MPX12 [FREESCALE]
10 kPa Uncompensated Silicon Pressure Sensors; 10千帕未补偿硅压力传感器型号: | MPX12 |
厂家: | Freescale |
描述: | 10 kPa Uncompensated Silicon Pressure Sensors |
文件: | 总8页 (文件大小:191K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MPX12
Rev 7, 01/2007
Freescale Semiconductor
Technical Data
10 kPa Uncompensated
Silicon Pressure Sensors
MPX12 SERIES
The MPX12 series device is a silicon piezoresistive pressure sensor providing
a very accurate and linear voltage output — directly proportional to the applied
pressure. This standard, low cost, uncompensated sensor permits
manufacturers to design and add their own external temperature compensating
and signal conditioning networks. Compensation techniques are simplified
because of the predictability of Freescale's single element strain gauge design.
UNCOMPENSATED PRESSURE
SENSOR
0 TO 10 kPA (0–1.45 psi)
55 mV FULL SCALE SPAN
(TYPICAL)
Features
•
•
•
•
•
•
Low Cost
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
Differential and Gauge Options
Durable Epoxy Package
MPX12D
Application Examples
CASE 344-15
•
•
•
•
•
•
•
•
Air Movement Control
Environmental Control Systems
Level Indicators
Leak Detection
Medical Instrumentation
Industrial Controls
Pneumatic Control Systems
Robotics
MPX12GP
CASE 344B-01
ORDERING INFORMATION(1)
Device Type
Options
Differential
Differential
Gauge
Case No.
344
Order Number
MPX12D
Device Marking
MPX12D
Basic Element
Ported Elements
MPX12DP
MPX12DP
344C
MPX12GP
MPX12GP
344B
1. MPX12 series pressure sensors are available in differential and gauge configurations.
Devices are available in the basic element package or with pressure port fittings which
provide printed circuit board mounting ease and barbed hose pressure connections.
MPX12DP
CASE 344C-01
PIN NUMBERS
1
2
GND
+Vout
3
4
VSS
–Vout
© Freescale Semiconductor, Inc., 2007. All rights reserved.
+VS
3
2
4
+VOUT
Sensing
Element
–VOUT
1
GND
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
Table 1. Maximum Ratings(1)
Rating
Symbol
PMAX
PBURST
TSTG
Value
75
Unit
kPa
kPa
°C
Maximum Pressure (P1 > P2)
Burst Pressure (P1 > P2)
Storage Temperature
100
–40 to +125
–40 to +125
Operating Temperature
TA
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX12
Sensors
Freescale Semiconductor
2
Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Differential Pressure Range(1)
Symbol
POP
VS
Min
0
Typ
—
Max
10
Unit
kPa
Supply Voltage(2)
—
3.0
6.0
55
6.0
—
Vdc
Supply Current
Io
—
mAdc
mV
Full Scale Span(3)
VFSS
Voff
45
70
Offset(4)
0
20
35
mV
Sensitivity
∆V/∆P
—
—
5.5
—
—
mV/kPa
%VFSS
%VFSS
%VFSS
%VFSS/°C
µV/°C
%Zin/°C
W
Linearity(5)
–0.5
—
5.0
—
Pressure Hysteresis6 (0 to 10 kPa)
Temperature Hysteresis(5) (–40°C to +125°C)
Temperature Coefficient of Full Scale Span(5)
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Input Impedance
—
±0.1
±0.5
—
—
—
—
TCVFSS
TCVoff
TCR
Zin
–0.22
—
–0.16
—
±15
—
0.28
400
750
—
0.34
550
1250
—
—
Output Impedance
Zout
tR
—
W
Response Time(6) (10% to 90%)
Warm-Up Time(7)
1.0
20
ms
—
—
—
ms
Offset Stability(8)
—
—
±0.5
—
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure at 25°C.
• TcSpan:
• TcOffset:
• TCR:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
Z
deviation with minimum rated pressure applied, over the temperature range of -40°C to ±125°C, relative to
IN
25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
8. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX12
Sensors
Freescale Semiconductor
3
TEMPERATURE COMPENSATION
LINEARITY
Figure 2 shows the typical output characteristics of the
MPX12 series over temperature.
