FSUSB30 [FAIRCHILD]
Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch; 低功耗双端口高速USB 2.0 （ 480Mbps的）开关
| 型号： | FSUSB30 |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch |
| 文件： | 总17页 (文件大小：951K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
February 2006
FSUSB30
Low Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
General Description
Features
The FSUSB30 is a Low Power, 2-Port Hi-Speed USB 2.0
switch. This part is configured as a DPDT switch and is
optimized for switching between two Hi-Speed (480Mbps)
sources or a Hi-Speed and Full Speed (12Mbps) source.
The FSUSB30 is compatible with the requirements of
USB2.0 and features an extremely low On Capacitance
■ Low On Capacitance, 6.5pF (typical)
■ Low On Resistance, 6.5Ω (typical)
■ Low power consumption (1µA maximum)
– 10µA maximum I
over and expanded control
CCT
voltage range (V = 2.6V, V = 4.3V)
IN
CC
■ Wide -3dB bandwidth, >720MHz
■ 8KV ESD protection
(C ) of 6.5pF. The wide bandwidth of this device
ON
(720MHz), exceeds the bandwidth needed to pass the
rd
3
harmonic, resulting in signals with minimum edge
■ Power OFF protection when V = 0V, D+/D- pins can
CC
and phase distortion. Superior channel-to-channel
crosstalk also minimizes interference.
tolerate up to 4.3V
■ Packaged in:
The FSUSB30 contains special circuitry on the D+/D-
pins which allows the device to withstand an overvoltage
condition. This device is also designed to minimize cur-
rent consumption even when the control voltage applied
– Pb-Free 10-lead MicroPak™ (1.6mm x 2.1mm)
– Pb-Free 14-lead DQFN
– Pb-Free 10-lead MSOP (preliminary)
to the S pin, is lower than the supply voltage (V ). This
CC
Applications
■ Cell phone, PDA, Digital Camera, and Notebook
■ LCD Monitor, TV, and Set-top Box
feature is especially valuable to Ultra-Portable applica-
tions such as cell phones, allowing for direct interface
with the General Purpose I/Os of the baseband proces-
sor. Other applications include switching and connector
sharing in portable cell phones, PDAs, digital cameras,
printers, and notebook computers.
Ordering Information
Order
Number
Package
Number
Package Description
FSUSB30L10X
FSUSB30BQX
MAC010A Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm
MLP014A Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),
JEDEC MO-241, 2.5 x 3.0mm
FSUSB30MUX
(Preliminary)
MUA10A 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide
Pb-Free package per JEDEC J-STD-020B.
Application Diagram
FSUSB30
V
CC
1D+
1D–
D+
D–
USB2.0
Controller
USB
Connector
Set Top Box
(STB) CPU
or
DSP
Processor
2D+
2D–
DVR or
Mass Storage
Controller
Control
S
OE
MicroPak is a trademark of Fairchild Semiconductor Corporation.
©2006 Fairchild Semiconductor Corporation
1
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FSUSB30 Rev. 1.0.1
Connection Diagrams
Analog Symbol
HSD1+
HSD2+
Pad Assignments for MicroPak
D+
D–
HSD1–
HSD2–
9
8
2
7
3
6
VCC 10
1
5
4
GND
S
Control
OE
Pin Descriptions
(Top View)
Pin Name
Description
OE
Bus Switch Enable
Select Input
S
D+, D−, HSDn+, HSDn−
NC
Pad Assignments for DQFN
Data Ports
NC VCC
No Connect
1
14
2
3
4
5
6
13
12
11
10
9
S
HSD1+
NC
OE
HSD1–
NC
Truth Table
S
X
L
OE
H
Function
HSD2+
D+
HSD2–
D–
Disconnect
L
D+, D− = HSD1
D+, D− = HSD2
n
7
8
H
L
n
GND NC
(Top Through View)
Pin Assignment for MSOP
1
10
S
VCC
HSD1+
2
3
4
9
8
7
OE
HSD2+
D+
HSD1–
HSD2–
D–
5
6
GND
(Top Through View)
2
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FSUSB30 Rev. 1.0.1
Absolute Maximum Ratings
(The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed.
The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics
tables are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table will
define the conditions for actual device operation.)
