FODM453 [FAIRCHILD]

5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS; 5针微型扁平封装高速晶体管光耦合器
FODM453
型号: FODM453
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
5针微型扁平封装高速晶体管光耦合器

晶体 光电 晶体管 输出元件 局域网
文件: 总11页 (文件大小:130K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
PACKAGE  
0.050 (1.27)  
TYP  
0.181 (4.60)  
0.165 (4.20)  
Pin 1  
0.169 (4.30)  
0.153 (3.90)  
SCHEMATIC  
0.008 (0.2)  
TYP  
0.094 (2.40)  
0.079 (2.00)  
VCC  
ANODE  
1
6
5
0.287 (7.30)  
0.248 (6.30)  
0.008 (0.20)  
0 (0.00)  
VO  
0.020 (0.50)  
0.011 (0.30)  
Lead Coplanarity : 0.004 (0.10) MAX  
CATHODE  
GND  
3
4
Note: All dimensions are in inches (millimeters)  
DESCRIPTION  
The FODM452 and FODM453 optocouplers consist of an AlGaAs LED optically coupled to a high speed photodetector transistor.  
The devices are housed in a compact 5-pin mini flat package for optimum mounting density. The FODM453 features a high CMR  
rating for optimum common mode transient immunity.  
FEATURES  
Compact 5-pin mini flat package  
High speed-1 MBit/s  
Superior CMR-15kV/µs at V  
= 1500V (FODM453)  
CM  
Performance guaranteed over temperature (0–70°C)  
U.L. recognized (File # E90700)  
VDE0884 recognized (File # 136480)  
– Ordering option V, e.g., FODM452V  
APPLICATIONS  
Line receivers  
Pulse transformer replacement  
Output interface to CMOS-LSTTL-TTL  
Wide bandwidth analog coupling  
© 2003 Fairchild Semiconductor Corporation  
Page 1 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise specied)  
A
Parameter  
Symbol  
Value  
Units  
Storage Temperature  
T
-40 to +125  
-40 to +85  
°C  
°C  
STG  
Operating Temperature  
T
OPR  
EMITTER  
DC/Average Forward Input Current  
I (avg)  
25  
50  
1.0  
5
mA  
mA  
A
F
Peak Forward Input Current (50% duty cycle, 1 ms P.W.)  
I (pk)  
F
Peak Transient Input Current - (1 µs P.W., 300 pps)  
I (trans)  
F
Reverse Input Voltage  
V
P
V
R
D
Input Power Dissipation (No derating required over specied operating temp range)  
45  
mW  
DETECTOR  
Average Output Current  
I
(avg)  
(pk)  
8
mA  
mA  
V
O
Peak Output Current  
I
16  
O
Supply Voltage  
V
-0.5 to 30  
-0.5 to 20  
100  
CC  
Output Voltage  
V
V
O
Output power dissipation (No derating required over specied operating temp range)  
P
mW  
D
ELECTRICAL CHARACTERISTICS (T = 0 to 70°C Unless otherwise specied)  
A
INDIVIDUAL COMPONENT CHARACTERISTICS  
Parameter  
Test Conditions  
(I = 16 mA, T =25°C)  
Symbol  
Min Typ** Max  
Unit  
EMITTER  
1.60  
1.7  
1.8  
F
A
V
V
F
Input Forward Voltage  
Input Reverse Breakdown Voltage  
(I = 16 mA)  
F
(I = 10 µA)  
B
5.0  
V
R
VR  
Temperature coefcient of  
forward voltage  
(I = 16 mA) (V /T )  
-1.8  
mV/°C  
F
F
A
DETECTOR  
(I = 0 mA, V = V = 5.5 V)  
F
O
CC  
.001  
.001  
0.5  
(T =25°C)  
A
Logic high output current  
(I = 0 mA, V = V = 15 V)  
I
µA  
F
O
CC  
OH  
1
(T =25°C)  
A
(I = 0 mA, V = V = 15 V)  
50  
F
O
CC  
(I = 16 mA, V = Open)  
F
O
Logic low supply current  
Logic high supply current  
I
100  
200  
µA  
µA  
CCL  
(V = 15 V)  
CC  
(I = 0 mA, V = Open, V = 15 V)  
