FAN5903UCX [FAIRCHILD]

Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs; 降压转换器,具有旁路模式的3 G / 3.5 G /的4G功率放大器
FAN5903UCX
型号: FAN5903UCX
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs
降压转换器,具有旁路模式的3 G / 3.5 G /的4G功率放大器

转换器 放大器 功率放大器
文件: 总3页 (文件大小:409K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
October 2012  
FAN5903  
Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs  
Features  
Description  
FAN5903 is a high-efficiency, low-noise, synchronous,  
step-down, DC-DC converter designed for powering  
3 G / 3.5 G / 4 G RF Power Amplifiers (PAs) in handsets  
and other mobile applications.  
.
.
.
2.7 V to 5.5 V Input Voltage Range  
VOUT Range from 0.4 V to 3.5 V (or VIN)  
Small Form Factor Inductor  
o
o
2012 470 nH or 540 nH for Minimal PCB Area  
2520 1.0 µH for Higher Efficiency  
The output voltage may be dynamically varied from  
0.40 V to 3.50 V, proportional to an analog input VCON  
,
ranging from 0.16 V to 1.40 V provided by an external  
DAC. This allows the PA to be supplied with the voltage  
that enables maximum power-added efficiency.  
.
.
.
.
Bypass Dropout at 500 mA, 60 mV Typical  
100% Duty Cycle for Low Dropout Operation  
Input Under-Voltage Lockout / Thermal Shutdown  
An integrated bypass FET automatically switches on  
when battery voltage drops close to the desired output  
voltage (VOUT=VBAT-200 mV). The DC-DC switches back  
to Synchronous Mode when the voltage dropout  
exceeds 375 mV. The integrated bypass FET is also  
enabled when VCON is nominally greater than to 1.5 V.  
1.34 mm x 1.29 mm, 9-Bump, 0.4 mm-Pitch  
WLCSP  
.
3 MHz / 6 MHz Selectable Switching Frequency to  
Facilitate System Optimization  
The FAN5903 offers fast transition times, enabling  
changes to the output voltage in less than 10 µs for  
power transitions. Moreover, a Current-Mode control  
loop with fast transient response ensures excellent line  
and load regulation.  
.
.
.
High-Efficiency PFM Operation at Low Power  
Sleep Mode for Very Low IQ Operation  
Up to 96% Efficient Synchronous Operation at  
High-Power Conditions  
Light-load efficiency is optimized by operating in PFM  
Mode for load currents typically less than 100 mA.  
.
10 µs Output Voltage Step Response for Early  
Power Loop Settling  
The switching frequency may be set to 3 MHz or 6 MHz,  
enabling further optimization of system performance.  
The FAN5903 typically uses a single, small-form-factor  
inductor of 540 nH. Efficiency may be further optimized  
using a 1.0 µH inductor when running at 3 MHz.  
Applications  
.
.
Dynamic Supply Bias for 3G/3.5G and 4G PAs  
Power Supply for WCDMA/LTE PAs  
When output regulation is not required, the FAN5903  
may be placed in Sleep Mode by setting VCON nominally  
to 50 mV. This ensures a very low IQ (<70 µA) while  
Resources  
For more information or a full copy of this datasheet,  
please contact a Fairchild representative.  
enabling  
a fast return to output regulation. The  
FAN5903 enables significant current reduction and  
increased talk time and is available in a 1.34 mm x  
1.29 mm, 9-bump, 0.40 mm-pitch, WLCSP package.  
Ordering Information  
Operating  
Part Number  
Package  
Packing Method  
Temperature Range  
1.34 mm x 1.29 mm, 9-bump, 0.4 mm Pitch,  
Wafer-Level Chip-Scale Package (WLCSP)  
FAN5903UCX  
-40 to +85°C  
Tape and Reel  
© 2008 Fairchild Semiconductor Corporation  
FAN5903 • Rev. 1.0.8  
www.fairchildsemi.com  
Physical Dimensions  
F
0.03 C  
A
E
2X  
0.40  
A1  
B
D
Ø0.20  
Cu Pad  
0.40  
PIN A1  
INDEX AREA  
Ø0.30  
Solder Mask  
0.03 C  
2X  
LAND PATTERN RECOMMENDATION  
(NSMD PAD TYPE)  
TOP VIEW  
0.06 C  
0.292±0.018  
0.208±0.021  
0.539  
0.461  
0.05 C  
E
C
SEATING PLANE  
D
SIDE VIEWS  
NOTES:  
A. NO JEDEC REGISTRATION APPLIES.  
B. DIMENSIONS ARE IN MILLIMETERS.  
Ø0.260±0.020  
9X  
0.40  
C. DIMENSIONS AND TOLERANCE  
PER ASMEY14.5M, 1994.  
C
B
A
D. DATUM C IS DEFINED BY THE SPHERICAL  
CROWNS OF THE BALLS.  
(Y)±0.018  
0.40  
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS  
±39 MICRONS (461-539 MICRONS).  
F
1
2 3  
(X)±0.018  
F. FOR DIMENSIONS D, E, X, AND Y SEE  
PRODUCT DATASHEET.  
BOTTOM VIEW  
G. DRAWING FILNAME: MKT-UC009AErev1  
Product  
D
E
X
Y
Unit  
FAN5903UCX  
1.292 ± 0.030  
1.342 ± 0.030  
0.271  
0.246  
mm  
Figure 42. 1.34 x 1.29mm, 9-Bump, 0.4mm-Pitch WLCSP  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2008 Fairchild Semiconductor Corporation  
FAN5903 • Rev. 1.0.8  
www.fairchildsemi.com  
18  
© 2008 Fairchild Semiconductor Corporation  
FAN5903 • Rev. 1.0.8  
www.fairchildsemi.com  
19  

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