MOC3163M [FAIRCHILD]
Triac Output Optocoupler With Zero CRSVR, 1-Element, 7500V Isolation, DIP-6;型号: | MOC3163M |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Triac Output Optocoupler With Zero CRSVR, 1-Element, 7500V Isolation, DIP-6 三端双向交流开关 输出元件 光电 |
文件: | 总11页 (文件大小:276K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
September 2009
MOC3061M, MOC3062M, MOC3063M,
MOC3162M, MOC3163M
6-Pin DIP Zero-Cross Phototriac Driver Optocoupler
(600 Volt Peak)
Features
Description
■ Simplifies logic control of 115/240 VAC power
■ Zero voltage crossing
The MOC306XM and MOC316XM devices consist of a
GaAs infrared emitting diode optically coupled to a
monolithic silicon detector performing the function of a
zero voltage crossing bilateral triac driver. They are
designed for use with a triac in the interface of logic sys-
tems to equipment powered from 115/240 VAC lines,
such as solid-state relays, industrial controls, motors,
solenoids and consumer appliances, etc.
■ dv/dt of 1000V/µs guaranteed (MOC316X-M),
– 600V/µs guaranteed (MOC306X-M)
■ VDE recognized (File # 94766)
– ordering option V (e.g., MOC3063V-M)
■ Underwriters Laboratories (UL) recognized
(File #E90700, volume 2)
Applications
■ Solenoid/valve controls
■ Static power switches
■ Temperature controls
■ AC motor starters
■ Lighting controls
■ AC motor drives
■ E.M. contactors
■ Solid state relays
Schematic
Package Outlines
ANODE 1
6 MAIN TERM.
CATHODE
N/C
NC*
2
3
5
4
ZERO
CROSSING
CIRCUIT
MAIN TERM.
*DO NOT CONNECT
(TRIAC SUBSTRATE)
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
Absolute Maximum Ratings (T = 25°C unless otherwise noted)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameters
Device
Value
Units
TOTAL DEVICE
T
Storage Temperature
All
All
All
All
All
-40 to +150
-40 to +85
260 for 10 sec
-40 to +100
7500
°C
°C
STG
T
Operating Temperature
OPR
T
Lead Solder Temperature
Junction Temperature Range
°C
SOL
T
°C
J
(1)
V
Isolation Surge Voltage
Vac(pk)
ISO
(peak AC voltage, 60Hz, 1 sec. duration)
Total Device Power Dissipation @ 25°C Ambient
Derate above 25°C
P
All
250
mW
D
2.94
mW/°C
EMITTER
I
Continuous Forward Current
Reverse Voltage
All
All
All
60
6
mA
V
F
V
P
R
D
Total Power Dissipation @ 25°C Ambient
Derate above 25°C
120
1.41
mW
mW/°C
DETECTOR
V
Off-State Output Terminal Voltage
All
All
600
1
V
A
DRM
TSM
I
Peak Repetitive Surge Current
(PW = 100µs, 120pps)
P
Total Power Dissipation @ 25°C Ambient
Derate above 25°C
All
150
mW
D
1.76
mW/°C
Note:
1. Isolation surge voltage, V , is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are
ISO
common, and Pins 4, 5 and 6 are common.
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
2
Electrical Characteristics (T = 25°C Unless otherwise specified)
A
Individual Component Characteristics
Symbol
EMITTER
Parameters
Test Conditions
Device
Min. Typ.* Max. Units
V
Input Forward Voltage
I = 30mA
All
All
1.3
1.5
V
F
F
I
Reverse Leakage Current
V = 6V
0.005
100
µA
R
R
DETECTOR
(2)
I
Peak Blocking Current,
Either Direction
V
= 600V, I = 0
MOC316XM
MOC306XM
MOC306XM
10
10
100
500
DRM1
DRM
F
nA
(3)
dv/dt
Critical Rate of Rise of
Off-State Voltage
I = 0 (Figure 9)
600
1500
F
V/µs
MOC316XM 1000
Transfer Characteristics
Symbol DC Characteristics
Test Conditions
Device
Min. Typ.* Max. Units
I
LED Trigger Current
(rated I
Main Terminal
Voltage = 3V
MOC3061M
15
10
mA
FT
(3)
)
FT
MOC3062M/
MOC3162M
MOC3063M/
MOC3163M
5
3
V
Peak On-State Voltage,
Either Direction
I
= 100 mA peak,
All
1.8
V
TM
TM
I = rated I
F
FT
I
Holding Current,
Either Direction
All
500
µA
H
Zero Crossing Characteristics
Symbol
Characteristics
Test Conditions
Device
Min. Typ.* Max. Units
V
Inhibit Voltage (MT1-MT2
voltage above which device
will not trigger)
I = Rated I
FT
MOC3061M/2M/3M
MOC3162M/3M
12
12
20
15
V
INH
F
I
Leakage in Inhibited State I = Rated I ,
All
150
500
µA
DRM2
F
FT
V
= 600V,
DRM
off state
Isolation Characteristics
Symbol
Characteristics
Test Conditions
Device
Min.
