FMBT5551 [FORMOSA]

600mA Silicon NPN Epitaxial Planar Transistor; 600毫安硅NPN外延平面晶体管
FMBT5551
型号: FMBT5551
厂家: FORMOSA MS    FORMOSA MS
描述:

600mA Silicon NPN Epitaxial Planar Transistor
600毫安硅NPN外延平面晶体管

晶体 晶体管
文件: 总8页 (文件大小:409K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
High Voltage NPN Epitaxial Planar Transistor  
Formosa MS  
FMBT5550 / FMBT5551  
List  
1
List.................................................................................................  
Package outline...............................................................................  
Features..........................................................................................  
Mechanical data...............................................................................  
Maximum ratings .............................................................................  
Rating and characteristic curves........................................................  
Pinning information...........................................................................  
Marking...........................................................................................  
Suggested solder pad layout.............................................................  
Packing information..........................................................................  
Reel packing....................................................................................  
Suggested thermal profiles for soldering processes.............................  
2
2
2
2~3  
4~5  
6
6
6
7
8
8
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-231108  
Issued Date  
2008/02/10  
Revised Date  
2011/07/21  
Revision  
C
Page.  
8
Page 1  
High Voltage NPN Epitaxial Planar Transistor  
Formosa MS  
FMBT5550 / FMBT5551  
600mA Silicon NPN Epitaxial Planar  
Package outline  
Transistor  
SOT-23  
Features  
High collector-emitterbreakdien voltage.  
(BVCEO = 140V~ 160V@IC=1mA)  
This device is designed for general purpose high voltage  
(B)  
(A)  
(C)  
amplifiers and gas discharge display driving.  
Epitaxial planar die construction.  
Complememntary PNP type available (FMBT5401)  
0.063 (1.60)  
0.047 (1.20)  
0.027 (0.67)  
0.013 (0.32)  
Lead-free parts for green partner, exceeds environmental  
standards of MIL-STD-19500 /228  
0.108 (2.75)  
0.083 (2.10)  
Suffix "-H" indicates Halogen-free part, ex.FMBT5550-H.  
0.051 (1.30)  
0.035 (0.89)  
Mechanical data  
Dimensions in inches and (millimeters)  
Epoxy:UL94-V0 rated flame retardant  
Case : Molded plastic, SOT-23  
Terminals : Solder plated, solderable per  
MIL-STD-750, Method 2026  
Mounting Position : Any  
Weight : Approximated 0.008 gram  
Maximum ratings (AT TA=25oC unless otherwise noted)  
PARAMETER  
Collector-Base voltage  
Collector-Emitter voltage  
Emitter-Base voltage  
Collector current  
CONDITIONS  
Symbol FMBT5550  
FMBT5551 UNIT  
VCBO  
VCEO  
VEBO  
IC  
V
V
dc  
160  
140  
180  
160  
dc  
V
dc  
6.0  
mAdc  
600  
Thermal Characteristics  
Characteristics  
CONDITIONS  
Symbol  
PD  
UNIT  
mW  
mW/OC  
OC/W  
mW  
mW/OC  
Maximum  
225  
TA = 25OC  
Total device dissipation FR-5 board  
(1)  
Derate above 25OC  
Junction to ambient  
TA = 25OC  
PD  
1.8  
Thermal resistance  
RθJA  
PD  
556  
300  
Total device dissipation alumina  
substrate(2)  
Derate above 25OC  
PD  
2.4  
OC/W  
Thermal resistance  
Operating temperature  
Junction to ambient  
RθJA  
TJ  
417  
-55 ~ +150  
oC  
Storage temperature  
TSTG  
-65 ~ +150  
1.FR-5 = 1.0 X 0.75 X0.062 in.  
2.Alumina = 0.4 X 0.3 X 0.024 in. 99.5% alumina.  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-231108  
Issued Date  
2008/02/10  
Revised Date  
2011/07/21  
Revision  
C
Page.  
8
Page 2  
High Voltage NPN Epitaxial Planar Transistor  
Formosa MS  
FMBT5550 / FMBT5551  
Characteristics (AT TA=25oC unless otherwise noted)  
Off characteristics  
PARAMETER  
CONDITIONS  
Ic = -100µAdc, IE = 0  
Symbol  
V(BR)CBO  
Types  
Max.  
UNIT  
Min.  
-
-
-
-
-
160  
FM5550  
FM5551  
FM5550  
FM5551  
Both Types  
FM5550  
FM5551  
FM5550  
FM5551  
Both Types  
Collector-Base breakdown voltage  
V
dc  
180  
Ic = 1.0mA c, IB = 0  
d
140  
V
V
dc  
dc  
Collector-Emitter breakdown voltage(3)  
Emitter-Base breakdown voltage  
V(BR)CEO  
V(BR)EBO  
160  
IE = 10µAdc, IC = 0  
6.0  
VCB = 100Vdc, IE = 0  
100  
50  
-
-
-
-
-
nAdc  
VCB = 120Vdc, IE = 0  
ICBO  
VCB = 100Vdc, IE = 0, TA = 100OC  
