FAN5904 [FAIRCHILD]

Multi-Mode Buck Converter for GSM/EDGE, 3G/3.5G and 4G PAs; 多模式降压转换器适用于GSM / EDGE , 3G / 3.5G和4G功率放大器
FAN5904
型号: FAN5904
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Multi-Mode Buck Converter for GSM/EDGE, 3G/3.5G and 4G PAs
多模式降压转换器适用于GSM / EDGE , 3G / 3.5G和4G功率放大器

转换器 放大器 功率放大器 GSM
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中文:  中文翻译
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December 2011  
FAN5904  
Multi-Mode Buck Converter for GSM/EDGE, 3G/3.5G and 4G PAs  
Description  
Features  
The FAN5904 is a high-efficiency, low-noise, synchronous,  
step-down, DC-DC converter optimized for powering Radio  
Frequency (RF) Power Amplifiers (PAs) in handsets and  
other mobile applications. In High-Power Mode, GSM Tx  
power is enabled. In Low-Power Mode, up to 3.0W is  
supported, enabling up to 29dBm output power for 3G/3.5G  
and 4G platforms.  
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2.7V to 5.5V Input Voltage Range  
VOUT Range from 0.40V to 3.50V (or VIN)  
Single 470nH Small Form Factor Inductor  
35mIntegrated Bypass FET  
100% Duty Cycle for Low Dropout Operation  
Input Under-Voltage Lockout / Thermal Shutdown  
1.71mm x 1.71mm, 16-Bump, 0.40mm Pitch WLCSP  
High Power PWM Mode  
The output voltage may be dynamically adjusted from 0.40V  
to 3.50V, proportional to an analog input voltage VCON  
ranging from 0.16V to 1.40V, optimizing power-added  
efficiency. Fast transition times of less than 10µs are  
achieved, allowing excellent inter-slot settling.  
o
Up to 95% Efficient Synchronous Operation in  
High POUT Conditions  
An integrated bypass FET is automatically enabled when  
the battery voltage and voltage drop across the DC-DC  
PMOS device are within a set voltage range of the desired  
output voltage (VOUT = VBAT - VPMOS - VBP_TH). This dynamic  
bypass feature enables the FAN5904 to support heavy load  
currents under the most stringent VSWR conditions while  
maintaining high efficiency and superior spectral  
performance. The bypass FET may also be enabled by  
providing a VCON voltage nominally greater than or equal  
to 1.5V or by driving BPEN high.  
o
o
Output current up to 2.3A  
10µs Output Voltage Step Response for Early  
GSM Tx Power-Loop Settling  
3MHz PWM Mode  
o
o
.
.
Low Power Auto Mode  
Up to 95% Efficient Synchronous Operation at  
Higher POUT Conditions  
o
o
Output Current up to 1.2A  
The FAN5904 operates in PWM Mode with a 6MHz  
switching frequency in Low-Power Mode and at 3MHz in  
High-Power Mode, which limits high-frequency spur levels.  
It uses a single, small form factor inductor of 470nH. In  
addition, PFM operation is allowed in Low-Power Mode to  
improve efficiency at low load currents.  
10µs Output Voltage Step Response for Early Tx  
Power-Loop Settling  
o
6MHz PWM Operation at High Power and PFM  
Operation at Low Power  
Bypass Mode  
o
Up to 3A Load Current  
The FAN5904UC00X option allows PFM Mode only when  
VOUT is less than 1V, while the FAN5904UC01X permits  
PFM Mode at higher voltages for applications that can  
tolerate larger output ripple and that demand optimal low-to-  
moderate load current efficiency.  
Applications  
.
Dynamic Supply Bias for Polar or Linear GSM/EDGE  
PAs and 3G/3.5G and 4G PAs  
.
Dynamic Supply Bias for GSM/EDGE Quad Band  
Amplifiers for Mobile Handsets and Data Cards  
Ordering Information  
Temperature  
Range  
Part Number LPM Mode PFM Output Voltage  
Package  
Packing  
1.71mm x 1.71mm, 16-Bump  
-40°C to +85°C 0.4mm Pitch, Wafer-Level  
Chip-Scale Package (WLCSP)  
FAN5904UC00X  
FAN5904UC01X  
VOUT < 1V  
All VOUT  
0.4V to PVIN  
Tape and Reel  
© 2011 Fairchild Semiconductor Corporation  
FAN5904 • Rev. 3.0.5  
www.fairchildsemi.com  
Physical Dimensions  
0.03 C  
2X  
F
E
A
B
D
0.40  
(Ø0.20)  
Cu Pad  
A1  
BALL A1  
INDEX AREA  
0.40  
(Ø0.30) Solder  
Mask Opening  
0.03 C  
2X  
RECOMMENDED LAND PATTERN  
(NSMD PAD TYPE)  
TOP VIEW  
0.06 C  
0.625  
0.547  
0.378±0.018  
0.208±0.021  
E
0.05 C  
C
SEATING  
PLANE  
D
SIDE VIEWS  
NOTES:  
A. NO JEDEC REGISTRATION APPLIES.  
B. DIMENSIONS ARE IN MILLIMETERS.  
0.005  
C A B  
Ø0.260±0.02  
16X  
0.40  
C. DIMENSIONS AND TOLERANCE  
PER ASME Y14.5M, 1994.  
D
C
B
A
D. DATUM C IS DEFINED BY THE SPHERICAL  
CROWNS OF THE BALLS.  
(Y) ±0.018  
F
0.40  
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS  
±39 MICRONS (547-625 MICRONS).  
2
3
4
1
(X) ±0.018  
F. FOR DIMENSIONS D, E, X, AND Y SEE  
PRODUCT DATASHEET.  
BOTTOM VIEW  
G. DRAWING FILNAME: MKT-UC016AArev2.  
Product  
D
E
X
Y
Unit  
mm  
mm  
FAN5904UC00X  
FAN5904UC01X  
1.710 ±0.030  
1.710 ±0.030  
1.710 ±0.030  
1.710 ±0.030  
0.255  
0.255  
0.255  
0.255  
Figure 60. 1.71x1.71mm Square, 16 Bumps, 0.4mm Pitch, WLCSP  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without  
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most  
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty  
therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/  
© 2011 Fairchild Semiconductor Corporation  
FAN5904 • Rev. 3.0.5  
www.fairchildsemi.com  
22  
© 2011 Fairchild Semiconductor Corporation  
FAN5904 • Rev. 3.0.5  
www.fairchildsemi.com  
23  

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