AN-9750 [FAIRCHILD]

High-Power Factor Flyback Converter for LED Driver with; 高功率因数反激式转换器LED驱动器
AN-9750
型号: AN-9750
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

High-Power Factor Flyback Converter for LED Driver with
高功率因数反激式转换器LED驱动器

驱动器 转换器
文件: 总13页 (文件大小:441K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
www.fairchildsemi.com  
AN-9750  
High-Power Factor Flyback Converter for LED Driver with  
FL7732 PSR Controller  
efficiency and simple design. FL7732 provides protection  
functions such as open-LED, short-LED and over-  
Introduction  
temperature protection. The current-limit level is  
This highly integrated PWM controller, FL7732, provides  
automatically reduced to minimize the output current and  
several features to enhance the performance of low-power  
protect external components in short-LED condition.  
flyback converters. The proprietary topology enables  
This application note presents practical design consideration  
for an LED driver employing Fairchild Semiconductor  
PWM PSR controller FL7732. It includes designing the  
transformer, selecting the components, and implementing  
constant current regulation. The step-by-step design  
procedure helps engineers design a power supply. The  
design procedure is verified through an experimental  
prototype converter. Figure 1 shows the typical application  
circuit of primary-side controlled flyback converter using  
FL7732 created in the design example.  
simplified circuit design for LED lighting applications. By  
using single-stage topology with primary-side regulation, a  
LED lighting board can be implemented with few external  
components and minimized cost, without requiring an input  
bulk capacitor and feedback circuitry. To implement high  
power factor and low THD, constant on-time control  
utilizes an external capacitor connected at the COMI pins.  
Precise constant-current control regulates accurate output  
current across changes in input voltage and output voltage.  
The operating frequency is proportionally changed by the  
output voltage to guarantee DCM operation with higher  
Figure 1. Typical Application Circuit  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
AN-9750  
APPLICATION NOTE  
D
ID  
VIN.peak  
n:1  
Basic Operation  
-
+
+
VD  
Generally, Discontinuous Conduction Mode (DCM)  
operation is preferred for primary-side regulation because it  
allows better output regulation. The operation principles of  
DCM flyback converter are as follows:  
Lm  
CO  
VOUT  
IM  
-
IDS  
Q
+
Mode I  
VDS  
During the MOSFET turn-on time (tON), input voltage  
(VIN.pk) is applied across the primary-side inductor (Lm).  
Then, drain current (IDS) of the MOSFET increases linearly  
from zero to the peak value (Ipk), as shown in Figure 2.  
During this time, the energy is drawn from the input and  
stored in the inductor.  
-
Figure 3. Mode I: Q[ON], D[OFF]  
Mode II  
When the MOSFET (Q) is turned off, the energy stored in  
the inductor forces the rectifier diode (D) to be turned on.  
MODE II  
MODE III  
MODE I  
VGate  
VDS  
nVOUT  
Figure 4. Mode II: Q[OFF], D[ON]  
VIN  
IM  
ID  
IDS  
IDS  
ID  
IO  
Figure 5. Mode III: Q[OFF], D[OFF]  
VA  
While the diode is conducting, output voltage (VOUT), together  
with diode forward-voltage drop (VF), is applied across the  
secondary-side inductor and diode current (ID) decreases  
linearly from the peak value (IpkNP/NS) to zero. At the end of  
inductor current discharge time (tDIS), all energy stored in the  
inductor has been delivered to the output.  