VCB = 100Vdc, IE = 0, TA = 100OC  
VEB = 4.0Vdc, IC = 0  
Collector cutoff current  
Emitter cutoff current  
100  
50  
µAdc  
IEBO  
nAdc  
50  
On characteristics(3)  
PARAMETER  
CONDITIONS  
Symbol  
Types  
Max.  
UNIT  
Min.  
60  
-
-
FM5550  
FM5551  
FM5550  
FM5551  
FM5550  
FM5551  
Both Types  
FM5550  
FM5551  
Both Types  
FM5550  
FM5551  
Ic = 1.0mAdc, VCE = 5.0Vdc  
80  
250  
60  
80  
20  
DCcurrent gain  
Ic = 10mAdc, VCE = 5.0Vdc  
hFE  
-
250  
-
-
Ic = 50mA, VCE = 10Vdc  
Ic = 10mAdc, IB = 1.0mAdc  
Ic = 50mAdc, IB = 5.0mAdc  
Ic = 10mAdc, IB = 1.0mAdc  
Ic = 50mAdc, IB = 5.0mAdc  
30  
-
0.15  
-
-
-
-
-
0.25  
0.20  
1.0  
VCE(sat)  
V
V
dc  
dc  
Collector-Emitter saturation voltage(3)  
Base-Emitter saturation voltage(3)  
VBE(sat)  
1.2  
1.0  
3.Pulse test : pukse width < 300uS, duty cycle < 2.0%.  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-231108  
Issued Date  
2008/02/10  
Revised Date  
2011/07/21  
Revision  
C
Page.  
8
Page 3  
High Voltage NPN Epitaxial Planar Transistor  
Formosa MS  
FMBT5550 / FMBT5551  
http://www.formosams.com/  
Document ID  
DS-231108  
Issued Date  
2008/02/10  
Revised Date  
2011/07/21  
Revision  
C
Page.  
8
TEL:886-2-22696661  
Page 4  
FAX:886-2-22696141  
High Voltage NPN Epitaxial Planar Transistor  
Formosa MS  
FMBT5550 / FMBT5551  
http://www.formosams.com/  
Document ID  
DS-231108  
Issued Date  
2008/02/10  
Revised Date  
2011/07/21  
Revision  
C
Page.  
8
TEL:886-2-22696661  
Page 5  
FAX:886-2-22696141  
High Voltage NPN Epitaxial Planar Transistor  
FMBT5550 / FMBT5551  
Pinning information  
Formosa MS  
Pin  
Simplified outline  
Symbol  
C
C
PinB Base  
PinC Collector  
PinE Emitter  
B
E
B
E
Marking  
Type number  
Marking code  
FMBT5550  
FMBT5551  
M1F  
G1  
Suggested solder pad layout  
SOT-23  
0.037(0.95)  
0.037(0.95)  
0.079(2.0)  
0.035(0.90)  
0.031(0.80)  
Dimensions in inches and (millimeters)  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-231108  
Issued Date  
2008/02/10  
Revised Date  
2011/07/21  
Revision  
C
Page.  
8
Page 6  
High Voltage NPN Epitaxial Planar Transistor  
Formosa MS  
FMBT5550 / FMBT5551  
Packing information  
P0  
P1  
d
E
F
W
B
A
P
D2  
D1  
T
C
W1  
D
unit:mm  
Symbol  
SOT-23  
Item  
Tolerance  
Carrier width  
A
B
C
d
D
D1  
D
D1  
D2  
E
0.1  
0.1  
0.1  
0.1  
2.0  
min  
2.0  
min  
0.5  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.3  
1.0  
3.15  
2.77  
1.22  
1.50  
-
Carrier length  
Carrier depth  
Sprocket hole  
13" Reel outside diameter  
13" Reel inner diameter  
7" Reel outside diameter  
7" Reel inner diameter  
Feed hole diameter  
Sprocket hole position  
Punch hole position  
Punch hole pitch  
Sprocket hole pitch  
Embossment center  
Overall tape thickness  
Tape width  
-
178.00  
55.00  
13.00  
1.75  
3.50  
4.00  
4.00  
2.00  
0.23  
8.00  
12.0  
F
P
P0  
P1  
T
W
W1  
Reel width  
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-231108  
Issued Date  
2008/02/10  
Revised Date  
2011/07/21  
Revision  
Page.  
C
8
Page 7  
High Voltage NPN Epitaxial Planar Transistor  
Formosa MS  
FMBT5550 / FMBT5551  
Reel packing  
INNER  
BOX  
(m/m)  
REEL  
DIA,  
(m/m)  
CARTON  
SIZE  
(m/m)  
COMPONENT  
SPACING  
APPROX.  
BOX  
(pcs)  
PACKAGE  
SOT-23  
REEL SIZE  
7"  
REEL  
(pcs)  
GROSS WEIGHT  
(kg)  
CARTON  
(pcs)  
(m/m)  
3000  
4.0  
30,000  
178  
383*262*387  
240,000  
11.6  
183*183*123  
Suggested thermal profiles for soldering processes  
1.Storage environment: Temperature=5oC~40oC Humidity=55%±25%  
2.Reflow soldering of surface-mount devices  
Critical Zone  
TL to TP  
Tp  
TP  
Ramp-up  
TL  
TL  
Tsmax  
Tsmin  
tS  
Preheat  
Ramp-down  
25  
t25oC to Peak  
Time  
3.Reflow soldering  
Profile Feature  
Soldering Condition  
Average ramp-up rate(TL to TP)  
<3oC/sec  
Preheat  
-Temperature Min(Tsmin)  
-Temperature Max(Tsmax)  
-Time(min to max)(ts)  
150oC  
200oC  
60~120sec  
Tsmax to TL  
-Ramp-upRate  
<3oC/sec  
Time maintained above:  
-Temperature(TL)  
-Time(tL)  
217oC  
60~260sec  
Peak Temperature(TP)  
255oC-0/+5oC  
Time within 5oC of actual Peak  
Temperature(tP)  
10~30sec  
Ramp-down Rate  
<6oC/sec  
Time 25oC to Peak Temperature  
<6minutes  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-231108  
Issued Date  
2008/02/10  
Revised Date  
2011/07/21  
Revision  
C
Page.  
8
Page 8  

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