MC33288DDH [FREESCALE]
Solid State Relay for Automotive Flasher Applications; 固态继电器用于汽车电子闪光器的应用
| 型号： | MC33288DDH |
| 厂家： | 
Freescale |
| 描述： | Solid State Relay for Automotive Flasher Applications |
| 文件： | 总15页 (文件大小：331K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: MC33288
Rev 6.0, 5/2006
Freescale Semiconductor
Advance Information
Solid State Relay for
Automotive Flasher
Applications
33288
This device is a Dual High-Side Power Switch dedicated for
automotive flasher applications. In comparison with mechanical
solutions, this device offers higher reliability as well as protection and
diagnostic features.
SOLID STATE RELAY
The device consists of two 25 mΩ Rdson fully protected high side
switches, in a surface mount power package. It interfaces directly
with a microcontroller and includes a current recopy function in order
to allow the detection of a failed lamp in the application.
Features
• Junction Temperature Range from -40°C to 150°C
• Operating Voltage Range from 8.0 V to 35 V
• Maximum Breakdown Voltage greater than 40 V
• 25 mΩ RDS(ON) per Channel at 25°C
• 8.0 Amps Nominal Current per Channel
• 1.2 W Warning Lamp Driver
DH SUFFIX
98ASH70273A
20-LEAD HSOP
ORDERING INFORMATION
• Overtemperature Protection with Hysteresis
• Open Load Detection in ON State
Temperature
Package
Device
Range (T )
A
• Current Recopy to Monitor Lamp Output Current
MC33288DDH/R2
-40°C to 125°C
20 HSOP
• Standby Current < 10 µA at VBAT < 14 V
Simplified Application Diagram
V
PWR
5.0 V
33288
V
BAT
ST
OUT-1
IN-1
IN-2
Cur R
WLP
1.2 W
21 W 21 W 5 W
21 W 5 W
MCU
OUT-2
GND
21 W 21 W 5 W
21 W 5 W
Figure 1. 33288 Simplified Internal Block Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
TERMINAL CONNECTIONS
TERMINAL CONNECTIONS
VBAT
21
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
GND
CUR R
IN1
WLP
STATUS
IN2
NC
NC
DNC
OUT1
OUT1
OUT1
NC
DNC
OUT2
OUT2
OUT2
NC
NC
NC
21
VBAT
Figure 2. 33288 Terminal Connections
Table 1. 33288 Terminal Definitions
A functional description of each terminal can be found in the Functional Description section beginning on 7.
Terminal
Number
Terminal
Name
Formal Name
Definition
The backside TAB is connected to the power supply of the MC33288DH.
TAB
2
VBAT
Supply Voltage
The Current Sense terminal delivers a ratioed amount (1/1000) of the sum of the currents
that can be used to generate signal ground referenced output voltages for use by the
microcontroller.
CUR R
Load Current Sense
These are the device input terminals which directly control their associated outputs.
3
IN1
IN2
INPUT Channel 1
INPUT Channel 2
18
These terminals are not used.
4, 9, 10, 11,
12, 17
NC
No Connect
These terminals must not be connected.
5, 16
DNC
Do Not Connect
They deliver current to the connected loads and are controlled via the IN1 terminals.
They deliver current to the connected loads and are controlled via the IN2 terminals,
6, 7, 8
OUT1
OUT2
OUTPUT Channel 1
OUTPUT Channel 2
13, 14, 15
This is the ground terminal of the device.
11
19
GND
Ground
The Fault output is an open drain indication that goes active low when a fault mode
(Openload, Overtemperature) is detected by the device.
STATUS
Status for Both
Channels
It delivers current through the connected load.
20
WLP
Warning Lamp Output
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
2
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfuncion or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VBAT Voltage with Respect to GND : Continuous/Pulse
OUT1 and OUT2 Voltage with Respect to GND : Continuous/Pulse
OUT1 to VBAT and OUT2 to VBAT Voltage : Continuous/Pulse
IN1, IN2, St DC Voltage : Continuous/Pulse
VBAT
VOUT
VOUT
VIN
-14 to 40
-0.3 to 40
40
V
V
V
V
V
V
-0.3 to 7.0
-0.3 to 7.0
CUR R Voltage : Continuous/Pulse
VCR
ESD All Pins
Human Body Model (1)
Machine Model (2)
VESD1
VESD2
±2000
±200
OUT1, OUT2 Output Current : Pulse (3)
IN1, IN2, STATUS
IOUTP
IIN
40
A
±5.0
mA
THERMAL RATINGS
Junction Temperature
TJ
TSTORAGE
R
-40 to 150
-65 to 150
2.0
°C
°C
Storage Temperature Range
Thermal Resistance Junction to Case
Thermal Resistance Junction to Ambient (4)
Power Dissipation at Tcase 140°C (5)
Notes
°C/W
°C/W
W
JC
θ
θ
R
25
JA
PD
5.0
1. ESD1 testing is performed in accordance with the Human Body Model (C
=100 pF, R
=1500 Ω).
