FSUSB23L10X [FAIRCHILD]
Low Power Hi-Speed USB 2.0 (480Mbps) Switch; 低功耗高速USB 2.0 ( 480Mbps的)开关型号: | FSUSB23L10X |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Low Power Hi-Speed USB 2.0 (480Mbps) Switch |
文件: | 总12页 (文件大小:335K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
August 2005
Revised August 2005
FSUSB23
Low Power Hi-Speed USB 2.0 (480Mbps) Switch
General Description
Features
The FSUSB23 is a low power high bandwidth analog switch
specifically designed for high speed USB 2.0 applications. The
FSUSB23 features very low quiescent current even when the
10 A maximum I
current over an expanded control
CCT
voltage range (V = 2.6V, V = 3.6V)
IN
CC
Lower Capacitance: Con = 9pF Typ
control voltage is lower than the V
supply. This feature ser-
CC
vices mobile handset applications well allowing for direct inter-
face with the baseband processor general purpose I/Os. Typical
applications involve switching in portables and consumer appli-
cations such as cell phones, digital cameras, and notebooks
with hubs or controllers. The wide bandwidth (>720MHz) of this
7
typical On Resistance (R
)
ON
3dB bandwidth: > 720MHz
Low power consumption (1 A maximum)
Packaged in:
rd
switch exceeds the bandwidth needed to pass the 3 harmonic
which results in signals with minimum edge and phase distor-
tion. Superior channel-to-channel crosstalk results in minimal
interference.
Pb-Free 10-lead MicroPak (1.6mm by 2.1mm)
Pb-Free 16-lead DQFN
7kV I/O to GND ESD performance
Applications
Cell phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-top Box
Ordering Code:
Order
Package
Package Description
Number
FSUSB23L10X
FSUSB23BQX
Number
MAC010A
MLP016E
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm
Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241,
2.5 x 3.5mm
Pb-Free package per JEDEC J-STD-020B.
MicroPak is a trademark of Fairchild Semiconductor Corporation.
© 2005 Fairchild Semiconductor Corporation
DS500925
www.fairchildsemi.com
Analog Symbol
Connection Diagrams
Pad Assignments for MicroPak
(Top View)
Pin Descriptions
Pad Assignments for DQFN
Pin Name
Description
OE
Bus Switch Enable
Select Input
S
D+, D , Dn+, Dn
Data Ports
Truth Table
S
X
L
OE
H
Function
Disconnect
L
D+, D = D1
D+, D = D2
n
n
H
L
(Top Through View)
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2
Absolute Maximum Ratings(Note 1)
Recommended Operating Conditions
(Note 3)
Supply Voltage (V
)
0.5V to +4.6V
CC
Supply Voltage V
3.0V to 3.6V
DC Switch Voltage (Note 2)
0.5V to V + 0.5V
CC
CC
Control Input Voltage
Switch Input Voltage
Operating Temperature
Thermal Resistance
10 MicroPak
0V to V
0V to V
DC Input Voltage (V ) (Note 2)
0.5v to +4.6V
50mA
CC
CC
IN
DC Input Diode Current
DC Output Current
Storage Temperature
ESD (Human Body Model)
All Pins
40 C to +85 C
50mA
65 C to +150 C
250 C/w
7 KV
7 KV
Note 1: The Absolute Maximum Ratings are those values beyond which the safety of
the device cannot be guaranteed. The device should not be operated at these limits.
The parametric values defined in the Electrical Characteristics tables are not guaran-
teed at the absolute maximum rating. The Recommended Operating Conditions
tables will define the conditions for actual device operation.
I/O to GND
Note 2: The input and output negative voltage ratings may be exceeded if the input
and output diode current ratings are observed. DC switch voltage may never exceed
4.6V.
Note 3: Control input must be held HIGH or LOW and it must not float.
DC Electrical Characteristics (All typical values are @ 25 C unless otherwise specified.)
V
T
=
A
40 C to +85 C
Typ
CC
Symbol
Parameter
Clamp Diode Voltage
Units
Conditions
(V)
3.0
Min
Max
V
V
V
1.2
V
V
V
A
A
I
= 18mA
IK
IH
IL
IN
Input Voltage HIGH
Input Voltage LOW
Control Input Leakage
OFF State Leakage
Switch On Resistance
(Note 4)
3.0 to 3.6
3.0 to 3.6
3.6
1.2
0.50
1.0
I
I
V
0
= 0V to V
CC
IN
OZ
IN
1.0
Dn, D1 , D2
V
CC
n
n
R
6.0
7.0
0.3
2.0
9.0
V
V
V
V
V
V
V
= 0.4V,
= 0.8V,
= 0.8V,
I
I
I
=
8mA
8mA
8mA
ON
IN
IN
IN
IN
IN
IN
CC
ON
ON
ON
3.0
10.0
=
=
R
Delta R (Note 5)
3.0
3.0
3.6
3.6
ON
ON
R
Flatness
R
Flatness (Note 4)
= 0.0V 1.0V, I =
ON
8mA
= 0
ON
ON
I
I
Quiescent Supply Current
Increase in I Current per
1.0
A
A
= 0.0V or V , I
CC OUT
CC
CCT
10.0
= 2.6V
= 3.6V
CC
Control Voltage and V Levels
CC
Note 4: Measured by the voltage drop between Dn, D1 , D2 pins at the indicated current through the switch. On Resistance is determined by the lower of the voltage on the two
n
n
ports.
Note 5: Guaranteed by characterization.
AC Electrical Characteristics (All typical values are for V = 3.3v @ 25 C unless otherwise specified.)
