FODM452V_技术文档

June 2007

FODM452, FODM453

tm

5-Pin Mini Flat Package High Speed Transistor

Optocoupler

Features

Description

■ Compact 5-pin mini flat package

■ High speed-1 MBit/s

The FODM452 and FODM453 optocouplers consist of

an AlGaAs LED optically coupled to a high speed photo-

detector transistor. The devices are housed in a compact

5-pin mini flat package for optimum mounting density.

The FODM453 features a high CMR rating for optimum

common mode transient immunity.

■ Superior CMR-15kV/µs at V

= 1500V (FODM453)

CM

■ Performance guaranteed over temperature (0–70°C)

■ U.L. recognized (File # E90700)

■ VDE0884 recognized (File # 136480)

– Ordering option V, e.g., FODM452V

Applications

■ Line receivers

■ Pulse transformer replacement

■ Output interface to CMOS-LSTTL-TTL

■ Wide bandwidth analog coupling

Package

Schematic

0.050 (1.27)

TYP

V_CC

ANODE

1

6

5

0.181 (4.60)

0.165 (4.20)

V_O

Pin 1

CATHODE

GND

3

4

0.169 (4.30)

0.153 (3.90)

0.008 (0.2)

TYP

0.094 (2.40)

0.079 (2.00)

0.287 (7.30)

0.248 (6.30)

0.008 (0.20)

0 (0.00)

0.020 (0.50)

0.011 (0.30)

Lead Coplanarity : 0.004 (0.10) MAX

Note:

All dimensions are in inches (millimeters).

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

Absolute Maximum Ratings ^{(T = 25°C unless otherwise noted)}

A

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Value

Units

°C

T

Storage Temperature

Operating Temperature

-40 to +125

-40 to +85

STG

T

°C

OPR

EMITTER

I (avg)

DC/Average Forward Input Current

25

50

1.0

5

mA

A

F

I (pk)

Peak Forward Input Current (50% duty cycle, 1ms P.W.)

Peak Transient Input Current (≤1µs P.W., 300pps)

Reverse Input Voltage

F

I (trans)

F

V

P

V

R

D

Input Power Dissipation

45

mW

(No derating required over speciﬁed operating temp range)

DETECTOR

I

(avg)

(pk)

Average Output Current

Peak Output Current

Supply Voltage

8

mA

V

O

I

16

O

V

-0.5 to 30

-0.5 to 20

100

CC

V

Output Voltage

V

O

P

Output Power Dissipation

mW

D

(No derating required over speciﬁed operating temp range)

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

2

Electrical Characteristics ^(T= 0 to 70°C unless otherwise specified)

A

Individual Component Characteristics

Symbol

EMITTER

Parameter

Test Conditions

Min. Typ.* Max. Unit

V

Input Forward Voltage

I = 16mA, T = 25°C

1.60

1.7

1.8

V

F

A

I = 16mA

F

B

Input Reverse Breakdown Voltage

I

= 10µA

5.0

V

VR

R

∆V /∆T

Temperature Coefﬁcient of

Forward Voltage

I = 16mA

-1.8

mV/°C

F

A

F

DETECTOR

I

Logic High Output Current

I = 0mA, V = V = 5.5V, T =25°C

.001

0.5

1

µA

OH

F

O

CC

A

I = 0 mA, V = V = 15V, T =25°C

F

O

CC

A

I = 0mA, V = V = 15V

50

200

1

F

O

CC

I

Logic Low Supply Current

Logic high supply current

I = 16mA, V = Open, V = 15V

100

µA

CCL

F

O

CC

I

I = 0 mA, V = Open, V = 15V,

0.05

CCH

F

O

CC

T = 25°C

A

I = 0mA, V = Open, V = 15V

2

F

O

CC

Transfer Characteristics

Symbol

COUPLED

CTR

Parameter

Test Conditions

Min. Typ.* Max Unit

(1)

Current Transfer Ratio

I = 16mA, V = 4.5V

T = 25°C V =0.4V

20

15

50

%

V

F

CC

A

OL

V

=0.5V

OL

V

Logic LOW Output

Voltage

I = 16mA, I = 3mA, V = 4.5V, T =2 5°C

0.4

0.5

OL

F

O

CC

A

I = 16mA, I = 2.4mA, V = 4.5 V

F

O

CC

Switching Characteristics (V = 5V)

CC

Symbol

Parameter

Test Conditions

Device Min. Typ.* Max. Unit

(2)

T

Propagation Delay

Time to Logic LOW

R = 1.9kΩ, I = 16mA, T = 25°C (Fig. 9)

0.40

0.8

1.0

0.8

1.0

µs

PHL

PLH

L

F

A

(2)

R = 1.9kΩ, I = 16mA (Fig. 9)

L

F

(2)

Propagation Delay

Time to Logic HIGH

R = 1.9kΩ, I = 16mA, T = 25°C (Fig. 9)

