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FM751V-NL [FORMOSA]

30mA Surface Mount Small Signal Schottky Diode- 40V; 30毫安表面贴装小信号肖特基Diode- 40V
FM751V-NL
型号： FM751V-NL
厂家： FORMOSA MS    FORMOSA MS
描述：

30mA Surface Mount Small Signal Schottky Diode- 40V
30毫安表面贴装小信号肖特基Diode- 40V
文件： 总7页 (文件大小：469K)
中文：  中文翻译
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Small Signal Schottky Diode  
Formosa MS  
FM751V-NL  
List  
1
2
2
2
2
3
4
4
4
5
6
6
7
List.................................................................................................  
Package outline...............................................................................  
Features..........................................................................................  
Mechanical data...............................................................................  
Maximum ratings .............................................................................  
Rating and characteristic curves........................................................  
Pinning information...........................................................................  
Marking...........................................................................................  
Suggested solder pad layout.............................................................  
Packing information..........................................................................  
Reel packing....................................................................................  
Suggested thermal profiles for soldering processes.............................  
High reliability test capabilities...........................................................  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-22160B  
Issued Date  
2008/02/10  
Revised Date  
2010/12/10  
Revision  
C
Page.  
7
Page 1  
Small Signal Schottky Diode  
Formosa MS  
FM751V-NL  
30mA Surface Mount Small Signal  
Package outline  
Schottky Diode- 40V  
SOD-323F  
Features  
• Low reverse current and low forward voltage.  
• Small surface mounting type SOD-323F.  
• High reliability.  
0.071(1.80)  
0.063(1.60)  
• Lead-free parts for green partner, exceeds environmental  
standards of MIL-STD-19500 /228  
• Suffix "-H" for Halogen-free part, ex. FM751V-NL-H.  
0.039(1.00)  
0.031(0.80)  
Construction  
• silicon epitaxial planar  
0.106(2.70)  
0.091(2.30)  
Mechanical data  
Dimensions in inches and (millimeters)  
• Epoxy:UL94-V0 rated flame retardant  
• Case : Molded plastic, SOD-323F  
• Terminals : Solder plated, solderable per  
MIL-STD-750, Method 2026  
• Polarity : Indicated by cathode band  
• Mounting Position : Any  
• Weight : Approximated 0.005 gram  
Maximum ratings (AT TA=25oC unless otherwise noted)  
PARAMETER  
Peak reverse voltage  
CONDITIONS  
Symbol  
Limits  
40  
30  
UNIT  
V
V
VRM  
VR  
IO  
DC reverse voltage  
Mean rectifying current  
mA  
30  
mA  
60Hz for 1cycle  
IFSM  
200  
Peak forward surge current  
oC  
oC  
125  
Junction temperature  
Storage temperature  
TJ  
TSTG  
-40~+125  
Electrical Characteristics(AT TA=25oC unless otherwise noted)  
PARAMETER  
CONDITIONS  
Symbol MIN. TYP. MAX.  
UNIT  
V
Forward voltage  
0.37  
IF = 1.0 mA  
VF  
Reverse current  
IR  
VR = 30 V  
uA  
pF  
0.5  
2.0  
CT  
Diode capacitance  
VR = 1 V, f = 1MHz  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-22160B  
Issued Date  
2008/02/10  
Revised Date  
2010/12/10  
Revision  
C
Page.  
7
Page 2  
Rating and characteristic curves (FM751V-NL)  
FIG.2 - TYPICAL REVERSE  
FIG.1-TYPICAL FORWARD  
CHARACTERISTICS  
CHARACTERISTICS  
100u  
10u  
1u  
REVERSE VOLTAGE , (V)  
FORWARD VOLTAGE,(mV)  
FIG.3-CAPACITANCE BETWEEN TERMINALS  
CHARACTERISTICS  
REVERSE VOLTAGE ,(V)  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-22160B  
Issued Date  
2008/02/10  
Revised Date  
2010/12/10  
Revision  
C
Page.  
7
Page 3  
Small Signal Schottky Diode  
Formosa MS  
FM751V-NL  
Pinning information  
Pin  
Simplified outline  
Symbol  
Pin1 cathode  
Pin2 anode  
1
2
1
2
Marking  
Type number  
