MPX10GP [NXP]
Pressure Sensor, 3V, 0/10kPa, Sensor 4, Tray;
| 型号： | MPX10GP |
| 厂家： | 
NXP |
| 描述： | Pressure Sensor, 3V, 0/10kPa, Sensor 4, Tray 传感器 换能器 |
| 文件： | 总8页 (文件大小：282K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M
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Freescale Semiconductor, Inc.
Order this document
by MPX10/D
SEMICONDUCTOR TECHNICAL DATA
1
S
0
k
P
a
U
n
s
c
s
o
u
m
p
e
n
s
a
t
e
e ns o r s
d
M P X1 0
M P XV1 0G C
S E RI ES
i
l
i
c
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P
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S
The MPX10 and MPXV10GC series devices are silicon piezoresistive pressure sensors
providing a very accurate and linear voltage output — directly proportional to the applied
pressure. These standard, low cost, uncompensated sensors permit manufacturers to
design and add their own external temperature compensation and signal conditioning
networks. Compensation techniques are simplified because of the predictability of
Motorola’s single element strain gauge design. Figure 1 shows a schematic of the internal
circuitry on the stand–alone pressure sensor chip.
0 to 10 kPa (0–1.45 psi)
35 mV FULL SCALE SPAN
(TYPICAL)
Features
•
•
•
•
•
•
Low Cost
SMALL OUTLINE PACKAGE
UNIBODY PACKAGE
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
Differential and Gauge Options
Durable Epoxy Unibody Element or Thermoplastic
(PPS) Surface Mount Package
MPXV10GC6U
CASE 482A
Application Examples
MPX10D
CASE 344
•
•
•
•
•
•
•
•
Air Movement Control
Environmental Control Systems
Level Indicators
Leak Detection
Medical Instrumentation
Industrial Controls
MPXV10GC7U
CASE 482C
Pneumatic Control Systems
Robotics
PIN NUMBER
3
+
V
S
1
2
3
Gnd
5
6
7
N/C
N/C
N/C
MPX10DP
CASE 344C
2
4
+V
out
+
-
V
ut
o
Vs
S
E
N
S
I
N
G
E
L
E
M
E
N
T
PIN NUMBER
4
–V
out
8
N/C
1
2
Gnd
+V
3
4
V
V
o ut
S
NOTE: Pin 1 is noted by the notch in
the lead.
–V
out
out
1
G
N
D
NOTE: Pin 1 is noted by the notch in
the lead.
Figure 1. Uncompensated Pressure
Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor increases with increasing pressure
applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage
increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure
side (P1).
REV 10
For More Information On This Product,
Motorola, Inc. 2001
Go to: www.freescale.com
S E RIFE Sreescale Semiconductor, Inc.
MP X1 0 M P XV1 0 GC
MAXIMUM RATINGS(NOTE)
Rating
Symbol
Value
75
Unit
kPa
kPa
°C
Maximum Pressure (P1 > P2)
Burst Pressure (P1 > P2)
Storage Temperature
P
max
P
burst
100
T
stg
–40 to +125
–40 to +125
Operating Temperature
T
A
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (V = 3.0 Vdc, T = 25°C unless otherwise noted, P1 > P2)
S
A
Characteristic
Symbol
Min
0
Typ
—
Max
10
6.0
—
Unit
kPa
Vdc
mAdc
mV
(1)
Differential Pressure Range
P
OP
(2)
Supply Voltage
V
S
—
3.0
6.0
35
Supply Current
I
o
—
(3)
Full Scale Span
V
FSS
20
50
35
—
(4)
Offset
V
off
0
20
mV
Sensitivity
∆V/∆P
—
—
3.5
—
mV/kPa
(5)
Linearity
–1.0
—
1.0
—
%V
%V
%V
FSS
FSS
FSS
(5)
Pressure Hysteresis (0 to 10 kPa)
—
± 0.1
± 0.5
—
(5)
Temperature Hysteresis (–40°C to +125°C)
—
—
—
(5)
Temperature Coefficient of Full Scale Span
TCV
–0.22
—
–ā 0.16
%V /°C
FSS
FSS
(5)
Temperature Coefficient of Offset
TCV
±15
—
—
µV/°C
off
(5)
Temperature Coefficient of Resistance
TCR
0.28
400
750
—
0.34
550
1250
—
%Z /°C
in
Input Impedance
Z
in
—
Ω
Ω
Output Impedance
Z
out
—
(6)
Response Time (10% to 90%)
t
R
1.0
20
ms
ms
(7)
Warm–Up Time
—
—
—
—
(8)