0.35

µs

L

F

A

(2)

R = 1.9kΩ, I = 16mA (Fig. 9)

µs

L

F

|CM |

Common Mode

Transient Immunity

at Logic HIGH

I = 0mA, V

= 10V , R = 1.9kΩ,

FODM452

FODM453

5

15

40

KV/µs

H

F

CM

P-P

L

(3)

T = 25°C (Fig. 10)

A

I = 0mA, V

= 1500V , R = 1.9kΩ

15

KV/µs

MHz

F

CM

(3)

P-P

L

T = 25°C (Fig. 10)

A

|CM |

Common Mode

Transient Immunity

at Logic LOW

I = 16mA, V

= 10V , R = 1.9kΩ,

FODM452

FODM453

5

15

40

3

L

F

CM

P-P

L

(3)

T = 25°C (Fig. 10)

A

I = 16mA, V

= 1500V , R = 1.9kΩ,

15

F

CM

P-P

L

(3)

T = 25°C (Fig. 10)

A

BW

Bandwidth

R = 100Ω

L

Isolation Characteristics

Symbol Characteristics

Test Conditions

Min. Typ.* Max. Unit

(4)

V

Withstand Insulation Test Voltage

Capacitance (Input to Output)

RH ≤ 50%, T = 25°C, t = 1 min.

3750

V

RMS

ISO

A

(4)

C

f = 1MHz

0.2

pF

I-O

*All Typicals at T = 25°C

A

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

3

Notes:

1. Current Transfer Ratio is deﬁned as a ratio of output collector current, I , to the forward LED input current, I ,

O

F

times 100%.

2. The 1.9kΩ load represents 1 TTL unit load of 1.6mA and 5.6kΩ pull-up resistor.

3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the

cm

leading edge of the common mode pulse signal V , to assure that the output will remain in a logic high state

CM

(i.e., V > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dV /dt

O

cm

on the trailing edge of the common mode pulse signal, V , to assure that the output will remain in a logic low

CM

state (i.e., V < 0.8V).

O

4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted

together.

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

4

Typical Performance Curves

Fig. 1 Input Forward Current vs Forward Voltage

Fig. 2 Normalized Current Transfer Ratio vs. Input Current

100

10

1.20

1.15

1.10

1.05

1.00

0.95

0.90

V

= 0.4V

O

T

= 25°C

A

= 5V

CC

T

= 25°C

A

Normalized to I_F= 16mA

1

0.1

0.01

0.001

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1

10

V_F– FORWARD CURRENT (mA)

I

– INPUT CURRENT (mA)

F

Fig. 3 Normalized Current Transfer Ratio

vs. Ambient Temperature

Fig. 4 Logic High Output Current

vs. Ambient Temperature

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

I_F= 16mA

V

= V

= 0V

= 5V

O

CC

V

= 0.4V

O

I

F

= 5V

CC

Normalized to T = 25°C

A

10

1

0.1

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

T

– TEMPERATURE (°C)

T

A

– AMBIENT TEMPERATURE

A

Fig. 5 DC and Pulsed Transfer Characteristics

Fig. 6 Propagation Delay vs. Load Resistance

10

14

12

T

V

= 25°C

A

T

V

= 25°C

= 5V

A

CC

= 5V

CC

I

= 16mA

= 10mA

F

I

F

= 40mA

10

8

35mA

30mA

t

PLH

25mA

20mA

1

6

4

15mA

t

PHL

10mA

5mA

2

0

0.1

0

2

4

6

8

10

12

14

16

1

2

3

4

5

6

7

8

9 10

V

O

– OUTPUT VOLTAGE (V)

R

– LOAD RESISTANCE (kΩ)

L

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

5

Typical Performance Curves (Continued)

Fig. 8 Frequency Response

Fig. 7 Propagation Delay vs. Ambient Temperature

1400

5

0

I

V

T

= 16mA

= 5V

I

V

R

= 16mA

= 5V

F

CC

= 25°C

= 1.9kΩ

1200

1000

800

A

L

R

= 220Ω

L

R

= 100Ω

L

-5

600

R

= 470Ω

L

t

PHL

400

-10

-15

t

PLH

R

= 1kΩ

L

200

0

-40

-20

0

20

40

60

80

100

0.01

0.1

1

10

T

A

– AMBIENT TEMPERATURE (°C)

f – FREQUENCY (MHz)

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

6

Pulse

Generator

tr = 5ns

Z_O= 50

10% D.C.