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2010D series
sensor.
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Applications Note AN840.
80
+25°C
VS = 3 VDC
70
P1 > P2
-40°C
60
50
Span
Range
(Typ)
+125°C
40
30
20
10
Offset
(Typ)
0
PSI
kPa
0
0.3
2.0
0.6
4.0
0.9
6.0
1.2
8.0
1.5
10
Pressure Differential
Figure 2. Output versus Pressure Differential
80
Linearity
70
60
Span
(VFSS
Actual
50
40
30
20
10
0
)
Theoretical
Offset
(Voff)
0
Max
POP
Pressure (kPA)
Figure 3. Linearity Specification Comparison
MPX12
Sensors
4
Freescale Semiconductor
Stainless Steel
Metal Cover
Silicone
Die Coat
Die
P1
P2
Epoxy
Case
Wire Bond
RTV Die
Bond
Lead Frame
Figure 4. Unibody Package — Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application/
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX12 series pressure sensor operating
characteristics and internal reliability and qualification tests
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
Part Number
MPX12D
Case Type
344
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX12DP
MPX12GP
344C
Side with Part Marking
Side with Port Attached
344B
The Pressure (P1) side may be identified by using the
following table
MPX12
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
R
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
Z
1
4
2
3
INCHES
MILLIMETERS
B
-A-
DIM MIN MAX MIN
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
N
0.514
0.200
0.016
0.048
L
1
2
3
4
0.220
0.020
0.064
5.08
0.41
1.22
PIN 1
0.51
1.63
-T-
SEATING
PLANE
G
J
L
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
G
J
F
Y
M
N
R
Y
Z
30˚ NOM
30˚ NOM
D 4 PL
0.475
0.430
0.048
0.106
0.495 12.07
0.450 10.92
12.57
11.43
1.32
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
M
0.136 (0.005)
T A
0.052
0.118
1.22
2.68
3.00
STYLE 1:
PIN 1. GROUND
STYLE 2:
PIN 1.
STYLE 3:
VCC
PIN 1. GND
2. -VOUT
3. VS
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
2. - SUPPLY
3. + SUPPLY
4. GROUND
4. +VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
SEATING
PLANE
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-T-
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29.08
17.40
7.75
MAX
29.85
18.16
8.26
A
B
C
D
F
1.145
0.685
0.305
0.016
0.048
1.175
0.715
0.325
0.020
0.064
N
B
PORT #1
-Q-
POSITIVE
0.41
1.22
0.51
1.63
PRESSURE
(P1)
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
4.62
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
1
2 3 4
PIN 1
K
-P-
S
M
S
0.25 (0.010)
T Q
J
F
0.910 BSC
23.11 BSC
G
C
D 4 PL
M
S
S
0.13 (0.005)
T S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX12
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
-A-
U
V
PORT #1
2. CONTROLLING DIMENSION: INCH.
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
PORT #2
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
PORT #1
PORT #2
VACUUM
(P2)
POSITIVE PRESSURE
(P1)
A
B
C
D
F
1.145
0.685
0.405
0.016
0.048
1.175
0.715
0.435
0.020
0.064
N
-Q-
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC
2.54 BSC
SEATING
PLANE
SEATING
PLANE
B
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
4.62
0.36
4.93
0.41
1
2 3 4
17.65 18.42
7.37 7.62
10.67 11.18
PIN 1
K
-P-
M
S
0.25 (0.010)
T Q
3.89
3.89
1.60
5.59
4.04
4.04
2.11
6.10
-T-
-T-
S
F
J
G
C
0.910 BSC
23.11 BSC
D 4 PL
0.248
0.310
0.278
0.330
6.30
7.87
7.06
8.38
M
S
S
0.13 (0.005)
T S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
MPX12
Sensors
Freescale Semiconductor
7
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MPX12
Rev. 7
01/2007
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