Offset Stability
—
±0.5
—
%V
FSS
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
4. Offset (V ) is defined as the output voltage at the minimum rated pressure.
off
5. Accuracy (error budget) consists of the following:
•
•
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•
•
TcSpan:
TcOffset:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
•
TCR:
Z deviation with minimum rated pressure applied, over the temperature range of –ā 40°C to +125°C,
in
relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
2
Motorola Sensor Device Data
For More Information On This Product,
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Freescale Semiconductor, Inc.
M P X1 0 M P XV1 0 G C SE R I ES
TEMPERATURE COMPENSATION
tion over both –40 to +125°C and 0 to +80°C ranges are
Figure 2 shows the typical output characteristics of the
MPX10 and MPXV10GC series over temperature.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differ-
ences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
presented in Motorola Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the cal-
culations required are burdensome.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2010D series
sensor.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange pressure.
Several approaches to external temperature compensa-
8
0
7
6
5
4
0
0
0
0
7
6
5
0
0
0
-
ā
0
°
C
L IN EA RI TY
+ ā2 5 °C
V
=
3
V
d
c
S
P
1
>
P 2
S PA N
+ ā1 25 °C
RA NG E
)
A
C
T
U
A
L
4
3
2
1
0
0
0
0
(
T
Y
P
SPAN
(
V
)
S S
F
3
2
0
0
T
H
E
O
R
E
T
I
C
A
L
O
F
F
S
E
T
(
T
Y
P
)
1
0
0
PSI 0
O
F
F
S
E
T
0
.
3
0
.
6
0
.
9
1
.
2
1 . 5
(
V
)
O F F
0
0
M
A
X
k
P
a
2
.
0
4
.
0
6
.
0
8
.
0
1 0
P
O P
P
RES
S
U
R
E
D
IF
F
E
R
EN
T
I
AL
P
R
E
SS
U
R
E
(kPA )
Figure 2. Output versus Pressure Differential
Figure 3. Linearity Specification Comparison
S
I
L
I
C
O
N
E
S
T
A
I
N
L
E
S
S
S
T
E
E
L
DI E
D
I
E
C
O
A
T
M
E
T
A
L
CO V E R
P
1
E
P
O
X
Y
W
I
R
E
D
B
O
N
D
C
A
S
E
R
T
V
D
I
E
L
E
A
F
R
AM E
B O ND
P
2
Figure 4. Unibody Package — Cross–Sectional
Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
ating characteristics and internal reliability and qualification
tests are based on use of dry air as the pressure media. Me-
dia other than dry air may have adverse effects on sensor per-
formance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
in the basic chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX10 and MPXV10GC series pressure sensor oper-
Motorola Sensor Device Data
3
For More Information On This Product,
Go to: www.freescale.com
S E RIFE Sreescale Semiconductor, Inc.
M
P
X
1
0
M
P
X
V
1
0
G
C
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Motorola pres-
sure sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Part Number
Case Type
344
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX10D
MPX10DP
MPX10GP
MPX10GS
344C
344B
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Part Marking
344E
MPXV10GC6U
MPXV10GC7U
482A
482C
Side with Part Marking
ORDERING INFORMATION — UNIBODY PACKAGE
MPX10 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPX Series
Order Number
MPX10D
Device Marking
MPX10D
Device Type
Basic Element
Ported Elements
Options
Differential
Case Type
Case 344
Differential
Gauge
Case 344C
Case 344B
Case 344E
MPX10DP
MPX10GP
MPX10GS
MPX10DP
MPX10GP
MPX10D
Gauge
ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV10GC SERIES)
Device Type/Order No.
