FSUSB23BQX_NL [FAIRCHILD]
Differential Multiplexer, 1 Func, 2 Channel, CMOS, 2.50 X 3.50 MM, LEAD FREE, MO-241AB, DQFN-16;型号: | FSUSB23BQX_NL |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Differential Multiplexer, 1 Func, 2 Channel, CMOS, 2.50 X 3.50 MM, LEAD FREE, MO-241AB, DQFN-16 |
文件: | 总10页 (文件大小:758K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
April 2008
FSUSB23 — High-Speed, USB2.0 (480Mbps) Switch
Features
Description
The FSUSB23 is a low-power, high-bandwidth analog
switch specifically designed for high speed USB 2.0
applications. The FSUSB23 features very low quiescent
current even when the control voltage is lower than the
VCC supply. This feature services mobile handset
applications, allowing direct interface with the baseband
processor general-purpose I/Os.
10µA Maximum ICCT Current over an Expanded
Control
Voltage Range: VIN = 2.6V, VCC = 3.6V)
Lower Capacitance: CON = 9pF Typical
7Ω Typical On Resistance (RON
)
-3dB Bandwidth: > 720MHz
Typical applications involve switching in portables and
consumer applications, such as cell phones, digital
cameras, and notebooks with hubs or controllers. The
wide bandwidth (>720MHz) of this switch exceeds the
bandwidth needed to pass the third harmonic, which
results in signals with minimum edge and phase
distortion. Superior channel-to-channel crosstalk results
in minimal interference.
Low Power Consumption: 1mA Maximum
Wide -3db Bandwidth: > 720MHz
Packaged in:
-10-Lead MicroPak™ (1.6 x 2.1mm)
-16-Lead DQFN (2.5 x3.5mm)
7kV I/O to GND ESD Performance
Applications
Cell phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
Ordering Information
Operating
Temperature Range
Part Number Top Mark
Package
FSUSB23L10X
FSUSB23BQX
EZ
-40 to +85°C
10-Lead MicroPak™ 1.6 x 2.1mm, JEDEC MO-255B
16-Terminal Depopulated Quad Very-Thin Flat Pack No
Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm
USB23
-40 to +85°C
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
All packages are lead free per JEDEC: J-STD-020B standard.
D1+
D2+
D+
D-
D1-
D2-
S
/OE
Control
Figure 1. Analog Symbol
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
Pin Configurations
VCC
16
S
1
D1+
D2+
2
3
15 /OE
D1-
D2-
14
7
3
6
8
2
9
10
1
D+
4
5
13
12
Vcc
5
GND
NC
D-
4
NC
NC
NC
NC
6
7
11
10
9
8
GND
NC
Figure 2. Pad Assignments for MicroPak™
(Top Through View)
Figure 3. Pin Assignments for DQFN
(Top Through View)
Pin Definitions
Pin # Micropak
Pin # DQFN
Pin Name
Pin Description
Switch Select
Bus Switch Enable
Data Port
1
1
S
9
15
/OE
2, 3, 4 ,6, 7, 8
2, 3, 4, 12, 13, 14
D+, D-, Dn+, Dn-
10
5
16
VCC
GND
NC
Supply Voltage
Ground
8
5, 6, 7, 9, 10, 11
No Connect
Truth Table
Sel
X
/OE
HIGH
LOW
LOW
Function
Disconnect
D+, D- = D1n
D+, D- = D2n
LOW
HIGH
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Min.
-0.5
-0.5
-0.5
-50
Max.
4.6
Unit
V
Supply Voltage
VSW
VIN
DC Switch Voltage(1)
DC Input Voltage(1)
DC Input Diode Current
DC Output Current
Storage Temperature
VCC + 0.5
4.6
V
V
IIK
mA
mA
°C
IOUT
50
TSTG
-65
+150
All Pins
7
7
ESD
Human Body Model, JEDEC: JESD22-A114
kV
I/O to GND
Note:
1. The input and output negative ratings may be exceeded if the input and output diode current ratings are
observed. DC switch voltage may never exceed 4.6V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VCC
Parameter
Min.