NA  
VO  
NS  
tDIS  
tS  
Mode III  
Figure 2. Basic Function of DCM Mode Flyback  
When the diode current reaches zero, the transformer  
auxiliary winding voltage begins to oscillate by the  
resonance between the primary-side inductor (Lm) and the  
effective capacitor loaded across MOSFET (Q).  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
2
AN-9750  
APPLICATION NOTE  
Constant Current Regulation  
OSC  
The output current (IO) can be estimated by using the peak  
drain current (Ipk) of MOSFET and discharging time (tDIS) of  
inductor current because output current (IO) is same as the  
average of the diode current (ID) in steady state. The output  
current estimator identifies the peak value of the drain  
current with a peak-detection circuit and calculates the  
output current using the inductor discharging time and  
switching period (tS). This output information is compared  
with an internal precise reference to generate error voltage  
(VCOMI), which determines the duty cycle of the MOSFET in  
Constant Current Mode. With Fairchild’s innovative  
TRUECURRENT® technique, the constant output current  
can be precisely controlled.  
VOUT  
Linear Frequency  
Controller  
VS  
Freq.  
6
VS  
Figure 8. Linear Frequency Control  
When output voltage decreases, secondary diode conduction  
time is increased and the linear frequency control lengthens  
the switching period, which retains DCM operation in the  
wide output voltage range, as shown in Figure 8. The  
frequency control also lowers primary rms current with  
better power efficiency in full-load condition.  
t DIS  
1
2
N
N
1
P
S
I
V  
CS  
(1)  
o
t S  
R
SENSE  
TRUECURRENT® calculation makes a precise output  
current prediction.  
nVo  
Lm  
T
t DIS  
3
4
Lm  
n
V
O
4
3
T
4
3
t
DIS  
3
n
V
O
5
Lm  
5
3
5
3
T
t
DIS  
Figure 6. Detection for TRUECURRENT® Calculation  
Figure 9. Primary and Secondary Current  
BCM Control  
The end of secondary diode conduction time is possibly over  
a switching period set by linear frequency control. In this  
case, FL7732 doesn’t allow CCM and the operation mode  
changes from DCM to BCM. Therefore, FL7732 originally  
eliminates sub-harmonic distortion in CCM.  
Figure 7. TRUECURRENT® Calculation Principle  
Linear Frequency Control  
As mentioned above, DCM should be guaranteed for high  
power factor in flyback topology. To maintain DCM in the  
wide range of output voltage, frequency is linearly changed  
by the output voltage in linear frequency control. Output  
voltage is detected by the auxiliary winding and resistive  
divider connected to the VS pin, as shown in Figure 7.  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
3
AN-9750  
APPLICATION NOTE  
Protections  
The FL7732 have several self-protection functions, such as  
over-voltage protection, over-temperature protection, and  
pulse-by-pulse current limit. All the protections are  
implemented as Auto-Restart Mode.  
Open-LED Protection  
FL7732 protects external components, such as diode and  
capacitor at secondary side, in open-LED condition. During  
switch-off, the VDD capacitor is charged up to the auxiliary  
winding voltage, which is applied as the reflected output  
voltage. Because the VDD voltage has output voltage  
information, the internal voltage comparator at the VDD pin  
can trigger output over-voltage protection (OVP), as shown  
in Figure 9. When at least one LED is open-circuited, output  
load impedance becomes very high and output capacitor is  
quickly charged up to VOVP x NS / NA. Then switching is shut  
down and the VDD block goes into “Hiccup Mode” until the  
open-LED condition is removed, as shown in Figure 10.  
Figure 11.Waveforms at Open-LED Condition  
Internal  
Bias  
Short-LED Protection (OCP)  
In case of short-LED condition, the switching MOSFET and  
secondary diode are usually stressed by the high powering  
current. However, FL7732 changes the OCP level in the  
short LED condition. When VS voltage is lower than 0.4V,  
OCP level changes to 0.2V from 0.7V, as shown in Figure  
12 so that powering is limited and external components  
current stress is relieved.  
VDD good  
+
-
VDD  
4
VOVP  
Shutdown Gate Driver  
S
Q
VDD good  
R
Figure 10.Internal OVP Block  
Under Voltage Lockout (UVLO)  
The turn-on and turn-off thresholds are fixed internally at  
16V and 7.5V, respectively. During startup, the VDD  
capacitor must be charged to 16V. The VDD capacitor  
continues to supply VDD until power can be delivered from  
the auxiliary winding of the main transformer. VDD is not  
allowed to drop below 7.5V during this startup process. This  
UVLO hysteresis window ensures that VDD capacitor  
properly supplies VDD during startup.  
