SG1577A_10 [FAIRCHILD]

Dual Synchronous DC/DC Controller; 双同步DC / DC控制器
SG1577A_10
型号: SG1577A_10
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Dual Synchronous DC/DC Controller
双同步DC / DC控制器

控制器
文件: 总15页 (文件大小:850K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
August 2010  
SG1577A  
Dual Synchronous DC/DC Controller  
Features  
Description  
The SG1577A is a high-efficiency, voltage-mode, dual-  
channel, synchronous DC/DC PWM controller for two  
independent outputs. The two channels are operated  
out of phase. The internal reference voltage is trimmed  
to 0.7V±1.5%. It is connected to the error amplifier’s  
positive terminal for voltage feedback regulation.  
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Integrated Two Sets of MOSFET Drivers  
Two Independent PWM Controllers  
Constant Frequency Operation: Free-Running  
Fixed Frequency Oscillator Programmable:  
61kHz to 340kHz  
The soft-start circuit ensures the output voltage can be  
gradually and smoothly increased from zero to its final  
regulated value. The soft-start pin can also be used for  
chip-enable function. When two soft-start pins are  
grounded, the chip is disabled and the total operation  
current can be reduced to under 0.7mA.  
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Maximum Input Supply Voltage: 15V  
Programmable Output as Low as 0.7V  
Internal Error Amplifier Reference Voltage:  
0.7V±1.5%  
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Two Soft-Start / EN Functions  
The fixed-frequency is programmable from 60kHz to  
340kHz. The Over-Current Protection (OCP) level can  
be programmed by an external current-sense resistor. It  
has two integrated sets of internal MOSFET drivers.  
Programmable Over-Current Protection (OCP)  
30V HIGH Voltage Pin for Bootstrap Voltage  
Output Over-Voltage Protection (OVP)  
20-Pin SOP  
SG1577A is available in a 20-pin SOP package.  
Applications  
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CPU and GPU Vcore Power Supply  
Power Supply Requiring Two Independent Outputs  
Ordering Information  
Part Number  
Operating Temperature Range  
-40°C to +105°C  
Package  
Packing Method  
20-Lead, Small Outline Package  
(SOP-20)  
SG1577ASY  
Tape & Reel  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
Application Diagram  
Figure 1.  
Typical Application  
Internal Block Diagram  
Figure 2.  
Functional Block Diagram  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
2
Marking Diagram  
SOP-20  
F: Fairchild Logo  
Z: Assembly Plant Code  
X: Year Code  
Y: Week Code  
TT: Die Run Code  
T: S = SOP  
20  
ZXYTT  
SG1577A  
TPM  
P: Y=Green Package  
M: Mask Version  
1
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
3
Pin Configuration  
Figure 3. SOP-20 Pin Configuration (Top View)  
Pin Definitions  
Name  
Pin #  
Type  
Description  
Switching frequency programming pin. An external resistor connecting  
this pin to GND can program the switching frequency. The switching  
frequency is 61kHz when RT is open and becomes 340kHz when RT is  
shorted to ground.  
RT  
1
Frequency Select  
Inverting input of the error amplifier. It is normally connected to the  
switching power supply output through a resistor divider.  
IN1  
2
3
4
5
Feedback  
Output of the error amplifier and input to the PWM comparator. It is used  
for feedback loop compensation.  
COMP1  
SS1/ENB  
CLP1  
Compensation  
Soft Start/Enable  
A 35/15µA internal current source charging an external capacitor for soft-  
start. Pull down this pin and pin 17 to disable the chip.  
Over Current  
Protection  
Over-current protection for high-side MOSFET. Connect a resistor from  
this pin to the high-side supply voltage to program the OCP level.  
BST1  
DH1  
6
7
Boost Supply  
Supply for high-side driver. Connect to the internal bootstrap circuit.  
High-Side Drive Channel 1, high-side MOSFET gate driver pin.  
Switch-node connection to inductor. For channel 1 high-side driver’s  
reference ground.  
