AN-994-1 [INFINEON]
MAXIMIZING THE EFFECTIVENESS OF YOUR SMD ASSEMBLIES; 最大限度地提高您的SMD集的有效性
| 型号： | AN-994-1 |
| 厂家： | 
Infineon |
| 描述： | MAXIMIZING THE EFFECTIVENESS OF YOUR SMD ASSEMBLIES |
| 文件： | 总7页 (文件大小：121K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AN-994-1
Rev. 2.0
MAXIMIZING THE
EFFECTIVENESS OF YOUR SMD
ASSEMBLIES
Gil Alivio
John Ambrus
Tim McDonald
Richard Dowling
2 of 7
IR Application Note –994 (Rev. 2)
Thermal Resistance was measured according to
Title: Maximizing the Effectiveness of Your SMD1
Assemblies
industry practice by first performing a reference
temperature estimate; a temperature sensitive
electrical parameter (TSEP) such as Vsd is measured
and compared with a calibration value to determine Tj.
Then a heating pulse of known power is applied
followed by a second TSEP measurement. That
measurement was compared to a calibration table to
estimate junction temperature and calculate the
temperature rise due to the heating pulse. From the
familiar equation:
Topics Covered:
•
•
Section I: How we Measure Rth (JA)
Section II: Thermal Characterization of
Surface Mount Packages
•
•
•
•
Section III: Attachment to board
Section IV: Solder Pastes
Section V: Heat Profiles
Section VI: Rework
∆T = RTH X PD
And where:
(equation 1)
Section I: How we measure Rth (JA)
Herein is described the device mounting and heat
sinking used and the test methods employed to
measure Thermal Resistance of the various packages.
Standard printed circuit boards were developed to
which devices were solder-mounted for measuring
thermal resistance. FR-4 material with 2 oz. Cu was
used. Board dimension were 4.75 inches by 4.5 inches
and backside of board had full metal pattern. Three
different PCB metallization patterns
∆T = TJ - TRef Temperature difference (C) between
junction temperature and reference temperature (here
ambient, case temperature or package lead),
RTH = Thermal Resistance (C/W) between junction and
reference point (again ambient, case temperature or
package lead),
PD = Power dissipated (W)
were tested: one with 1 sq inch of Cu area, the second
one
with Cu trace minimized so as to cover only as much
area
as taken up by the Device Under Test (DUT) and
necessary lead mounting pads (described as “modified
minimum pattern”), and the last one is the “absolute
minimum” pattern with the metallized area sized only
as needed to mount each lead. (See the figure 1.)
We can calculate the thermal resistance by plugging in
the measured values of temperature rise and power. In
this way measurements were taken on representative
samples of all packages listed in the table below.
Dut placed in the
middle of this pad
Dut placed in the
for Modified Minimum
Pattern Area Measurements
middle of this pad
for Minimum Pattern
Area Measurements
Dut placed in the
middle of this pad
for 1 Square Inch
Pattern Area Measurements
Board size 4.5 inches by 4.75 inches
Copper layer on the back
Figure 1.
1 This application note applies only to surface mountable type devices. Through-hole
devices such as TO-220, TO-247, Fulpak, etc are excluded and not covered by this note.
3 of 7
Based on the Max Rth (JA) values in Table 1 please see
in Figures 2-4 the graphs of power dissipation vs.
ambient temperature for each type of PCB pattern.
Note that generally the larger packages with exposed
heat sinks (D2-Pak, D-Pak & SOT-223) have the
highest Power Dissipation capabilities.
Section II: Thermal Characterization of Surface
Mount Packages
Table 1 shows typical and Maximum Rth (JA) and typical
R
th (JL) values of the SMD packages presently offered
Note also that the larger the metallized PCB pattern
area, the lower will be the thermal resistance.
Measurements at 3 different PCB pattern Areas reflect
this sensitivity.
by International Rectifier. For Rth (JC) values, please
refer to the appropriate data sheet.
Measurements are provided for devices mounted on
three different PCB patterns: 1 square inch (“1 sq”),
modified minimum area, and minimum area, as
described graphically in Figure 1.
