MPX10DP [FREESCALE]
10 kPa Uncompensated Silicon Pressure Sensors; 10千帕未补偿硅压力传感器
| 型号： | MPX10DP |
| 厂家： | 
Freescale |
| 描述： | 10 kPa Uncompensated Silicon Pressure Sensors |
| 文件： | 总9页 (文件大小：228K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPX10
Rev 12, 01/2007
Freescale Semiconductor
Technical Data
10 kPa Uncompensated
Silicon Pressure Sensors
MPX10
MPXV10GC
SERIES
The MPX10 and MPXV10GC series devices are silicon piezoresistive
pressure sensors providing a very accurate and linear voltage output — directly
proportional to the applied pressure. These standard, low cost, uncompensated
sensors permit manufacturers to design and add their own external temperature
compensation and signal conditioning networks. Compensation techniques are
simplified because of the predictability of Freescale's single element strain gauge
design. Figure 1 shows a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
UNCOMPENSATED PRESSURE
SENSOR
0 TO 10 kPA (0–1.45 psi)
35 mV FULL SCALE SPAN
(TYPICAL)
Features
•
•
•
•
•
•
Low Cost
SMALL OUTLINE PACKAGES
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
Differential and Gauge Options
Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package
Functional Description
•
•
•
•
•
•
•
•
Air Movement Control
Environmental Control Systems
Level Indicators
Leak Detection
Medical Instrumentation
Industrial Controls
MPXV10GC6U
CASE 482A-01
MPXV10GC7U
CASE 482C-03
SMALL OUTLINE PACKAGE
PIN NUMBERS
Pneumatic Control Systems
Robotics
1
2
3
4
GND
+Vout
Vs
5
6
7
8
N/C
N/C
N/C
N/C
ORDERING INFORMATION(1)
Options Case No. Order Number
SMALL OUTLINE PACKAGE (MPXV10G SERIES)
Device Type
Device Marking
–Vout
NOTE: Pin 1 is noted by the notch in the lead.
Ported
Elements
Rails
482A
482A
482C
MPXV10GC6U
MPXV10GC6T1
MPXV10GC7U
MPXV10G
MPXV10G
MPXV10G
Tape and Reel
Rails
UNIBODY PACKAGE PIN NUMBERS
1
2
GND
+Vout
3
4
Vs
UNIBODY PACKAGE (MPX10 SERIES)
–Vout
Basic
Differential
344
MPX10D
MPX10D
Element
Ported
Elements
NOTE: Pin 1 is noted by the notch in the lead.
Differential
Gauge
344C
344B
344E
MPX10DP
MPX10GP
MPX10GS
MPX10DP
MPX10GP
MPX10D
Gauge
1. MPX10 series pressure sensors are available in differential and gauge configurations.
Devices are available in the basic element package or with pressure port fittings which
provide printed circuit board mounting ease and barbed hose pressure connections.
UNIBODY PACKAGES
MPX10D
CASE 344-15
MPX10GP
CASE 344B-01
MPX10DP
CASE 344C-01
MPX10GS
CASE 344E-01
© Freescale Semiconductor, Inc., 2007. All rights reserved.
+VS
3
2
4
+VOUT
Sensing
Element
–VOUT
1
GND
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
Table 1. Maximum Ratings(1)
Rating
Maximum Pressure (P1 > P2)
Burst Pressure (P > P2)
Symbol
PMAX
PBURST
TSTG
Value
75
Unit
kPa
kPa
°C
100
Storage Temperature
–40 to +125
–40 to +125
Operating Temperature
TA
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX10
Sensors
Freescale Semiconductor
2
Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Differential Pressure Range(1)
Symbol
POP
VS
Min
0
Typ
—
Max
10
Units
kPa
Supply Voltage(2)
—
3.0
6.0
35
6.0
—
VDC
Supply Current
IO
—
mAdc
mV
Full Scale Span(3)
VFSS
VOFF
∆V/∆Ρ
—
20
50
Offset(4)
0
20
35
mV
Sensitivity
—
3.5
—
—
mV/kPa
%VFSS
%VFSS
%VFSS
%VFSS/°C
µV/°C
%/ZIN/°C
Ω
Linearity(5)
–1.0
—
1.0
—
Pressure Hysteresis(5) (0 to 10 kPa)
Temperature Hysteresis(5) (–40°C to +125°C)
Temperature Coefficient of Full Scale Span(5)
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Input Impedance
—
±0.1
±0.5
—
—
—
—
TCVFSS
TCVOFF
TCR
ZIN
–0.22
—
–0.16
—
±15
—
0.28
400
750
—
0.34
550
1250
—
—
Output Impedance
ZOUT
tR
—
Ω
Response Time(6) (10% to 90%)
Warm-Up Time(7)
1.0
20
ms
—
—
—
ms
Offset Stability(8)
—
—
±0.5
—
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure at 25°C.
• TcSpan:
• TcOffset:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
• TCR:
Z
deviation with minimum rated pressure applied, over the temperature range of -40°C to ±125°C, relative to 25°C.