Typ.*
Max.
Units
V
Isolation Voltage
f = 60 Hz, t = 1 sec
All
7500
V
ISO
*Typical values at T = 25°C
A
Notes:
2. Test voltage must be applied within dv/dt rating.
3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating
F
FT
I lies between max I (15mA for MOC3061M, 10mA for MOC3062M & MOC3162M, 5mA for MOC3063M &
F
FT
MOC3163M) and absolute max I (60mA).
F
4. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
3
Safety and Insulation Ratings
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.
Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Installation Classifications per DIN VDE 0110/1.89
Table 1
For Rated Main Voltage < 150Vrms
For Rated Main voltage < 300Vrms
Climatic Classification
I-IV
I-IV
55/100/21
2
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
CTI
175
V
Input to Output Test Voltage, Method b,
1594
V
V
PR
peak
V
x 1.875 = V , 100% Production Test
IORM
PR
with tm = 1 sec, Partial Discharge < 5pC
Input to Output Test Voltage, Method a,
1275
peak
V
x 1.5 = V , Type and Sample Test
PR
IORM
with tm = 60 sec, Partial Discharge < 5pC
Max. Working Insulation Voltage
Highest Allowable Over Voltage
External Creepage
V
850
6000
7
V
V
IORM
peak
V
IOTM
peak
mm
mm
mm
Ω
External Clearance
7
Insulation Thickness
0.5
9
RIO
Insulation Resistance at Ts, V = 500V
10
IO
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
4
Typical Performance Curves
Figure 1. LED Forward Voltage vs. Forward Current
Figure 2. Trigger Current Vs. Temperature
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
1.7
1.6
1.5
1.4
1.3
V
= 3V
TM
NORMALIZED TO T = 25°C
A
T
= -40°C
= 25°C
A
1.2
1.1
1.0
0.9
0.8
0.7
T
A
A
T
= 85°C
0.1
1
10
100
-40
-20
0
20
40
60
80
100
I , LED FORWARD CURRENT (mA)
F
T , AMBIENT TEMPERATURE (°C)
A
Figure 3. LED Current Required to Trigger vs.
LED Pulse Width
Figure 4. Leakage Current, I
vs. Temperature
DRM
16
14
12
10
8
10000
1000
100
10
T
= 25°C
A
NORMALIZED TO PW >> 100µs
IN
6
4
1
2
0.1
-40
0
-20
0
20
40
60
80
100
1
10
100
T , AMBIENT TEMPERATURE (°C)
A
PW , LED TRIGGER PULSE WIDTH (µs)
IN
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
5
Typical Performance Curves (Continued)
Figure 5. I
, Leakage in Inhibit State vs. Temperature
DRM2
Figure 6. On-State Characteristics
2.4
800
600
400
200
0
I
= RATED I
FT
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
F
NORMALIZED TO T = 25°C
A
T
= 25°C
A
-200
-400
-600
-800
0.4
-40
-20
0
20
40
60
80
100
-4
-3
-2
-1
0
1
2
3
4
T , AMBIENT TEMPERATURE (°C)
A
V
, ON-STATE VOLTAGE (VOLTS)
TM
Figure 7. I , Holding Current vs. Temperature
Figure 8. Inhibit Voltage vs. Temperature
H
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
NORMALIZED TO T = 25°C
A
-40
-20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE (°C)
A
-40
-20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE (°C)
A
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
6
1. 100x scope probes are used, to allow high speeds and voltages.
2. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then
removing the current. The variable vernier resistor combined with various capacitor combinations allows the dv/dt to
be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the
LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. t is measured at this
RC
point and recorded.
27
V
/V
SELECT
2W
DRM RRM
2W
1000
10 WATT
WIREWOUND
6
4
X100 PROBE
1
DUT
DIFFERENTIAL
PREAMP
20k
0.33 1000V
0.047
1000V
2
X100 PROBE
470pF
dV
dt
VERNIER
MOUNT DUT ON
TEMPERATURE CONTROLLED
Cµ PLATE
0.001
0.005
0.01
100
2W
1 MEG
2W EACH
1.2 MEG
82
2W
2W
POWER
TEST
0.047
0.1
1N914
RFP4N100
20V
0.47
0-1000V
10mA
56
2W
1000
1/4W
1N967A
18V
f = 10 Hz
PW = 100 µs
50 Ω PULSE
GENERATOR
ALL COMPONENTS ARE NON-INDUCTIVE UNLESS SHOWN
dV
dt
Figure 9. Circuit for Static
Measurement of Power Thyristors
Basic Applications
Typical circuit for use when hot line switching is
required. In this circuit the “hot” side of the line is
switched and the load connected to the cold or
neutral side. The load may be connected to either
the neutral or hot line.