3.0
0
Max.
3.6
Unit
V
Supply Voltage
VCNTRL
VSW
Control Input Voltage(2)(3)
Switch Input Voltage
Operating Temperature
Thermal Resistance
VCC
VCC
+85
250
V
0
V
TA
-40
°C
Micropak
°C/W
ΘJA
Note:
2. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed. DC switch voltage may never exceed 4.6V.
3. The control input must be held HIGH or LOW; it must not float.
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
3
DC Electrical Characteristics
All typical values are at 25°C unless otherwise specified.
TA=- 40ºC to +85ºC
Symbol
Parameter
Conditions
IIN=-18mA
VCC (V)
Units
Min. Typ. Max.
VIK
VIH
VIL
IIN
Clamp Diode Voltage
Input Voltage High
Input Voltage Low
3.0
-1.2
V
V
3.0 to 3.6
3.0 to 3.6
3.6
1.2
.50
1
V
Control Input Leakage
VIN=0V to VCC
µA
IOZ
Off State Leakage
1
µA
0 ≤ Dn, D1n, D2n ≤ VCC
VSW=0.4V, ION=-8mA
6
7
9
RON
Switch On Resistance(4)
3.0
Ω
VSW=0.8V, ION=-8mA
10
(5)
∆RON
RON Flat
ICC
Delta RON
VIN=0.4V, ION=-8mA
VIN=0V-1.0V, ION=-8mA
VIN=0 or VCC, IOUT=0
3.0
3.0
3.6
0.3
2.0
Ω
Ω
RON Flatness(4)
Quiescent Supply Current
1
µA
Increase in ICC Current Per
Control Voltage and VCC
ICCT
VIN=2.6V VCC=3.6V
3.6
10
µA
Notes:
4. Measured by the voltage drop across the Dn, D1n, D2n pins at the indicated current through the switch.
On resistance is determined by the lower of the voltage on the two (HSDn or Dn ports).
5. Guaranteed by characterization.
AC Electrical Characteristics
All typical values are for VCC=3.3V at 25°C unless otherwise specified.
TA=- 40ºC to +85ºC
Symbol
tON
Parameter
Conditions
VD1n, D2n=0.8V,
RL=50Ω, CL=10pF
Figure 8
VCC (V)
3.0 to 3.6
3.0 to 3.6
Units
ns
Min. Typ. Max.
Turn-On Time S,
/OE to Output
10
8
13
11
VD1n, D2n=0.8V,
RL=50Ω, CL=10pF
Figure 8
Turn-Off Time S,
/OE to Output
tOFF
ns
RL=50Ω, CL=10pF
Figure 6, Figure 7
tPD
Propagation Delay(6)
3.3
0.25
-30
ns
dB
Off Isolation,
Non-Adjacent
f=250MHz, RT=50Ω
Figure 14
OIRR
Xtalk
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
Non-Adjacent Channel
Crosstalk
f=250MHz, RT=50Ω
Figure 9
-43
dB
RT=50Ω
Figure 13
BW
-3db Bandwidth
720
MHz
Note:
6. Guaranteed by characterization.
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
4
USB Hi-Speed-Related AC Electrical Characteristics
TA=- 40ºC to +85ºC
Min. Typ. Max.
Symbol
tSK(O)
Parameter
Conditions
VCC (V)
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
Units
ps
RL=50Ω, CL=10pF
Figure 6, Figure 12
Channel-to-Channel Skew(7)
40
20
Skew of Opposite Transitions RL=50Ω, CL=10pF
tSK(P)
ps
of the Same Output(7)
Figure 6, Figure 12
RL=50ꢀ, CL=10pf,
tR=tF=750ps at 480Mbps
(PRBS=215 – 1)
tJ
Total Jitter(7)
150
ps
Note:
7. Guaranteed by characterization.
Capacitance
TA=- 40ºC to +85ºC
Symbol
Parameter
Conditions
Units
Min.
Typ. Max.
