G1422F2U [GMT]
2W Stereo Audio Amplifier; 2W立体声音频放大器
| 型号： | G1422F2U |
| 厂家： | 
GLOBAL MIXED-MODE TECHNOLOGY INC |
| 描述： | 2W Stereo Audio Amplifier |
| 文件： | 总15页 (文件大小：300K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
G1422
Global Mixed-mode Technology Inc.
2W Stereo Audio Amplifier
Features
General Description
Depop Circuitry Integrated
The G1422 is a stereo audio power amplifier in 20pin
TSSOP thermal pad package. It can drive 2W con-
tinuous RMS power into 4Ω load per channel in
Bridge-Tied Load (BTL) mode at 5V supply voltage. Its
THD is smaller than 1% under the above operation
condition. To simplify the audio system design in the
notebook application, the G1422 supports the Bridge-
Tied Load (BTL) mode for driving the speakers, Sin-
gle-End (SE) mode for driving the headphone. For the
low current consumption applications, the SHDN mode
is supported to disable the G1422 when it is idle. The
current consumption can be further reduced to below
2µA.
Output Power at 1% THD+N, VDD=5V
--2W/CH (typical) into a 4Ω Load
--1.2W/CH (typical) into a 8Ω Load
Bridge-Tied Load (BTL), Single-Ended (SE)
Shutdown Control Available
Thermal protection
Surface-Mount Power Package
20-Pin TSSOP-P
Applications
Stereo Power Amplifiers for Notebooks or
Desktop Computers
Multimedia Monitors
Stereo Power Amplifiers for Portable Audio
Systems
Ordering Information
ORDER
NUMBER
G1422F2U
ORDER NUMBER
TEMP.
RANGE
MARKING
G1422
PACKAGE
(Pb free)
G1422F2Uf
-40°C to +85°C
TSSOP-20 (FD)
Note:F2: TSSOP-20 (FD)
U: Tape & Reel
Pin Configuration
G1422
SHUTDOWN
GND/HS
1
2
3
4
5
6
HP-IN
20
19
18
GND/HS
+OUTB
+OUTA
VDD
-OUTA
-INA
17 VDD
-OUTB
16
15
Thermal
-INB
Pad
GND/HS
BYPASS
+INB
14
13
12
7
8
9
+INA
GND/HS
GND/HS
GND/HS
GND/HS
10
11
Top View
Bottom View
TSSOP-20 (FD)
Note: Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
1
G1422
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
Supply Voltage, VCC…………………..…...…….……...6V
Operating Ambient Temperature Range
Power Dissipation (1)
TA ≤ 25°C………………………………………….2.7W
TA ≤ 70°C………………………………………….1.7W
TA ≤ 85°C………………….………………………1.4W
Electrostatic Discharge, VESD
TA…….…………………………….……….-40°C to +85°C
Maximum Junction Temperature, TJ…..……….….150°C
Storage Temperature Range, TSTG….…-65°C to+150°C
Reflow Temperature (soldering, 10sec)….……..260°C
Human body mode..………………….…-3000 to 3000(2)
Note:
(1) : Recommended PCB Layout
(2) : Human body model : C = 100pF, R = 1500Ω, 3 positive pulses plus 3 negative pulses
Electrical Characteristics
DC Electrical Characteristics, VDD = 5.0V, TA=+25°C, unless otherwise noted
PARAMETER
Supply Current
SYMBOL
CONDITION
Stereo BTL
STEREO SE
MIN TYP MAX UNIT
---
---
---
---
4
8.5
4
15
8
IDD
VDD = 5V
mA
DC Differential Output Voltage
IDD in Shutdown
VO(DIFF)
ISD
VDD = 5V,Gain = 2
VDD = 5V
5
50
2
mV
µA
V
0.1
---
---
Headphone High Input Voltage
Headphone Low Input Voltage
VIH
---
0.8
VIL
---
V
(AC Operation Characteristics, VDD = 5.0V, TA=+25°C, RL = 4Ω, unless otherwise noted)
PARAMETER
SYMBOL
CONDITION
THD = 1%, BTL, RL = 4Ω
THD = 1%, BTL, RL = 8Ω
THD = 10%, BTL, RL = 4Ω
THD = 10%, BTL, RL = 8Ω
THD = 1%, SE, RL = 4Ω
THD = 1%, SE, RL = 8Ω
THD = 10%, SE, RL = 4Ω
THD = 10%, SE, RL L = 8Ω
THD = 0.5%, SE, RL = 32Ω
PO = 1.6W, BTL, RL = 4Ω
PO = 1W, BTL, RL = 8Ω
PO = 75mW, SE, RL = 32Ω
VI = 1V, RL = 10KΩ, G = 1, SE
G = 1, THD = 1%
MIN TYP MAX UNIT
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
2
1.25
2.5
1.6
550
340
700
440
92
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
W
Output power (each channel) see Note
P(OUT)
mW
300
100
15
Total harmonic distortion plus noise
THD+N
m%
2.5
20
Maximum output power bandwidth
Phase margin
BOM
kHz
°
RL = 4Ω, Open Load
65
Power supply ripple rejection
Channel-to-channel output separation
Input separation
PSRR
f = 120Hz
75
dB
f = 1kHz
80
dB
80
dB
BTL attenuation in SE mode
Input impedance
85
dB
ZI
2
MΩ
dB
Signal-to-noise ratio
PO = 500mW, BTL
90
Output noise voltage
Vn
Output noise voltage
55
µV (rms)
Note :Output power is measured at the output terminals of the IC at 1kHz.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
2
G1422
Global Mixed-mode Technology Inc.