Figure 12.Internal OCP Block  
Figure 13 shows operational waveforms at short-LED  
condition. Output voltage is quickly lowered to 0V right  
after the LED-short event. Then, the reflected auxiliary  
voltage is also 0V making VS voltage less than 0.4V. 0.2V  
OCP level limits primary-side current and VDD hiccups up  
and down in between UVLO hysteresis.  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
4
AN-9750  
APPLICATION NOTE  
Over-Voltage Protection (OVP)  
The OVP prevents damage in over-voltage conditions. If the  
VDD voltage exceeds 23V at open-loop feedback condition,  
the OVP is triggered and the PWM switching is disabled. At  
open-LED condition, VDD reaches VDD_OVP. Then, auto-  
restart sequence causes a delay, limiting output voltage.  
Over-Temperature Protection (OTP)  
The built-in temperature-sensing circuit shuts down PWM  
output if the junction temperature exceeds 150°C. There is  
hysteresis of 10°C.  
Figure 13.Waveforms at Short-LED Condition  
At short-LED condition, VS is low due to low output voltage.  
Then, OCP level is changed to 0.2V to reduce output current.  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
5
AN-9750  
APPLICATION NOTE  
V
2 V  
IN.rms  
(5)  
IN.min.pk  
Design Procedure  
where the IIN.rms and VIN.rms are rms line input current and  
voltage, respectively.  
In this section, a design procedure a of single-stage flyback  
using FL7732 is presented using the schematic of Figure 1  
as a reference. An offline LED driver with 16.8W  
(24V/0.7A) output has been selected as a design example.  
The design specifications are as follows:  
tON is required to calculate reasonable Lm value. With  
Equation (2) ~ (5), the turn-on time, tON, is obtained as:  
2Lm IIN.rms  
VI N.rms fs  
2
.
.
.
.
Input voltage range: 90 ~ 264VAC and 50 ~ 60Hz  
Nominal output voltage and current: 24V/0.7A  
Minimum efficiency: 87%  
tON  
(6)  
The input power is given as:  
Maximum switching frequency: 65kHz  
P
O
P IIN.rms  
(7)  
IN  
Step 1. Inductor Selection (Lm)  
FL7732 operates with constant turn-on and turn-off time, as  
shown Figure 14. When MOSFET turn-on time (tON) and  
switching period (tS) are constant, IIN is proportional to VIN  
and can implement high power factor.  
With Equation (6) and (7), the Lm value is obtained as:  
2
(VIN.rms )2 fs tON  
(8)  
Lm   
2P  
O
(Design Example) Since the minimum input voltage is  
90VAC, the maximum tON occurs at full-load condition.  
Assuming the maximum tON is 7.4µs at 65kHz of the  
maximum frequency, the magnetizing inductance is  
obtained as:  
2
3
6 2  
)
0.8790 6510 (7.410  
216.8  
Figure 14.Theoretical Waveform  
L
743µH  
m
The single-stage flyback using FL7732 is assumed to  
operate in DCM due to constant tON and tS. Input voltage is  
applied across the magnetizing inductance (Lm) during tON  
charging the magnetic energy in Lm. Therefore, the  
maximum peak switch current (ISW.pk) of MOSFET occurs at  
peak point of line voltage, as shown Figure 14. The peak  
input current (IIN.pk) is also shown at the peak input voltage  
of one line cycle. Once the maximum tON is decided, ISW.pk of  
MOSFET is obtained at the minimum line input voltage and  
full-load condition as:  
The maximum peak current of MOSFET at nominal output  
power is calculated as:  
,
7.4106 2 90  
ISW . pk  
1.26A  
743106  
Step 2. Sensing Resistor and nPS Selection  
Since FL7732 adopts TRUECURRENT® Calculation  
method to regulate constant output current (IO), as defined in  
equation 1. The output current is proportional to turn ratio  
nps between the primary and secondary windings of the  
transformer and inversely proportional to sensing resistor  
(RS). The FL7732 also implements cycle-by-cycle current  
limitation by detecting VCS to protect system from output  
short or overload. Therefore, VCS level to handle rated  
system power without the current limitation should be  
considered. It is typical to set the cycle-by-cycle limit level  
(typical: 0.67V) at 20~30% higher than CS peak voltage  
tON VIN.min pk  
ISW . pk  
(2)  
Lm  
where VIN.min.pk and tON are the peak input voltage and the  
maximum turn-on time at the minimum line input voltage,  
respectively.  