MPXV10GC6U
Packing Options
Rails
Case Type
Case 482A
Case 482A
Case 482C
Device Marking
MPXV10G
MPXV10GC6T1
MPXV10GC7U
Tape and Reel
Rails
MPXV10G
MPXV10G
4
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
M P X1 0 M P XV1 0 G C SE R I ES
UNIBODY PACKAGE DIMENSIONS
N O TE S :
C
1. D I MEN S I ON I N G A ND TO LE R AN C IN G PE R AS ME
Y 14. 5M, 199 4.
2. C O N TR O LL IN G D I MEN S I ON : I N C H .
R
3. D I MEN S I ON -A - I S I N CL U SI V E O F TH E
S TO P R I NG . MO LD S TO P RI N G N O T TO EX C EED
16. 00 (0 .63 0).
M
O
L
D
M
Z
1
4
2
3
INCHES
DIM MIN MAX
MILLIMETERS
B
–A–
MIN
15. 11
13. 06
5. 08
MAX
1 6. 00
1 3. 56
5 .5 9
A
B
C
D
F
0. 595
0. 514
0. 200
0. 016
0. 048
0. 630
0. 534
0. 220
0. 020
0. 064
N
L
1
2
3
4
PIN 1
0. 41
1. 22
0 .5 1
1 .6 3
–T–
SEATING
PLANE
G
J
0. 100 ꢀB SC
2
.
5
4
ꢀ
B
S
C
F
0. 014
0. 695
0. 016
0. 725
0. 36
17. 65
0 .4 0
1 8. 42
G
J
L
F
Y
M
N
R
Y
Z
30ꢀ ꢀ ꢀꢀ N O M
30ꢀ ꢀ ꢀꢀ N O M
_
_
D 4 PL
0
.
4
7
5
0. 495
0. 450
0. 052
0. 118
1
2
.
0
7
1 2. 57
11 .4 3
1 .3 2
0. 430
0. 048
0. 106
10. 92
1. 22
2. 68
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. “F” 8 PL
M
M
T A
0
.
1
3
6
ꢀ
(
0
.
0
0
5
)
3
.
0
0
S
T
Y
L
E
1
:
S TY LE 2:
P IN 1. V
S TY LE 3:
P IN 1. G N D
PIN 1. G R OU N D
2. + O U TPU T
3. + SU PPLY
4. - O U TPU T
C C
2. - S U PP LY
2. -V O U T
3. V S
4. +V O U T
3. + S UP P LY
4. G R O U N D
CASE 344–15
ISSUE Z
N
O
T
E
S
:
–A–
SEATING
PLANE
1. D I MEN S I ON I N G A ND TO LE R AN C IN G PE R AN S I
Y 14. 5, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N C H .
–T–
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29. 08
17. 40
7. 75
MAX
2 9. 85
1 8. 16
8 .2 6
A
B
C
D
F
1. 145
0. 685
0. 305
0. 016
0. 048
1. 175
0. 715
0. 325
0. 020
0. 064
N
B
PORT #1
POSITIVE
PRESSURE
(P1)
–Q–
0. 41
1. 22
0 .5 1
1 .6 3
G
H
J
0
.
1
0
0
ꢀ
B
S
C
2
.
5
4
ꢀ
B
S
C
0. 182
0. 014
0. 695
0. 290
0. 420
0. 153
0. 153
0. 230
0. 220
0. 194
0. 016
0. 725
0. 300
0. 440
0. 159
0. 159
0. 250
0. 240
4. 62
0. 36
17. 65
7. 37
10. 67
3. 89
3. 89
5. 84
5. 59
4 .9 3
0 .4 1
1 8. 42
7 .6 2
11 .1 8
4 .0 4
4 .0 4
6 .3 5
6 .1 0
K
L
1
2
3
4
PIN 1
N
P
Q
R
S
U
K
–P–
S
M
S
0
.
