FAN5903UCX [FAIRCHILD]
Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs; 降压转换器,具有旁路模式的3 G / 3.5 G /的4G功率放大器型号: | FAN5903UCX |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs |
文件: | 总3页 (文件大小:409K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
October 2012
FAN5903
Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs
Features
Description
FAN5903 is a high-efficiency, low-noise, synchronous,
step-down, DC-DC converter designed for powering
3 G / 3.5 G / 4 G RF Power Amplifiers (PAs) in handsets
and other mobile applications.
.
.
.
2.7 V to 5.5 V Input Voltage Range
VOUT Range from 0.4 V to 3.5 V (or VIN)
Small Form Factor Inductor
o
o
2012 470 nH or 540 nH for Minimal PCB Area
2520 1.0 µH for Higher Efficiency
The output voltage may be dynamically varied from
0.40 V to 3.50 V, proportional to an analog input VCON
,
ranging from 0.16 V to 1.40 V provided by an external
DAC. This allows the PA to be supplied with the voltage
that enables maximum power-added efficiency.
.
.
.
.
Bypass Dropout at 500 mA, 60 mV Typical
100% Duty Cycle for Low Dropout Operation
Input Under-Voltage Lockout / Thermal Shutdown
An integrated bypass FET automatically switches on
when battery voltage drops close to the desired output
voltage (VOUT=VBAT-200 mV). The DC-DC switches back
to Synchronous Mode when the voltage dropout
exceeds 375 mV. The integrated bypass FET is also
enabled when VCON is nominally greater than to 1.5 V.
1.34 mm x 1.29 mm, 9-Bump, 0.4 mm-Pitch
WLCSP
.
3 MHz / 6 MHz Selectable Switching Frequency to
Facilitate System Optimization
The FAN5903 offers fast transition times, enabling
changes to the output voltage in less than 10 µs for
power transitions. Moreover, a Current-Mode control
loop with fast transient response ensures excellent line
and load regulation.
.
.
.
High-Efficiency PFM Operation at Low Power
Sleep Mode for Very Low IQ Operation
Up to 96% Efficient Synchronous Operation at
High-Power Conditions
Light-load efficiency is optimized by operating in PFM
Mode for load currents typically less than 100 mA.
.
10 µs Output Voltage Step Response for Early
Power Loop Settling
The switching frequency may be set to 3 MHz or 6 MHz,
enabling further optimization of system performance.
The FAN5903 typically uses a single, small-form-factor
inductor of 540 nH. Efficiency may be further optimized
using a 1.0 µH inductor when running at 3 MHz.
Applications
.
.
Dynamic Supply Bias for 3G/3.5G and 4G PAs
Power Supply for WCDMA/LTE PAs
When output regulation is not required, the FAN5903
may be placed in Sleep Mode by setting VCON nominally
to 50 mV. This ensures a very low IQ (<70 µA) while
Resources
For more information or a full copy of this datasheet,
please contact a Fairchild representative.
enabling
a fast return to output regulation. The
FAN5903 enables significant current reduction and
increased talk time and is available in a 1.34 mm x
1.29 mm, 9-bump, 0.40 mm-pitch, WLCSP package.
Ordering Information
Operating
Part Number
Package
Packing Method
Temperature Range
1.34 mm x 1.29 mm, 9-bump, 0.4 mm Pitch,
Wafer-Level Chip-Scale Package (WLCSP)
FAN5903UCX
-40 to +85°C
Tape and Reel
© 2008 Fairchild Semiconductor Corporation
FAN5903 • Rev. 1.0.8
www.fairchildsemi.com
Physical Dimensions
F
0.03 C
A
E
2X
0.40
A1
B
D
Ø0.20
Cu Pad
0.40
PIN A1
INDEX AREA
Ø0.30
Solder Mask
0.03 C
2X
LAND PATTERN RECOMMENDATION
(NSMD PAD TYPE)
TOP VIEW
0.06 C
0.292±0.018
0.208±0.021
0.539
0.461
0.05 C
E
C
SEATING PLANE
D
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
Ø0.260±0.020
9X
0.40
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
C
B
A
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
(Y)±0.018
0.40
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
F
1
2 3
(X)±0.018
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
BOTTOM VIEW
G. DRAWING FILNAME: MKT-UC009AErev1
Product
D
E
X
Y
Unit
FAN5903UCX
1.292 ± 0.030
1.342 ± 0.030
0.271
0.246
mm
Figure 42. 1.34 x 1.29mm, 9-Bump, 0.4mm-Pitch WLCSP
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FAN5903 • Rev. 1.0.8
www.fairchildsemi.com
18
© 2008 Fairchild Semiconductor Corporation
FAN5903 • Rev. 1.0.8
www.fairchildsemi.com
19
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