ZAP
ZAP
2. ESD2 testing is performed in accordance with the Machine Model (C
3. During lamp inrush current.
=200 pF, R
=0 Ω).
ZAP
ZAP
4. Device mounted on dual side printed circuit board with 70 µm copper thickness and 10 cm2 copper heat sink (2.5 cm2 on top side and
7.5 cm2 on down side).
5. Assuming a 150°C maximum junction temperature.
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Charactersitics
Characteristics noted under conditions 4.5 V ≤ VDD ≤ 5.5 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
POWER INPUT
Nominal Operating Voltage
VBAT
VBAT
VµV
9
8
6
–
–
7
16
35
8
V
V
Functional Operating Voltage
Under Voltage Threshold
V
VBAT Standby Supply Current
ISTDBY
µA
VBAT < 14 V and VIN = 0 V, TJ < 125°C
–
–
–
–
–
1
10
20
25
40
–
Supply Current in ON State
ION
RDSON
RDSON
ILIM
mA
mΩ
mΩ
A
IN1 and IN2 @ 3.5 V, no fault, VBAT < 14 V, TJ < 125°C
8
Drain to Source on Resistance
IOUT = 4.0 A, VBAT > 9.0 V and TJ = 25°C
20
30
30
Drain to Source on Resistance
IOUT = 4.0 A, VBAT > 9.0 V and TJ = 150°C
High Current Limitation
VOUT > 1.0 V
Short Circuit limitation
ILIM
A
VOUT < 1.0 V, TJ = 25°C
–
–
4
1
–
–
Hot Openload Threshold
IOL
A
A
VBAT to Output Breakdown Voltage
VDSS
IN1 and IN2 @ 0 V, VOUT = 0 V, IOUT -0.25 mA
40
–
–
–
–
–
VBAT to OUT1 : Leakage Current
IOUT-LEAK
µA
µA
VIN1 = 0 V, VBAT = 35 V, VOUT1 = 0 V
10
10
VBAT to OUT2 : Leakage Current
IOUT-LEAK
VIN2 = 0 V, VBAT = 35 V, VOUT2 = 0 V
–
VIN1, VIN2 : Input Voltage Low Threshold
VIN1, VIN2 : Input Voltage High Threshold
VIN1, VIN2 : Input Voltage Hysteresis
V
–
–
–
1.5
–
V
V
IL
V
3.5
0.4
IH
V
0.7
0.9
V
IH
VIN1, VIN2 : Input Current
VIN1, VIN2 = 3.5 V
I
µA
IN
–
18
40
Status Output Voltage
Vst
V
Ist = 1 mA; Output in Fault
–
150
–
–
–
0.5
–
Thermal Shutdown
TSHUT
THYST
°C
°C
Thermal Shutdown Hysteresis
10
–
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Analog Integrated Circuit Device Data
Freescale Semiconductor
4
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Charactersitics(continued)
Characteristics noted under conditions 4.5 V ≤ VDD ≤ 5.5 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
Current Recopy Ratio
CR
µA
VOUT > VBAT -1.0 V, IOUT from 2.0 A to 4.0 A
–
1/1000
–
TJ -40°C to 105°C, VBAT 9.0 V to 16 V
Current Recopy Ratio Accuracy
CR-AC
%
VOUT > VBAT -1.0 V, IOUT from 2.0 A to 4.0 A
TJ -40°C to 105°C, VBAT 9.0 V to 16 V
-10
–
10
Extended Current Recopy Ratio
CREX
%
%
VOUT > VBAT -1.0 V, IOUT from 1.0 A to 8.0 A
–
1/1000
–
–
Extended Current Recopy Ratio Accuracy
VOUT > VBAT -1.0 V, IOUT from 1.0 A to 8.0 A
CREX-AC
-20
20
Current Recopy Clamp Voltage At 10mA
Nominal Flasher Frequency Operation
Frequency Operation
VCLST
FFL
5.5
–
–
1.5
–
7.0
–
V
Hz
Hz
%
FOP
–
100
–
Nominal Flasher Duty Cycle Operation
DCFL
RWON
–
50
WLP Output Drain to Source on Resistance
Ω
IOUT = 100 mA, VBAT > 9.0 V and TJ = 25°C
–
–
–
–
3.2
5.0
WLP Output Drain to Source on Resistance
RWON
Ω
IOUT = 100 mA, VBAT > 9.0 V and TJ = 125°C
WLP Output Current Limitation
VOUT = 0 V
IWLIM
mA
°C
–
500
–
–
–
WLP Thermal Shutdown
TWSHUT
150
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions 4.5 V ≤ VDD ≤ 5.5 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
MICROCONTROLLER INTERFACE
Maximum Output Positive Slew Rate
tR
V/µs
V/µs
µs
Load = 6.0 Ω
0.01
0.01
1.0
0.3
0.3
30
2.0
2.0
200
Maximum Output Negative Slew Rate
tF
Load = 6.0 Ω
Turn ON Delay Time
TDON
Load = 6.0 Ω, from VIN/2 to 10% VOUT
Turn OFF Delay Time
TDOFF
µs
Load = 6.0 Ω, from VIN/2 to 90% VOUT
1.0
40
200
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
6
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The MC33288DH is a dual high side switch with
W warning lamp. It interfaces directly with a microcontroller
and the package used is a 20-HSOP power small outline, 20
terminals. The MC33288 incorporates a status terminal and
a load current sense capability.