VCC=0V
Figure 11
CIN
CON
COFF
Control Pin Input Capacitance
D1n, D2n, Dn On Capacitance
D1n, D2n Off Capacitance
2
pF
pF
pF
VCC=3.3V, /OE=0V
Figure 10
9
4
VCC and /OE=3.3V
Figure 11
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
5
Test Diagrams
VON
I
D (OFF)
n
NC
A
D1 , D2
n
n
V
IN
D
n
Select
=0 or V
V
IN
GND
ION
GND
V
GND
S
CC
Select
V
**Each switch port is tested separately
V
= 0 to
S
CC
R
ON = VON / ION
Figure 4. On Resistance
Figure 5. Off Leakage
D1+, D1-
t
=500ps
t
=500ps
FALL
RISE
D1+, D1-
V
IN
800mV
V
OUT
90%
50%
90%
50%
C
R
L
R
GND
V
L
S
Input:D , D
n+ n-
GND
10%
10%
50%
400mV
V
Sel
OH
50%
GND
Output:D+, D-
R , R , and C are functions of the application
L
S
L
V
OL
t
PLH
environment (see AC Tables for specific values)
t
PHL
C
includes test fixture and stray capacitance.
L
Figure 6. AC Test Circuit Load
Figure 7. Switch Propagation Delay Waveforms
t
=2.5ns
t
=2.5ns
FALL
RISE
Network Analyzer
NC
R
S
V
CC
Input - S, /OE
V
IN
V
GND
90%
90%
/2
S
GND
V
V
/2
Sel
V
CC
CC
10%
10%
90%
GND
R
GND
T
V
GND
OH
90%
V
OUT
Output - V
OUT
GND
R
T
R
and R are functions of the application environment
T
S
GND
(50Ω, 75Ω or 100Ω).
V
OL
t
t
Crosstalk = 20 Log (VOUT / VIN)
ON
OFF
Figure 8. Turn On / Turn Off Waveform
Figure 9. Non-Adjacent Channel-to-Channel Crosstalk
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
6
Test Diagrams (Continued)
D
n
Capacitance
Meter
D
n
S
S
Capacitance
Meter
V
=0 or V
CC
f=1MHz
Sel
V
= 0 or V
CC
Sel
D1 , D2
n
n
f=1MHz
D1 , D2
n
n
Figure 10. Channel On Capacitance
Figure 11. Channel Off Capacitance
t
=750ps
t
=750ps
FALL
RISE
800mV
90%
50%
90%
50%
Input: D+, D-
t
=750ps
t
=750ps
FALL
RISE
10%
10%
50%
400mV
V
800mV
90%
50%
90%
50%
OH
Input:D , D
n+ n-
50%
Output 1: D+, D-
10%
10%
50%
400mV
V
V
V
OL
OH
t
PLH1
t
PHL1
50%
Output:D+, D-
V
OL
t
OH
PLH
t
PHL
50%
50%
Output 1: D2+, D2-
T
= t
-t
SK(P) PHL PLH
Pulse Skew, T
SK(P)
V
OL
t
PLH2
t
PHL2
Figure 12. Switch Skew Tests
Network Analyzer
R
S
V
IN
V
S
GND
V
Sel
GND
GND
V
OUT
GND
R
T
R and RT are functions of the application environment
(see AC tables for specific values).
S
GND
Figure 13. Bandwidth
Network Analyzer
R
S
V
IN
R
V
T
S
GND
V
Sel
GND
GND
GND
V
OUT
R
GND
T
Off Isolation =20Log(V
/V )
OUT IN
GND
Figure 14. Channel Off Isolation
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
7
Physical Dimensions
Figure 15. 10-Lead MicroPak™ 1.6 x 2.1mm
Note: click here for tape and reel specifcations, available at:
http://www.fairchildsemi.com/products/analog/pdf//micropak_tr.pdf
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
8
Physical Dimensions
Figure 16. 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN) Package
Note: click here for tape and reel specifcations, available at:
http://www.fairchildsemi.com/products/analog/packaging/MLP16_25x35.html
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
9
© 2006 Fairchild Semiconductor Corporation
FSUSB23 • Rev. 1.0.1
www.fairchildsemi.com
10
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