Rin
360Ω
1
2
6
5
VCC
HOT
FKPF12N60
MOC3061-M
MOC3062-M
MOC3063-M
R
is calculated so that I is equal to the rated I
F FT
in
39Ω
of the part, 15mA for the MOC3061M, 10mA for
the MOC3062M, or 5mA for the MOC3063M.
The 39Ω resistor and 0.01µF capacitor are for
3
4
240 VAC
0.01µF
360Ω
LOAD
NEUTRAL
snubbing of the triac and is often, but not always,
necessary depending upon the particular triac and
load used.
Figure 10. Hot-Line Switching Application Circuit
Suggested method of firing two, back-to-back
SCR’s with a Fairchild triac driver. Diodes
can be 1N4001; resistors, R1 and R2, are
optional 330Ω.
115 VAC
R1
D1
1
2
6
5
VCC
Note:
Rin
MOC3061-M
MOC3062-M
MOC3063-M
SCR
This optoisolator should not be used to drive
a load directly. It is intended to be a trigger
device only.
SCR
360Ω
3
4
R2
D2
LOAD
Figure 11. Inverse-Parallel SCR Driver Circuit
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
7
Package Dimensions
Through Hole
0.4" Lead Spacing
8.13–8.89
6
4
8.13–8.89
6
4
6.10–6.60
6.10–6.60
Pin 1
1
3
Pin 1
1
3
5.08 (Max.)
3.28–3.53
0.25–0.36
7.62 (Typ.)
5.08 (Max.)
3.28–3.53
0.25–0.36
0.38 (Min.)
2.54–3.81
2.54 (Bsc)
0.38 (Min.)
2.54–3.81
2.54 (Bsc)
0.20–0.30
(0.86)
15° (Typ.)
(0.86)
0.41–0.51
0.76–1.14
0.20–0.30
10.16–10.80
1.02–1.78
0.41–0.51
0.76–1.14
1.02–1.78
Surface Mount
(1.78)
8.13–8.89
6
4
(1.52)
(2.54)
(7.49)
6.10–6.60
8.43–9.90
(10.54)
1
3
(0.76)
Pin 1
Rcommended Pad Layout
0.25–0.36
3.28–3.53
5.08
(Max.)
0.20–0.30
0.38 (Min.)
0.16–0.88
(8.13)
2.54 (Bsc)
(0.86)
0.41–0.51
0.76–1.14
1.02–1.78
Note:
All dimensions in mm.
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
8
Ordering Information
Order Entry Identifier
(Example)
Option
Description
No option
MOC3061M
MOC3061SM
Standard Through Hole Device
Surface Mount Lead Bend
Surface Mount; Tape and Reel
0.4" Lead Spacing
S
SR2
T
MOC3061SR2M
MOC3061TM
V
MOC3061VM
VDE 0884
TV
MOC3061TVM
MOC3061SVM
MOC3061SR2VM
VDE 0884, 0.4" Lead Spacing
VDE 0884, Surface Mount
VDE 0884, Surface Mount, Tape and Reel
SV
SR2V
Marking Information
1
2
MOC3061
X YY Q
6
V
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘3’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are
marked with date code ‘325’ or earlier are marked in portrait format.
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
9
Carrier Tape Specification
12.0 ± 0.1
2.0 ± 0.05
4.5 ± 0.20
Ø1.5 MIN
1.75 ± 0.10
0.30 ± 0.05
4.0 ± 0.1
11.5 ± 1.0
24.0 ± 0.3
9.1 ± 0.20
21.0 ± 0.1
Ø1.5 ± 0.1/-0
10.1 ± 0.20
0.1 MAX
User Direction of Feed
Reflow Profile
300
280
260
240
220
200
180
160
140
120
100
80
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
°C
1.822°C/Sec Ramp up rate
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
10
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
PowerTrench®
PowerXS™
The Power Franchise®
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSWITCH™*
™*
F-PFS™
FRFET®
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
Programmable Active Droop™
QFET®
TinyBoost™
TinyBuck™
QS™
Quiet Series™
RapidConfigure™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
™
Saving our world, 1mW/W/kW at a time™
SmartMax™
TinyWire™
TriFault Detect™
TRUECURRENT™*
µSerDes™
SMART START™
SPM®
®
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
OPTOPLANAR®
FAST®
®
FastvCore™
FETBench™
PDP SPM™
Power-SPM™
Sync-Lock™
FlashWriter®
®
*
*
FPS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Advance Information
Preliminary
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
First Production
Full Production
Not In Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
No Identification Needed
Obsolete
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I40
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.0.3
www.fairchildsemi.com
11
相关型号:
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