appropriate control, protection, and diagnostic features
dedicated to automotive flasher applications. The device
consists of two independent 25mW power switches and an
additionnal 3.2 Ω high-side switch capable of controlling a 1.2
FUNCTIONAL TERMINAL DESCRIPTIONS
SUPPLY VOLTAGE (VBAT)
OUTPUT CHANNEL (OUT1, OUT2)
The backside TAB is connected to the power supply of the
MC33288DH. In addition to its supply function, this terminal
contributes to the thermal behaviour of the device by
conducting the heat from the switching MOSFET to the
printed circuit board.
Pins 6, 7, and 8 are the source of the output 1 25 mΩ
MOSFET1. Pins 13, 14, and 15 are the source of the output
2 25 mΩ MOSFET2. They deliver current to the connected
loads and are controlled via the IN1 and IN2 terminals,
respectively . These outputs are current limited and
thermally protected.
LOAD CURRENT SENSE (CUR R)
GROUND (GND)
The Current Sense terminal delivers a ratioed amount (1/
1000) of the sum of the currents that can be used to generate
signal ground referenced output voltages for use by the
microcontroller.
This is the ground terminal of the device.
STATUS FOR BOTH CHANNELS (STATUS)
The Fault output is an open drain indication that goes active
low when a fault mode (Openload, Overtemperature) is
detected by the device on either one channel or both
channels simultaneously. Its internal structure is an open
drain architecture with an internal clamp at 6.0 V. An
external pull-up resistor connected to VDD (5.0 V) is needed.
INPUT CHANNEL 1/2 (IN1, IN2)
These are the device input terminals which directly control
their associated outputs. The levels are CMOS compatible.
When the input is a logic low, the associated output MOSFET
is in the OFF state. When input is high, the MOSFET is turned
ON and the load is activated. When both inputs are low, the
device is in standby mode and its supply current is reduced.
Each input terminal has an internal active pull-down, so that
it will not float if disconnected.
WARNING LAMP OUTPUT (WLP)
This terminal is the source of a 3.2 Ω MOSFET. This output
is current limited and thermally protected. It delivers current
through the connected load when both IN1 and IN2 inputs
are logic high. It is usually used as a warning lamp driver for
Flasher application.
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
is up to 48 A per channel. The 48 A value will only occur at
Power Supply
the first lamp turn-on. In order to optimise the total system
(MC33288, printed circuit board, wiring, fuse etc.), the device
incorporates a current limitation at 30 A typical. This means
that the first in rush current will be clamped at 30 A. The
second lamp turn-on of the flashing cycle will not see any
clamping as the lamps have been heated up in the previous
cycle.
The MC33288 can be directly connected to the supply line.
In standby mode (IN1 and IN2 @ OV), the supply current is
less than 10 mA for VBAT supply voltage below 14 V. This
feature allows a very low supply current on the battery when
the car is idle or parked.
During the OFF state, the current recopy terminal and the
status terminals are in high impedance.
IN1 and IN2 are the two inputs of the device, connected to
a microcontroller I/O; they are CMOS compatible. When
these inputs are in low state, the device is in standby mode.
When any of the inputs are switched to a high level, the
associated output MOSFET is turned on.
In case of loss of (digital) ground, the power MOSFETs
turn off in order to safely tie the load current to zero.
