2SK2050 [FUJI]

N-channel MOS-FET; N沟道MOS - FET的
2SK2050
型号: 2SK2050
厂家: FUJI ELECTRIC    FUJI ELECTRIC
描述:

N-channel MOS-FET
N沟道MOS - FET的

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N-channel MOS-FET  
2SK2050  
F-III Series  
100V 0,055W 30A  
80W  
> Features  
> Outline Drawing  
- High Current  
- Low On-Resistance  
- No Secondary Breakdown  
- Low Driving Power  
- High Forward Transconductance  
> Applications  
- Motor Control  
- General Purpose Power Amplifier  
- DC-DC converters  
> Maximum Ratings and Characteristics  
> Equivalent Circuit  
- Absolute Maximum Ratings (TC=25°C), unless otherwise specified  
Item  
Symbol  
Rating  
Unit  
V
Drain-Source-Voltage  
V
100  
DS  
V
100  
30  
V
Drain-Gate-Voltage (RGS=20KW)  
Continous Drain Current  
Pulsed Drain Current  
DGR  
I
A
D
I
120  
A
D(puls)  
Gate-Source-Voltage  
V
±20  
V
GS  
Max. Power Dissipation  
Operating and Storage Temperature Range  
P
80  
W
°C  
°C  
D
T
150  
ch  
T
-55 ~ +150  
stg  
Electrical Characteristics (TC=25°C), unless otherwise specified  
-
Item  
Symbol  
Test conditions  
Min.  
100  
Typ.  
1,5  
Max.  
Unit  
V
ID=1mA  
VGS=0V  
Drain-Source Breakdown-Voltage  
Gate Threshhold Voltage  
Zero Gate Voltage Drain Current  
V
(BR)DSS  
ID=1mA  
VDS=VGS  
Tch=25°C  
Tch=125°C  
VDS=0V  
V
1,0  
2,5  
500  
1,0  
V
GS(th)  
VDS=100V  
I
10  
0,2  
µA  
mA  
nA  
W
W
S
DSS  
V
GS=0V  
VGS=±20V  
ID=15A  
Gate Source Leakage Current  
I
10  
100  
0,07  
GSS  
VGS=4V  
Drain Source On-State Resistance  
R
0,04  
DS(on)  
ID=15A  
VGS=10V  
VDS=25V  
0,03 0,055  
30  
ID=15A  
Forward Transconductance  
Input Capacitance  
g
15  
fs  
VDS=25V  
C
2500  
500  
250  
20  
3700  
750  
380  
30  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
A
iss  
VGS=0V  
f=1MHz  
VCC=30V  
ID=30A  
Output Capacitance  
C
oss  
Reverse Transfer Capacitance  
Turn-On-Time ton (ton=td(on)+tr)  
C
rss  
t
d(on)  
t
140  
500  
260  
210  
750  
390  
30  
r
Turn-Off-Time toff (ton=td(off)+tf)  
VGS=10V  
RGS=25 W  
t
d(off)  
t
f
Continous Reverse Drain Current  
Pulsed Reverse Drain Current  
Diode Forward On-Voltage  
Reverse Recovery Time  
I
DR  
I
120  
1,5  
A
DRM  
IF=2xIDR VGS=0V Tch=25°C  
IF=IDR VGS=0V  
V
0,9  
130  
1
V
SD  
t
ns  
µC  
rr  
-dIF/dt=100A/µs Tch=25°C  
Reverse Recovery Charge  
Q
rr  
-
Thermal Characteristics  
Item  
Symbol  
Test conditions  
channel to air  
Min.  
Typ.  
Max.  
75  
Unit  
Thermal Resistance  
R
°C/W  
th(ch-a)  
R
channel to case  
1,56 °C/W  
th(ch-c)  
Collmer Semiconductor, Inc. - P.O. Box 702708 - Dallas, TX - 75370 - 972-233-1589 - FAX 972-233-0481 - http://www.collmer.com  
N-channel MOS-FET  
2SK2050  
100V 0,055W 30A  
80W  
F-III Series  
> Characteristics  
Typical Output Characteristics  
Drain-Source-On-State Resistance vs. Tch  
Typical Transfer Characteristics  
VDS [V] ®  
Tch [°C] ®  
VGS [V] ®  
Typical Drain-Source-On-State-Resistance vs. ID  
Typical Forward Transconductance vs. ID  
Gate Threshold Voltage vs. Tch  
ID [A] ®  
ID [A] ®  
Tch [°C] ®  
Typical Capacitance vs. VDS  
Typical Input Charge  
Forward Characteristics of Reverse Diode  
VDS [V] ®  
Qg [nC] ®  
VSD [V] ®  
Allowable Power Dissipation vs. TC  
Safe operation area  
Transient Thermal impedance  
Tc [°C] ®  
VDS [V] ®  
t [s] ®  
This specification is subject to change without notice!  

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