2SD2213 [HITACHI]
Silicon NPN Epitaxial, Darlington; 硅NPN外延，达林顿
| 型号： | 2SD2213 |
| 厂家： | 
HITACHI SEMICONDUCTOR |
| 描述： | Silicon NPN Epitaxial, Darlington |
| 文件： | 总6页 (文件大小：35K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2SD2213
Silicon NPN Epitaxial, Darlington
Application
Low frequency power amplifier
Outline
TO-92MOD
2
3
ID
1. Emitter
2. Collector
3. Base
15 kΩ
(Typ)
0.5 Ω
(Typ)
1
3
2
1
2SD2213
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
VCBO
VCEO
VEBO
IC
Ratings
Unit
V
Collector to base voltage
Collector to emitter voltage
Emitter to base voltage
Collector current
150
80
V
8
V
1.5
A
Collector peak current
Collector power dissipation
Junction temperature
Storage temperature
E to C diode forward current
ic (peak)
PC
3
A
0.9
W
°C
°C
A
Tj
150
Tstg
ID
–55 to +150
1.5
Electrical Characteristics (Ta = 25°C)
Item
Symbol Min
Typ
Max
Unit
Test conditions
Collector to base breakdown
voltage
V(BR)CBO
150
80
8
—
—
V
IC = 1 mA, IE = 0
Collector to emitter breakdown V(BR)CEO
voltage
—
—
—
—
V
V
IC = 10 mA, RBE = ∞
Emitter to base breakdown
voltage
V(BR)EBO
IE = 50 mA, IC = 0
Collector cutoff current
ICBO
ICEO
hFE
hFE
hFE
—
—
—
—
—
—
—
5.0
5.0
—
µA
µA
VCB = 120 V, IE = 0
VCE = 65 V, IE = ∞
VCE = 2 V, IC = 0.15 A*1
VCE = 2 V, IC = 1 A*1
VCE = 2 V, IC = 1.5 A*1
IC = 1 A*1, IB = 1 mA
—
DC current transfer ratio
2000
5000
1000
—
30000
—
Collector to emitter saturation VCE(sat)
voltage
1.5
V
V
V
Base to emitter saturation
voltage
VBE(sat)
—
—
—
—
2.0
3.0
IC = 1 A*1, IB = 1 mA
ID = 1.5 A*1
E to C diode forward voltage
Note: 1. Pulse test
VD
2
2SD2213
Area of Safe Operation
Maximum Collector Dissipation Curve
10
1.2
0.8
0.4
iC(peak)
3
1
0.3
0.1
Ta = 25°C
1 Shot Pulse
0.03
0.01
1
3
10
30
100
0
50
100
150
Collector to Emitter Voltage VCE (V)
Ambient Temperature Ta (°C)
DC Current Transfer Ratio vs.
Collector Current
Typical Output Characteristics
2
100,000
30,000
10,000
VCE = 2 V
1.6
1.2
0.8
0.4
3,000
1,000
300
100
Ta = 25°C
IB = 0
0
1
2
3
4
5
0.01 0.03 0.1 0.3
1.0
3
10
Collector to Emitter Voltage VCE (V)
Collector Current IC (A)
3
2SD2213
Collector to Emitter Saturation Voltage
vs. Collector Current
10
3
IC/IB = 100
Ta = –25°C
1.0
75°C
25°C
0.3
0.1
0.01 0.03 0.1 0.3
1.0
3
10
Collector Current IC (A)
Transient Thermal Resistance
300
100
30
10
Ta = 25°C
3
1.0
0.3
1 m
10 m
100 m
1
10
100
1,000
Time t (s)
4
Unit: mm
4.8 ± 0.3
3.8 ± 0.3
0.65 ± 0.1
0.75 Max
0.60 Max
0.5 ± 0.1
0.5
1.27
2.54
Hitachi Code
JEDEC
TO-92 Mod
—
EIAJ
Conforms
Weight (reference value) 0.35 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
Europe
: http:semiconductor.hitachi.com/
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Asia (Taiwan)
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: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
Hitachi Europe GmbH
Hitachi Asia (Hong Kong) Ltd.
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7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
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Tel: 535-2100
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Tel: <886> (2) 2718-3666
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Tel: <44> (1628) 585000
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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