R (Sample Size 3 pc/package type)
th
Package type
1sq"
Modified Minimum
Minimum
Typ R
*
th(JL)
Typ R
Typ R
Typ R
th(JA)
Max R
Max R
Max R
th(JA)
th(JA)
th(JA)
th(JA)
th(JA)
342.6
222.0
152.1
162.4
163.9
154.0
123.1
86.0
230.0
125.0
83.0
75.0
70.0
62.5
62.5
60.0
58.0
50.0
45.0
308.2
175.1
138.3
146.3
133.2
145.6
95.1
u-3
TSOP6 (Dual)
TSSOP8
169.2
237.1
263.6
139.3
35.5
35.5
14.7
17.0
17.0
28.7
4.9
NA
10.6
NA
2.0
1.6
73.4
60.9
47.1
39.9
47.3
54.5
27.2
32.1
33.5
32.3
20.2
18.0
134.7
106.4
112.5
102.4
112.0
73.1
170.7
117.0
124.9
126.1
118.5
94.7
u-6
u-8
TSOP6 (Single)
SO-8 (Dual)
SOT-223
63.7
49.0
66.1
64.0
88.5
Small-can DirectFET
SO-8
Mid-can DirectFET
D-Pak
49.2
68.1
86.2
91.8
66.3
70.6
72.3
80.9
55.6
62.2
26.3
23.3
54.6
43.7
77.3
47.7
42.0
33.6
59.5
36.7
D2-Pak
Table 1: Rth typical and max values for various SMD packages
.
NOTES:
1. * The Rth (JL) & the Rth (JA) 1sq" were measured at the same time. Rth reference to drain lead.
2. See Section I for details of measurement conditions.
3. The PCB contributes greatly to the total Rth. If PCB material properties or dimensions vary significantly
from those used by IR, actual Rth (actual) results may also vary.
4 of 7
Figure 2: Mod Min Power Dissipation (T_ambient)
Power Dissipation vs. Ambient Temperature Modified
Minimum PCB footprint
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
D2-Pak **
D-Pak **
SOT-223
small-can DirectFET **
mid-can DirectFET **
SO-8
SO-8 (Dual)
u-8
TSSOP8
TSOP6 (Single)
u-6
TSOP6 (Dual)
u-3
0
25
50
75
100
125
150
175
T_ambient(°C)
Figure 3: 1 sq" Power Dissipation (T ambient)
Power Dissipation vs. Ambient Temperature
D2-Pak **
1"square Cu area on PCB
D-Pak **
6.00
mid-can DirectFET **
SO-8
5.00
4.00
3.00
2.00
1.00
0.00
small-can DirectFET **
SOT-223
SO-8 (Dual)
TSOP6 (Single)
u-8
u-6
0
25
50
75 100 125 150 175
TSSOP8
T_ambient(°C)
TSOP6 (Dual)
u-3
5 of 7
Figure 4: Absolute Min Power Dissipation (T ambient)
Power Dissipation vs. Ambient Temperature
Absolute Minimum PCB footprint
D2-Pak **
D-Pak **
3.00
2.50
2.00
1.50
1.00
0.50
0.00
mid-can DirectFET **
SOT-223
small-can DirectFET **
SO-8
SO-8 (Dual)
TSSOP8
TSOP6 (Single)
u-6
0
25
50
75
100
125
150
175
u-8
T_ambient(°C)
TSOP6 (Dual)
u-3
Section IV: Solder Pastes:
Section III: Attachment to board:
Most designers and technicians in the electronic industry are
familiar with printed circuits that are provided with holes to
support leaded components during the soldering process.
Surface mount components on the other hand are by
definition leadless and rely on the strength of the solder joint
alone for mechanical as well as electrical connection. Many
PCB assemblies require the mounting of devices on both
sides of the board. The reflow process is typically performed
once. Both sides of the board are pasted at the same time.
Components are then placed on the topside only. An
adhesive is then applied to the topside to hold the
components in place. The board is then inverted 180
degrees and the second side is populated with components.
At that point the populated board is ready for the thermal
process that will melt the solder paste and attach the
components to the board. After the mounting process is
complete the adhesive serves no further purpose.
There are a wide variety of solder pastes available for
surface mounting applications. Typical solder pastes
are composed of a homogeneous mixture of pre
alloyed solder powder with a specific grain size.
Fluxes are also provided in the solder paste mixture as
a necessary component of the surface mounting
process.
In today’s densely populated assemblies, pin spacing
of SMD components has significantly been reduced.
Pin spacing of less than 0.4mm is common which
poses problem such as solder bridging, insufficient
solder on the lead and device placement accuracy.
Solder stencil thickness, dimension and registration
accuracy, solder paste composition and particle size
are all critical to successful soldering of these
assemblies.
The adhesives used must provide sufficient tenacity to
prevent component movement during handling and soldering.
