G1426F2U [GMT]
2.2W Stereo Audio Amplifier; 2.2W立体声音频放大器
| 型号： | G1426F2U |
| 厂家： | 
GLOBAL MIXED-MODE TECHNOLOGY INC |
| 描述： | 2.2W Stereo Audio Amplifier |
| 文件： | 总13页 (文件大小：310K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Global Mixed-mode Technology Inc.
2.2W Stereo Audio Amplifier
General Description
G1426
Features
ꢀDepop Circuitry Integrated
ꢀOutput Power at 10% THD+N, VDD=5V
--2.2W/CH (typical) into a 4Ω Load
ꢀOutput Power at 1% THD+N, VDD=5V
--2W/CH (typical) into a 4Ω Load
--1.2W/CH (typical) into a 8Ω Load
ꢀBridge-Tied Load (BTL)
The G1426 is a stereo audio power amplifier in 20pin
TSSOP package. It can deliver 2W continuous RMS
power into 4 load per channel in Bridge-Tied Load
Ω
(BTL) mode at 5V supply voltage under 1% THD. To
simplify the audio system design in the notebook ap-
plication, The G1426 supports the Bridge-Tied Load
(BTL) mode for driving the speakers. For the low cur-
rent consumption applications, the SHDN mode is
supported to disable the G1426 when it is idle. The
current consumption can be further reduced to below
2µA.
ꢀShutdown Control Available
ꢀThermal protection
ꢀSurface-Mount Power Package
20-Pin TSSOP-P
Applications
ꢀStereo Power Amplifiers for Notebooks or
Desktop Computers
Ordering Information
ꢀMultimedia Monitors
ORDER
NUMBER
G1426D5X
G1426F2X
TEMP.
MARKING
PACKAGE
ꢀStereo Power Amplifiers for Portable Audio
Systems
RANGE
G1426
G1426
-40°C to +85°C
-40°C to +85°C TSSOP-20L (FD)
TSSOP-20L
Note: X Specify the packing type
U: Tape & Reel
T: Tube
* TSSOP-20L (FD): Thermal Pad
Pin Configuration
G1426
GND/HS
GND/HS
18 +OUTB
1
SHUTDOWN
GND/HS
+OUTA
VDD
20
19
2
3
4
5
6
17
16
15
VDD
-OUTB
-INB
-OUTA
-INA
Thermal
Pad
GND/HS
14 BYPASS
+INB
12 NC
7
8
9
13
+INA
NC
GND/HS
11 NC
10
Top View
20Pin TSSOP
Bottom View
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Global Mixed-mode Technology Inc.
G1426
Absolute Maximum Ratings
Supply Voltage, VCC…………………..…...…….……...6V
Operating Ambient Temperature Range
Power Dissipation (1)
TA ≤ 25°C………………………………………….2.7W
TA ≤ 70°C………………………………………….1.7W
TA ≤ 85°C………………….………………………1.4W
Electrostatic Discharge, VESD
TA…….…………………………….……….-40°C to +85°C
Maximum Junction Temperature, TJ…..……….….150°C
Storage Temperature Range, TSTG….….-65°C to+150°C
Soldering Temperature, 10seconds, TS……….……260°C
Human body mode..…………………….-3000 to 3000(2)
Note:
(1) : Recommended PCB Layout
(2) : Human body model : C = 100pF, R = 1500Ω, 3 positive pulses plus 3 negative pulses
Electrical Characteristics
DC Electrical Characteristics, VDD = 5.0V, TA=+25°C, unless otherwise noted
PARAMETER
Supply Current
DC Differential Output Voltage
IDD in Shutdown
SYMBOL
IDD
VO(DIFF)
ISD
CONDITION
MIN TYP MAX UNIT
VDD = 5V
-
-
-
8.5
5
15
50
2
mA
mV
µA
VDD = 5V,Gain = 2
VDD = 5V
0.1
(AC Operation Characteristics, VDD = 5.0V, TA=+25°C, RL = 4Ω, unless otherwise noted)
PARAMETER
SYMBOL
CONDITION
THD = 1%, BTL, RL = 4Ω
THD = 1%, BTL, RL = 8Ω
THD = 10%, BTL, RL = 4Ω
THD = 10%, BTL, RL = 8Ω
PO = 1.6W, BTL, RL = 4Ω
PO = 1W, BTL, RL = 8Ω
VI = 1V, RL = 10KΩ, G = 1
G = 10, THD = 1%
MIN TYP MAX UNIT
-
-
-
-
-
-
-
-
-
-
-
-
-
-
2
1.25
2.5
1.6
300
100
10
20
65
75
80
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Output power (each channel) see Note
P(OUT)
W
Total harmonic distortion plus noise
THD+N
BOM
m%
Maximum output power bandwidth
Phase margin
Power supply ripple rejection
Channel-to-channel output separation
Input impedance
kHz
°
dB
dB
MΩ
dB
RL = 4Ω, Open Load
f = 120Hz
f = 1kHz
PSRR
ZI
2
90
55
Signal-to-noise ratio
Output noise voltage
PO = 500mW, BTL
Output noise voltage
Vn
µV (rms)
Note :Output power is measured at the output terminals of the IC at 1kHz.