Low-Side Drive Low-side MOSFET gate driver pin.  
CLN1  
8
Switch Node  
DL1  
PGND  
VCC  
DL2  
9
10  
11  
12  
Driver Ground  
Power Supply  
Driver circuit reference. Connect to low-side MOSFET GND.  
Supply voltage input.  
Low-Side Drive Low-side MOSFET gate driver pin.  
Switch-node connection to inductor. For channel 2, high-side driver’s  
reference ground.  
High-Side Drive Channel 2 high-side MOSFET gate driver pin.  
CLN2  
13  
Switch Node  
DH2  
14  
15  
BST2  
Boost Supply  
Supply for high-side driver. Connect to the internal bootstrap circuit.  
Over-Current  
Protection  
Over-current protection for the high-side MOSFET. Connect a resistor  
from this pin to the high-side supply voltage to program the OCP level.  
CLP2  
16  
17  
18  
A 35/15µA internal current source charging an external capacitor for soft-  
start. Pull down this pin and pin 4 to disable the chip.  
SS2/ENB  
COMP2  
Soft-Start/Enable  
Compensation  
Feedback  
Output of the error amplifier and input to the PWM comparator. It is used  
for feedback-loop compensation.  
Inverting input of the error amplifier. It is normally connected to the  
switching power supply output through a resistor divider.  
IN2  
19  
20  
GND  
Analog Ground The reference of internal control circuits.  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
4
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device  
reliability. The absolute maximum ratings are stress ratings only. All voltage values, except differential voltages, are  
given with respect to the network ground terminal. Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device.  
Symbol  
Parameter  
Supply Voltage, VCC to GND  
Min.  
Max.  
Unit  
VCC  
16  
V
BST1(or 2) -  
CLN1(or 2)  
BST1(2) to CLN1(2)  
16  
18  
V
V
V
V
V
CLN1(or 2) -  
GND  
CLN1(2) to GND for 100ns Transient  
BST1(2) to GND for 100ns Transient  
-4  
BST1(or 2) -  
GND  
30  
DH1(or 2) -  
CLN1(or 2)  
16  
CLN1(or 2),  
DL1(or 2)  
-0.3  
VCC+0.3  
PGND  
ΘJA  
PGND to GND  
± 1  
90  
V
°C/W  
°C  
Thermal Resistance, Junction-Air  
Operating Junction Temperature  
Storage Temperature Range  
TJ  
-40  
-65  
+125  
+150  
2
TSTG  
°C  
Human Body Model (HBM)  
Charged Device Model (CDM)  
Electrostatic Discharge  
Protection Level  
ESD  
kV  
1
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to absolute maximum ratings.  
Symbol  
VCC  
Parameter  
Min.  
Max.  
+15  
Unit  
V
Supply Voltage  
Operating Ambient Temperature  
-40  
TA  
+105  
°C  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
5
Electrical Characteristics  
VCC=12V, TA =25°C, unless otherwise noted.  