Typical Characteristics
Table of Graphs
FIGURE
vs Frequency
2,4,6,9,11,15,17
THD +N Total harmonic distortion plus noise
Output noise voltage
vs Output Power
vs Frequency
1,3,5,7,8,10,12,13,14,16,18
20
Supply ripple rejection ratio
vs Frequency
19
Vn
Crosstalk
vs Frequency
22,23
21
Open loop response
IDD Supply current
vs Frequency
Vs Supply Voltage
vs Load Resistance
Vs Load Resistance
vs Output Power
24
25,26
27,28
29,30,31,32
PO
PD
Output power
Power dissipation
Total Harmonic Distortion Plus
Noise vs Output Power
Total Harmonic Distortion Plus
Noise vs Frequency
10
5
10
5
20kHz
2
1
2
1
Po=1.8W
1kHz
0.5
0.5
%
%
0.2
0.1
0.2
0.1
VDD=5V
RL=3Ω
BTL
20 Hz
VDD=5V
RL=3Ω
BTL
0.05
0.05
Av=-2V/V
0.02
0.01
0.02
0.01
Av=-2V/V
3m
5m
10m
20m
50m
100m
200m
500m
1
2
3
20
50
100
200
500
1k
2k
5k
10k
20k
W
Hz
Figure 1
Figure 2
Total Harmonic Distortion Plus
Noise vs Output Power
Total Harmonic Distortion Plus
Noise vs Frequency
10
5
10
5
20kHz
Av=-4V/V
2
1
2
1
Av=-2V/V
0.5
0.5
1kHz
%
%
0.2
0.1
0.2
0.1
VDD=5V
RL=4Ω
BTL
Av=-1V/V
VDD=5V
RL=4Ω
BTL
20 Hz
0.05
0.05
Po=2W
Av=-2V/V
0.02
0.01
0.02
0.01
3m
5m
10m
20m
50m
100m
W
200m
500m
1
2
3
20
50
100
200
500
1k
2k
5k
10k
20k
Hz
Figure 3
Figure 4
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
3
G1422
Global Mixed-mode Technology Inc.