IN
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
8. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX10
Sensors
Freescale Semiconductor
3
TEMPERATURE COMPENSATION
LINEARITY
Figure 2 shows the typical output characteristics of the
MPX10 and MPXV10GC series over temperature.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: 1) end point straight line fit or 2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2010D series
sensor.
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Application Note AN840.
80
VS = 3 VDC
70
P1 > P2
60
+25°C
-40°C
50
Span
Range
(Typ)
40
30
20
10
+125°C
Offset
(Typ)
0
PSI
kPa
0
0.3
2.0
0.6
4.0
0.9
6.0
1.2
8.0
1.5
10
Pressure Differential
Figure 2. Output versus Pressure Differential
70
Linearity
60
50
Actual
Span
40
(VFSS
)
30
20
10
0
Theoretical
Offset
(Voff)
0
Max
POP
Pressure (kPA)
Figure 3. Linearity Specification Comparison
MPX10
Sensors
4
Freescale Semiconductor
Stainless Steel
Metal Cover
Silicone
Die Coat
Die
P1
P2
Epoxy
Case
Wire Bond
RTV Die
Bond
Lead Frame
Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale)
Figure 4 illustrates the differential or gauge configuration
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX10 and MPXV10GC series pressure sensor
operating characteristics and internal reliability and
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
Part Number
MPX10D
Case Type
344
Pressure (P1) Side Identifier
Stainless Steep Cap
MPX10DP
344C
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Part Marking
Side with Part Marking
MPX10GP
344B
The Pressure (P1) side may be identified by using the
following table.
MPX10GS
344E
MPXV10GC6U
MPXV10GC7U
482A
482C
MPX10
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
R
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
Z
1
4
2
3
INCHES
MILLIMETERS
B
-A-
DIM MIN MAX MIN
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
N
0.514
0.200
0.016
0.048
L
1
2
3
4
0.220
0.020
0.064
5.08
0.41
1.22
PIN 1
0.51
1.63
-T-
SEATING
PLANE
G
J
L
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
G
J
F
Y
M
N
R
Y
Z
30˚ NOM
30˚ NOM
D 4 PL
0.475
0.430
0.048
0.106
0.495 12.07
0.450 10.92
12.57
11.43
1.32
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
M
0.136 (0.005)
T A
0.052
0.118
1.22
2.68
3.00
STYLE 1:
PIN 1. GROUND
STYLE 2:
PIN 1.
STYLE 3:
VCC
PIN 1. GND
2. -VOUT
3. VS
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
2. - SUPPLY
3. + SUPPLY
4. GROUND
4. +VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
SEATING
PLANE
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-T-
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29.08
17.40
7.75
MAX
29.85
18.16
8.26
A
B
C
D
F
1.145
0.685
0.305
0.016
0.048
1.175
0.715
0.325
0.020
0.064
N
B
PORT #1
-Q-
POSITIVE
PRESSURE
(P1)
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
4.62
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
1
2 3 4
PIN 1
K
-P-
S
M
S
0.25 (0.010)
T Q
J
F
0.910 BSC
23.11 BSC
G
C
D 4 PL
M
S
S
0.13 (0.005)
T
S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX10
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
-A-
U
V
PORT #1
2. CONTROLLING DIMENSION: INCH.
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
PORT #2
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
PORT #1
PORT #2
VACUUM
(P2)
POSITIVE PRESSURE
(P1)
A
B
C
D
F
1.145
0.685
0.405
0.016
0.048
1.175
0.715
0.435
0.020
0.064
N
-Q-
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC
2.54 BSC
SEATING
PLANE
SEATING
PLANE
B
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
4.62
0.36
4.93
0.41
1
2 3 4
17.65 18.42
7.37 7.62
10.67 11.18
PIN 1
K
-P-
M
S
0.25 (0.010)
T
Q
3.89
3.89
1.60
5.59
4.04
4.04
2.11
6.10
-T-
-T-
S
F
J
G
C
0.910 BSC
23.11 BSC
D 4 PL
0.248
0.310
0.278
0.330
6.30
7.87
7.06
8.38
M
S
S
0.13 (0.005)
T
S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
PORT #1
POSITIVE
PRESSURE
(P1)
C
A
BACK SIDE
VACUUM
(P2)
INCHES
MILLIMETERS
DIM MIN MAX MIN
MAX
18.28
6.48
A
B
C
D
F
0.690
0.720 17.53
0.255 6.22
0.820 19.81
0.020 0.41
0.064 1.22
0.245
0.780
0.016
0.048
-B-
V
20.82
0.51
1.63
3
2
1
4
PIN 1
G
J
0.100 BSC
2.54 BSC
0.014
0.345
0.300
0.178
0.220
0.182
0.016 0.36
0.375 8.76
0.310 7.62
0.186 4.52
0.240 5.59
0.194 4.62
0.41
9.53
7.87
4.72
6.10
4.93
K
N
R
S
V
K
S
J
N
G
STYLE 1:
PIN 1. GROUND
F
R
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
D 4 PL
0.13 (0.005)
SEATING
PLANE
M
M
T B
-T-
CASE 344E-01
ISSUE B
UNIBODY PACKAGE
MPX10
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPX10
Sensors
8
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MPX10
Rev. 12
01/2007
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