Symbol  
VCC UVLO  
VCC_ON  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Turn-On Threshold  
UVLO Hysteresis  
VCC Ramp-Up  
9.5  
1.5  
10.0  
2.0  
10.5  
2.5  
V
V
VCC Ramp-Down  
VCC_HYS  
Oscillator  
RRT=OPEN  
RRT=GND  
55  
308  
-10  
85  
61  
67  
372  
10  
Oscillator Frequency  
fosc  
KHz  
340  
20kΩ<RRT  
Total Accuracy  
fosc,rt  
%
%
90  
95  
Maximum Duty Cycle  
DON_MAX  
Error Amplifier  
Internal Reference Voltage  
VREF Temperature Coefficient TA=0~85oC  
VCC=8V, VCC=15V  
VREF  
VREF  
AVOL  
0.6895 0.7000 0.7105  
V
mV/oC  
dB  
(1)  
0.03  
77  
Open-loop Voltage Gain  
Unity Gain Bandwidth  
Output Source Current  
Output Sink Current  
The Peak of VRAMP  
BW  
3.5  
MHz  
µA  
IN1=IN2=0.6V  
ISOURCE  
ISINK  
VRAMP_Peak  
V RAMP_Valley  
60  
80  
400  
2.8  
1.2  
100  
550  
IN1=IN2=0.8V  
250  
2.45  
1.05  
µA  
Gate Output=DON_MAX  
No Gate Output  
3.15  
1.35  
V
V
The Valley of VRAMP  
Two-Stage Soft-Start  
1st Soft-start Charge Current  
nd Soft-start Charge Current  
st  
V
CLPVCLN , VSS_TransitionVSS  
CLPVCLN , VSS_TransitionVSS  
ISOURCE_1  
28  
13  
35  
16  
42  
19  
µA  
µA  
nd  
V
2
ISOURCE_2  
nd  
ISOURCE_1st Transit to ISOURCE_2  
Soft-start Transition Point  
VSS_Transition  
1.40  
1.42  
50  
1.44  
V
See Figure 4  
VCLPVCLN  
Soft-start Discharge Current  
ISINK  
Protections  
IOCSET  
µA  
90  
120  
150  
20  
150  
126  
3.8  
µA  
°C  
°C  
%
OC Sink Current  
VCC=12V  
TOT  
Over-Temperature  
TOT_hys  
VOVP  
Over-Temperature Hysteresis  
118  
1.0  
1.0  
50  
122  
Over-Voltage Protection of IN VOVP/VIN  
Output  
IDH  
1.8  
2.8  
1.8  
2.8  
70  
A
A
High-Side Current Source  
High-Side Sink Resistor  
Low-Side Current Source  
Low-Side Sink Resistor  
Dead Time  
VBST - VCLN=12V, VDH - VCLN=6V  
VBST - VCLN=12V  
RDH  
IDL  
VCC=12V, VDL =6V  
RDL  
3.8  
90  
ns  
VCC=12V  
(2)  
TDT  
VCC=12V, DH & DL=1000pF  
Total Operating Current  
ICC_OP  
3.3  
4.3  
0.7  
5.3  
1.0  
mA  
mA  
Operating Supply Current  
Standby Current (Disabled)  
VCC=12V, No load  
ICC_SBY  
SS1/ENB=SS2/ENB=0V  
Notes:  
1. Not tested in production, 30pcs sample.  
2. When VDL falls less than 2V relative to VDH rising to 2V.  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
SG1577A • Rev. 1.0.2  
6
Timing Diagrams  
Figure 4. Timing Chart of Two-Stage Soft-Start  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
7
Typical Performance Characteristics  
Unless otherwise noted, values are for VCC=12V, TA=+25°C, CSS1/ENB=150nF and CSS2/ENB=168nF.  
Figure 5. Power On at 0.3A Load  
Figure 7. Power On at 9A Load  
Figure 9. Power Off with 0.3A Load  
Figure 6. Power On at 3.6A Load  
Figure 8. Power On at 18A Load  
Figure 10. Power Off with 18A Load  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
8
Typical Performance Characteristics (Continued)  
Unless otherwise noted, values are for VCC=12V, TA=+25°C, CSS1/ENB=150nF and CSS2/ENB=168nF.  
Figure 11. Phase Shift at 0.3A Load  
Figure 12. Phase Shift at 18A Load  
Figure 13. Dead Time at 0.3A Load (Rising Edge)  
Figure 14. Dead Time at 0.3A Load (Falling Edge)  
Figure 15. Dead Time at 18A Load (Rising Edge)  
Figure 16. Dead Time at 18A Load (Falling Edge)  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
9
Typical Performance Characteristics (Continued)  
Unless otherwise noted, values are for VCC=12V, TA=+25°C, CSS1/ENB=150nF and CSS2/ENB=168nF.  
