FODM453 [FAIRCHILD]
5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS; 5针微型扁平封装高速晶体管光耦合器型号: | FODM453 |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | 5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS |
文件: | 总11页 (文件大小:130K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
PACKAGE
0.050 (1.27)
TYP
0.181 (4.60)
0.165 (4.20)
Pin 1
0.169 (4.30)
0.153 (3.90)
SCHEMATIC
0.008 (0.2)
TYP
0.094 (2.40)
0.079 (2.00)
VCC
ANODE
1
6
5
0.287 (7.30)
0.248 (6.30)
0.008 (0.20)
0 (0.00)
VO
0.020 (0.50)
0.011 (0.30)
Lead Coplanarity : 0.004 (0.10) MAX
CATHODE
GND
3
4
Note: All dimensions are in inches (millimeters)
DESCRIPTION
The FODM452 and FODM453 optocouplers consist of an AlGaAs LED optically coupled to a high speed photodetector transistor.
The devices are housed in a compact 5-pin mini flat package for optimum mounting density. The FODM453 features a high CMR
rating for optimum common mode transient immunity.
FEATURES
•
•
•
Compact 5-pin mini flat package
High speed-1 MBit/s
Superior CMR-15kV/µs at V
= 1500V (FODM453)
CM
•
•
•
Performance guaranteed over temperature (0–70°C)
U.L. recognized (File # E90700)
VDE0884 recognized (File # 136480)
– Ordering option V, e.g., FODM452V
APPLICATIONS
•
•
•
•
Line receivers
Pulse transformer replacement
Output interface to CMOS-LSTTL-TTL
Wide bandwidth analog coupling
© 2003 Fairchild Semiconductor Corporation
Page 1 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise specified)
A
Parameter
Symbol
Value
Units
Storage Temperature
T
-40 to +125
-40 to +85
°C
°C
STG
Operating Temperature
T
OPR
EMITTER
DC/Average Forward Input Current
I (avg)
25
50
1.0
5
mA
mA
A
F
Peak Forward Input Current (50% duty cycle, 1 ms P.W.)
I (pk)
F
Peak Transient Input Current - (≤1 µs P.W., 300 pps)
I (trans)
F
Reverse Input Voltage
V
P
V
R
D
Input Power Dissipation (No derating required over specified operating temp range)
45
mW
DETECTOR
Average Output Current
I
(avg)
(pk)
8
mA
mA
V
O
Peak Output Current
I
16
O
Supply Voltage
V
-0.5 to 30
-0.5 to 20
100
CC
Output Voltage
V
V
O
Output power dissipation (No derating required over specified operating temp range)
P
mW
D
ELECTRICAL CHARACTERISTICS (T = 0 to 70°C Unless otherwise specified)
A
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
Test Conditions
(I = 16 mA, T =25°C)
Symbol
Min Typ** Max
Unit
EMITTER
1.60
1.7
1.8
F
A
V
V
F
Input Forward Voltage
Input Reverse Breakdown Voltage
(I = 16 mA)
F
(I = 10 µA)
B
5.0
V
R
VR
Temperature coefficient of
forward voltage
(I = 16 mA) (∆V /∆T )
-1.8
mV/°C
F
F
A
DETECTOR
(I = 0 mA, V = V = 5.5 V)
F
O
CC
.001
.001
0.5
(T =25°C)
A
Logic high output current
(I = 0 mA, V = V = 15 V)
I
µA
F
O
CC
OH
1
(T =25°C)
A
(I = 0 mA, V = V = 15 V)
50
F
O
CC
(I = 16 mA, V = Open)
F
O
Logic low supply current
Logic high supply current
I
100
200
µA
µA
CCL
(V = 15 V)
CC
