MOC3162V-M_技术文档

September 2010

MOC3061M, MOC3062M, MOC3063M,

MOC3162M, MOC3163M

6-Pin DIP Zero-Cross Phototriac Driver Optocoupler

(600 Volt Peak)

Features

Description

■ Simplifies logic control of 115/240 VAC power

■ Zero voltage crossing

The MOC306XM and MOC316XM devices consist of a

GaAs infrared emitting diode optically coupled to a

monolithic silicon detector performing the function of a

zero voltage crossing bilateral triac driver. They are

designed for use with a triac in the interface of logic sys-

tems to equipment powered from 115/240 VAC lines,

such as solid-state relays, industrial controls, motors,

solenoids and consumer appliances, etc.

■ dv/dt of 1000V/µs guaranteed (MOC316X-M),

– 600V/µs guaranteed (MOC306X-M)

■ VDE recognized (File # 94766)

– ordering option V (e.g., MOC3063V-M)

■ Underwriters Laboratories (UL) recognized

(File #E90700, volume 2)

Applications

■ Solenoid/valve controls

■ Static power switches

■ Temperature controls

■ AC motor starters

■ Lighting controls

■ AC motor drives

■ E.M. contactors

■ Solid state relays

Schematic

Package Outlines

ANODE 1

6 MAIN TERM.

CATHODE

N/C

NC*

2

3

5

4

ZERO

CROSSING

CIRCUIT

MAIN TERM.

*DO NOT CONNECT

(TRIAC SUBSTRATE)

www.fairchildsemi.com

MOC306XM, MOC316XM Rev. 1.0.4

Absolute Maximum Ratings ^{(T = 25°C unless otherwise noted)}

A

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameters

Device

Value

Units

TOTAL DEVICE

T

Storage Temperature

All

-40 to +150

-40 to +85

260 for 10 sec

-40 to +100

7500

°C

STG

T

Operating Temperature

OPR

T

Lead Solder Temperature

Junction Temperature Range

°C

SOL

T

°C

J

(1)

V

Isolation Surge Voltage

Vac(pk)

ISO

(peak AC voltage, 60Hz, 1 sec. duration)

Total Device Power Dissipation @ 25°C Ambient

Derate above 25°C

P

All

250

mW

D

2.94

mW/°C

EMITTER

I

Continuous Forward Current

Reverse Voltage

All

60

6

mA

V

F

V

P

R

D

Total Power Dissipation @ 25°C Ambient

Derate above 25°C

120

1.41

mW

mW/°C

DETECTOR

V

Off-State Output Terminal Voltage

All

600

1

V

A

DRM

TSM

I

Peak Repetitive Surge Current

(PW = 100µs, 120pps)

P

Total Power Dissipation @ 25°C Ambient

Derate above 25°C

All

150

mW

D

1.76

mW/°C

Note:

1. Isolation surge voltage, V , is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are

ISO

common, and Pins 4, 5 and 6 are common.

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

2

Electrical Characteristics ^{(T = 25°C Unless otherwise speciﬁed)}

A

Individual Component Characteristics

Symbol

EMITTER

Parameters

Test Conditions

Device

Min. Typ.* Max. Units

V

Input Forward Voltage

I = 30mA

All

1.3

1.5

V

F

I

Reverse Leakage Current

V = 6V

0.005

100

µA

R

DETECTOR

(2)

I

Peak Blocking Current,

Either Direction

V

= 600V, I = 0

MOC316XM

MOC306XM

10

100

500

DRM1

DRM

F

nA

(3)

dv/dt

Critical Rate of Rise of

Off-State Voltage

I = 0 (Figure 9)

600

1500

F

V/µs

MOC316XM 1000

Transfer Characteristics

Symbol DC Characteristics

Test Conditions

Device

Min. Typ.* Max. Units

I

LED Trigger Current

(rated I

Main Terminal

Voltage = 3V

MOC3061M

15

10

mA

FT

(3)

)

FT

MOC3062M/

MOC3162M

MOC3063M/

MOC3163M

5

3

V

Peak On-State Voltage,

Either Direction

I

= 100 mA peak,

All

1.8

V

TM

I = rated I

F

FT

I

Holding Current,

Either Direction

All

500

µA

H

Zero Crossing Characteristics

Symbol

Characteristics

Test Conditions

Device

Min. Typ.* Max. Units

V

Inhibit Voltage (MT1-MT2

voltage above which device

will not trigger)

I = Rated I

FT

MOC3061M/2M/3M

MOC3162M/3M

12

20

15

V

INH

F

I

Leakage in Inhibited State I = Rated I ,

Al

2

mA

DRM2

F

FT

V

= 600V,

DRM

off state

Isolation Characteristics

Symbol

Characteristics

Test Conditions

Device

Min.

