FS8601HD [FORTUNE]

One Cell Lithium-ion/Polymer Battery Protection IC With Built-in MOSFET;
FS8601HD
型号: FS8601HD
厂家: Fortune Semiconductor    Fortune Semiconductor
描述:

One Cell Lithium-ion/Polymer Battery Protection IC With Built-in MOSFET

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REV. 1.3 FS8601Hx-DS-13_EN  
JAN 2014  
Datasheet  
FS8601Hx  
One Cell Lithium-ion/Polymer Battery Proection IC With ilt-in MOSFET  
FS8601Hx  
Fortune Semiconductor Corporation  
富晶電子股份有限公司  
23F, No. 29-5, Sec. 2, Zhongzheng E. Rd.,  
Danshui Dist., New Taipei City 251, Taiwan  
Tel.886-2-28094742  
Fax886-2-28094874  
www.ic-fortune.com  
This manual contins new ct information. Fortune Semiconductor Corporation reserves the rights to  
modify the prouct spcification without further notice. No liability is assumed by Fortune Semiconductor  
Corporation as a rsult of the use of this product. No rights under any patent accompany the sale of the  
product.  
Rev. 1.3  
2/15  
FS8601Hx  
3. Ordering Information  
1. General Description  
FS8601Hx-D (DFN-5 Green-Package)  
Serial code form A, D  
FS8601Hx is a series of lithium-ion and  
lithium-polymer rechargeable battery protection  
ICs with high accurate voltage detection and  
delay circuits.  
*: Refer to the product name list on next page.  
4. Applications  
These Ics are suitable for protection of single  
cell lithium-ion or lithium polymer battery packs  
from over charge, over discharge and over  
current.  
z
Protection IC for One-Cell Lithium-Ion /  
Lithium-Polymer Battery Pack  
2. Features  
z
z
z
With built-in N-MOSFET of low turn-on  
resistance.  
Reduction in Board Size due to Minature  
Package DFN-5.  
Protection IC  
„
Low supply curent  
Normal Operation : 2.5μA (typ.)  
@VDD=3.
Power-ode : 0.05μA (typ.)  
@VDD=2
„
„
„
„
„
Oge dtection voltage  
4.255V~4.335V
f ±25mV  
Overdischarge detection e  
VODL﹞  
2.223V~
Accuracy of ±100mV  
Over currention voltage  
VOI1﹞  
120V~0.140 V,  
Accuracy of ±mV  
Charger over current detection  
voltage  
-0.09 V(FS8601HA),  
-0.10(FS8601HD)  
0V-Battery charging fu
z
MOSFET:  
Rss(ON) 48mΩ  
(VGS = 3.5V , ID = 1A)  
„
.
Rev. 1.3  
3/15  
FS8601Hx  
5. Product Name List  
Package  
DFN-5  
Overcharge Overcharge Overdischarge Overdischarge Overcurrent  
Standby  
detection  
voltage  
release  
voltage  
detection  
voltage  
release  
voltage  
detection  
voltage  
0V change  
function  
Model  
function  
release  
[VOCP] (V)  
[VOCR] (V)  
[VODP] (V)  
[VODR] (V)  
[VOI1] (V)  
Connection  
of charger  
FS8601HA  
FS8601HD  
FS8601Hx  
FS8601Hx  
4.310±25mV 4.110±50mV  
4.280±25mV 4.080±50mV  
2.300±77mV  
2.300±00mV  
2.300±77mV  
2.300±100mV  
0.130±10mV  
0.130±10mV  
YES  
0.65  
Connection  
of charger  
6. Pin Configuration and PackagMarkinInformation  
Pin No. Symbol  
Description  
1
2
3
4
5
6
NC  
NC  
GND  
Groud pin  
BATT- Connect tnegative of charger or load  
VCC  
CS  
wer supply, through a resistor R1)  
put pin for current senseger detect  
Tow MOSFET common draconnection pin  
XSerial code fm A, D  
AYear.  
BWeek Code, A~Z & A ~ Z  
001 :Serial number  
Rev. 1.3  
4/15  
FS8601Hx  
7. Functional Block Diagram  
8. Typical Appliction Circuit  
Symbol  
Purpose  
Recommended  
Remakes  
R1  
ESD protectio.  
For power fluctuation.  
100~470Ω  
Resistance should be as small as  
possible to avoid lowering of the  
overcharge  
detection  
accuracy  
caused by VDD pin current. Use  
470Ω for better ESD protection.  