(I = 0 mA, V = Open, V = 15 V)
F
O
CC
0.05
1
2
(T =25°C)
A
I
CCH
(I = 0 mA, V = Open)
F
O
(V = 15 V)
CC
** All Typicals at T = 25°C
A
© 2003 Fairchild Semiconductor Corporation
Page 2 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
TRANSFER CHARACTERISTICS (T = 0 to 70°C Unless otherwise specified)
A
Parameter
COUPLED
Test Conditions
Symbol Min
Typ**
Max
Unit
T = 25°C V =0.4V
20
50
(Note 1)
(I = 16 mA, V = 4.5 V)
A
OL
Current transfer ratio
CTR
15
%
V
=0.5V
F
CC
OL
(I = 16 mA, I = 3 mA)
F
O
0.4
0.5
(V = 4.5 V, T =25°C)
Logic low output voltage
output voltage
CC
A
V
V
OL
(I = 16 mA, I = 2.4 mA)
F
O
(V = 4.5 V)
CC
** All Typicals at T = 25°C
A
SWITCHING CHARACTERISTICS (T = 0 to 70°C unless otherwise specified., V = 5 V)
A
CC
Parameter
Test Conditions
Symbol
Device
Min Typ** Max Unit
(R = 1.9 kΩ, I = 16 mA) (Note 2) (Fig. 9) T = 25°C
0.40 0.8
1.0
µs
µs
Propagation delay
time to logic low
L
F
A
T
PHL
PLH
(R = 1.9 kΩ, I = 16 mA) (Note 2) (Fig. 9)
L
F
(R = 1.9 kΩ, I = 16 mA) (Note 2) (Fig. 9)
L
F
0.35 0.8
µs
µs
Propagation delay
time to logic high
T = 25°C
T
A
(R = 1.9 kΩ, I = 16 mA) (Note 2) (Fig. 9)
1.0
L
F
(I = 0 mA, V
= 10 V , R = 1.9 kΩ)
P-P L
F
CM
FODM452
FODM453
FODM452
FODM453
5
15
5
15
KV/µs
Common mode
transient
immunity at
logic high
(Note 3) (Fig. 10) T = 25°C
A
|CM |
(I = 0 mA, V
= 1500 V
)
H
F
CM
P-P
T = 25°C, (R = 1.9 kΩ)
40
15
KV/µs
KV/µs
A
L
(Note 3) (Fig. 10)
(I = 16 mA, V
= 10 V , R = 1.9 kΩ)
P-P L
F
CM
Common mode
transient
immunity at
logic low
(Note 3) (Fig. 10) T = 25°C
A
|CM |
(I = 16 mA, V
= 1500 V
)
L
F
CM
P-P
(R = 1.9 kΩ)
15
40
3
KV/µs
MHz
L
(T = 25°C)(Note 3) (Fig. 10)
A
Bandwidth
R = 100Ω
BW
L
** All Typicals at T = 25°C
A
© 2003 Fairchild Semiconductor Corporation
Page 3 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
ISOLATION CHARACTERISTICS (T = 0 to 70°C Unless otherwise specified)
A
Characteristics
Test Conditions
Symbol
Min
Typ**
Max
Unit
(RH ≤ 50%, T = 25°C)
A
Withstand insulation test voltage
Capacitance (input to output)
V
3750
V
RMS
ISO
(Note 4) ( t = 1 min.)
(Note 4) (f = 1 MHz)
C
0.2
pF
I-O
** All Typicals at T = 25°C
A
Notes
1. Current Transfer Ratio is defined as a ratio of output collector current, I , to the forward LED input current, I , times 100%.
O
F
2. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and 5.6 kΩ pull-up resistor.
3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the leading edge of the
cm
common mode pulse signal V , to assure that the output will remain in a logic high state (i.e., V >2.0 V). Common mode
CM
O
transient immunity in logic low level is the maximum tolerable (negative) dV /dt on the trailing edge of the common mode
cm
pulse signal, V , to assure that the output will remain in a logic low state (i.e., V <0.8 V).
CM
O
4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted together.
