SG1577A_10 [FAIRCHILD]
Dual Synchronous DC/DC Controller; 双同步DC / DC控制器![SG1577A_10](http://pdffile.icpdf.com/pdf1/p00172/img/icpdf/SG157_963677_icpdf.jpg)
型号: | SG1577A_10 |
厂家: | ![]() |
描述: | Dual Synchronous DC/DC Controller |
文件: | 总15页 (文件大小:850K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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August 2010
SG1577A
Dual Synchronous DC/DC Controller
Features
Description
The SG1577A is a high-efficiency, voltage-mode, dual-
channel, synchronous DC/DC PWM controller for two
independent outputs. The two channels are operated
out of phase. The internal reference voltage is trimmed
to 0.7V±1.5%. It is connected to the error amplifier’s
positive terminal for voltage feedback regulation.
Integrated Two Sets of MOSFET Drivers
Two Independent PWM Controllers
Constant Frequency Operation: Free-Running
Fixed Frequency Oscillator Programmable:
61kHz to 340kHz
The soft-start circuit ensures the output voltage can be
gradually and smoothly increased from zero to its final
regulated value. The soft-start pin can also be used for
chip-enable function. When two soft-start pins are
grounded, the chip is disabled and the total operation
current can be reduced to under 0.7mA.
Maximum Input Supply Voltage: 15V
Programmable Output as Low as 0.7V
Internal Error Amplifier Reference Voltage:
0.7V±1.5%
Two Soft-Start / EN Functions
The fixed-frequency is programmable from 60kHz to
340kHz. The Over-Current Protection (OCP) level can
be programmed by an external current-sense resistor. It
has two integrated sets of internal MOSFET drivers.
Programmable Over-Current Protection (OCP)
30V HIGH Voltage Pin for Bootstrap Voltage
Output Over-Voltage Protection (OVP)
20-Pin SOP
SG1577A is available in a 20-pin SOP package.
Applications
CPU and GPU Vcore Power Supply
Power Supply Requiring Two Independent Outputs
Ordering Information
Part Number
Operating Temperature Range
-40°C to +105°C
Package
Packing Method
20-Lead, Small Outline Package
(SOP-20)
SG1577ASY
Tape & Reel
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
Application Diagram
Figure 1.
Typical Application
Internal Block Diagram
Figure 2.
Functional Block Diagram
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
2
Marking Diagram
SOP-20
F: Fairchild Logo
Z: Assembly Plant Code
X: Year Code
Y: Week Code
TT: Die Run Code
T: S = SOP
20
ZXYTT
SG1577A
TPM
P: Y=Green Package
M: Mask Version
1
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
3
Pin Configuration
Figure 3. SOP-20 Pin Configuration (Top View)
Pin Definitions
Name
Pin #
Type
Description
Switching frequency programming pin. An external resistor connecting
this pin to GND can program the switching frequency. The switching
frequency is 61kHz when RT is open and becomes 340kHz when RT is
shorted to ground.
RT
1
Frequency Select
Inverting input of the error amplifier. It is normally connected to the
switching power supply output through a resistor divider.
IN1
2
3
4
5
Feedback
Output of the error amplifier and input to the PWM comparator. It is used
for feedback loop compensation.
COMP1
SS1/ENB
CLP1
Compensation
Soft Start/Enable
A 35/15µA internal current source charging an external capacitor for soft-
start. Pull down this pin and pin 17 to disable the chip.
Over Current
Protection
Over-current protection for high-side MOSFET. Connect a resistor from
this pin to the high-side supply voltage to program the OCP level.
BST1
DH1
6
7
Boost Supply
Supply for high-side driver. Connect to the internal bootstrap circuit.
High-Side Drive Channel 1, high-side MOSFET gate driver pin.
Switch-node connection to inductor. For channel 1 high-side driver’s
reference ground.
Low-Side Drive Low-side MOSFET gate driver pin.
CLN1
8
Switch Node
DL1
PGND
VCC
DL2
9
10
11
12
Driver Ground
Power Supply
Driver circuit reference. Connect to low-side MOSFET GND.
Supply voltage input.
Low-Side Drive Low-side MOSFET gate driver pin.
Switch-node connection to inductor. For channel 2, high-side driver’s
reference ground.
High-Side Drive Channel 2 high-side MOSFET gate driver pin.