Total Harmonic Distortion Plus
Total Harmonic Distortion Plus
Noise vs Output Power
Noise vs Frequency
10
5
10
VDD=5V
RL=8Ω
BTL
5
VDD=5V
RL=8Ω
BTL
20kHz
2
1
2
1
Av=-2V/V
Po=1W
Av=-4V/V
0.5
0.5
%
%
%
%
%
%
1kHz
0.2
0.1
0.2
0.1
Av=-2V/V
20 Hz
0.05
0.05
Av=-1V/V
0.02
0.01
0.02
0.01
2m
5m
10m
20m
50m
100m
200m
500m
1
2
20
50
100
200
500
1k
2k
5k
10k
20k
W
Hz
Figure 6
Figure 5
Total Harmonic Distortion Plus
Noise vs Output Power
Total Harmonic Distortion Plus
Noise vs Frequency
10
5
10
5
VDD=5V
RL=32Ω
BTL
20kH
2
1
2
1
Av=-2V/V
20kHz
1kHz
0.5
0.5
0.2
0.1
0.2
0.1
1kHz
VDD=3.3V
RL=4Ω
BTL
0.05
0.05
20 Hz
Av=-2V/V
20 Hz
0.02
0.01
0.02
0.01
1m
2m
5m
10m
20m
50m
100m
200m
500m
1
1m
2m
5m
10m
20m
50m
100m
200m
500m
1
W
W
Figure 7
Figure 8
Total Harmonic Distortion Plus
Noise vs Frequency
Total Harmonic Distortion Plus
Noise vs Output Power
10
5
10
5
VDD=3.3V
RL=4Ω
BTL
Av=-4V/V
20kHz
2
1
2
1
Po=0.75W
0.5
0.5
1kHz
Av=-2V/V
0.2
0.1
0.2
0.1
VDD=3.3V
RL=8Ω
0.05
0.05
20 Hz
BTL
Av=-2V/V
Av=-1V/V
0.02
0.01
0.02
0.01
20
50
100
200
500
Hz
1k
2k
5k
10k
20k
1m
2m
5m
10m
20m
50m
100m
200m
500m
1
W
Figure 9
Figure 10
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
4
G1422
Global Mixed-mode Technology Inc.
Total Harmonic Distortion Plus
Total Harmonic Distortion Plus
Noise vs Frequency
Noise vs Output Power
10
5
10
VDD=5V
RL=4Ω
SE
VDD=3.3V
RL=8Ω
BTL
5
2
1
2
1
20kHz
1kHz
Av=-2V/V
Po=0.45W
Av=-4V/V
0.5
0.5
%
%
0.2
0.1
0.2
0.1
Av=-2V/V
Av=-1V/V
0.05
0.05
100Hz
0.02
0.01
0.02
0.01
20
50
100
200
500
1k
2k
5k
10k
20k
1m
2m
5m
10m
20m
50m
100m
200m
500m
1
Hz
W
Figure 11
Figure 12
Total Harmonic Distortion Plus
Noise vs Output Power
Total Harmonic Distortion Plus
Noise vs Output Power
10
5
10
5
VDD=5V
VDD=5V
RL=16Ω
SE
RL=8Ω
SE
Av=-2V/V
2
1
2
1
Av=-2V/V
20kHz
0.5
0.5
20kHz
20 Hz
%
%
0.2
0.1
0.2
0.1
1kHz
0.05
0.05
0.02
0.01
0.02 100kHz
1kHz
0.01
1m
2m
5m
10m
20m
50m
100m
200m
500m
1m
2m
5m
10m
20m
50m
W
100m
200m
500m
1
W
Figure 13
Figure 14
Total Harmonic Distortion Plus
Noise vs Frequency
Total Harmonic Distortion Plus
Noise vs Output Power
10
10
5
5
VDD=5V
RL=32Ω
SE
VDD=5V
RL=16Ω
SE
2
1
2
1
Av=-2V/V
Po=150mW
0.5
0.5
20kHz
%
%
Av=-4V/V
0.2
0.1
0.2
0.1
Av=-2V/V
0.05
0.05
1kHz
20 Hz
0.02
0.01
0.02
0.01
Av=-1V/V
20
50
100
200
500
1k
2k
5k
10k
20k
1m
2m
5m
10m
20m
50m
W
100m
200m
500m
1
Hz
Figure 15
Figure 16
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
5
G1422
Global Mixed-mode Technology Inc.
Total Harmonic Distortion Plus
Noise vs Frequency
Total Harmonic Distortion Plus
Noise vs Output Power
10
5
10
5
VDD=5V
VDD=3.3V
RL=32
RL=32
2
2
Ω
Ω
SE
SE
1
1
Po=75mW
Av=-2V/V
20kHz
0.5
0.5
Av=-4V/V
0.2
0.1
0.2
0.1
%
%
0.05
0.05
20 Hz
Av=-2V/V
0.02
0.01
0.02
0.01
1kHz
0.005
0.005
Av=-1V/V
0.002
0.001
0.002
0.001
20
50
100
200
500
1k
2k
5k
10k
20k
1m
2m
5m
10m
W
20m
50m
100m
Hz
Figure 17
Figure 18
Output Noise Voltage
vs Frequency
Supply Ripple Rejection Ratio
vs Frequency
+0
100u
90u
T
-10
80u
70u
VDD=5V RL=4
BTL Mode 20kHz LP
VDD=5V
Ω
RL=4
Ω
-20
-30
-40
-50
60u
50u
CB=4.7µF
Vripple=0.5Vpp
40u
30u
d
B
V
SE Mode
-60
-70
-80
VDD=5V RL=32
SE Mode BW<32kHz
Ω
20u
BTL Mode
-90
-100
10u
20
50
100
200
500
Hz
1k
2k
5k
10k
20 k
20
50
100
200
500
1k
2k
5k
10k
20k
Hz
Figure 19
Figure 20
Open Loop Response
Channel Separation
-30
-35
VDD=5V
Po=1.5W
-40
-45
-50
RL=4
BTL
Ω
-55
-60
d
B
Channel A to B
-65
-70
-75
-80
-85
-90
Channel B to A
-95
-100
20
50
100
200
500
Hz
1k
2k
5k
10k
20k
Figure 22
Figure 21
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
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G1422
Global Mixed-mode Technology Inc.