© 2003 Fairchild Semiconductor Corporation
Page 4 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
TYPICAL PERFORMANCE CURVES
Fig. 1 Input Forward Current vs Forward Voltage
Fig. 2 Normalized Current Transfer Ratio vs. Input Current
100
1.20
1.15
1.10
1.05
1.00
0.95
0.90
V
V
= 0.4V
O
T
= 25°C
A
= 5 V
CC
T
= 25°C
A
10
1
Normalized to IF = 16mA
0.1
0.01
0.001
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1
10
VF - FORWARD CURRENT (mA)
I
- INPUT CURRENT (mA)
F
Fig. 3 Normalized Current Transfer Ratio
vs. Ambient Temperature
Fig. 4 Logic High Output Current
vs. Ambient Temperature
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
IF = 16mA
V
= V
= 0 V
= 5V
O
CC
V
V
= 0.4V
O
I
F
= 5 V
CC
Normalized to T = 25°C
A
10
1
0.1
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
T
- TEMPERATURE (°C)
T
A
- AMBIENT TEMPERATURE
A
Fig. 5 DC and Pulsed Transfer Characteristics
Fig. 6 Propagation Delay vs. Load Resistance
10
14
12
T
V
= 25°C
A
T
V
= 25°C
= 5 V
A
CC
= 5 V
CC
I
I
= 16mA
= 10mA
F
F
I
= 40mA
F
10
8
35mA
30mA
t
PLH
25mA
20mA
1
6
4
15mA
t
PHL
10mA
5mA
2
0
0.1
0
2
4
6
8
10
12
14
16
1
2
3
4
5
6
7
8
9 10
V
O
- OUTPUT VOLTAGE (V)
R
L
= LOAD RESISTANCE (kΩ)
© 2003 Fairchild Semiconductor Corporation
Page 5 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
TYPICAL PERFORMANCE CURVES
Fig. 8 Frequency Response
Fig. 7 Propagation Delay vs. Ambient Temperature
1400
5
0
I
V
T
= 16 mA
= 5V
I
V
R
= 16 mA
= 5V
F
F
CC
CC
= 25°C
= 1.9K Ω
1200
1000
800
A
L
R
= 220Ω
L
R
= 100Ω
L
-5
600
R
= 470Ω
L
t
PHL
400
-10
-15
t
PLH
R
= 1kΩ
L
200
0
-40
-20
0
20
40
60
80
100
0.01
0.1
1
10
T
- AMBIENT TEMPERATURE (°C)
f - FREQUENCY (MHz)
A
© 2003 Fairchild Semiconductor Corporation
Page 6 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
Pulse
Generator
tr = 5ns
ZO= 50
10% D.C.
I/f< 100µs
Noise
Shield
IF
+
VCC
+5 V
1
3
Ω
6
5
4
RL
VO
VO
0.1 µF
CL = 1.5 µF
IF Monitor
GND
Rm
IF
0
5 V
VO
1.5 V
1.5 V
VOL
TPHL
TPLH
Fig. 9 Switching Time Test Circuit
IF
Noise
Shield
+
VCC
+5 V
1
3
6
5
4
RL
VO
A
VO
B
0.1 µF
VFF
GND
-
VCM
+
-
Pulse Gen
VCM 10 V
0 V
90% 90%
10%
tr
10%
tf
VO
5 V
Switch at A : IF = 0 mA
VO
VOL
Switch at A : IF = 16 mA
Fig. 10 Common Mode Immunity eTst Circuit
© 2003 Fairchild Semiconductor Corporation
Page 7 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
FOOTPRINT DRAWING FOR PCB LAYOUT
0.050 0.050 0.050
(1.27) (1.27) (1.27)
0.024 (0.61)
0.190
(4.83)
0.310
(7.87)
Device
‘A’
Device
‘B’
Pin 1
Pin 1
0.060
(1.52)
0.100
(2.54)
End Stacking Configuration
Unutilized Solder Pad
Dimensions in inches (mm)
© 2003 Fairchild Semiconductor Corporation
Page 8 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
ORDERING INFORMATION
Option
Description
R1
R2
Tape and Reel (500 per reel)
Tape and Reel (2500 per reel)
VDE0884
V
R1V
R2V
VDE0884, Tape and Reel (500 per reel)
VDE0884, Tape and Reel (2500 per reel)
MARKING INFORMATION
1
2
M453
6
V X YY M
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘3’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
© 2003 Fairchild Semiconductor Corporation
Page 9 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
Carrier Tape Specifications
8.0 ± 0.1
2 ± 0.05
3.5 ± 0.2
Ø1.5 MIN
4.0 ± 0.1
0.3 MAX
1.75 ± 0.10
5.5 ± 0.05
12.0 ± 0.3
5.2 ± 0.2
8.3 ± 0.1
6.4 ± 0.2
User Direction of Feed
Ø1.5 + 0.1/-0
0.1 MAX
Reflow Profile
(Heating)
to 30 s
230°C (peak temperature)
210°C
180°C
to 60 s
150 s
90 s
80 s
Time (s)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
© 2003 Fairchild Semiconductor Corporation
Page 10 of 11
4/12/04
5-PIN MINI FLAT PACKAGE
HIGH SPEED TRANSISTOR
OPTOCOUPLERS
FODM452
FODM453
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
© 2003 Fairchild Semiconductor Corporation
Page 11 of 11
4/12/04
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