Symbol
Parameter
Rating
V
V
V
Supply Voltage
−0.5V to +4.6V
−0.5V to +4.6V
CC
1
DC Input Voltage
CNTRL
SW
1
DC Switch Voltage
HSDnX
−0.5V to V + 0.3V
CC
D+, D−
−0.5V to +4.6V
−50mA
DC Input Diode Current
DC Output Current
Storage Temperature
ESD (Human Body Model)
All Pins
50mA
−65°C to +150°C
8 KV
8 KV
I/O to GND
2
Recommended Operating Conditions
Symbol
Parameter
Rating
V
V
Supply Voltage
3.0V to 4.3V
CC
IN
Control Input Voltage
Switch Input Voltage
0V to V
0V to V
CC
CC
Operating Temperature
Thermal Resistance, 10 MicroPak
−40°C to +85°C
250°C/W
Notes:
1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed. DC switch voltage may never exceed 4.6V.
2. Control input must be held HIGH or LOW and it must not float.
3
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FSUSB30 Rev. 1.0.1
DC Electrical Characteristics
(All typical values are @ 25°C unless otherwise specified.)
TA = −40°C to +85°C
V
CC (V)
Symbol
Parameter
Clamp Diode Voltage
Input Voltage HIGH
Conditions
Min
Typ
Max
Units
V
V
V
I
= −18mA
3.0
−1.2
IK
IN
3.0 to 3.6
1.3
1.7
V
IH
IL
4.3
3.0 to 3.6
4.3
V
V
Input Voltage LOW
0.5
0.7
1.0
2.0
2.0
V
V
I
I
I
Control Input Leakage
OFF State Leakage
V
= 0.0V to V
CC
4.3
−1.0
−2.0
-2.0
µA
µA
µA
IN
SW
0 ≤ Dn, HSD1 , HSD2 ≤ V
CC
4.3
OZ
n
n
Power OFF Leakage
Current (D+, D–)
V
= 0V to 4.3V, V = 0V
0
OFF
SW
CC
3
R
Switch On Resistance
V
V
V
= 0.8V, I = −8mA
3.0
3.0
3.0
6.5
0.35
2.0
9.0
Ω
Ω
Ω
ON
SW
SW
SW
ON
4
∆R
Delta R
= 0.8V, I = −8mA
ON
ON
ON
3
R
Flatness
R
Flatness
= 0.0V − 1.0V,
ON
ON
I
= −8mA
ON
I
I
Quiescent Supply
Current
V
= 0.0V or V ,
CC
= 0
4.3
4.3
1.0
µA
µA
CC
CNTRL
I
OUT
Increase in I Current
V
(control input) = 2.6V
10.0
CCT
CC
CNTRL
per Control Voltage
AC Electrical Characteristics
(All typical values are for V = 3.3V @ 25°C unless otherwise specified.)
CC
TA = −40°C to +85°C
Figure
VCC (V)
Symbol
Parameter
Conditions
Min
Typ
Max Units Number
t
Turn On Time S,
OE to Output
HD1 , HD2 = 0.8V,
3.0 to 3.6
3.0 to 3.6
3.3
13.0
30.0
ns
ns
ns
ns
dB
dB
Figure 8
Figure 8
ON
OFF
PD
n
n
R = 50Ω, C = 5pF
L
L
t
t
Turn OFF Time S,
OE to Output
HD1 , HD2 = 0.8V,
12.0
0.25
25.0
n
n
R = 50Ω, C = 5pF
L
L
4
Propagation Delay
R = 50Ω, C = 5pF
Figure 6
Figure 7
L
L
T
Break-Before-Make
R = 50Ω, C = 5pF,
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
2.0
6.5
Figure 9
Figure 12
Figure 13
BBM
L
L
V
= 0.8V
IN
O
OFF Isolation
(Non-Adjacent)
f = 240MHz, R = 50Ω
−30.0
−45.0
IRR
T
Xtalk
BW
Non-Adjacent Channel R = 50Ω, f = 240MHz
Crosstalk
T
−3dB Bandwidth
R = 50Ω, C = 0pF
720
550
MHz Figure 11
T
L
R = 50Ω, C = 5pF
T
L
Notes:
3. Measured by the voltage drop between Dn, HSD1 , HSD2 pins at the indicated current through the switch.
n
n
On Resistance is determined by the lower of the voltage on the two ports.