CLN2
13
Switch Node
DH2
14
15
BST2
Boost Supply
Supply for high-side driver. Connect to the internal bootstrap circuit.
Over-Current
Protection
Over-current protection for the high-side MOSFET. Connect a resistor
from this pin to the high-side supply voltage to program the OCP level.
CLP2
16
17
18
A 35/15µA internal current source charging an external capacitor for soft-
start. Pull down this pin and pin 4 to disable the chip.
SS2/ENB
COMP2
Soft-Start/Enable
Compensation
Feedback
Output of the error amplifier and input to the PWM comparator. It is used
for feedback-loop compensation.
Inverting input of the error amplifier. It is normally connected to the
switching power supply output through a resistor divider.
IN2
19
20
GND
Analog Ground The reference of internal control circuits.
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only. All voltage values, except differential voltages, are
given with respect to the network ground terminal. Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device.
Symbol
Parameter
Supply Voltage, VCC to GND
Min.
Max.
Unit
VCC
16
V
BST1(or 2) -
CLN1(or 2)
BST1(2) to CLN1(2)
16
18
V
V
V
V
V
CLN1(or 2) -
GND
CLN1(2) to GND for 100ns Transient
BST1(2) to GND for 100ns Transient
-4
BST1(or 2) -
GND
30
DH1(or 2) -
CLN1(or 2)
16
CLN1(or 2),
DL1(or 2)
-0.3
VCC+0.3
PGND
ΘJA
PGND to GND
± 1
90
V
°C/W
°C
Thermal Resistance, Junction-Air
Operating Junction Temperature
Storage Temperature Range
TJ
-40
-65
+125
+150
2
TSTG
°C
Human Body Model (HBM)
Charged Device Model (CDM)
Electrostatic Discharge
Protection Level
ESD
kV
1
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC
Parameter
Min.
Max.
+15
Unit
V
Supply Voltage
Operating Ambient Temperature
-40
TA
+105
°C
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
5
Electrical Characteristics
VCC=12V, TA =25°C, unless otherwise noted.
Symbol
VCC UVLO
VCC_ON
Parameter
Conditions
Min.
Typ.
Max.
Unit
Turn-On Threshold
UVLO Hysteresis
VCC Ramp-Up
9.5
1.5
10.0
2.0
10.5
2.5
V
V
VCC Ramp-Down
VCC_HYS
Oscillator
RRT=OPEN
RRT=GND
55
308
-10
85
61
67
372
10
Oscillator Frequency
fosc
KHz
340
20kΩ<RRT
Total Accuracy
fosc,rt
%
%
90
95
Maximum Duty Cycle
DON_MAX
Error Amplifier
Internal Reference Voltage
VREF Temperature Coefficient TA=0~85oC
VCC=8V, VCC=15V
VREF
△VREF
AVOL
0.6895 0.7000 0.7105
V
mV/oC
dB
(1)
0.03
77
Open-loop Voltage Gain
Unity Gain Bandwidth
Output Source Current
Output Sink Current
The Peak of VRAMP
BW
3.5
MHz
µA
IN1=IN2=0.6V
ISOURCE
ISINK
VRAMP_Peak
V RAMP_Valley
60
80
400
2.8
1.2
100
550
IN1=IN2=0.8V
250
2.45
1.05
µA
Gate Output=DON_MAX
No Gate Output
3.15
1.35
V
V
The Valley of VRAMP
Two-Stage Soft-Start
1st Soft-start Charge Current
nd Soft-start Charge Current
st
V
CLP<VCLN , VSS_Transition>VSS
CLP<VCLN , VSS_Transition<VSS
ISOURCE_1
28
13
35
16
42
19
µA
µA
nd
V
2
ISOURCE_2
nd
ISOURCE_1st Transit to ISOURCE_2
Soft-start Transition Point
VSS_Transition
1.40
1.42
50
1.44
V
See Figure 4
VCLP>VCLN
Soft-start Discharge Current
ISINK
Protections
IOCSET
µA
90
120
150
20
150
126
3.8
µA
°C
°C
%
OC Sink Current
VCC=12V
TOT
Over-Temperature
TOT_hys
VOVP
Over-Temperature Hysteresis
118
1.0
1.0
50
122
Over-Voltage Protection of IN VOVP/VIN
Output
IDH
1.8
2.8
1.8
2.8
70
A
Ω
A
High-Side Current Source
High-Side Sink Resistor
Low-Side Current Source
Low-Side Sink Resistor
Dead Time
VBST - VCLN=12V, VDH - VCLN=6V
VBST - VCLN=12V
RDH
IDL
VCC=12V, VDL =6V
RDL
3.8
90
Ω
ns
VCC=12V
(2)
TDT
VCC=12V, DH & DL=1000pF
Total Operating Current
ICC_OP
3.3
4.3
0.7
5.3
1.0
mA
mA
Operating Supply Current
Standby Current (Disabled)
VCC=12V, No load
ICC_SBY
SS1/ENB=SS2/ENB=0V
Notes:
1. Not tested in production, 30pcs sample.
2. When VDL falls less than 2V relative to VDH rising to 2V.
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
SG1577A • Rev. 1.0.2
6
Timing Diagrams
Figure 4. Timing Chart of Two-Stage Soft-Start
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
7
Typical Performance Characteristics
Unless otherwise noted, values are for VCC=12V, TA=+25°C, CSS1/ENB=150nF and CSS2/ENB=168nF.
Figure 5. Power On at 0.3A Load
Figure 7. Power On at 9A Load
Figure 9. Power Off with 0.3A Load
Figure 6. Power On at 3.6A Load
Figure 8. Power On at 18A Load
Figure 10. Power Off with 18A Load
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
8
Typical Performance Characteristics (Continued)
Unless otherwise noted, values are for VCC=12V, TA=+25°C, CSS1/ENB=150nF and CSS2/ENB=168nF.
Figure 11. Phase Shift at 0.3A Load
Figure 12. Phase Shift at 18A Load
Figure 13. Dead Time at 0.3A Load (Rising Edge)
Figure 14. Dead Time at 0.3A Load (Falling Edge)
Figure 15. Dead Time at 18A Load (Rising Edge)
Figure 16. Dead Time at 18A Load (Falling Edge)
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
9
Typical Performance Characteristics (Continued)
Unless otherwise noted, values are for VCC=12V, TA=+25°C, CSS1/ENB=150nF and CSS2/ENB=168nF.
Figure 17. Load Transient Response (Step-Up)
Figure 18. Load Transient Response (Step-Down)
20kΩ/22nF in Compensation Loop
20kΩ/22nF in Compensation Loop
Figure 19. Over-Current Protection (OCP)
Figure 20. Over-Current Protection (“Hiccup” Mode)
150
Iocset 1
140
130
120
110
100
90
Iocset 2
-40
-25
-10
5
20
35
50
65
80
95
Temperature (oC)
Figure 21. Over-Voltage Protection (OVP)
Figure 22. IOCSET vs. Temperature
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
10
Functional Description
The SG1577A is a dual-channel voltage-mode PWM
controller. It has two sets of synchronous MOSFET
driving circuits. The two channels are running 180-
degrees out of phase. The following descriptions
highlight the advantages of the SG1577A design.
compensation externally. Non-inverting inputs are
internally tied to a fixed 0.7V ± 1.5% reference voltage.
Oscillator Operation
The SG1577A has
a
frequency-programmable
oscillator. The oscillator is running at 61kHz when the
RT pin is floating. The oscillator frequency can be
adjusted from 61kHz up to 340kHz by an external
resistor RRT between RT pin and the ground. The
oscillator generates a sawtooth wave that has 90%
rising duty. Sawtooth wave voltage threshold is from
1.2V to 2.8V. The frequency of oscillator can be
programmed according to the following equation:
Soft Start
An internal start-up current (35/15µA) flows out of
SS/EN pin to charge an external capacitor. During the
startup sequence, SG1577A isn’t enabled until the
SS/ENB pin is higher than 1.2V. From 1.2V to (1.2 + 1.6
x DON / DON_MAX) V, the PWM duty cycle gradually
increases following the SS/ENB pin voltage to bring
output rising. After (1.2 + 1.6 x DON / DON_MAX) V, the
soft-start period ends and SS/ENB pin continually rises
to 4.8V. When input power is abnormal, the external
capacitor on the SS pin is shorted to ground and the
chip is disabled.