Using equation 2, the peak input current is obtained by:  
(VCS.pk) at full-load condition. MOSFET peak current (ISW.pk  
is converted into VCS,pk as:  
)
V
1
2
IN.min.pk  
(3)  
(4)  
I
(t  
)(  
t  
) f  
ON  
s
IN.pk  
ON  
L
m
VCS. pk ISW . pk RS  
(9)  
then IIN.pk and VIN.min.pk can be expressed as:  
IIN. pk 2 IIN.rms  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
6
AN-9750  
APPLICATION NOTE  
According to Equation (1), the transformer turn ratio is  
determined by the sensing resistor and nominal output  
current as:  
RVS1 r RVS 2  
(14)  
VS  
where VVS.max is the VS value to set the maximum  
switching frequency for constant output current in rated  
power and VF is secondary diode forward voltage.  
nps 10.5IO RS  
(10)  
where:  
0.545 VIN nAP  
1
bnk  
RVS  
(0.545   
)
(15)  
2
100106  
RVS  
1 tDIS  
1
VCS  
(11)  
where VIN.bnk and nAP are the blanking level of input  
voltage and the turn ratio of auxiliary to primary,  
respectively. The nAP can be calculated as the ratio of  
nAS to nPS.  
2 tS  
10.5  
(Design Example) Once VCS,pk is set as 0.5V, the sensing  
resistor value is obtained as:  
(Design Example) The voltage divider network is  
determined as:  
VCS. pk  
0.5  
RS   
0.396  
ISW .PK 1.26  
(24 0.7)0.77 2.35  
nps 10.50.70.396 2.91  
R
7.06  
VS  
2.35  
Step 3. nAS Selection  
Once VIN.bnk level is set to 50V, RVS2 is obtained as.  
When VDD voltage is 23V, FL7732 stops switching  
operation due to over-voltage protection (OVP). So nAS can  
be determined as follows:  
0.77  
0.54550  
1
2.91  
RVS  
(0.545  
)
2
100106  
7.06  
VDD.OVP  
23  
nAS  
(12)  
24.86k  
VO.OVP VO.OVP  
where (nAS=NA/NS) is the turns ratio the of secondary to  
auxiliary of transformer. Therefore, VO.OVP can be set by  
changing the nAS value.  
Then RVS1 is determined to be 175.5kΩ.  
It is recommended to place a bypass capacitor of 10 ~ 30pF  
closely between the VS pin and the GND pin to bypass the  
switching noise and keep the accuracy of the VS sensing for  
CC regulation. The value of the capacitor affects constant-  
current regulation. If a high value of VS capacitor is selected,  
the discharge time tDIS becomes longer and the output  
current is lower, compared to small VS capacitor.  
(Design Example) Once output over-voltage level is set as  
30V, nAS is obtained as:  
23  
nAS  
0.77  
30  
Step 4. Resistor Selection (RVS1 and RVS2  
)
Step 5. Design the Transformer  
The first consideration for RVS1 and RVS2 selection is that VS  
is 2.35V at the end of diode current conduction time to  
operate at maximum switching frequency at rated power.  