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Pin Description
G1426
PIN
NAME
I/O
FUNCTION
1
SHUTDOWN
I
Shutdown mode control signal input, places entire IC in shutdown mode when held
high, IDD is below 2µA.
2,7,10,19,20
GND/HS
+OUTA
VDD
Ground connection for circuitry, directly connected to thermal pad.
A channel + output
Supply voltage for circuitry.
3
4,17
5
O
O
-OUTA
A channel - output
6
8
9
11
12
13
14
15
16
18
-INA
+INA
NC
NC
NC
+INB
BYPASS
-INB
-OUTB
+OUTB
I
I
I
I
A channel input signal
A channel positive input of OPAMP, biasing DC operation of OPAMP
NC
NC
NC
I
B channel positive input of OPAMP, biasing DC operation of OPAMP
Connect to voltage divider for internal mid-supply bias.
B channel input signal
B channel - output
B channel + output
I
O
O
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Global Mixed-mode Technology Inc.
G1426
Typical Characteristics
Table of Graphs
FIGURE
vs Frequency
2,4,6,9,11
THD +N Total harmonic distortion plus noise
vs Output power
vs Frequency
1,3,5,7,8,10
Vn
13
Output noise voltage
Supply ripple rejection ratio
Crosstalk
vs Frequency
12
vs Frequency
14
vs Frequency
Closed loop response
17
IDD
PO
vs supply voltage
vs supply voltage
vs Load resistance
vs Output power
15
Supply current
16
Output power
18
19,20
PD
Power dissipation
TOTAL HARMONIC DISTORTION PLUS NOISE
vs OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs FREQUENCY
10
10
5
5
20kHz
2
1
2
1
Po=1.8W
1kHz
0.5
0.5
%
%
0.2
0.1
0.2
0.1
VDD=5V
RL=3Ω
BTL
20Hz
VDD=5V
RL=3Ω
BTL
0.05
0.05
Av=-2V/V
0.02
0.01
0.02
0.01
Av=-2V/V
3m
5m
10m
20m
50m
100m
W
200m
500m
1
2
3
20
50
100
200
500
1k
2k
5k
10k
20k
Hz
Figure 2
Figure 1
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G1426
TOTAL HARMONIC DISTORTION PLUS NOISE
vs OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs FREQUENCY
10
5
10
5
Av=-4V/V
20kHz
2
2
Av=-2V/V
1
1
0.5
0.5
1kHz
%
%
0.2
0.1
0.2
0.1
VDD=5V
RL=4Ω
BTL
Av=-1V/V
VDD=5V
RL=4Ω
BTL
20Hz
0.05
0.05
Po=2W
0.02
0.01
0.02
0.01
Av=-2V/V
3m
5m
10m
20m
50m
100m
W
200m
500m
1
2
3
20
50
100
200
500
1k
2k
5k
10k
20k
Hz
Figure 3
Figure 4
TOTAL HARMONIC DISTORTION PLUS NOISE
vs OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs FREQUENCY
10
10
VDD=5V
5
5
VDD=5V
RL=8Ω
20kHz
RL=8Ω
BTL
Av=-2V/V
2
2
BTL
Po=1W
1
1
Av=-4V/V
0.5
0.5
%
%
1kHz
Av=-2V/V
0.2
0.1
0.2
0.1
20Hz
0.05
0.05
Av=-1V/V
0.02
0.01
0.02
0.01
2m
5m
10m
20m
50m
100m
200m
500m
1
2
20
50
100
200
500
1k
2k
5k
10k
20k
W
Hz
Figure 6
Figure 5
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Global Mixed-mode Technology Inc.