F
O
CC  
0.05  
1
2
(T =25°C)  
A
I
CCH  
(I = 0 mA, V = Open)  
F
O
(V = 15 V)  
CC  
** All Typicals at T = 25°C  
A
© 2003 Fairchild Semiconductor Corporation  
Page 2 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
TRANSFER CHARACTERISTICS (T = 0 to 70°C Unless otherwise specied)  
A
Parameter  
COUPLED  
Test Conditions  
Symbol Min  
Typ**  
Max  
Unit  
T = 25°C V =0.4V  
20  
50  
(Note 1)  
(I = 16 mA, V = 4.5 V)  
A
OL  
Current transfer ratio  
CTR  
15  
%
V
=0.5V  
F
CC  
OL  
(I = 16 mA, I = 3 mA)  
F
O
0.4  
0.5  
(V = 4.5 V, T =25°C)  
Logic low output voltage  
output voltage  
CC  
A
V
V
OL  
(I = 16 mA, I = 2.4 mA)  
F
O
(V = 4.5 V)  
CC  
** All Typicals at T = 25°C  
A
SWITCHING CHARACTERISTICS (T = 0 to 70°C unless otherwise specied., V = 5 V)  
A
CC  
Parameter  
Test Conditions  
Symbol  
Device  
Min Typ** Max Unit  
(R = 1.9 k, I = 16 mA) (Note 2) (Fig. 9) T = 25°C  
0.40 0.8  
1.0  
µs  
µs  
Propagation delay  
time to logic low  
L
F
A
T
PHL  
PLH  
(R = 1.9 k, I = 16 mA) (Note 2) (Fig. 9)  
L
F
(R = 1.9 k, I = 16 mA) (Note 2) (Fig. 9)  
L
F
0.35 0.8  
µs  
µs  
Propagation delay  
time to logic high  
T = 25°C  
T
A
(R = 1.9 k, I = 16 mA) (Note 2) (Fig. 9)  
1.0  
L
F
(I = 0 mA, V  
= 10 V , R = 1.9 k)  
P-P L  
F
CM  
FODM452  
FODM453  
FODM452  
FODM453  
5
15  
5
15  
KV/µs  
Common mode  
transient  
immunity at  
logic high  
(Note 3) (Fig. 10) T = 25°C  
A
|CM |  
(I = 0 mA, V  
= 1500 V  
)
H
F
CM  
P-P  
T = 25°C, (R = 1.9 k)  
40  
15  
KV/µs  
KV/µs  
A
L
(Note 3) (Fig. 10)  
(I = 16 mA, V  
= 10 V , R = 1.9 k)  
P-P L  
F
CM  
Common mode  
transient  
immunity at  
logic low  
(Note 3) (Fig. 10) T = 25°C  
A
|CM |  
(I = 16 mA, V  
= 1500 V  
)
L
F
CM  
P-P  
(R = 1.9 k)  
15  
40  
3
KV/µs  
MHz  
L
(T = 25°C)(Note 3) (Fig. 10)  
A
Bandwidth  
R = 100Ω  
BW  
L
** All Typicals at T = 25°C  
A
© 2003 Fairchild Semiconductor Corporation  
Page 3 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
ISOLATION CHARACTERISTICS (T = 0 to 70°C Unless otherwise specied)  
A
Characteristics  
Test Conditions  
Symbol  
Min  
Typ**  
Max  
Unit  
(RH 50%, T = 25°C)  
A
Withstand insulation test voltage  
Capacitance (input to output)  
V
3750  
V
RMS  
ISO  
(Note 4) ( t = 1 min.)  
(Note 4) (f = 1 MHz)  
C
0.2  
pF  
I-O  
** All Typicals at T = 25°C  
A
Notes  
1. Current Transfer Ratio is dened as a ratio of output collector current, I , to the forward LED input current, I , times 100%.  
O
F
2. The 1.9 kload represents 1 TTL unit load of 1.6 mA and 5.6 kpull-up resistor.  
3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the leading edge of the  
cm  
common mode pulse signal V , to assure that the output will remain in a logic high state (i.e., V >2.0 V). Common mode  
CM  
O
transient immunity in logic low level is the maximum tolerable (negative) dV /dt on the trailing edge of the common mode  
cm  
pulse signal, V , to assure that the output will remain in a logic low state (i.e., V <0.8 V).  
CM  
O
4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted together.  