Figure 17. Load Transient Response (Step-Up)  
Figure 18. Load Transient Response (Step-Down)  
20kΩ/22nF in Compensation Loop  
20kΩ/22nF in Compensation Loop  
Figure 19. Over-Current Protection (OCP)  
Figure 20. Over-Current Protection (“Hiccup” Mode)  
150  
Iocset 1  
140  
130  
120  
110  
100  
90  
Iocset 2  
-40  
-25  
-10  
5
20  
35  
50  
65  
80  
95  
Temperature (oC)  
Figure 21. Over-Voltage Protection (OVP)  
Figure 22. IOCSET vs. Temperature  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
10  
Functional Description  
The SG1577A is a dual-channel voltage-mode PWM  
controller. It has two sets of synchronous MOSFET  
driving circuits. The two channels are running 180-  
degrees out of phase. The following descriptions  
highlight the advantages of the SG1577A design.  
compensation externally. Non-inverting inputs are  
internally tied to a fixed 0.7V ± 1.5% reference voltage.  
Oscillator Operation  
The SG1577A has  
a
frequency-programmable  
oscillator. The oscillator is running at 61kHz when the  
RT pin is floating. The oscillator frequency can be  
adjusted from 61kHz up to 340kHz by an external  
resistor RRT between RT pin and the ground. The  
oscillator generates a sawtooth wave that has 90%  
rising duty. Sawtooth wave voltage threshold is from  
1.2V to 2.8V. The frequency of oscillator can be  
programmed according to the following equation:  
Soft Start  
An internal start-up current (35/15µA) flows out of  
SS/EN pin to charge an external capacitor. During the  
startup sequence, SG1577A isn’t enabled until the  
SS/ENB pin is higher than 1.2V. From 1.2V to (1.2 + 1.6  
x DON / DON_MAX) V, the PWM duty cycle gradually  
increases following the SS/ENB pin voltage to bring  
output rising. After (1.2 + 1.6 x DON / DON_MAX) V, the  
soft-start period ends and SS/ENB pin continually rises  
to 4.8V. When input power is abnormal, the external  
capacitor on the SS pin is shorted to ground and the  
chip is disabled.  
(3)  
fOSC, RT(kHz) = 61kHz + 8522 / RRT(k)  
Output Driver  
The high-side gate drivers need an external  
bootstrapping circuit to provide the required boost  
voltage. The highest gate driver’s output (15V is the  
allowed) on high-side and low-side MOSFETs forces  
external MOSFETs to have the lowest RDS(ON), which  
results in higher efficiency.  
5
12  
0.9  
CSS1 × (1.4V - 1.2V) =35μA × t1; CSS1 ×(1.2V +1.6 ×  
- 1.4V) =15μA × t2  
; t1 + t2 = tSS1  
3.3  
12  
0.9  
CSS2 ×(1.4V -1.2V) = 35μA × t1; CSS2 × (1.2V +1.6 ×  
- 1.4V) =15μA × t2  
(1)  
; t1 + t2 = tSS2  
CSS2 ×0.3V CSS2 ×(1.2V - 0.3V)  
Over-Temperature Protection (OTP)  
The device is over-temperature protected. When chip  
temperature is over 150oC, the chip enters tri-state  
(high-side driver is turned off). The hysteresis is 20oC.  
CSS1×1.2V = 35μA × t3;  
+
= t4  
15μA  
35μA  
;t4 - t3 = ttime-shift  
Over-Current Protection (OCP)  
Over-current protection is implemented by sensing the  
voltage drop across the drain and the source of external  
high-side MOSFET. Over-current protection is triggered  
when the voltage drop on external high-side MOSFET’s  
RDS(ON) is greater than the programmable current limit  
voltage threshold. 120µA flowing through an external  
resistor between input voltage and the CLP pin sets the  
threshold of current limit voltage. When over-current  
condition is true, the system is protected against the  
cycle-by-cycle current limit. A counter counts a series of  
over-current peak values to eight cycles; the soft-start  
capacitor is discharged by a 50µA current until the  
voltage on SS pin reaches 1.2V. During the discharge  
period, the high-side driver is turned off and the low-  
side driver is turned on. Once the voltage on SS/ENB  
pin is under 1.2V, the normal soft-start sequence is  
initiated and the 35/15µA current charges the soft-start  
capacitor again.  