G1426
TOTAL HARMONIC DISTORTION PLUS NOISE
vs OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs OUTPUT POWER
10
10
5
5
VDD=5V
20kHz
RL=32Ω
2
2
1
BTL
Av=-2V/V
1
20kH
1kHz
0.5
0.5
%
%
0.2
0.1
0.2
0.1
1kHz
VDD=3.3V
RL=4Ω
BTL
0.05
0.05
20Hz
0.02
0.01
0.02
0.01
20Hz
Av=-2V/V
1m
2m
5m
10m
20m
50m
100m
200m
500m
1
1m
2m
5m
10m
20m
50m
100m
200m
500m
1
W
W
Figure 8
Figure 7
TOTAL HARMONIC DISTORTION PLUS NOISE
vs FREQUENCY
TOTAL HARMONIC DISTORTION PLUS NOISE
vs OUTPUT POWER
10
10
5
VDD=3.3V
5
RL=4Ω
2
2
BTL
Po=0.75W
20kHz
Av=-4V/V
1
1
0.5
0.5
1kHz
%
%
Av=-2V/V
0.2
0.1
0.2
0.1
VDD=3.3V
RL=8Ω
BTL
0.05
0.05
20Hz
Av=-1V/V
0.02
0.01
0.02
0.01
Av=-2V/V
20
50
100
200
500
1k
2k
5k
10k
20k
1m
2m
5m
10m
20m
50m
100m
200m
500m
1
Hz
W
Figure 10
Figure 9
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G1426
TOTAL HARMONIC DISTORTION PLUS NOISE
vs FREQUENCY
SUPPLY RIPPLE REJECTION RATIO
vs FREQUENCY
+0
ꢀꢀ
10
ꢀꢀ
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
-75
-80
-85
-90
-95
5
VDD=5V
RL=4Ω
VDD=3.3V
2
RL=8Ω
CB=4.7µF
BTL
1
Vripple=0.5Vpp
Av=-4V/V
Po=0.45W
0.5
d
%
B
Av=-2V/V
0.2
0.1
BTL Mode
0.05
0.02
0.01
Av=-1V/V
-100
20
50
100
200
500
1k
2k
5k
10k
20k
20
50
100
200
500
1k
2k
5k
10k
20k
Hz
Hz
Figure 11
Figure 12
OUTPUT NOISE VOLTAGE vs FREQUENCY
CHANNEL SEPARATION
100u
90u
-30
-35
80u
70u
-40
VDD=5V
-45
Po=1.5W
60u
50u
-50
RL=4Ω
BTL
-55
40u
-60
VDD=5V RL=4Ω
BTL Mode 20kHz
d
Channel A to B
V
-65
-70
-75
-80
-85
-90
-95
30u
20u
B
Channel B to A
10u
-100
20
50
100
200
500
1k
2k
5k
10k
20k
20
50
100
200
500
1k
2k
5k
10k
20k
Hz
Hz
Figure 13
Figure 14
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G1426
OUTPUT POWER vs SUPPLY VOLTAGE
SUPPLY CURRENT vs SUPPLY VOLTAGE
9
8.5
8
3
2.5
2
THD+N=1%
BTL
Stereo BTL
Each Channel
RL=4Ω
7.5
7
RL=3Ω
1.5
1
6.5
6
RL=8Ω
0.5
0
5.5
5
3
3.5
4
4.5
5
5.5
6
2.5
3.5
4.5
5.5
6.5
Supply Voltage(V)
Supply Voltage(V)
Figure 15
Figure 16
OPEN LOOP RESPONSE
Figure 17
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G1426
OUTPUT POWER vs LOAD RESISTANCE
POWER DISSIPATION vs OUTPUT POWER
1.8
1.6
1.4
1.2
1
2.5
2
THD+N=1%
BTL
Each Channel
RL=3Ω
RL=4Ω
1.5
1
0.8
0.6
0.4
0.2
0
VDD=5V
VDD=5V
BTL
Each Channel
0.5
0
RL=8Ω
VDD=3.3V
0
5
10
15
20
25
30
35
0
0.5
1
1.5
2
2.5
Load Resistance(Ω)
Po-Output Power(W)
Figure 18
Figure 19
Recommended PCB Layout
Unit:mm
POWER DISSIPATION vs OUTPUT POWER