© 2003 Fairchild Semiconductor Corporation  
Page 4 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
TYPICAL PERFORMANCE CURVES  
Fig. 1 Input Forward Current vs Forward Voltage  
Fig. 2 Normalized Current Transfer Ratio vs. Input Current  
100  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
V
V
= 0.4V  
O
T
= 25°C  
A
= 5 V  
CC  
T
= 25°C  
A
10  
1
Normalized to IF = 16mA  
0.1  
0.01  
0.001  
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
1.7  
1.8  
1
10  
VF - FORWARD CURRENT (mA)  
I
- INPUT CURRENT (mA)  
F
Fig. 3 Normalized Current Transfer Ratio  
vs. Ambient Temperature  
Fig. 4 Logic High Output Current  
vs. Ambient Temperature  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
IF = 16mA  
V
= V  
= 0 V  
= 5V  
O
CC  
V
V
= 0.4V  
O
I
F
= 5 V  
CC  
Normalized to T = 25°C  
A
10  
1
0.1  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
T
- TEMPERATURE (°C)  
T
A
- AMBIENT TEMPERATURE  
A
Fig. 5 DC and Pulsed Transfer Characteristics  
Fig. 6 Propagation Delay vs. Load Resistance  
10  
14  
12  
T
V
= 25°C  
A
T
V
= 25°C  
= 5 V  
A
CC  
= 5 V  
CC  
I
I
= 16mA  
= 10mA  
F
F
I
= 40mA  
F
10  
8
35mA  
30mA  
t
PLH  
25mA  
20mA  
1
6
4
15mA  
t
PHL  
10mA  
5mA  
2
0
0.1  
0
2
4
6
8
10  
12  
14  
16  
1
2
3
4
5
6
7
8
9 10  
V
O
- OUTPUT VOLTAGE (V)  
R
L
= LOAD RESISTANCE (k)  
© 2003 Fairchild Semiconductor Corporation  
Page 5 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
TYPICAL PERFORMANCE CURVES  
Fig. 8 Frequency Response  
Fig. 7 Propagation Delay vs. Ambient Temperature  
1400  
5
0
I
V
T
= 16 mA  
= 5V  
I
V
R
= 16 mA  
= 5V  
F
F
CC  
CC  
= 25°C  
= 1.9K Ω  
1200  
1000  
800  
A
L
R
= 220Ω  
L
R
= 100Ω  
L
-5  
600  
R
= 470Ω  
L
t
PHL  
400  
-10  
-15  
t
PLH  
R
= 1kΩ  
L
200  
0
-40  
-20  
0
20  
40  
60  
80  
100  
0.01  
0.1  
1
10  
T
- AMBIENT TEMPERATURE (°C)  
f - FREQUENCY (MHz)  
A
© 2003 Fairchild Semiconductor Corporation  
Page 6 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
Pulse  
Generator  
tr = 5ns  
ZO= 50  
10% D.C.  
I/f< 100µs  
Noise  
Shield  
IF  
+
VCC  
+5 V  
1
3
6
5
4
RL  
VO  
VO  
0.1 µF  
CL = 1.5 µF  
IF Monitor  
GND  
Rm  
IF  
0
5 V  
VO  
1.5 V  
1.5 V  
VOL  
TPHL  
TPLH  
Fig. 9 Switching Time Test Circuit  
IF  
Noise  
Shield  
+
VCC  
+5 V  
1
3
6
5
4
RL  
VO  
A
VO  
B
0.1 µF  
VFF  
GND  
-
VCM  
+
-
Pulse Gen  
VCM 10 V  
0 V  
90% 90%  
10%  
tr  
10%  
tf  
VO  
5 V  
Switch at A : IF = 0 mA  
VO  
VOL  
Switch at A : IF = 16 mA  
Fig. 10 Common Mode Immunity eTst Circuit  
© 2003 Fairchild Semiconductor Corporation  
Page 7 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
FOOTPRINT DRAWING FOR PCB LAYOUT  
0.050 0.050 0.050  
(1.27) (1.27) (1.27)  
0.024 (0.61)  
0.190  
(4.83)  
0.310  
(7.87)  
Device  
A’  
Device  
B’  
Pin 1  
Pin 1  
0.060  
(1.52)  
0.100  
(2.54)  
End Stacking Configuration  
Unutilized Solder Pad  
Dimensions in inches (mm)  
© 2003 Fairchild Semiconductor Corporation  
Page 8 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
ORDERING INFORMATION  
Option  
Description  
R1  
R2  
Tape and Reel (500 per reel)  
Tape and Reel (2500 per reel)  
VDE0884  
V
R1V  
R2V  
VDE0884, Tape and Reel (500 per reel)  
VDE0884, Tape and Reel (2500 per reel)  
MARKING INFORMATION  
1
2
M453  
6
V X YY M  
5
3
4
Definitions  
1
2
Fairchild logo  
Device number  
VDE mark (Note: Only appears on parts ordered with VDE  
option See order entry table)  
3
4
5
6
One digit year code, e.g., 3’  
Two digit work week ranging from 01to 53’  
Assembly package code  
© 2003 Fairchild Semiconductor Corporation  
Page 9 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
Carrier Tape Specifications  
8.0 ± 0.1  
2 ± 0.05  
3.5 ± 0.2  
Ø1.5 MIN  
4.0 ± 0.1  
0.3 MAX  
1.75 ± 0.10  
5.5 ± 0.05  
12.0 ± 0.3  
5.2 ± 0.2  
8.3 ± 0.1  
6.4 ± 0.2  
User Direction of Feed  
Ø1.5 + 0.1/-0  
0.1 MAX  
Reflow Profile  
(Heating)  
to 30 s  
230°C (peak temperature)  
210°C  
180°C  
to 60 s  
150 s  
90 s  
80 s  
Time (s)  
Peak reflow temperature: 230°C (package surface temperature) for 30 seconds  
Time of temperature higher than 210°C: 60 seconds or less  
One time soldering reflow is recommended  
© 2003 Fairchild Semiconductor Corporation  
Page 10 of 11  
4/12/04  
5-PIN MINI FLAT PACKAGE  
HIGH SPEED TRANSISTOR  
OPTOCOUPLERS  
FODM452  
FODM453  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO  
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME  
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in a significant injury of the user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
© 2003 Fairchild Semiconductor Corporation  
Page 11 of 11  
4/12/04  

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