The second consideration is VS blanking, as explained  
below. The output voltage is detected by auxiliary winding  
and a resistive divider connected to the VS pin, as shown in  
Figure 7. However, in a single-stage flyback without DC  
link capacitor, auxiliary winding voltage cannot be clamped  
to reflected output voltage due to the small Lm current,  
which induces VS voltage sensing error. Then, frequency  
decreases rapidly at the zero-crossing point of line voltage,  
which can cause flicker. To maintain constant frequency  
over the whole sinusoidal line voltage, FL7732 has VS  
blanking to disable sampling of VS voltage at less than a  
particular line voltage by sensing the auxiliary winding.  
The number of primary turns is determined by Faraday’s  
law. Np,min is fixed by the peak value of the minimum line  
input voltage across the primary winding and the maximum  
on time. The minimum number of turns for the transformer  
primary side to avoid the core saturation is given by:  
V
t  
IN.min .pk ON  
N
(16)  
p,min  
B
A  
e
sat  
where Ae is the cross-sectional area of the core in m2  
and Bsat is the saturation flux density in Tesla.  
Since the saturation flux density decreases as the  
temperature rises, the high-temperature characteristics  
should be considered when it is used in an enclosed case.  
Considering the maximum switching frequency at rated  
power and VS blanking level, RVS1 and RVS2 are obtained as:  
(V V )n V .  
VS max  
O
F
AS  
R
(13)  
VS  
V
.
VS max  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
7
AN-9750  
APPLICATION NOTE  
(Design Example) An RM8 core is selected for the  
transformer and the minimum number of turns for the  
transformer primary side to avoid the core saturation is  
given by:  
2 907.4106  
Np,min  
54.5T  
0.2764106  
Considering the tolerance of the transformer and high  
ambient temperature, NP should be selected with a margin  
about 5% ~ 10% to avoid core saturation:  
Np 54.51.159.95T  
Once the turn number of the primary side (NP) is  
determined as 60T, the turn number of the secondary side  
(NS) is obtained by:  
Figure 15.Drain Voltage of MOSFET  
NS 602.9120.5T  
(Design Example) Assuming that drain voltage overshoot  
is the same as the reflected output voltage, the maximum  
drain voltage across the MOSFET is calculated as:  
Once the turn number of the secondary side (NS) is  
determined as 20T, the auxiliary winding turns (NA) is  
obtained by:  
60  
VDS(max) 374(240.7)2 522V  
NA 200.77 15.4T  
20  
The rms current though the MOSFET is  
NA is determined to be 15T.  
7.40.065  
ISW.rms 1.26  
0.357A  
6
Step 6. Calculate the Voltage and Current of  
the Switching Devices  
Secondary-Side Diode: The maximum reverse voltage and  
Primary-Side MOSFET: The voltage stress of the  
MOSFET was discussed when determining the transformer  
turns ratio. Assuming the drain voltage overshoot is the  
same as the reflected output voltage, the maximum drain  
voltage is given as:  
rms current of the rectifier diode are obtained as:  
NS  
VD VO   
V  
(19)  
(20)  
in. max . pk  
NP  
V
NP  
in. min . pk  
N
ID.rms ISW .rms  
P
V
V  
(V V ) V  
o F OS  
(17)  
DS(max)  
IN.max.pk  
2VRO NS  
N
S
where Vin.max.pk is the maximum line peak voltage.  