I/f< 100µs

Noise

Shield

I_F

+

V_CC

+5 V

V_O

1

3

Ω

6

5

4

R_L

V_O

0.1 µF

C

L = 1.5 µF

I_FMonitor

GND

R_m

I_F

0

5 V

V_O

1.5 V

V_OL

T_PHL

T_PLH

Fig. 9 Switching Time Test Circuit

I_F

Noise

Shield

+

V_CC

+5 V

1

3

6

5

4

R_L

A

V_O

0.1 µF

B

V_FF

GND

-

V_CM

+

-

Pulse Gen

V_CM10 V

0 V

90% 90%

10%

t_r

10%

t_f

V_O

5 V

Switch at A : I_F= 0 mA

V_O

V_OL

Switch at A : I_F= 16 mA

Fig. 10 Common Mode Immunity Test Circuit

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

7

Footprint Drawing for PCB Layout

0.050 0.050 0.050

(1.27) (1.27) (1.27)

0.024 (0.61)

0.190

(4.83)

0.310

(7.87)

Device

‘A’

Device

‘B’

Pin 1

0.060

(1.52)

0.100

(2.54)

End Stacking Configuration

Unutilized Solder Pad

Dimensions in inches (mm)

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

8

Ordering Information

Order Entry Identiﬁer

(example)

Option

R1

Description

FODM452R1

FODM452R2

FODM452V

Tape and Reel (500 per reel)

R2

Tape and Reel (2500 per reel)

VDE0884

V

R1V

R2V

FODM452R1V

FODM452R2V

VDE0884, Tape and Reel (500 per reel)

VDE0884, Tape and Reel (2500 per reel)

Marking Information

1

2

M453

6

V X YY M

5

3

4

Deﬁnitions

1

Fairchild logo

Device number

2

VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

3

4

5

6

One digit year code, e.g., ‘7’

Two digit work week ranging from ‘01’ to ‘53’

Assembly package code

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

9

Carrier Tape Speciﬁcations

8.0 ± 0.1

2 ± 0.05

3.5 ± 0.2

Ø1.5 MIN

1.75 ± 0.10

4.0 ± 0.1

0.3 MAX

5.5 ± 0.05

12.0 ± 0.3

5.2 ± 0.2

8.3 ± 0.1

6.4 ± 0.2

User Direction of Feed

Ø1.5 + 0.1/-0

0.1 MAX

Note:

All dimensions are in millimeters.

Reflow Profile

(Heating)

to 30 s

230°C (peak temperature)

210°C

180°C

to 60 s

150 s

90 s

80 s

Time (s)

• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds

• Time of temperature higher than 210°C: 60 seconds or less

• One time soldering reflow is recommended

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

10

TRADEMARKS

The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not

intended to be an exhaustive list of all such trademarks.

ACEx^®

POWEREDGE^®

Power-SPM™

PowerTrench^®

Programmable Active Droop™

QFET^®

Green FPS™ e-Series™

GTO™

i-Lo™

SuperSOT™-8

SyncFET™

The Power Franchise^®

™

Build it Now™

CorePLUS™

CROSSVOLT ™

CTL™

IntelliMAX™

TinyBoost™

TinyBuck™

TinyLogic^®

TINYOPTO™

TinyPower™

TinyPWM™

TinyWire™

µSerDes™

UHC^®

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

Current Transfer Logic™

EcoSPARK^®

FACT Quiet Series™

FACT^®

QS™

QT Optoelectronics™

Quiet Series™

RapidConfigure™

SMART START™

SPM^®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

MicroPak™

FAST^®

Motion-SPM™

OPTOLOGIC^®

OPTOPLANAR^®

PDP-SPM™

Power220^®

FastvCore™

FPS™

FRFET^®

Global Power Resource^SM

Green FPS™

UniFET™

VCX™

Power247^®

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS

HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE

APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS

PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S

WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,

which, (a) are intended for surgical implant into the body or

(b) support or sustain life, and (c) whose failure to perform

when properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to

result in a significant injury of the user.

device, or system whose failure to perform can be

reasonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification

Product Status

Definition

Advance Information

Formative or In Design

This datasheet contains the design specifications for product

development. Specifications may change in any manner without notice.

First Production

Full Production

Not In Production

Preliminary

This datasheet contains preliminary data; supplementary data will be

published at a later date. Fairchild Semiconductor reserves the right to

make changes at any time without notice to improve design.

No Identification Needed

Obsolete

This datasheet contains final specifications. Fairchild Semiconductor

reserves the right to make changes at any time without notice to improve

design.

This datasheet contains specifications on a product that has been

discontinued by Fairchild Semiconductor. The datasheet is printed for

reference information only.

Rev. I29

FODM452, FODM453 Rev. 1.0.0

www.fairchildsemi.com

11


型号：	FODM452V
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	5-Pin Mini Flat Package High Speed Transistor Optocoupler 5引脚微型扁平封装高速晶体管光耦晶体光电晶体管输出元件局域网
文件：	总11页 (文件大小：234K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

FODM452V [FAIRCHILD]

相关型号：

FODM453

FODM453

FODM453R1

FODM453R1V

FODM453R1V

FODM453R2

FODM453R2

FODM453R2V

FODM453R2V

FODM453V

FODM453V

FODM453_07