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
RL=3Ω
RL=4Ω
VDD=3.3V
RL=8Ω
BTL
Each Channel
0
0.2
0.4
0.6
0.8
1
1.2
Po-Output Power(W)
Figure 20
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G1426
Block Diagram
VDD
+
CS
1µF
RF
20k
TANT
Ω
4,17
Audio
Input
R1
6
8
-IN A
-
- OUT A
5
3
Amp A1
+
20kΩ
C1
+IN A
1µF
20k
Ω
20k
Ω
RL
20kΩ
50k
Ω
8
Ω
+OUT A
-
Amp A2
+
Bypass
-IN B
14
15
V
DD/2
+
CB
0.33µF
50k
Ω
Audio
Input
R1
16
18
-
- OUT B
Amp A1
+
20kΩ
C1
1µF
13 +IN B
20k
Ω
RF
20kΩ
20k
Ω
RL
8
20kΩ
Ω
9,11,12 NC
+OUT B
-
Amp A2
+
1
Shutdown
GND
2,7,10,19,20
Application Circuits
4,17
VDD
6
8
-IN A
-
AmpA1
+
- OUT A
5
3
+IN A
20kΩ
20kΩ
20kΩ
50kΩ
+OUT A
-
AmpA2
+
Bypass
-IN B
14
15
VDD/2
50kΩ
16
18
-
- OUT B
AmpA1
+
13 +IN B
20kΩ
20kΩ
20kΩ
9,11,12 NC
+OUT B
-
Amp A2
+
1
Shutdown
GND
2,7,10,19,20
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G1426
Application Information
Bridged-Tied Load Mode Operation
Optimizing DEPOP Operation
G1426 has two linear amplifiers to drive both ends of
the speaker load in Bridged-Tied Load (BTL) mode
operation. Figure 1 shows the BTL configuration. The
differential driving to the speaker load means that
when one side is slewing up, the other side is slewing
down, and vice versa. This configuration in effect will
double the voltage swing on the load as compared to a
ground reference load. In BTL mode, the peak-to-peak
voltage VO(PP) on the load will be two times than a
ground reference configuration. The voltage on the
load is doubled, this will also yield 4 times output
power on the load at the same power supply rail and
loading. Another benefit of using differential driving
configuration is that BTL operation cancels the dc off-
sets, which eliminates the dc coupling capacitor that is
needed to cancelled dc offsets in the ground reference
configuration. Low-frequency performance is then lim-
ited only by the input network and speaker responses.
Cost and PCB space can be minimized by eliminating
the dc coupling capacitors.
Circuitry has been implemented in G1426 to mini-
mize the amount of popping heard at power-up and
when coming out of shutdown mode. Popping oc-
curs whenever a voltage step is applied to the
speaker and making the differential voltage gener-
ated at the two ends of the speaker. To avoid the
popping heard, the bypass capacitor should be
chosen promptly, 1/(C x100k ) ≦ 1/(C *(R +R )).