The rms current (ISW.rms) though the MOSFET is given as:  
(Design Example) The diode voltage and current are  
obtained as:  
20  
VD 24374 148.7V  
t
f  
S
ON  
(18)  
60  
I
I  
pk  
SW .rms  
6
127  
60  
ID.rms 0.357  
0.991A  
274.1 20  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
8
AN-9750  
APPLICATION NOTE  
Snubber capacitor voltage at full-load condition is given as:  
VSN VRO VOS  
Step 7. Design RCD Snubber in Primary Side  
(21)  
When the power MOSFET is turned off, there is a high-  
voltage spike on the drain due to the transformer leakage  
inductance. This excessive voltage on the MOSFET may  
lead to an avalanche breakdown and eventually failure of the  
device. Therefore, it is necessary to use an additional  
network to clamp the voltage. The RCD snubber circuit and  
its waveform are shown in Figure 16 and Figure 17,  
respectively. The RCD snubber network absorbs the current  
in the leakage inductance by turning on the snubber diode  
(DSN) once the MOSFET drain voltage exceeds the cathode  
voltage of snubber diode. In the analysis of snubber network,  
it is assumed that the snubber capacitor is large enough that  
its voltage does not change significantly during one  
switching cycle. The snubber capacitor should be ceramic or  
a material that offers low ESR. Electrolytic or tantalum  
capacitors are unacceptable for these reasons.  
The power dissipated in the snubber network is obtained as:  
2
VSN  
RSN  
VSN  
1
P   
Llk IPK 2   
fS  
(22)  
SN  
2
VSN VRO  
where Llk is leakage inductance, VSN is the  
snubber capacitor voltage at full load, and RSN is the  
snubber resistor.  
The leakage inductance is measured at the switching  
frequency on the primary winding with all other windings  
shorted. Then, the snubber resistor with proper rated wattage  
should be chosen based on the power loss. The maximum  
ripple of the snubber capacitor voltage is obtained as:  
VSN  
VSN  
(23)  
CSN RSN fS  
In general, 5 ~ 20% ripple of the selected capacitor voltage  
is reasonable. In this snubber design, neither the lossy  
discharge of the inductor nor stray capacitance is considered.  
(Design Example) Since the voltage overshoot of drain  
voltage has been determined to be the same as the  
reflected output voltage, the snubber voltage is:  
VSN VRO VOS 150V  
The leakage inductance is measured as 10µH. Then the  
loss in snubber networking is given as:  
1
150  
P 10106 1.262   
65103  
SN  
2
150 75  
Figure 16.Snubber Circuit  
1.03W  
1502  
RSN  
21.84k  
1.03  
To allow 7% ripple on the snubber voltage (150V):  
150  
CSN  
10.06nF  
0.0715021.84103 65103  
Figure 17.Snubber Waveforms  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
9
AN-9750  
APPLICATION NOTE  
Lab Notes  
1. Before modifying or soldering/desoldering the power  
supply, discharge the primary capacitors through the  
external bleeding resistor. Otherwise, the PWM IC may  
be destroyed by external high-voltage during the process.  
This device is sensitive to electrostatic discharge (ESD).  
To improve the yield, the production line should be ESD  
protected as required by ANSI ESD S1.1, ESD S1.4, ESD  
S7.1, ESD STM 12.1, and EOS/ESD S6.1 standards.  
2. In case of LED-short condition, VDD voltage charged  
at VDD capacitor should touch VDD off level rapidly to  
stop switching. Therefore, VDD capacitor value is  
recommended under 22µF.  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
Rev. 1.0.3 • 5/15/12  
10  
AN-9750  
APPLICATION NOTE  
Schematic of Design example  
Figure 18 shows the schematic of the 16.8W LED driver design example. RM8 core is used for the transformer. Figure 19  
shows the transformer information.  
Figure 18.Schematic of the FL7732 17W Design Example  
Figure 19.Transformer Winding Structure  
No.  