Type II Compensation Design  
(for Output Capacitors with High ESR)  
SG1577A is a voltage-mode controller; the control loop  
is a single voltage feedback path, including an error  
amplifier and PWM comparator, as shown in Figure 23.  
To achieve fast transient response and accurate output  
regulation, an adequate compensator design is  
necessary. A stable control loop has a 0dB gain  
crossing with -20dB/decade slope and a phase margin  
greater than 45°.  
IL(OCP)= [(RSENSE x IOCSET + VOFFSET) / RDS(ON)  
(VIN - VOUT) x VOUT / (fOSC x LOUT x VIN x 2) ]  
-
(2)  
where VOFFSET ( 10mV) is the offset voltage  
contributed by the internal OCP comparator.  
Error Amplifier  
The IN1 and IN2 pins are connected to the  
corresponding internal error amplifier’s inverting input  
and the outputs of the error amplifiers are connected to  
the corresponding COMP1 and COMP2 pins. The  
COMP1 and COMP2 pins are available for control-loop  
Figure 23. Closed Loop  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
11  
1. Modulator Frequency Equations  
The modulator transfer function is the small-signal  
transfer function of VOUT/VE/A. This transfer function is  
dominated by a DC gain and the output filter (LO and  
CO) with a double-pole frequency at fLC and a zero at  
fP1 = 0  
fZ1  
1
=
2π × R2 × C2  
(6)  
1
f
ESR. The DC gain of the modulator is the input voltage  
fP2  
=
2π × R2 × (C1 //C2)  
(VIN) divided by the peak-to-peak oscillator voltage  
ΔVRAMP(=1.6V). The first step is to calculate the complex  
conjugate poles contributed by the LC output filter. The  
Figure 25 shows the DC-DC converter gain vs.  
frequency. The compensation gain uses external  
impedance networks ZC and Zf to provide a stable, high-  
bandwidth loop.  
output LC filter introduces  
a
double pole,  
-40dB / decade gain slope above its corner resonant  
frequency, and a total phase lag of 180 degrees. The  
resonant frequency of the LC filter expressed as:  
High crossover frequency is desirable for fast transient  
response, but often jeopardizes system stability. To  
cancel one of the LC filter poles, place the zero before  
the LC filter resonant frequency. Place the zero at 75%  
of the LC filter resonant frequency. Crossover frequency  
should be higher than the ESR zero, but less than 1/5  
of the switching frequency. The second pole should be  
placed at half the switching frequency.  
1
f
=
P(LC)  
(4)  
2π ×  
L × C  
O O  
The next step of compensation design is to calculate  
the ESR zero. The ESR zero is contributed by the ESR  
associated with the output capacitance. Note that this  
requires that the output capacitor should have enough  
ESR to satisfy stability requirements. The ESR zero of  
the output capacitor is expressed as:  
1
f
=
(5)  
Z(ESR)  
2π × C × ESR  
O
2. Compensation Frequency Equations  
The compensation network consists of the error  
amplifier and the impedance networks ZC and Zf, as  
Figure 24 shows.  
Figure 25. Bode Plot  
Figure 24. Compensation Loop  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
12  
Layout Considerations  
Layout is important in high-frequency switching converter  
design. If designed improperly, PCB can radiate  
excessive noise and contribute to converter instability.  
ƒ
ƒ
Place the bootstrap capacitor near the BSTx and  
CLNx pins.  
The resistor on the RT pin should be near this pin  
and the GND return should be short and kept away  
from the noisy MOSFET’s GND (which is shorted  
together with IC’s PGND pin to GND plane on back  
side of PCB).  