(3)
fOSC, RT(kHz) = 61kHz + 8522 / RRT(kΩ)
Output Driver
The high-side gate drivers need an external
bootstrapping circuit to provide the required boost
voltage. The highest gate driver’s output (15V is the
allowed) on high-side and low-side MOSFETs forces
external MOSFETs to have the lowest RDS(ON), which
results in higher efficiency.
5
12
0.9
CSS1 × (1.4V - 1.2V) =35μA × t1; CSS1 ×(1.2V +1.6 ×
- 1.4V) =15μA × t2
; t1 + t2 = tSS1
3.3
12
0.9
CSS2 ×(1.4V -1.2V) = 35μA × t1; CSS2 × (1.2V +1.6 ×
- 1.4V) =15μA × t2
(1)
; t1 + t2 = tSS2
CSS2 ×0.3V CSS2 ×(1.2V - 0.3V)
Over-Temperature Protection (OTP)
The device is over-temperature protected. When chip
temperature is over 150oC, the chip enters tri-state
(high-side driver is turned off). The hysteresis is 20oC.
CSS1×1.2V = 35μA × t3;
+
= t4
15μA
35μA
;t4 - t3 = ttime-shift
Over-Current Protection (OCP)
Over-current protection is implemented by sensing the
voltage drop across the drain and the source of external
high-side MOSFET. Over-current protection is triggered
when the voltage drop on external high-side MOSFET’s
RDS(ON) is greater than the programmable current limit
voltage threshold. 120µA flowing through an external
resistor between input voltage and the CLP pin sets the
threshold of current limit voltage. When over-current
condition is true, the system is protected against the
cycle-by-cycle current limit. A counter counts a series of
over-current peak values to eight cycles; the soft-start
capacitor is discharged by a 50µA current until the
voltage on SS pin reaches 1.2V. During the discharge
period, the high-side driver is turned off and the low-
side driver is turned on. Once the voltage on SS/ENB
pin is under 1.2V, the normal soft-start sequence is
initiated and the 35/15µA current charges the soft-start
capacitor again.
Type II Compensation Design
(for Output Capacitors with High ESR)
SG1577A is a voltage-mode controller; the control loop
is a single voltage feedback path, including an error
amplifier and PWM comparator, as shown in Figure 23.
To achieve fast transient response and accurate output
regulation, an adequate compensator design is
necessary. A stable control loop has a 0dB gain
crossing with -20dB/decade slope and a phase margin
greater than 45°.
IL(OCP)= [(RSENSE x IOCSET + VOFFSET) / RDS(ON)
(VIN - VOUT) x VOUT / (fOSC x LOUT x VIN x 2) ]
-
(2)
where VOFFSET ( ≒ 10mV) is the offset voltage
contributed by the internal OCP comparator.
Error Amplifier
The IN1 and IN2 pins are connected to the
corresponding internal error amplifier’s inverting input
and the outputs of the error amplifiers are connected to
the corresponding COMP1 and COMP2 pins. The
COMP1 and COMP2 pins are available for control-loop
Figure 23. Closed Loop
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
11
1. Modulator Frequency Equations
The modulator transfer function is the small-signal
transfer function of VOUT/VE/A. This transfer function is
dominated by a DC gain and the output filter (LO and
CO) with a double-pole frequency at fLC and a zero at
fP1 = 0
fZ1
1
=
2π × R2 × C2
(6)
1
f
ESR. The DC gain of the modulator is the input voltage
fP2
=
2π × R2 × (C1 //C2)
(VIN) divided by the peak-to-peak oscillator voltage
ΔVRAMP(=1.6V). The first step is to calculate the complex
conjugate poles contributed by the LC output filter. The
Figure 25 shows the DC-DC converter gain vs.
frequency. The compensation gain uses external
impedance networks ZC and Zf to provide a stable, high-
bandwidth loop.
output LC filter introduces
a
double pole,
-40dB / decade gain slope above its corner resonant
frequency, and a total phase lag of 180 degrees. The
resonant frequency of the LC filter expressed as:
High crossover frequency is desirable for fast transient
response, but often jeopardizes system stability. To
cancel one of the LC filter poles, place the zero before
the LC filter resonant frequency. Place the zero at 75%
of the LC filter resonant frequency. Crossover frequency
should be higher than the ESR zero, but less than 1/5
of the switching frequency. The second pole should be
placed at half the switching frequency.