2
5
ꢀ
(
0
.
0
1
0
)
T
Q
J
F
0
.
9
1
0
ꢀ
B
S
C
2
3
.
1
1
ꢀ
B
S
C
G
C
D 4 PL
M
S
S
Q
0
.
1
3
ꢀ
(
0
.
0
0
5
)
T
S
S TY LE 1:
P IN 1. G R O U N D
2. + O U TP U T
3. + S UP P LY
4. - O U TP U T
CASE 344B–01
ISSUE B
Motorola Sensor Device Data
5
For More Information On This Product,
Go to: www.freescale.com
S E RIFE Sreescale Semiconductor, Inc.
MP X1 0 M P XV1 0 GC
UNIBODY PACKAGE DIMENSIONS — CONTINUED
N
O
T
E
S
:
–A–
1. D I MEN S I ON I N G A ND TO LE R AN C I N G PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
V
U
PORT #1
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
PORT #2
MIN
29. 08
17. 40
10. 29
0. 41
MAX
29. 85
18. 16
11. 05
0. 51
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
A
B
C
D
F
1. 145
0. 685
0. 405
0. 016
0. 048
1. 175
0. 715
0. 435
0. 020
0. 064
N
–Q–
1. 22
1. 63
G
H
J
0. 100 ꢀB SC
2
.
5
4
ꢀ
B
S
C
SEATING
PLANE
SEATING
PLANE
B
0. 182
0. 014
0. 695
0. 290
0. 420
0. 153
0. 153
0. 063
0. 220
0. 194
0. 016
0. 725
0. 300
0. 440
0. 159
0. 159
0. 083
0. 240
4. 62
0. 36
17. 65
7. 37
10. 67
3. 89
3. 89
1. 60
5. 59
4. 93
0. 41
18. 42
7. 62
11. 18
4. 04
4. 04
2. 11
1
2
3
4
K
L
PIN 1
K
–P–
N
P
Q
R
S
U
V
W
M
S
0
.
2
5
ꢀ
(
0
.
0
1
0
)
T
Q
–T–
–T–
S
F
J
6
.
1
0
G
C
0
.
9
1
0
ꢀ
B
S
C
2
3
.
1
1
ꢀ
B
S
C
D 4 PL
0. 248
0. 310
0. 278
0. 330
6. 30
7. 87
7. 06
8. 38
M
S
S
0
.
1
3
ꢀ
(
0
.0
0
5
)
T
S
Q
S
T
Y
L
E
1
:
P IN 1. G R O U N D
2. + O U TP U T
3. + S UP P LY
4. - O U TP U T
CASE 344C–01
ISSUE B
N
O
T
E
S
:
1. D I MEN S IO N I N G A ND TO LE R AN C I N G PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
PORT #1
POSITIVE
PRESSURE
(P1)
C
A
BACK SIDE
VACUUM
(P2)
INCHES
DIM MIN MAX
MILLIMETERS
MIN
17. 53
6. 22
MAX
18. 28
6. 48
A
B
C
D
F
0. 690
0. 245
0. 780
0. 016
0. 048
0. 720
0. 255
0. 820
0. 020
0. 064
–B–
V
19. 81
0. 41
1. 22
20. 82
0. 51
1. 63
3
2
1
4
PIN 1
G
J
0
.
1
0
0
ꢀ
B
S
C
2
.
5
4
ꢀ
B
S
C
0. 014
0. 345
0. 300
0. 178
0. 220
0. 182
0. 016
0. 375
0. 310
0. 186
0. 240
0. 194
0. 36
8. 76
7. 62
4. 52
5. 59
4. 62
0. 41
9. 53
7. 87
4. 72
6. 10
4. 93
K
N
R
S
V
K
S
J
N
G
S TY LE 1:
P IN 1. G R O U N D
F
R
–T–
2. + O U TP U T
3. + S UP P LY
4. - O U TP U T
D 4 PL
SEATING
PLANE
M M
T B
0
.