4. Guaranteed by characterization.
4
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FSUSB30 Rev. 1.0.1
USB Hi-Speed Related AC Electrical Characteristics
TA = −40°C to +85°C
Figure
Number
V
CC (V)
Symbol
SK(O)
Parameter
Conditions
Units
Min
Typ
Max
t
t
Channel-to-Channel R = 50Ω, C = 5pF
3.0 to 3.6
3.0 to 3.6
50.0
ps
Figure 6
Figure 10
L
L
5
Skew
Skew of Opposite
Transitions of the
R = 50Ω, C = 5pF
20.0
200
ps
ps
Figure 6
Figure 10
SK(P)
L
L
5
Same Output
5
t
Total Jitter
R = 50Ω, C = 5pF,
3.0 to 3.6
J
L
L
t
= t = 500ps at 480 Mbps
R
F
15
(PRBS = 2 − 1)
Notes:
5. Guaranteed by characterization.
Capacitance
TA = −40°C to +85°C
Figure
Number
Symbol
Parameter
Conditions
Units
Min
Typ
1.5
6.5
2.5
Max
C
Control Pin Input Capacitance
V
V
V
= 0V
pF
pF
pF
Figure 15
Figure 14
Figure 15
IN
CC
CC
CC
C
C
D1 , D2 , Dn ON Capacitance
= 3.3, OE = 0V
and OE = 3.3
ON
OFF
n
n
D1 , D2 OFF Capacitance
n
n
5
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FSUSB30 Rev. 1.0.1
Typical Characteristics
Freqency Response
0
-1
-2
-3
-4
-5
-6
-7
-8
1
10
100
1000
10000
Frequency (MHz)
Figure 1. Gain vs. Frequency, CL = 0pF, VCC = 3.3V
Freqency Response
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
1
10
100
1000
Frequency (MHz)
Figure 2. OFF Isolation, VCC = 3.3V
Freqency Response
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
1
10
100
1000
Frequency (MHz)
Figure 3. Crosstalk, VCC = 3.3V
6
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FSUSB30 Rev. 1.0.1
Test Diagrams
VON
FSUSB30
FSUSB30
IDn(OFF)
NC
HSDn
VIN
Dn
A
VIN
ION
Select
VS = 0 or VCC
Select
VS = 0 to VCC
GND
GND
GND
RON = VON / ION
Each switch port is tested separately.
Figure 4. On Resistance
Figure 5. OFF Leakage
FSUSB30
tFALL = 500ps
tRISE = 500ps
800mV
HSDn
D+, D–
VIN
90%
50%
90%
50%
VOUT
RL
CL
Input: HSDn+,
RS
GND
HSDn–
10%
10%
400mV
GND
VSel
GND
VOH
Output: D+, D–
50%
50%
RL, RS, and CL are functions of the application environment
(see AC Electrical tables for specific values).
VOL
tPLH
tPHL
CL includes test fixture and stray capacitance.
Figure 6. AC Test Circuit Load
Figure 7. Switch Propagation Delay Waveforms
tFALL = 2.5ns
tRISE = 2.5ns
VCC
90%
/2
90%
Input – S, OE
V
V
/2
CC
CC
10%
10%
GND
VOH
90%
90%
Output – VOUT
VOL
tON
tOFF
Figure 8. Turn ON / Turn OFF Waveform
7
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FSUSB30 Rev. 1.0.1
VCC
VCC
HSDn
HSDn
VO
VOUT
CL*
VCC
0V
D+, D–
Control
Input
50%
RL
tR = tF = 2.5ns (10–90%)
S
VOUT
Control
Input
GND
0.9 x VOUT
tD
*CL includes test fixture and stray capacitance.
Figure 9. Break-before-Make (T
)
BBM
tFALL = 500ps
tRISE = 500ps
800mV
90%
50%
90%
50%
Input: D+, D–
10%
10%
400mV
t
FALL = 500ps
tRISE = 500ps
800mV
VOH
Output1: HSD1+
HSD1–
90%
50%
90%
50%
50%
50%
Input: HSDn+
HSDn–
VOL
10%
10%
tPLH1
tPHL1
400mV
VOH
VOH
50%
50%
50%
50%
Output1: D2+, D2–
Output: D+, D–
VOL
VOL
tPLH
tPHL
tPLH2
tPHL2
TSK(P) = | tPHL – tPLH
Pulse Skew, TSK(P)
|
TSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2
Output Skew, TSK(OUT)
|
Figure 10. Switch Skew Tests
Network Analyzer
FSUSB30
RS
VIN
VS
GND
GND
V
Sel
GND
VOUT
RT
GND
RS and RT are functions of the application environment
(See AC Electrical Tables for specific values).