Typ.*

Max.

Units

V

Isolation Voltage

f = 60 Hz, t = 1 sec

All

7500

V

ISO

*Typical values at T = 25°C

A

Notes:

2. Test voltage must be applied within dv/dt rating.

3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating

F

FT

I lies between max I (15mA for MOC3061M, 10mA for MOC3062M & MOC3162M, 5mA for MOC3063M &

F

FT

MOC3163M) and absolute max I (60mA).

F

4. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

3

Safety and Insulation Ratings

As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.

Compliance with the safety ratings shall be ensured by means of protective circuits.

Symbol

Parameter

Min.

Typ.

Max.

Unit

Installation Classiﬁcations per DIN VDE 0110/1.89

Table 1

For Rated Main Voltage < 150Vrms

For Rated Main voltage < 300Vrms

Climatic Classiﬁcation

I-IV

55/100/21

2

Pollution Degree (DIN VDE 0110/1.89)

Comparative Tracking Index

CTI

175

V

Input to Output Test Voltage, Method b,

1594

V

PR

peak

V

x 1.875 = V , 100% Production Test

IORM

PR

with tm = 1 sec, Partial Discharge < 5pC

Input to Output Test Voltage, Method a,

1275

V

x 1.5 = V , Type and Sample Test

PR

IORM

with tm = 60 sec, Partial Discharge < 5pC

Max. Working Insulation Voltage

Highest Allowable Over Voltage

External Creepage

V

850

6000

7

V

IORM

peak

V

IOTM

peak

mm

Ω

External Clearance

7

Insulation Thickness

0.5

9

RIO

Insulation Resistance at Ts, V = 500V

10

IO

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

4

Typical Performance Curves

Figure 1. LED Forward Voltage vs. Forward Current

Figure 2. Trigger Current Vs. Temperature

1.6

1.5

1.4

1.3

1.2

1.1

1.0

0.9

0.8

1.7

1.6

1.5

1.4

1.3

V

= 3V

TM

NORMALIZED TO T = 25°C

A

T

= -40°C

= 25°C

A

1.2

1.1

1.0

0.9

0.8

0.7

T

A

T

= 85°C

0.1

1

10

100

-40

-20

0

20

40

60

80

100

I , LED FORWARD CURRENT (mA)

F

T , AMBIENT TEMPERATURE (°C)

A

Figure 3. LED Current Required to Trigger vs.

LED Pulse Width

Figure 4. Leakage Current, I

vs. Temperature

DRM

16

14

12

10

8

10000

1000

100

10

T

= 25°C

A

NORMALIZED TO PW >> 100µs

IN

6

4

1

2

0.1

-40

0

-20

0

20

40

60

80

100

1

10

100

T , AMBIENT TEMPERATURE (°C)

A

PW , LED TRIGGER PULSE WIDTH (µs)

IN

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

5

Typical Performance Curves ^(Continued)

Figure 5. I

, Leakage in Inhibit State vs. Temperature

DRM2

Figure 6. On-State Characteristics

2.4

800

600

400

200

0

I

= RATED I

FT

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

F

NORMALIZED TO T = 25°C

A

T

= 25°C

A

-200

-400

-600

-800

0.4

-40

-20

0

20

40

60

80

100

-4

-3

-2

-1

0

1

2

3

4

T , AMBIENT TEMPERATURE (°C)

A

V

, ON-STATE VOLTAGE (VOLTS)

TM

Figure 7. I , Holding Current vs. Temperature

Figure 8. Inhibit Voltage vs. Temperature

H

3.2

2.8

2.4

2.0

1.6

1.2

0.8

0.4

0.0

1.20

1.15

1.10

1.05

1.00

0.95

0.90

0.85

0.80

NORMALIZED TO T = 25°C

A

-40

-20

0

20

40

60

80

100

T , AMBIENT TEMPERATURE (°C)

A

-40

-20

0

20

40

60

80

100

T , AMBIENT TEMPERATURE (°C)

A

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

6

1. 100x scope probes are used, to allow high speeds and voltages.

2. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then

removing the current. The variable vernier resistor combined with various capacitor combinations allows the dv/dt to

be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the

LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. t is measured at this

RC

point and recorded.

27

V

/V

SELECT

2W

DRM RRM

2W

1000

10 WATT

WIREWOUND

6

4

X100 PROBE

1

DUT

DIFFERENTIAL

PREAMP

20k

0.33 1000V

0.047

1000V

2

X100 PROBE

470pF

dV

dt

VERNIER

MOUNT DUT ON

TEMPERATURE CONTROLLED

Cµ PLATE

0.001

0.005

0.01

100

2W

1 MEG

2W EACH

1.2 MEG

82

2W

POWER

TEST

0.047

0.1

1N914

RFP4N100

20V

0.47

0-1000V

10mA

56

2W

1000

1/4W

1N967A

18V

f = 10 Hz

PW = 100 µs

50 Ω PULSE

GENERATOR

ALL COMPONENTS ARE NON-INDUCTIVE UNLESS SHOWN

dV

dt

Figure 9. Circuit for Static

Measurement of Power Thyristors

Basic Applications

Typical circuit for use when hot line switching is

required. In this circuit the “hot” side of the line is

switched and the load connected to the cold or

neutral side. The load may be connected to either

the neutral or hot line.

R_in

360Ω

1

2

6

5

V_CC

HOT

FKPF12N60

MOC3061-M

MOC3062-M

MOC3063-M

R

is calculated so that I is equal to the rated I

F FT

in

39Ω

of the part, 15mA for the MOC3061M, 10mA for

the MOC3062M, or 5mA for the MOC3063M.

The 39Ω resistor and 0.01µF capacitor are for

3

4

240 VAC

0.01µF

360Ω

LOAD

NEUTRAL

snubbing of the triac and is often, but not always,

necessary depending upon the particular triac and

load used.

Figure 10. Hot-Line Switching Application Circuit

Suggested method of firing two, back-to-back

SCR’s with a Fairchild triac driver. Diodes

can be 1N4001; resistors, R1 and R2, are

optional 330Ω.

115 VAC

R1

D1

1

2

6

5

V_CC

Note:

R_in

MOC3061-M

MOC3062-M

MOC3063-M

SCR

This optoisolator should not be used to drive

a load directly. It is intended to be a trigger

device only.

SCR

360Ω

3

4

R2

D2

LOAD

Figure 11. Inverse-Parallel SCR Driver Circuit

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

7

Package Dimensions

Through Hole

0.4" Lead Spacing

8.13–8.89

6

4

8.13–8.89

6

4

6.10–6.60

Pin 1

1

3

Pin 1

1

3

5.08 (Max.)

3.28–3.53

0.25–0.36

7.62 (Typ.)

5.08 (Max.)

3.28–3.53

0.25–0.36

0.38 (Min.)

2.54–3.81

2.54 (Bsc)

0.38 (Min.)

2.54–3.81

2.54 (Bsc)

0.20–0.30

(0.86)

15° (Typ.)

(0.86)

0.41–0.51

0.76–1.14

0.20–0.30

10.16–10.80

1.02–1.78

0.41–0.51

0.76–1.14

1.02–1.78

Surface Mount

(1.78)

8.13–8.89

6

4

(1.52)

(2.54)

(7.49)

6.10–6.60

8.43–9.90

(10.54)

1

3

(0.76)

Pin 1

Rcommended Pad Layout

0.25–0.36

3.28–3.53

5.08

(Max.)

0.20–0.30

0.38 (Min.)

0.16–0.88

(8.13)

2.54 (Bsc)

(0.86)

0.41–0.51

0.76–1.14

1.02–1.78

Note:

All dimensions in mm.