1
3
ꢀ
(
0
.
0
0
5
)
CASE 344E–01
ISSUE B
6
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
M P X1 0 M P XV1 0 G C SE R I ES
SMALL OUTLINE PACKAGE DIMENSIONS
–A–
D 8 PL
N
O
T
E
S
:
1. D I MEN S IO N I N G A ND TO LE R AN C I NG PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
4
M
S
S
A
0
.
25
ꢀ
(
0
.
01
0
)
T
B
5
8
3. D I MEN S IO N
P R OT R U SI O N .
A
A ND
B
D O N O T IN C L U D E M O LD
N
–B–
4. MA XI MU M MO LD P RO T R U SI O N 0 .1 5 (0 .0 06 ).
5. A LL V ERT IC A L S U RFA C E_S T5YP IC AL D R AF T.
G
INCHES
MILLIMETERS
1
DIM MIN MAX
MIN
10. 54
10. 54
12. 70
0. 96
MAX
10 .7 9
10 .7 9
13 .2 1
1 .0 7
A
B
C
D
G
H
J
0. 415
0. 415
0. 500
0. 038
0. 425
0. 425
0. 520
0. 042
S
W
0
.
1
0
0
ꢀ
B
S
C
2
.
5
4
ꢀ
B
S
C
0. 002
0. 009
0. 061
0ꢀ ꢀ
0. 010
0. 011
0. 071
7ꢀ ꢀ
0. 05
0. 23
1. 55
0ꢀ ꢀ
0 .2 5
0 .2 8
1 .8 0
7 ꢀꢀ
K
M
N
S
V
_
_
_
_
0. 444
0. 709
0. 245
0. 115
0. 448
0. 725
0. 255
0. 125
11. 28
18. 01
6. 22
11 .3 8
18 .4 1
6 .4 8
C
V
W
2
.
9
2
3
.
1
7
H
J
–T–
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A–01
ISSUE A
N
O
T
E
S
:
1. D I MEN S IO N I N G A ND TO LE R AN C IN G PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N C H .
–A–
4
3. D I MEN S IO N
P R OT R U SI O N .
A
A
N
D
B
D
O
N
O
T
I
N
C
L
U
D
E
M
O
L
D
5
8
4. MA XI MU M MO LD P RO T R U SI O N 0 .1 5 (0 .0 06 ).
5. A LL V ERT IC A L S U RFA C E_S T5YP IC AL D R AF T.
F O RM ED PA RA LL EL.
N
–B–
6
.
D
I
M
E
N
S
I
O
N
S
T
O
C
E
N
T
E
R
O
F
L
E
A
D
W
H
E
N
D 8 PL
G
M
S
S
A
INCHES
MILLIMETERS
0
.
2
5
ꢀ
(
0
.
0
1
0
)
T
B
1
DIM MIN
MAX
0. 425
0. 425
0. 520
0. 034
MIN
10. 54
10. 54
12. 70
0. 66
MAX
1 0. 79
1 0. 79
1 3. 21
0 .8 64
A
B
C
D
G
J
0. 415
0. 415
0. 500
0. 026
DETAIL X
S
W
0
.
1
0
0
ꢀ
B
S
C
2
.
5
4
ꢀ
B
S
C
0. 009
0. 100
0ꢀ ꢀ
0. 011
0. 120
15ꢀ ꢀ
0. 23
2. 54
0ꢀ ꢀ
0 .2 8
3 .0 5
1 5ꢀ ꢀ
K
M
N
S
PIN 1
IDENTIFIER
V
_
_
_
_
0. 444
0. 540
0. 245
0. 115
0. 448
0. 560
0. 255
0. 125
11. 28
13. 72
6. 22
11 .3 8
1 4. 22
6 .4 8
C
V
W
2
.
9
2
3
.
1
7
SEATING
PLANE
–T–
K
M
J
DETAIL X
CASE 482C–03
ISSUE B
Motorola Sensor Device Data
7
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MP X1 0 M P XV1 0 GC
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