1
f
=
P(LC)
(4)
2π ×
L × C
O O
The next step of compensation design is to calculate
the ESR zero. The ESR zero is contributed by the ESR
associated with the output capacitance. Note that this
requires that the output capacitor should have enough
ESR to satisfy stability requirements. The ESR zero of
the output capacitor is expressed as:
1
f
=
(5)
Z(ESR)
2π × C × ESR
O
2. Compensation Frequency Equations
The compensation network consists of the error
amplifier and the impedance networks ZC and Zf, as
Figure 24 shows.
Figure 25. Bode Plot
Figure 24. Compensation Loop
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
12
Layout Considerations
Layout is important in high-frequency switching converter
design. If designed improperly, PCB can radiate
excessive noise and contribute to converter instability.
Place the bootstrap capacitor near the BSTx and
CLNx pins.
The resistor on the RT pin should be near this pin
and the GND return should be short and kept away
from the noisy MOSFET’s GND (which is shorted
together with IC’s PGND pin to GND plane on back
side of PCB).
Place the PWM power stage components first. Mount
all the power components and connections in the top
layer with wide copper areas. The MOSFETs of buck,
inductor, and output capacitor should be as close to
each other as possible to reduce the radiation of EMI
due to the high-frequency current loop. If the output
capacitors are placed in parallel to reduce the ESR of
capacitor, equal sharing ripple current should be
considered. Place the input capacitor near the drain of
high-side MOSFET. In multi-layer PCB, use one layer
as power ground and have a separate control signal
ground as the reference for all signals. To avoid the
signal ground being affected by noise and to achieve
the best load regulation, it should be connected to the
ground terminal of output.
Place the compensation components close to the
INx and COMPx pins.
The feedback resistors for both regulators should
be located as close as possible to the relevant INx
pin with vias tied straight to the ground plane as
required.
Minimize the length of the connections between the
input capacitors, CIN, and the power switchers
(MOSFETs) by placing them nearby.
Position both the ceramic and bulk input capacitors
as close to the upper MOSFET drain as possible
and make the GND returns short (from the source
of lower MOSFET to VIN capacitor GND).
Follow the below guidelines for best performance:
A two-layer printed circuit board is recommended.
Use the bottom layer of the PCB as a ground plane
and make all critical component ground
connections through vias to this layer.
Position the output inductor and output capacitors
between the upper MOSFET and lower MOSFET
and the load.
Keep the metal running from the CLNx terminal to
the output inductor short.
Keep AGND on the clearer plane and away from
the noisy MOSFET GND.
Use copper-filled polygons on the top (and bottom,
if two-layer PCB) circuit layers for the CLN node.
PGND should be short, together with MOSFET
GND, then through vias to GND plane on the
bottom of PCB.
The small-signal wiring traces from the DLx and
DHx pins to the MOSFET gates should be kept
short and wide enough to easily handle the several
amps of drive current.
Prevent a spike on the CLN pin with a proper
snubber circuit for CLN and GND.
The critical, small-signal components include any
bypass capacitors (SMD-type of capacitors applied
at VCC and SSx/ENB pins), feedback components
(resistor divider), and compensation components
(between INx and COMPx pins). Position those
components close to their pins with a local, clear,
GND connection or directly to the ground plane.
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
13
Physical Dimensions
13.00
12.60
A
11.43
20
11
B
9.50
10.65 7.60
10.00 7.40
2.25
1
PIN ONE
INDICATOR
10
0.65
0.51
0.35
1.27
1.27
M
0.25
C B A
LAND PATTERN RECOMMENDATION
SEE DETAIL A
2.65 MAX
0.33
0.20
C
0.10
C
0.30
0.10
SEATING PLANE
0.75
0.25
X 45°
NOTES: UNLESS OTHERWISE SPECIFIED
(R0.10)
(R0.10)
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, VARIATION AC, ISSUE E
GAGE PLANE
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
0.25
8°
0°
D) CONFORMS TO ASME Y14.5M-1994
1.27
0.40
SEATING PLANE
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
F) DRAWING FILENAME: MKT-M20BREV3
(1.40)
DETAIL A
SCALE: 2:1
Figure 26. 20-Lead Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
14
© 2009 Fairchild Semiconductor Corporation
SG1577A • Rev. 1.0.2
www.fairchildsemi.com
15
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