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

8

Ordering Information

Order Entry Identiﬁer

(Example)

Option

Description

No option

MOC3061M

MOC3061SM

Standard Through Hole Device

Surface Mount Lead Bend

Surface Mount; Tape and Reel

0.4" Lead Spacing

S

SR2

T

MOC3061SR2M

MOC3061TM

V

MOC3061VM

VDE 0884

TV

MOC3061TVM

MOC3061SVM

MOC3061SR2VM

VDE 0884, 0.4" Lead Spacing

VDE 0884, Surface Mount

VDE 0884, Surface Mount, Tape and Reel

SV

SR2V

Marking Information

1

2

MOC3061

X YY Q

6

V

5

3

4

Deﬁnitions

1

2

Fairchild logo

Device number

VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

3

4

5

6

One digit year code, e.g., ‘3’

Two digit work week ranging from ‘01’ to ‘53’

Assembly package code

*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are

marked with date code ‘325’ or earlier are marked in portrait format.

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

9

Carrier Tape Specification

12.0 ± 0.1

2.0 ± 0.05

4.5 ± 0.20

Ø1.5 MIN

1.75 ± 0.10

4.0 ± 0.1

0.30 ± 0.05

11.5 ± 1.0

24.0 ± 0.3

9.1 ± 0.20

21.0 ± 0.1

Ø1.5 ± 0.1/-0

10.1 ± 0.20

0.1 MAX

User Direction of Feed

Reflow Profile

300

280

260

240

220

200

180

160

140

120

100

80

260°C

>245°C = 42 Sec

Time above

183°C = 90 Sec

°C

1.822°C/Sec Ramp up rate

60

40

33 Sec

20

0

60

120

180

270

360

Time (s)

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

10

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not

intended to be an exhaustive list of all such trademarks.

®

*

AccuPower™

Auto-SPM™

F-PFS™

Power-SPM™

PowerTrench^®

PowerXS™

FRFET^®

The Power Franchise^®

Build it Now™

CorePLUS™

CorePOWER™

CROSSVOLT™

CTL™

Global Power Resource^SM

Green FPS™

Green FPS™ e-Series™

Gmax™

GTO™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

Programmable Active Droop™

QFET^®

QS™

TinyBoost™

TinyBuck™

Quiet Series™

RapidConfigure™

™

TinyCalc™

Current Transfer Logic™

DEUXPEED^®

Dual Cool™

TinyLogic^®

TINYOPTO™

TinyPower™

TinyPWM™

TinyWire™

TriFault Detect™

TRUECURRENT™*

" SerDes™

Saving our world, 1mW/W/kW at a time™

SignalWise™

SmartMax™

EcoSPARK^®

n

EfficientMax™

ESBC™

MicroPak™

SMART START™

®

SPM^®

MicroPak2™

MillerDrive™

MotionMax™

Motion-SPM™

OptoHiT™

Fairchild^®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS^®

Fairchild Semiconductor^®

FACT Quiet Series™

FACT^®

OPTOLOGIC^®

UHC^®

FAST^®

OPTOPLANAR^®

Ultra FRFET™

UniFET™

VCX™

FastvCore™

®

SyncFET™

Sync-Lock™

FETBench™

FlashWriter^®

*

PDP SPM™

VisualMax™

XS™

FPS™

* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE

RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT

OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE

SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,

WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE

EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a)

are intended for surgical implant into the body or (b) support or

sustain life, and (c) whose failure to perform when properly used in

accordance with instructions for use provided in the labeling, can be

reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or

system whose failure to perform can be reasonably expected to

cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on ourexternal website, www.fairchildsemi.com,

under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their

parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed

applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the

proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild

Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors

are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical

and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.

Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global

problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet

Product Status

Definition

Identification

Datasheet contains the design specifications for product development. Specifications may change

in any manner without notice.

Advance Information

Preliminary

Formative / In Design

First Production

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

Semiconductor reserves the right to make changes at any time without notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make

changes at any time without notice to improve the design.

No Identification Needed Full Production

Obsolete Not In Production

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.

The datasheet is for reference information only.

Rev. I49

MOC306XM, MOC316XM Rev. 1.0.4

www.fairchildsemi.com

10


型号：	MOC3162V-M
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	1 CHANNEL TRIAC OUTPUT WITH ZERO CRSVR OPTOCOUPLER, DIP-6 三端双向交流开关输出元件光电
文件：	总11页 (文件大小：296K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MOC3162V-M [FAIRCHILD]

相关型号：

MOC3162VM

MOC3162VM

MOC3163

MOC3163-M

MOC3163F

MOC3163FR2

MOC3163FR2-M

MOC3163FR2V-M

MOC3163M

MOC3163M

MOC3163S

MOC3163S-M