C1  
R2  
For power fluctuation.  
Protection for reverse  
connection of a  
charger.  
0.1μF  
1k~2kΩ  
Select a resistance as large as  
possible to prevent large current  
when a charge is connected in  
reverse.  
Rev. 1.3  
5/15  
FS8601Hx  
9. Absolute Maximum Ratings  
(VSS=0V, Ta=25°C unless otherwise specified)  
Item  
Input voltage between VCC and GND *  
CS input pin voltage  
Symbol  
Rating  
GND-0.3 to GND+15  
VCC -30 to VCC +0.3  
-40 to +85  
Unit  
V
VCC  
VCS  
TOP  
TST  
VDS  
VGS  
V
Operating Temperature Range  
Storage Temperature Range  
Drain-Source Voltage  
°C  
°C  
V
-40 to +125  
30  
Gate-Source Voltage  
±12  
V
ID  
Continuous Drain Current3  
Pulsed Drain Current1  
Total Power Dissipation  
10  
60  
A
@TA=25  
IDM  
PD  
@TA=25℃  
1.4  
W
Storage Temperature Range  
TSTG  
TJ  
-55 to 150  
-55 to 150  
Operating Junction Teture Rang  
Note: FS8601Hx cins a circuit that will prit from static discharge; but please take special  
care that no exessive static electricity volage which exceeds the limit of the protection  
circuiapplied to it.  
z
Pulse se exceeding the aut voltage (VSS+12V) may cause damage to the IC.  
Rev. 1.3  
6/15  
FS8601Hx  
10. Electrical Characteristics  
FS8601HA(VSS=0V, Ta=25°C unless otherwise specified)  
PARAMETER  
Supply Current  
Power-Down Current  
CONDITIONS  
VDD=3.9V  
VDD=2.0V  
SYMBOL  
IDD  
Min  
Typ  
2.5  
Max  
5.2  
1.0  
UNIT  
μA  
μA  
V
V
V
V
V
V
V
IPD  
0.05  
4.310  
4.110  
2.300  
2.300  
0.130  
0.90  
-0.09  
8.0  
Overcharge detection voltage  
Overcharge release voltage  
Overdischarge detection voltage  
Overdischarge release voltage  
Over current detection voltage  
Short circuit detection voltage  
Charger over current detection voltage  
Faulty charger detect voltage  
Faulty charger recovery voltage  
VOCU  
VOCR  
VODL  
VODR  
VOI1  
VOI2  
VCH  
4.285  
4.060  
2.223  
2.223  
0.120  
0.80  
-0.11  
5.5  
4.335  
4.160  
2.377  
2.377  
0.140  
1.00  
-0.07  
10.5  
9.3  
VDD=3.6V  
VDD=3.6V  
Vdet  
Vrec  
V
V
5.3  
7.3  
0
4
65  
7.35  
0.45  
16.25  
5.0  
5.0  
0.3  
0
1
1.4  
48.75  
50.0  
50.0  
3.0  
V
s
VST  
TOC  
TOD  
TOI1  
TOI2  
det  
Td1  
0V charging prohibit  
VDD=4.0V to 4.4V  
VDD=3.0V to 2.0V  
VDD=3.6V  
Overcharge detection delay time  
Overdischarge detection delay time  
Over current detection delay time  
Short circuit detection delay tim
Charger over current delay time  
Overcharge timer reset delay time  
Charge release delay ti
6.25  
100  
11.0  
0.750  
32.5  
1
ms  
ms  
ms  
ms  
ms  
ms  
ms  
VDD=3.6V  
VDD=3.6V  
Td2  
Tdr1  
16  
1
Charge connection detdelay  
N-MOSFET have low turn-oresistance  
Drain-Source Breoltage  
3
V
VGS=0V,ID
BVDSS  
(BATT- to D12 /
Breakdown Voltagure  
Coefficient  
Reference to
ID=1
V/℃  
mΩ  
mΩ  
mΩ  
uA  
0.1  
36  
39  
48  
ΔBVDSS/ΔTj  
27  
30  
33  
45  
48  
65  
1
VGS==1A  
VGS=3.5V,ID=1A  
VGS=2.5V,ID=1A  
VDS=20V,VGS
Static Source-Surce On-Resise  
(BATT- to GND)  
ON)  
Drain-Source Leakage Current)  
(BATT- to D12 / D12 to GND)  
IDSS  
(Tj=25)  
Rev. 1.3  
7/15  
FS8601Hx  
FS8601HD(VSS=0V, Ta=25°C unless otherwise specified)  
PARAMETER  
CONDITIONS  
SYMBOL  
Min  
Typ  
Max  
UNIT  
CURRENT CONSUMPTION  
Supply Current  
Power-Down Current  
VDD=3.9V  
VDD=2.0V  
IDD  
IPD  
2.5  
0.05  
4.280  
4.080  
2.300  
2.300  
0.130  