Winding  
Pin (S F)  
12 1  
Wire  
Turns  
Winding Method  
1
2
3
4
5
6
7
8
NP1  
0.25φ  
30 Ts  
Solenoid Winding  
Insulation: Polyester Tape t = 0.025mm, 3-Layer  
7- 8 0.5φ (TIW) 20 Ts  
Insulation: Polyester Tape t = 0.025mm, 3-Layer  
1 2 0.25φ 30 Ts  
Insulation: Polyester Tape t = 0.025mm, 3-Layer  
6 5 0.25φ 15 Ts  
NS  
NP2  
NA  
Solenoid Winding  
Solenoid Winding  
Solenoid Winding  
Insulation: Polyester Tape t = 0.025mm, 3-Layer  
Pin  
Specification  
Remark  
Inductance  
Leakage  
12– 2  
1– 2  
750µH ± 10%  
60kHz, 1V  
60kHz, 1V Short All Output Pins  
6µH  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
11  
AN-9750  
APPLICATION NOTE  
Bill of Materials  
Item No. Part Reference  
Part Number  
Qty  
Description  
Manufacturer  
1
BD1  
CF1  
DF06S  
1
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
1
1
1
3
1
1
1
1.5A/600V Bridge Diode  
104/AC275V X-Capacitor  
473/AC275V X-Capacitor  
103/1kV SMD Capacitor 3216  
472/250V Y-Capacitor  
Fairchild  
Carli  
2
MPX AC275V 104K  
MPX AC275V 473K  
C1206C103KDRACTU  
SCFz2E472M10BW  
KMG 470µF/35V  
MPE 630V104K 14S  
KMG 22µF/50V  
C0805C104K5RACTU  
C0805C200J5GACTU  
C0805C225Z3VACTU  
RS1M  
3
CF2  
Carli  
4
CS1  
Kemet  
5
CY1  
Samwha  
Samyoung  
Sungho  
Samyoung  
Kemet  
6
CO1,CO2  
C1  
470uF/35V Electrolytic Capacitor  
104/630V MPE Film Capacitor  
22uF/35V Electrolytic Capacitor  
104/50V SMD Capacitor 2012  
200/50V SMD Capacitor 2012  
225/25V SMD Capacitor 2012  
1000V/1A Ultra Fast Recovery Diode  
200V/3A, Fast Rectifier  
7
8
C2  
9
C3  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
C4  
Kemet  
C5  
Kemet  
DS1  
Fairchild  
Fairchild  
Fairchild  
Bussmann  
Bosung  
Samwha  
Fairchild  
Yageo  
Do1  
ES3D  
D1  
1N4003  
200V/1A, General Purpose Rectifier  
250V/1A Fuse  
F1  
SS-5-1A  
LF1  
R10402KT00  
4mH Inductor, 10Ø  
MOV1  
Q1  
SVC 471 D-07A  
FDD5N60NZ  
Metal Oxide Varistor  
600V/4A, N-Channel MOSFET  
10SMD Resistor 3216  
100kSMD Resistor 3216  
1SMD Resistor 3216  
RG1, R6  
RS1,RS2  
RCS1,RCS2  
RCS3  
RO1  
R4  
RC1206JR-0710L  
RC1206JR-07100KL  
RC1206JR-071RL  
RC1206JR-072R4L  
RC1206JR-0720KL  
RC1206JR-07150KL  
RC1206JR-0768KL  
RC1206JR-0724KL  
RM8 Core  
Yageo  
Yageo  
2.4SMD Resistor 3216  
20KSMD Resistor 3216  
150KSMD Resistor 3216  
68KSMD Resistor 3216  
24KSMD Resistor 3216  
12pin, Transformer  
Yageo  
Yageo  
Yageo  
R1,R2,R3  
R5  
Yageo  
Yageo  
T1  
TDK  
U1  
FL7732M_F116  
Main PSR Controller  
Fairchild  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
12  
AN-9750  
APPLICATION NOTE  
Related Datasheets  
FL7732 — Single-Stage PFC Primary-Side-Regulation Offline LED Driver  
Reference Designs http://www.fairchildsemi.com/referencedesign/  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE  
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS  
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
© 2011 Fairchild Semiconductor Corporation  
Rev. 1.0.3 • 5/15/12  
www.fairchildsemi.com  
13  

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