Nominal Voltage and Transient Operation
The nominal operation voltage is from 9.0 V to 16 V. The
MC33288 is functional over a larger voltage range from 8.0 V
to 35 V. The technology used for both power and analog
circuitry sustains 40 V DC voltage.
Status
The device has a single status terminal which reports an
overtemperature and an openload condition in the device.
This terminal is an open drain structure and needs an
external pull-up resistor. The device incorporates
overtemperature sense on each output MOSFET in order to
independently protect each output. But, the report of the
overtemperature is done through one single status terminal,
called STATUS, in order to minimize the number of I/O
connections of the MCU.
Reverse Battery
The MC33288 is self protected against reverse battery up
to -14 V in a continuous mode. When a negative battery
voltage arises, the MOSFETs are internally turned off. The
load current flows in the body diode of each MOSFET. The
power dissipation within the MC33288DH is then VF x ILOAD
,
where ILOAD is the total current set by the loads and VF is the
forward body diode voltage. VF is 0.5 V typical at 150°C and
decreases with temperature with a drop of -2.0 mV/°C.
Open Load Function
The open load detection is active during the ON phase (hot
openload detection). An amplifier measures the differential
voltage between VBAT and VOUT
Power Output Switches
.
The device has two independent high-side switches. Each
switch is realized with an N-channel power MOSFET and
includes current and temperature sensing circuitries. The
MOSFET gates are driven by analog circuitry which includes
charge pump and fault detection. A specific feature of this
device is the output current recopy.
When the load current is below 1.0 A, the openload
circuitry will pull down the status output. If the openload
condition is present before the device turn-on, the status will
be pulled down after a delay due to the rise time of the output.
Current Recopy Function
Each output has a 25 mΩ RDSON maximum at 25°C. The
RDSON value reaches 40 mΩ at 150°C junction temperature.
Each output has a parasitic drain to source diode, inherent to
the technology. This diode can sustain as much current as
the MOSFET. This diode is reversed biased during normal
operation of the MOSFET and is forward biased during
reverse battery or negative transient pulses.
Flasher application needs to detect failed lamp. The
system must detect one 21 W lamp failing, in the flasher
application only, without a trailor. The MC33288 has an
output current recopy function which recopies on the CUR R
terminal a portion of the output current. Each channel is
connected to the same CUR R terminal as the system has to
operate in the flasher mode only and not in the warning
operation.
The output MOSFET can each drive 8.0 A nominal. This
maximum current condition occurs when up to three 21 W
lamps and two small 5.0 W or 7.0 W lamps are connected on
each channel, at higher VBAT voltage specification. This is the
case when a trailor is attached to the car. As the flasher can
operate in warning or hazard operation mode with its two
channels on, the MC33288 can drive 16 A total.
The MC33288 provides a current recopy of 1/1000 of the
main output current, either output left or right. The recopy
function has its higher accuracy of ±10% in the usual
operation range and an accuracy of ±20% in the total
operating range. This allows a precise detection of one 21 W
lamp, but also the detection of additional lamps in case of
trailor connection.
When lamps are turned on, the inrush current can reach
up to 6 times the nominal lamp current. For this particular
application, the total inrush current can reach 6 x 8.0 A–that
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
8
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
This paragraph is boilerplate - you may add to it but, can not change wording. You may change numeric values
An external resistor must be connected to the CUR R
terminal and then tied to a microcontroller A/D input for
analog voltage measurement. The CUR R terminal is
internally clamped to protect the MCU A/D input.
Top side pcb
Down side pcb
2
2
2 cm
8 cm
Warning Lamp Driver
The warning lamp driver is a 3.2 Ω RDSON maximum
high-side MOSFET to control the 1.2 W dashboard warning
lamp. This output is current limited and thermally
HSOP20
protected-activated only in the warning mode. It is turned on
by activation of both right and left inputs (IN1 and IN2).
Thermal
via from
top to down
side pcb
Package
The device is assembled into a power surface mount
package. This package offers high thermal performances
and high current capabilities. It offers 10 terminals on each
package sides and an additional terminal which is the
package heat sink , called terminal 21. The heak sink acts as
the MC33288 power VBAT connection.
external pcb (4x4 cm)
Figure 3. Printed Board Layout Example (not to scale)
Figure 1 shows an example of printed circuit board layout.
It has a total of 10 cm2 additional copper on two sides (2.5
cm2 on the top side and 7.5 cm2 on the down side).
With the above layout, thermal resistance junction to
ambient of 25°C/W can be achieved, this value being split
into:
Soldering Information
This device is packaged in a Surface Mount Power
package indended to be soldered directly on the Printed
Circuit Board.