0.70  
-0.100  
8.0  
5.5  
1.0  
μA  
μA  
V
V
V
V
V
V
V
Overcharge detection voltage  
Overcharge release voltage  
Overdischarge detection voltage  
Overdischarge release voltage  
Over current detection voltage  
Short circuit detection voltage  
Charger over current detection voltage  
Faulty charger detect voltage  
Faulty charger recovery voltage  
VOCU  
VOCR  
VODL  
VODR  
VOI1  
VOI2  
VCH  
Vdet  
4.255  
4.030  
2.200  
2.200  
0.120  
0.60  
-0.120  
6.0  
4.305  
4.130  
2.400  
2.400  
0.140  
0.80  
-0.080  
10.0  
8.8  
VDD=3.6V  
VDD=3.6V  
V
V
Vrec  
5.8  
7.3  
0.40  
0.6  
65  
13.3  
0.60  
5.10  
0.65  
1
100  
20.0  
1.0  
8.50  
1.10  
1.80  
12.75  
V
s
ms  
ms  
ms  
ms  
VST  
0V charging prohibit  
VDD=4.0V to 4.V  
VDD=3.0V t2.0V  
VDD=3.6V  
Overcharge detection delay time  
Overdischarge detection delay time  
Over current detection delay time  
Short circuit detection delay time  
Charger over current delay time  
TOC  
TOD  
TOI1  
TOI2  
Tdet  
VDD=.6V  
VDD=3.6V  
N-MOSFET have low turn-on resistanc
Drain-Source Breakdown V
V
30  
VGS=0V,ID=1mA  
BVDSS  
(BATT- to D12 / D12 to G
Breakdown Voltage Tempere  
Coefficient  
Reference to 25
ID=1mA  
V/℃  
mΩ  
mΩ  
mΩ  
uA  
0.1  
36  
39  
48  
ΔBVDSS/ΔTj  
2
30  
33  
45  
48  
65  
1
VGS=4.5V,
VGS=ID=1
VGS=2D=1A  
VDS=20V,VGS=0V  
Static Source-Souresistance  
(BATT- to GND)  
RSS(ON)  
Drain-Source Leakage Current
(BATT- to D12 / D12 to GN
25
Rev. 1.3  
8/15  
FS8601Hx  
MOSFET. The overcurrent condition returns to the  
normal mode when the load is released or the  
impedance between BATT+ and BATT- is larger than  
150kΩ. The FS8601HX provides two overcurrent  
detection levels (0.13V and 0.7V or 0.9V) with two  
overcurrent delay time (TOI1 and TOI2)  
corresponding to each overcurrent detection level.  
11. Description of Operation  
Normal Condition  
If VODL<VCC<VOCU and VST<VCS<VOI1, M1 and  
M2 are both turned on. The charging and  
discharging processes can be operated normally.  
Overcharge Protection  
When the voltage of the battery cell exceeds the  
overcharge detection voltage (VOCU) beyond the  
overcharge delay time (TOC) period, charging is  
inhibited by turning off of the charge control  
MOSFET. The overcharge condition is released in  
two cases:  
Charge Detection after Overdischarge  
Wen overdischarge occurs, the discharge control  
MOSFET turns off and discharging is inhibited.  
However, charging is still permitted through the  
paasitic diode of MOSFET. Once the charger is  
connected to the battery pack, the FS8601HX  
immediately turns on all the timing gention and  
detection circuitry. Chaging progresed if  
the voltage ween CS and GND irge  
detection shod voltage.  
The voltage of the battery cell becomes ower han  
the overcharge release voltage (VOCR) hrough  
self-discharge.  
The voltage of the battery cell falls below the  
overcharge detection voltage (VOCU) and a load is  
connected.  
Power Down after Overharge  
When overdischarge occursthe S8601HX will  
enter into power-down mode, turning off all the  
timing generation and detection circuitry to reduce  
te quiescent current to 1.0μA (VCC=2.0V). At the  
When the battery vis above VOCU, the  
overcharge conditiot release even a load is  
connected to the pack.  
same time, the CS pin is pull-up to VCC through an  
internal resistor.  