GND
Figure 11. Bandwidth
8
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FSUSB30 Rev. 1.0.1
Network Analyzer
FSUSB30
RS
VIN
VS
GND
GND
RT
GND
V
Sel
GND
GND
VOUT
RT
GND
OFF-Isolation = 20 Log (VOUT /VIN)
Figure 12. Channel OFF Isolation
NC
Network Analyzer
FSUSB30
RS
VIN
VS
GND
GND
V
Sel
RT
GND
GND
RT
VOUT
GND
R
S and RT are functions of the application environment
GND
(50, 75 or 100Ω)
Crosstalk = 20 Log (VOUT / VIN)
Figure 13. Non-Adjacent Channel-to-Channel Crosstalk
FSUSB30
FSUSB30
Dn
Dn
Capacitance
Meter
S
S
Capacitance
Meter
F = 1MHz
VSel = 0 or VCC
VSel = 0 or VCC
F = 1MHz
D1n, D2n
D1n, D2n
Figure 14. Channel ON Capacitance
Figure 15. Channel OFF Capacitance
9
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FSUSB30 Rev. 1.0.1
Tape and Reel Specifications
Tape Format for MircoPak
Package
Designator
Tape
Section
Number
Cavities
Cavity
Status
Cover Tape
Status
L10X
Leader (Start End)
Carrier
125 (typ)
5000
Empty
Filled
Sealed
Sealed
Sealed
Trailer (Hub End)
75 (typ)
Empty
Tape Dimension inches (millimeters)
10
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FSUSB30 Rev. 1.0.1
Reel Dimension for MircoPak inches (millimeters)
Tape Size
A
B
C
D
N
W1
W2
W3
8 mm
7.0
(177.8)
0.059
(1.50)
0.512
(13.00)
0.795
(20.20)
2.165 0.331 + 0.059/−0.000
0.567
(14.40)
W1 + 0.078/−0.039
(W1 + 2.00/−1.00)
(55.00)
(8.40 + 1.50/−0.00)
11
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FSUSB30 Rev. 1.0.1
Tape Format for DQFN
Package
Designator
Tape
Section
Number
Cavities
Cavity
Status
Cover Tape
Status
BQX
Leader (Start End)
Carrier
125 (typ)
2500/3000
75 (typ)
Empty
Filled
Sealed
Sealed
Sealed
Trailer (Hub End)
Empty
Tap Dimensions inches (millimeters)
12
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FSUSB30 Rev. 1.0.1
Reel Dimensions for DQFN inches (millimeters)
Tape Size
A
B
C
D
N
W1
W2
12 mm
13.0
(330)
0.059
(1.50)
0.512
(13.00)
0.795
(20.20)
7.008
(178)
0.488
(12.4)
0.724
(18.4)
13
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FSUSB30 Rev. 1.0.1
Physical Dimensions inches (millimeters) unless otherwise noted
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm
Package Number MAC010A
14
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FSUSB30 Rev. 1.0.1
Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm
Package Number MLP014A
15
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FSUSB30 Rev. 1.0.1
SEE DETAIL A
DETAIL A
10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide
Package Number MUA10A
16
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FSUSB30 Rev. 1.0.1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
FAST®
FASTr™
FPS™
FRFET™
GlobalOptoisolator™
GTO™
ACEx™
PowerSaver™
PowerTrench®
QFET®
SuperSOT™-6
SuperSOT™-8
SyncFET™
TCM™
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
CROSSVOLT™
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
FACT™
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
ScalarPump™
SILENT SWITCHER®
SMART START™
SPM™
TinyLogic®
TINYOPTO™
TruTranslation™
UHC™
HiSeC™
I2C™
MSXPro™
OCX™
OCXPro™
UltraFET®
UniFET™
VCX™
i-Lo™
ImpliedDisconnect™
IntelliMAX™
OPTOLOGIC®
OPTOPLANAR™
PACMAN™
POP™
Wire™
FACT Quiet Series™
Across the board. Around the world.™
The Power Franchise®
Programmable Active Droop™
Stealth™
SuperFET™
SuperSOT™-3
Power247™
PowerEdge™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I18
17
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FSUSB30 Rev. 1.0.1
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