Ω
B
I
I
F
Where 100k
Ω
is the output impedance of the
mid-rail generator, CB is the mid-rail bypass capaci-
tor, CI is the input coupling capacitor, RI is the input
impedance, RF is the gain setting impedance which
is on the feedback path. CB is the most important
capacitor. Besides it is used to reduce the popping,
CB can also determine the rate at which the amplifier
starts up during startup or recovery from shutdown
mode.
De-popping circuitry of G1426 is shown on Figure 2.
The PNP transistor limits the voltage drop across
the 225kΩ by slewing the internal node slowly when
power is applied. At start-up, the voltage at
BYPASS capacitor is 0. The PNP is ON to pull the
mid-point of the bias circuit down. So the capacitor
sees a lower effective voltage, and thus the charg-
ing is slower. This appears as a linear ramp (while
the PNP transistor is conducting), followed by the
expected exponential ramp of an R-C circuit.
VDD
Vo(PP)
RL
2xVo(PP)
-Vo(PP)
VDD
VDD
Figure 1
Vo(PP)+VDD/2
RL
Vo(PP)
SHUTDOWN Mode Operations
G1426 implements the shutdown mode operations
to reduce supply current, IDD, to the absolute mini-
mum level during nonuse periods for battery-power
conservation. When the shutdown pin (pin 1) is
pulled high, all linear amplifiers will be deactivated
to mute the amplifier outputs. And G1426 enters an
extra low current consumption state, IDD is smaller
than 2µA. Shutdown pin should never be left un-
connected, this floating condition will cause the am-
plifier operations unpredictable.
VDD/2
VDD/2
Figure 2
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Package Information
G1426
D
L
E1
E
A2
A
A1
e
y
b
TSSOP-20L Package
NOTE:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance 0.1mm unless otherwise specified
3. Coplanarity : 0.1mm
4. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact.
5. Follow JEDEC MO-153
DIMENSION IN MM
DIMENSION IN INCH
SYMBOL
MIN.
-----
0.05
0.80
0.19
0.09
6.40
-----
4.30
-----
0.45
-----
0°
NOM.
MAX.
1.20
0.15
1.05
0.30
0.20
6.60
-----
4.50
-----
0.75
0.10
8°
MIN.
-----
NOM.
MAX.
0.048
0.006
0.041
0.012
0.008
0.260
-----
0.177
-----
0.030
0.004
8°
A
A1
A2
b
-----
-----
1.00
-----
-----
-----
-----
0.039
-----
-----
0.002
0.031
0.007
0.004
0.252
-----
0.169
-----
0.018
-----
0°
C
D
6.50
6.40
4.40
0.65
0.60
-----
0.256
0.252
0.173
0.026
0.024
-----
E
E1
e
L
y
θ
-----
-----
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G1426
D
L
D1
E1
E
E2
Note 5
A2
A
A1
e
y
b
TSSOP-20L (FD) Package
NOTE:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance 0.1mm unless otherwise specified
3. Coplanarity : 0.1mm
4. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact.
5. Die pad exposure size is according to lead frame design.
6. Follow JEDEC MO-153
DIMENSION IN MM
DIMENSION IN INCH
SYMBOL
MIN.
0.80
0.00
0.80
0.19
0.09
6.40
-----
4.30
-----
0.45
-----
0°
NOM.
-----
MAX.
1.15
0.10
1.05
0.30
0.20
6.60
-----
MIN.
0.031
0.000
0.031
0.007
0.004
0.252
-----
NOM.
-----
MAX.
0.045
0.004
0.041
0.012
0.008
0.260
-----
A
A1
A2
b
-----
-----
1.00
-----
0.039
-----
C
-----
-----
D
6.50
6.40
4.40
0.65
0.60
-----
0.256
0.252
0.173
0.026
0.024
-----
E
E1
e
4.50
-----
0.169
-----
0.177
-----
L
y
0.75
0.10
8°
4.28
2.78
0.018
-----
0.030
0.004
8°
0.168
0.109
-----
-----
θ
D1
E2
0°
3.90
2.30
-----
0.153
0.091
-----
-----
-----
Taping Specification
Feed Direction
Typical TSSOP Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.0
Dec 04, 2003
13
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