Channel Separation
Supply Current vs Supply Voltage
-30
-35
9
Stereo BTL
VDD=5V
Po=75mW
-40
-45
-50
8
RL=32
SE
Ω
7
6
5
4
3
2
-55
-60
d
B
-65
-70
-75
Channel A to B
Channel B to A
-80
-85
-90
Stereo SE
-95
-100
20
50
100
200
500
Hz
1k
2k
5k
10k
20k
3
4
5
6
Supply Voltage(V)
Figure 23
Figure 24
Output Power vs Supply Voltage
Output Power vs Supply Voltage
0.25
0.2
0.15
0.1
0.05
0
3
THD+N=1%
SE
Each Channel
THD+N=1%
BTL
Each Channel
2.5
2
RL=4
Ω
RL=3
Ω
RL=16
Ω
1.5
1
RL=8
Ω
RL=32
Ω
0.5
0
2.5
3.5
4.5
5.5
6.5
2.5
3.5
4.5
5.5
6.5
Supply Voltage(V)
Supply Voltage(V)
Figure 26
Figure 25
Output Power vs Load Resistance
Output Power vs Loard Resistance
2.5
2
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
THD+N=1%
BTL
Each Channel
THD+N=1%
SE
Each Channel
VDD=5V
VDD=5V
1.5
1
0.5
0
VDD=3.3V
VDD=3.3V
4
8
12
16
20
24
28
32
0
10
20
30
40
Load Resistance(Ω)
Load Resistance(Ω)
Figure 27
Figure 28
TEL: 886-3-5788833
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Ver: 1.2
Jun 29, 2005
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G1422
Global Mixed-mode Technology Inc.
Power Dippipation vs Output Power
Power Dissipation vs Output Power
1.8
1.6
1.4
1.2
1
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
RL=3
Ω
RL=3
Ω
RL=4
Ω
RL=4
Ω
VDD=5V
BTL
Each Channel
0.8
0.6
0.4
0.2
0
VDD=3.3V
BTL
Each Channel
RL=8
0.5
Ω
RL=8
Ω
0
1
1.5
2
2.5
0
0.5
1
1.5
Po-Output Pow er(W)
Po-Output Pow er(W)
Figure 29
Figure 30
Power Dissipation vs Output Power
Power Dissipation vs Output Power
0.35
0.3
0.16
0.14
0.12
0.1
RL=4
Ω
RL=4
Ω
0.25
0.2
VDD=3.3V
SE
RL=8
Ω
RL=8
Ω
Each Channel
0.08
0.06
0.04
0.02
0
0.15
0.1
VDD=5V
SE
Each Channel
RL=32
Ω
RL=32
Ω
0.05
0
0
0.2
0.4
0.6
0.8
0
0.1
0.2
0.3
Po-Output Pow er(W)
Po-Output Pow er(W)
Figure 32
Figure 31
Recommended Minimum Footprint
TSSOP-20 (FD)
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
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G1422
Global Mixed-mode Technology Inc.
Pin Description
PIN
NAME
I/O
FUNCTION
1
SHUTDOWN
I
Shutdown mode control signal input, places entire IC in shutdown mode when held
high, IDD is below 2µA.
2,7,9,10,11,12,19
GND/HS
+OUTA
VDD
Ground connection for circuitry, directly connected to thermal pad.
A channel + output in BTL mode, high impedance state in SE mode
Supply voltage for circuitry.
3
4,17
5
O
O
-OUTA
A channel - output in BTL mode, - output in SE mode.
6
-INA
+INA
I
I
I
A channel input signal I, selected when MUXCTRL is held low.