Place the PWM power stage components first. Mount  
all the power components and connections in the top  
layer with wide copper areas. The MOSFETs of buck,  
inductor, and output capacitor should be as close to  
each other as possible to reduce the radiation of EMI  
due to the high-frequency current loop. If the output  
capacitors are placed in parallel to reduce the ESR of  
capacitor, equal sharing ripple current should be  
considered. Place the input capacitor near the drain of  
high-side MOSFET. In multi-layer PCB, use one layer  
as power ground and have a separate control signal  
ground as the reference for all signals. To avoid the  
signal ground being affected by noise and to achieve  
the best load regulation, it should be connected to the  
ground terminal of output.  
ƒ
ƒ
Place the compensation components close to the  
INx and COMPx pins.  
The feedback resistors for both regulators should  
be located as close as possible to the relevant INx  
pin with vias tied straight to the ground plane as  
required.  
ƒ
ƒ
Minimize the length of the connections between the  
input capacitors, CIN, and the power switchers  
(MOSFETs) by placing them nearby.  
Position both the ceramic and bulk input capacitors  
as close to the upper MOSFET drain as possible  
and make the GND returns short (from the source  
of lower MOSFET to VIN capacitor GND).  
Follow the below guidelines for best performance:  
ƒ
ƒ
A two-layer printed circuit board is recommended.  
Use the bottom layer of the PCB as a ground plane  
and make all critical component ground  
connections through vias to this layer.  
ƒ
Position the output inductor and output capacitors  
between the upper MOSFET and lower MOSFET  
and the load.  
ƒ
ƒ
ƒ
Keep the metal running from the CLNx terminal to  
the output inductor short.  
ƒ
ƒ
Keep AGND on the clearer plane and away from  
the noisy MOSFET GND.  
Use copper-filled polygons on the top (and bottom,  
if two-layer PCB) circuit layers for the CLN node.  
PGND should be short, together with MOSFET  
GND, then through vias to GND plane on the  
bottom of PCB.  
The small-signal wiring traces from the DLx and  
DHx pins to the MOSFET gates should be kept  
short and wide enough to easily handle the several  
amps of drive current.  
ƒ
Prevent a spike on the CLN pin with a proper  
snubber circuit for CLN and GND.  
ƒ
The critical, small-signal components include any  
bypass capacitors (SMD-type of capacitors applied  
at VCC and SSx/ENB pins), feedback components  
(resistor divider), and compensation components  
(between INx and COMPx pins). Position those  
components close to their pins with a local, clear,  
GND connection or directly to the ground plane.  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
13  
Physical Dimensions  
13.00  
12.60  
A
11.43  
20  
11  
B
9.50  
10.65 7.60  
10.00 7.40  
2.25  
1
PIN ONE  
INDICATOR  
10  
0.65  
0.51  
0.35  
1.27  
1.27  
M
0.25  
C B A  
LAND PATTERN RECOMMENDATION  
SEE DETAIL A  
2.65 MAX  
0.33  
0.20  
C
0.10  
C
0.30  
0.10  
SEATING PLANE  
0.75  
0.25  
X 45°  
NOTES: UNLESS OTHERWISE SPECIFIED  
(R0.10)  
(R0.10)  
A) THIS PACKAGE CONFORMS TO JEDEC  
MS-013, VARIATION AC, ISSUE E  
GAGE PLANE  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS DO NOT INCLUDE MOLD  
FLASH OR BURRS.  
0.25  
8°  
0°  
D) CONFORMS TO ASME Y14.5M-1994  
1.27  
0.40  
SEATING PLANE  
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L  
F) DRAWING FILENAME: MKT-M20BREV3  
(1.40)  
DETAIL A  
SCALE: 2:1  
Figure 26. 20-Lead Small Outline Package (SOP)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify  
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically  
the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
14  
© 2009 Fairchild Semiconductor Corporation  
SG1577A • Rev. 1.0.2  
www.fairchildsemi.com  
15  

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