CC
V
T = 40 C to +85 C
A
Figure
Number
Figure 5
Figure 5
CC
Symbol
Parameter
Units
Conditions
(V)
Min
Typ
Max
t
Turn On Time S, OE to Output
3.0 to 3.6
10.0
13.0
11.0
ns
V
V
,
= 0.8V, R = 50
C
C
= 10
= 10
ON
D1n D2n
L
L
t
t
Turn OFF Time S, OE to Output
Propagation Delay (Note 6)
3.0 to 3.6
3.3
8.0
ns
ns
,
= 0.8V, R = 50
OFF
PD
D1n D2n L
L
0.25
C
= 10 pF
Figures 3,
4
L
O
OFF Isolation (Non-Adjacent)
Non-Adjacent Channel Crosstalk
3dB Bandwidth
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
30.0
43.0
720
dB
dB
f = 250MHz, R = 50
Figure 8
Figure 9
Figure 7
IRR
L
Xtalk
BW
R
R
= 50 , f = 250MHz
= 50
L
L
MHz
Note 6: Guaranteed by characterization
3
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USB Related AC Electrical Characteristics
V
T = 40 C to +85 C
A
Figure
CC
Symbol
Parameter
Units
ps
Conditions
(V)
Min
Typ
Max
Number
t
t
t
Channel-to-Channel Skew (Note 7)
3.0 to 3.6
40.0
C
C
R
= 10pF
= 10pF
Figures
3, 6
SK(O)
L
L
L
Skew of Opposite Transitions of
the Same Output (Note 7)
3.0 to 3.6
3.0 to 3.6
20.0
150
ps
Figures
3, 6
SK(P)
J
Total Jitter (Note 7)
ps
= 50 , C = 10pF,
L
t
= t = 750ps at 480 Mbps
F
R
15
(PRBS = 2
1)
Note 7: Guaranteed by design.
Capacitance
T
=
40 C to +85 C
Figure
A
Symbol
Parameter
Control Pin Input Capacitance
Units
Conditions
Min
Typ
Max
Number
C
C
C
2.0
pF
pF
pF
V
V
V
= 0V
Figure
11
IN
CC
CC
CC
D1 , D2 , Dn ON Capacitance
9.0
4.0
= 3.3, OE = 0V
and OE = 3.3
Figure
10
ON
OFF
n
n
D1 , D2 OFF Capacitance
Figure
11
n
n
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4
Test Diagrams
Note: Each switch port is tested separately.
FIGURE 1. On Resistance
FIGURE 2. OFF Leakage
Note: R , R , and C are functions of application environment
L
S
L
(See AC Electrical table for specific values).
FIGURE 4. Switch Propagation Delay Waveforms
Note: C includes test fixture and stray capacitance.
L
FIGURE 3. AC Test Circuit Load
FIGURE 5. Turn ON/ Turn OFF Waveform
5
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FIGURE 6. Switch Skew Tests
Note: R and R are functions of application environment (See AC Electrical Tables for specific values).
S
T
FIGURE 7. Bandwidth
FIGURE 8. Channel OFF Isolation
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6
FIGURE 9. Non-Adjacent Channel-to-Channel Crosstalk
FIGURE 11. Channel OFF Capacitance
FIGURE 10. Channel ON Capacitance
7
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Tape and Reel Specification
TAPE FORMAT for MircoPak
Package
Tape
Number
Cavity
Cover Tape
Designator
Section
Leader (Start End)
Carrier
Cavities
125 (typ)
5000
Status
Empty
Filled
Status
Sealed
Sealed
Sealed
L10X
Trailer (Hub End)
75 (typ)
Empty
TAPE DIMENSIONS inches (millimeters)
REEL DIMENSIONS inches (millimeters)
Tape Size
A
7.0
B
C
D
N
W1
W2
0.567
(14.40)
W3
0.059
(1.50)
0.512
(13.00)
0.795
(20.20)
2.165 0.331 + 0.059/ 0.000
W1 + 0.078/ 0.039
(W1 + 2.00/ 1.00)
8 mm
(177.8)
(55.00)
(8.40 + 1.50/ 0.00)
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8
Tape Format for DQFN
Package
Tape
Number
Cavity
Cover Tape
Designator
Section
Leader (Start End)
Carrier
Cavities
125 (typ)
2500/3000
75 (typ)
Status
Empty
Filled
Status
Sealed
Sealed
Sealed
BQX
Trailer (Hub End)
Empty
TAPE DIMENSIONS inches (millimeters)
REEL DIMENSIONS inches (millimeters)
Tape Size
A
B
C
D
N
W1
0.488
(12.4)
W2
0.724
(18.4)
13.0
(330)
0.059
(1.50)
0.512
(13.00)
0.795
7.008
(178)
12 mm
(20.20)
9
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Physical Dimensions inches (millimeters) unless otherwise noted
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm
Package Number MAC010A
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10
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm
Package Number MLP016E
11
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION
As used herein:
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
2. A critical component is any component of a life support
device or system whose failure to perform can be reason-
ably expected to cause the failure of the life support device
or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of terms
Datasheet Identification Product Status
Definition
Advance Information
Formative or In Design This datasheet contains the design specifications for product develop-
ment. Specifications may change in any manner without notice.
Preliminary
First Production
Full Production
Not In Production
This datasheet contains preliminary data, and supplementary data will
be published at a later date. Fairchild Semiconductor reserves the right
to make changes at any time without notice in order to improve design.
No Identification Needed
Obsolete
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice in order
to improve design.
This datasheet contains specifications on a product that has been dis-
continued by Fairchild Semiconductor. The datasheet is printed for ref-
erence information only.
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12
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