A channel positive input of OPAMP, biasing DC operation of OPAMP
B channel positive input of OPAMP, biasing DC operation of OPAMP
Connect to voltage divider for internal mid-supply bias.
8
13
+INB
14
BYPASS
-INB
15
I
B channel input signal I, selected when MUXCTRL is held low.
B channel - output in BTL mode, - output in SE mode.
16
-OUTB
+OUTB
HP-IN
O
O
I
18
20
B channel + output in BTL mode, high impedance state in SE mode
Mode control signal input, hold low for BTL mode, hold high for SE mode.
Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
Thermal Pad
TEL: 886-3-5788833
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Jun 29, 2005
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G1422
Global Mixed-mode Technology Inc.
Block Diagram
20k
6
8
-INA
_
+
5
3
-OUT
+OUT
+INA
14 BYPASS
VDD 4,17
HP-IN 20
BIAS CIRCUITS
MODES CONTROL
CIRCUITS
1
SHUTDOWN
+INB
13
+
_
+OUTB 18
16
-INB
-OUTB
15
20k
Parameter Measurement Information
1
SHUTDOWN
20
HP-IN
14
8
BYPASS
+INA
4,17
VDD
RL 4/8/32Ω
CB
4.7µF
-OUTA
+OUTA
5
3
+
_
CI
6
-INA
AC source
RI
RF
BTL Mode Test Circuit
TEL: 886-3-5788833
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Ver: 1.2
Jun 29, 2005
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G1422
Global Mixed-mode Technology Inc.
Parameter Measurement Information (Continued)
1
SHUTDOWN
VDD
20
HP-IN
14 BYPASS
VDD 4,17
8
6
+INA
-INA
CB
4.7µF
-OUTA
+OUTA
5
3
+
_
CI
AC source
RI
RL 32Ω
RF
SE Mode Test Circuit
TEL: 886-3-5788833
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Ver: 1.2
Jun 29, 2005
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G1422
Global Mixed-mode Technology Inc.
Application Circuits
PHONEJACK
R2
1K
R1
1K
COB
100µF
COA
100µF
R4
1
20
19
SHUTDOWN
HP-IN
GND
100K
0.1µF
R3
100K
2
3
GND
SPEAKER
SPEAKER
18
+OUTA
+OUTB
VDD
17
16
15
14
4
5
6
VDD
-OUTA
-INA
RFB1
20K
CS
1µF
RFA1
20K
-OUTB
-INB
CB1
1µF
RB1
20K
CA1
1µF
RA1
20K
G1422
RCA
RCA
7
8
9
BYPASS
+INB
GND
CB
0.33µF
13
12
11
+INA
GND
GND
GND
10
GND
Logical Truth Table
INPUTS
AMPLIFIER STATES
HP-IN
X
Shutdown
High
A/B Out-
----
A/B Out+
----
Mode
Mute
BTL
BTL
Low
Low
High
High
Low
Low
Low
Low
BTL
BTL
SE
Output
BTL
Output
BTL
Output
SE
Output
----
----
Output
SE
SE
Output
TEL: 886-3-5788833
Ver: 1.2
http://www.gmt.com.tw
Jun 29, 2005
12
G1422
Global Mixed-mode Technology Inc.
Application Information
Single Ended Mode Operation
Bridged-Tied Load Mode Operation
The G1422 can drive clean, low distortion SE output
power into headphone loads (generally 16Ω or 32Ω)
as in Figure A. Please refer to Electrical Characteris-
tics to see the performances. A coupling capacitor is
needed to block the dc offset voltage, allowing pure ac
signals into headphone loads. Choosing the coupling
capacitor will also determine the 3 dB point of the
high-pass filter network, as Figure B.
The G1422 has two linear amplifiers to drive both ends
of the speaker load in Bridged-Tied Load (BTL) mode
operation. Figure C shows the BTL configuration. The
differential driving to the speaker load means that
when one side is slewing up, the other side is slewing
down, and vice versa. This configuration in effect will
double the voltage swing on the load as compared to a
ground reference load. In BTL mode, the peak-to-peak
voltage VO(PP) on the load will be two times than a
ground reference configuration. The voltage on the
load is doubled, this will also yield 4 times output
power on the load at the same power supply rail and
loading. Another benefit of using differential driving
configuration is that BTL operation cancels the dc off-
sets, which eliminates the dc coupling capacitor that is
needed to cancelled dc offsets in the ground reference
configuration. Low-frequency performance is then lim-
ited only by the input network and speaker responses.
