the  
body, or in other applications intended to support or sustain life, or in any other application in which the failure of the IR product  
could create a situation where personal injury or death may occur. Should Buyer purchase or use IR products for any such  
unintended or unauthorized application, Buyer shall indemnify and hold International Rectifier and its officers, employees,  
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use,  
even if such claim alleges that IR was negligent regarding the design or manufacture of the product.  
Only products certified as military grade by the Defense Logistics Agency (DLA) of the US Department of Defense, are designed  
and manufactured to meet DLA military specifications required by certain military, aerospace or other applications. Buyers  
acknowledge and agree that any use of IR products not certified by DLA as military-grade, in applications requiring military grade  
products, is solely at the Buyer’s own risk and that they are solely responsible for compliance with all legal and regulatory  
requirements in connection with such use.  
IR products are neither designed nor intended for use in automotive applications or environments unless the specific IR products  
are designated by IR as compliant with ISO/TS 16949 requirements and bear a part number including the designation ―AU‖.  
Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, IR will not be  
responsible for any failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLD HEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
Sept 29nd, 2014  
19  
www.irf.com  
© 2014 International Rectifier  
AUIRB24427S  
Rev  
1v7  
Description  
Updated datasheet parameters according to standard lots test results.  
OUTx_x splitted overt  
June, 26th 2013  
UVLO+ increased the max to 12.6V  
Toff increased to 45ns from 40ns  
Toff-EN increased to 48ns from 40ns  
Introduced VOH/L parameters  
Changed Fig. T2.  
Added application sections:  
1- pulse width distortion  
2- Bypass capacitance  
1v8  
Updated pulse width distortion section based on new R0E silicon.  
September, 23rd 2013 Added min VCC in recommended table. Updated Toff delay page 4  
Added CBP min in recommended table.  
1v9  
Nov. 15th  
2v0  
Updated comments on page 13 and 3  
Updated Rdson Max on page 1  
Updated Vhys on page 3, removed tube packaging and updated typical applications on  
page 1, updated qualification information  
Dec 2013  
Updated date, added Important Notice page, DR3 version  
2v1  
Updated Ton & Toff value on page 1, updated Toff limits on page 4  
Mar 18th 2014  
2v2  
Updated Tr & Tf value on page 4. Last DR3 version  
Mar 24th 2014  
2V3  
Updated application sections adding typical and BT-GTD circuits. Updated typical  
application list on page 1  
Part Marking drawing updated  
May 23rd 2014  
Sept.29,2104  
Sept 29nd, 2014  
20  
www.irf.com  
© 2014 International Rectifier  

相关型号:

AUIRF1010EZ

HEXFET® Power MOSFET
INFINEON

AUIRF1010EZL

HEXFET® Power MOSFET
INFINEON

AUIRF1010EZS

HEXFET® Power MOSFET
INFINEON

AUIRF1010EZSTRL

HEXFET® Power MOSFET
INFINEON

AUIRF1010EZSTRR

HEXFET® Power MOSFET
INFINEON

AUIRF1010Z

HEXFET® Power MOSFET
INFINEON

AUIRF1010ZL

HEXFET® Power MOSFET
INFINEON

AUIRF1010ZS

HEXFET® Power MOSFET
INFINEON

AUIRF1010ZSTRL

HEXFET® Power MOSFET
INFINEON

AUIRF1010ZSTRR

HEXFET® Power MOSFET
INFINEON

AUIRF1010Z_12

Advanced Process Technology
INFINEON

AUIRF1018ES

Advanced Process Technology
INFINEON