• junction to case : RθJC1 = RθJC2 = 2°C/W
• case to ambient : RθCA = 23°C/W
This device was qualified according to JEDEC standards
JESD22-A113-B and J-STD-020A with the reflow conditions
applicable for packages with thickness above 2.5 mm:
Lower value can be reached with the help of larger and
thicker copper metal, higher number of thermal via from top
to down side pcb and the use of additional thermal via from
the circuit board to the module case.
Convection 220°C +5/-0°C
VPR 215-219°C
IR / Convection 220°C +5/-0°C
Steady State Thermal Model
The maximum peak temperature during the soldering
process should not exceed 220°C (+5°C/-0°C). The time at
maximum temperature should range from 10 to 40s
maximum.
The junction to ambient thermal resistance of the circuit
mounted on a printed circuit board can be split into two main
parts: junction to case and case to ambient resistances.
A simplified steady state model is shown in Figure 2.
Thermal Management
Chan 1 Junction
Temp Node
The junction to case thermal resistance is 2°C/W
maximum. The junction to ambient thermal resistance is
dependent on the mounting technology and the addition of
heat sink. One of the most commonly used mounting
techniques consists of using the printed circuit board and the
copper lines as heat sink.
(Volts represent Die
Temp Node
Chan 2 Junction
Surface Temperature)
Chan 1
Chan 2
Switch
Switch
R
R
θJC1
θJC2
2°C/W
2°C/W
Chan 2
Power (W)
Chan 1
Power (W)
Case Temp Node
(1.0A=1W of
Power Dissipation)
Rthca
(1.0Ω=1°C/W)
25°C/W
Ambient Temp Node
AmbientTemperature
(1.0V=1°C)
Figure 4. Simplified Thermal Model (Electrical
Equivalent)
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
Transient Thermal Model
A more complete model including thermal capacitance is
proposed in Figure 3.
30
20
1mJ/K
4mJ/K
3.5K/W
5mJ/K
3K/W
5mJ/K
MOS1
MOS3
MOS2
Control
10
3.5K/W
3K/W
3K/W
Case
450K/W
0
3K/W
0
100
200
300
400
500
600
700
800
Time (sec.)
Board
0.5J/K
300K/W
20K/W
6J/K
Ambiant
Figure 6. Junction to Ambiant Thermal Impedance
This figure shows that the steady state is reached after
about 10 minutes. It also clearly shows that the device can
dissipate almost twice the power within one minute compared
to the maximum allowed power dissipation in steady state.
Figure 5. Transient Thermal Model
This gives a thermal impedance versus time (Figure 4),
which has been determined with the printed circuit board
shown in Figure 1.
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
10
TYPICAL APPLICATIONS
OPERATIONAL MODES
TYPICAL APPLICATIONS
Battery
V
33288
BAT
C
B
OUT2
OUT2
OUT2
Charge
Pump
5.0 V
CHANNEL 2
Left
OUT1
OUT1
OUT1
21+5W
Trailor Left Side
21+21+5W
Left Side
Over
Temp
Over
10 K
Current
V
BATC
Input
Trigger
R
IN2
I/O
St-2 Cr 2
Open
Load
MCU
R
R
IN1
ST
I/O
I/O
Current
Recopy
Fault
Monitoring
St-1
CHANNEL 1
Right
C
1
R
R
A/D
CUR R
21+21+5W
Right Side
V
BAT
IN2
Current Copy
Resistor
Drive &
Protect
R
CR
Warning Lamp
Driver
WLP
21+5W
R : 10 k typical
V
BAT
Trailor Right Side
R
C
R
CR : 500 Ω to 1 kΩ typical
B : 100 nF to 470 nF
WLP : 100 Ω typical
R
WLP
1.2 W
GND
Figure 7. Typical Application - Automotive Flasher
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
PACKAGING
PACKAGING INFORMATION
PACKAGING
PACKAGING INFORMATION
DH SUFFIX
20-LEAD HSOP
PLASTIC PACKAGE
98ASH70273A
ISSUE C
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
12
PACKAGING
PACKAGING INFORMATION (CONTINUED)
PACKAGING INFORMATION (CONTINUED)
DH SUFFIX
20-LEAD HSOP
PLASTIC PACKAGE
98ASH70273A
ISSUE C
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
•
•
Implemed Revision History page
Changed Part Number MC33288DH to MC33288DDH - Noelectrical changes.
5/2005
6.0
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
14
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MC33288
Rev 6.0
5/2006
相关型号：
MC33289DW
2 CHANNEL, BUF OR INV BASED PRPHL DRVR, PDSO20, 1.27 MM PITCH, PLASTIC, MS-013AC, SOIC-20
NXP
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