Cost and PCB space can be minimized by eliminating
the dc coupling capacitors.
fC=1/(2πRLCC)
For example, a 68uF capacitor with 32Ω headphone
load would attenuate low frequency performance be-
low 73Hz. So the coupling capacitor should be well
chosen to achieve the excellent bass performance
when in SE mode operation.
VDD
VDD
Vo(PP)
Vo(PP)
RL
2xVo(PP)
-Vo(PP)
VDD
CC
Vo(PP)
RL
Figure C
Figure A
-3 dB
fc
Figure B
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
13
G1422
Global Mixed-mode Technology Inc.
SHUTDOWN Mode Operations
De-popping circuitry of theG1422 is shown on Fig-
ure D. The PNP transistor limits the voltage drop
across the 225kΩ by slewing the internal node
slowly when power is applied. At start-up, the volt-
age at BYPASS capacitor is 0. The PNP is ON to
pull the mid-point of the bias circuit down. So the
capacitor sees a lower effective voltage, and thus
the charging is slower. This appears as a linear
ramp (while the PNP transistor is conducting), fol-
lowed by the expected exponential ramp of an R-C
circuit.
The G1422 implements the shutdown mode opera-
tions to reduce supply current, IDD, to the absolute
minimum level during nonuse periods for bat-
tery-power conservation. When the shutdown pin
(pin 1) is pulled high, all linear amplifiers will be
deactivated to mute the amplifier outputs. And The
G1422 enters an extra low current consumption
state, IDD is smaller than 2µA. Shutdown pin should
never be left unconnected, this floating condition
will cause the amplifier operations unpredictable.
Optimizing DEPOP Operation
Circuitry has been implemented in the G1422 to
minimize the amount of popping heard at power-up
and when coming out of shutdown mode. Popping
occurs whenever a voltage step is applied to the
speaker and making the differential voltage gener-
ated at the two ends of the speaker. To avoid the
popping heard, the bypass capacitor should be cho-
VDD
100 kΩ
225 kΩ
Bypass
100 kΩ
sen promptly, 1/(CBx100kΩ)
≦
1/(CI*(RI+RF)).
Where 100kΩ is the output impedance of the mid-rail
generator, CB is the mid-rail bypass capacitor, CI is
the input coupling capacitor, RI is the input imped-
ance, RF is the gain setting impedance which is on
the feedback path. CB is the most important capacitor.
Besides it is used to reduce the popping, CB can also
determine the rate at which the amplifier starts up
during startup or recovery from shutdown mode.
Figure D
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
14
G1422
Global Mixed-mode Technology Inc.
Package Information
C
D
L
D1
E1
E
E2
H
A2
A
A1
e
0.05
b
TSSOP-20 (FD) Package
Note:
1. JEDCE outline: MP-153 AC/MO-153 ACT (thermally enhanced variations only)
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall
not exceed 0.15 per side.
3. Dimension “E1” does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed
0.25 per side.
4. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in ex-
cess of the “b” dimension at maximum material conditions. Dambar cannot be located on the lower radius of
the foot. Minimum space between protrusion and adjacent lead is 0.07mm.
5. Dimensions “D” and “E1” to be determined at datum plane “H”.
DIMENSION IN MM
DIMENSION IN INCH
SYMBOLS
MIN
-----
NOM
-----
-----
1.00
-----
-----
6.50
-----
6.40 BSC
4.40
MAX
1.20
0.15
1.05
0.30
-----
MIN
-----
NOM
-----
-----
0.039
-----
-----
MAX
0.047
0.006
0.041
0.012
-----
A
A1
A2
b
C
D
D1
E
E1
E2
e
0.00
0.80
0.19
0.20
6.40
3.90
0.000
0.031
0.007
0.008
0.252
0.154
6.60
4.40
0.256
-----
0.260
0.173
0.252 BSC
0.173
-----
0.026 BSC
0.024
-----
4.30
2.70
4.50
3.20
0.169
0.106
0.177
0.126
-----
0.65 BSC
0.60
L
θ
0.45
0º
0.75
8º
0.018
0º
0.030
8º
-----
Taping Specification
PACKAGE
Q’TY/BY REEL
TSSOP-20 (FD)
2,500 ea
Feed Direction
Typical TSSOP Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.2
Jun 29, 2005
15
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