FM751V-NL  
Marking code  
5E  
Suggested solder pad layout  
C
A
B
Dimensions in inches and (millimeters)  
PACKAGE  
SOD-323F  
A
B
C
0.059 (1.50)  
0.039 (1.00)  
0.051 (1.30)  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-22160B  
Issued Date  
2008/02/10  
Revised Date  
2010/12/10  
Revision  
C
Page.  
7
Page 4  
Small Signal Schottky Diode  
Formosa MS  
FM751V-NL  
Packing information  
P0  
P1  
d
E
F
W
B
A
P
D2  
D1  
T
C
W1  
D
unit:mm  
Symbol  
SOD-323F  
Item  
Tolerance  
Carrier width  
Carrier length  
Carrier depth  
Sprocket hole  
13" Reel outside diameter  
13" Reel inner diameter  
7" Reel outside diameter  
7" Reel inner diameter  
Feed hole diameter  
Sprocket hole position  
Punch hole position  
Punch hole pitch  
A
B
C
d
D
D1  
D
D1  
D2  
E
0.1  
0.1  
0.1  
0.1  
2.0  
min  
2.0  
min  
0.5  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.3  
1.0  
1.46  
2.95  
1.25  
1.50  
-
-
178.00  
62.00  
13.00  
1.75  
3.50  
4.00  
4.00  
2.00  
0.23  
8.00  
11.40  
F
P
Sprocket hole pitch  
Embossment center  
Overall tape thickness  
Tape width  
P0  
P1  
T
W
W1  
Reel width  
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-22160B  
Issued Date  
2008/02/10  
Revised Date  
2010/12/10  
Revision  
Page.  
7
C
Page 5  
Small Signal Schottky Diode  
Formosa MS  
FM751V-NL  
Reel packing  
COMPONENT  
INNER  
BOX  
(m/m)  
REEL  
DIA,  
(m/m)  
CARTON  
SIZE  
(m/m)  
APPROX.  
REEL  
(pcs)  
PACKAGE  
SOD-323F  
REEL SIZE  
7"  
SPACING  
(m/m)  
BOX  
(pcs)  
CARTON  
(pcs)  
GROSS WEIGHT  
(kg)  
3,000  
4.0  
30,000  
183*183*123  
178  
382*262*387  
240,000  
8.0  
Suggested thermal profiles for soldering processes  
1.Storage environment: Temperature=5oC~40oC Humidity=55%±25%  
2.Reflow soldering of surface-mount devices  
Critical Zone  
TL to TP  
Tp  
TP  
Ramp-up  
TL  
TL  
Tsmax  
Tsmin  
tS  
Preheat  
Ramp-down  
25  
t25oC to Peak  
Time  
3.Reflow soldering  
Profile Feature  
Soldering Condition  
Average ramp-up rate(TL to TP)  
<3oC/sec  
Preheat  
-Temperature Min(Tsmin)  
-Temperature Max(Tsmax)  
-Time(min to max)(ts)  
150oC  
200oC  
60~120sec  
Tsmax to TL  
-Ramp-upRate  
<3oC/sec  
Time maintained above:  
-Temperature(TL)  
-Time(tL)  
217oC  
60~260sec  
Peak Temperature(TP)  
255oC-0/+5oC  
Time within 5oC of actual Peak  
Temperature(tP)  
10~30sec  
Ramp-down Rate  
<6oC/sec  
Time 25oC to Peak Temperature  
<6minutes  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-22160B  
Issued Date  
2008/02/10  
Revised Date  
2010/12/10  
Revision  
C
Page.  
7
Page 6  
Small Signal Schottky Diode  
Formosa MS  
FM751V-NL  
High reliability test capabilities  
Item Test  
1. Solder Resistance  
Conditions  
Reference  
MIL-STD-750D  
METHOD-2031  
at 260±5OC for 10±2sec.  
immerse body into solder 1/16"±1/32"  
at 245±5OC for 5 sec.  
2. Solderability  
MIL-STD-202F  
METHOD-208  
VR=80% rate at TJ=125OC for 168 hrs.  
Rated average rectifier current at TA=25OC for 500hrs.  
3. High Temperature Reverse Bias  
4. Forward Operation Life  
5. Intermittent Operation Life  
6. Pressure Cooker  
MIL-STD-750D  
METHOD-1038  
MIL-STD-750D  
METHOD-1027  
TA = 25OC, IF = IO  
On state: power on for 5 min.  
off state: power off for 5 min.  
on and off for 500 cycles.  
MIL-STD-750D  
METHOD-1036  
JESD22-A102  
15PSIG at TA=121OC for 4 hrs.  
MIL-STD-750D  
METHOD-1051  
-55OC to +125OC dwelled for 30 min.  
7. Temperature Cycling  
8. Thermal Shock  
and transferred for 5min. total 10 cycles.  
MIL-STD-750D  
METHOD-1056  
0OC for 5 min. rise to 100OC for 5 min. total 10 cycles.  
MIL-STD-750D  
METHOD-4066-2  
9. Forward Surge  
60Hz for 1cycle  
MIL-STD-750D  
METHOD-1021  
at TA=85OC, RH=85% for 1000hrs.  
10. Humidity  
MIL-STD-750D  
METHOD-1031  
at 175OC for 1000 hrs.  
11. High Temperature Storage Life  
http://www.formosams.com/  
TEL:886-2-22696661  
FAX:886-2-22696141  
Document ID  
DS-22160B  
Issued Date  
2008/02/10  
Revised Date  
2010/12/10  
Revision  
C
Page.  
7
Page 7  

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