Overdiotection  
When he voltahe battery cell goelow e  
overdischage detection voltage (VODnd the  
overdscarge delay time (TOD) priodarging  
is inhibitd by turning off the ischarge control  
MOSFET.  
Supersing charger voltage  
By supervising the charge voltage, charging can be  
ited instantly when a charger with overvoltage  
onnvted. The charger voltage detection circuit  
supervises the voltage between the VDD and CSI  
pins. When this voltage exceeds Vdet(Vdet <  
(VDD – VCSI)),regardless of the battery voltage,the  
charge FET control pin output alow level(CSI  
level)signal and the charge FET is turned off. When  
the charger voltage drops to Vrec or lower, the  
charger FET control output level is dependent on  
battery voltage.  
The default of overdischae delay time is 100ms.  
Inhibition of discharging is mmediately released  
when the voltage of the battery cell becomes hi
than overdischarge release voltage (VODR) throh  
charging.  
Overcurrent Protection  
In normal mode, the FS861HX continuously  
monitors the discharge currenby sensing the  
voltage of CS pin. If the voe of CS pin exceeds  
the overcurrent detection VOI1) beyond the  
overcurrent delay ime (TOIod, the overcurrent  
protection circit operates and discharging is  
inhibited by turng off the discharge control  
Note: When a battery is connected to FS8601HX  
for the first time, it may not enter the normal  
condition (dischargeable may not be enabled). In  
this case, short the CS and VSS pins or connect  
to a charger to restore to the normal condition.  
Rev. 1.3  
9/15  
FS8601Hx  
As the turn-on resistance of the external MOSFET  
changes, the design of the overcurrent threshold  
current changes accordingly.  
12. Design Guide  
Selection of External Control MOSFET  
Because the overcurrent protection voltage is preset,  
the threshold current for overcurrent detection is  
determined by the turn-on resistance of the charge  
and discharge control MOSFETs. The turn-on  
resistance of the external control MOSFETs can be  
determined by the equation: RON=VOIP/ (2 x IT) (IT  
is the overcurrent threshold current). For example, if  
the overcurrent threshold current IT is designed to  
be 3A, the turn-on resistance of the external control  
MOSFET must be 25mΩ. Be aware that turn-on  
resistance of the MOSFET changes with  
temperature variation due to heat dissipaon. It  
changes with the voltage between gate and souce  
as well. (Turn-on resistance of MOSFET inceases  
as the voltage between gate and sorce decreaes).  
Suppressing the Ripple and Disturbance  
from Charger  
To suppress the ripple and disturbance from charger,  
connecting R1 and C1 to VCC is recommended.  
Protection the CS pin  
2 iused for latch-up protection when charger is  
connected under overdischarge condition and  
overstress protection at reverse connecting f a  
charger.  
Rev. 1.3  
10/15  
FS8601Hx  
13. Timing Diagram  
Overcharge Condition ÆLoad Discharging Æ Normal Condition  
Charger  
Load  
VOCP  
VOCR  
VODR  
VODP  
VCC  
CS  
VCC  
GND  
VC  
VOI1  
GND  
VCH  
TOC  
TOC  
Rev. 1.3  
11/15  
FS8601Hx  
Overdischarge Condition Æ Charging by a Charger ÆNormal Condition  
Charger  
Load  
VOCP  
VOCR  
VODR  
VODP  
VCC  
CS  
VCC  
GND  
VCC  
VOI2  
GD  
VCH  
D  
Rev. 1.3  
12/15  
FS8601Hx  
Over Current Condition Æ Normal Condition  
Charger  
Load  
VOCP  
VOCR  
VODR  
VODP  
VCC  
CS  
VCC  
GND  
VCC  
VOI2  
VI1  
GND  
TOI1  
TOI2  
Rev. 1.3  
13/15  
FS8601Hx  
14. Package Outline  
DFN-5  
Rev. 1.3  
14/15  
FS8601Hx  
15. Revision History  
Version Date  
Page  
ALL  
0
Description  
New release  
Rename Sign Head  
Revise Drain-Source Voltage  
1.0  
1.1  
2011/09/27  
2012/02/10  
6
1.2  
1.3  
2012/09/12  
2014/01/09  
14  
4
Revise package outline  
Revise VOI1 Specified Unit  
Rev. 1.3  
15/15  

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