At the same time, the adhesive should provide a bond that
can be broken with minimal disturbance to the populated
board in order to replace incorrect components before
soldering. It must also be capable of maintaining adhesion
during the preheat cycle and it should not become a deterrent
to solder flow during the reflow or wave soldering process.
Typical adhesives of this type are made from non-activated
resins (R), which can be used in forming gas atmosphere to
reduce oxides. Some are mildly activated resin (RMA), which
can be used in normal factory environment. The activation in
this case is used to reduce small amounts of oxidation of the
solderable surfaces and the solder particles in the paste.
With the advanced state of the art of fine pitch device
technology, a simple guideline for the choice of solder
paste is outside the scope of this document. The
customer should seek expert guidance from the solder
paste vendor and PCB board fabricator for detailed,
application specific recommendations.
6 of 7
Section V: Heat profiles
In addition to the over temperature considerations,
Reflow Soldering Heat Profiles
under temperature conditions can in turn result in a
failure of the mechanical attachment of the device
during the reflow profile. A carefully controlled preheat
and post-cooling sequence is necessary. Properly
controlling the preheat cycle will remove any volatile
component of the solder paste such as alcohol or
water by evaporation prior to the solder fusing cycle.
This will reduce the chances of forming void or solder
ball.
A major problem associated with surface mounting of
electronic components, especially those with
mismatched internal expansion coefficients is the
thermal shock of the soldering process. The advent of
lead free assemblies has driven the requirement to
develop and implement new handling techniques for
surface mounting devices. Typical lead free solders
have higher melting point temperatures than the
traditional Pb based solders. Whereas previously,
assemblies could be mounted at peak reflow
temperatures in the range of 220°C to 245°C, Pb free
assemblies require reflow temperatures in the range of
245°C to 260°C. The higher peak reflow temperatures
require careful control of the reflow environment to
prevent over temperature conditions that can severely
degrade the reliability of surface mount devices.
Caution must be taken when choosing the reflow
profile in order to optimize the thermal stresses that are
applied to either Pb based or Pb free assemblies.
This thermal conditioning can be applied in several
ways such as using Infrared/Convection ovens, Vapor
Phase, or Wave Solder equipments. The
recommended thermal conditioning method is the
Infrared/Convection Soldering Temp / Time Profile
described below:
Infrared/Convection Soldering Temp/Time Profile.
The critical parameters shown below are defined in
table 2 by solder paste type and device volume.
Temperature
Ramp up
tp
TP
TL
Ramp down
tL
TSmax
TSmin
ts preheat
t 25°C to peak
Time
Figure 5: Soldering & Test Profile
7 of 7
Table 2
Profile Feature
Sn-Pb Eutectic Assembly
Pb Free2 Assembly
*Large Body
*Large Body
**Small Body
**Small Body
Ave ramp up rate
(TL to Tp)
3°C/Sec maximum
3°C/Sec maximum
Preheat
•
•
•
Temp Min (Tsmin)
Temp Max (Tsmax)
Time (min to max) ts
100°C
150°C
60 – 120 sec
150°C
200°C
60 - 180 sec
Tsmax to TL
Ramp up rate
-
3°C/Sec maximum
Time maintained above:
•
•
Temp (TL)
Time (tL)
183°C
60 – 150 sec
217°C
60 – 150 sec
Peak Temperature (Tp)
225°C +0/-5°C
10 – 30 sec
240°C +0/-5°C
260°C +0/-5°C3
Time within 5°C of actual peak
temperature (tp)
10 – 30 sec
10 – 30 sec
Ramp-down rate
6°C/sec maximum
6 minute minimum
6°C/sec maximum
8 minute minimum
Time 25°C to Peak temperature
Section VI: Rework
•
•
Large Body: TO-220, D2pak and larger
(Package Thickness ≥2.5 mm or Package
Volume ≥ 350 mm3
The primary problem in replacing soldered SMDs
on substrates is how to apply sufficient heat to
simultaneously fuse all the connections on the
component to be replaced without overheating the
adjacent components on the substrate itself.
Soldering irons with specially shaped tips are
usually used for this purpose and because of the
multiplicity of SMD package styles a
corresponding variety of soldering tips is required.
These tips also must have a gripping function so
that when the solder is reflowed the device can be
extracted from the board assembly.
Small Body: Dpak, Ipak and smaller (Package
Thickness < 2.5 mm or Package Volume <
350 mm3))
Table 2
2 Devices that are lead free have the suffix “Pbf” in the
part number. If unsure of the status of a device,
contact the Sales Representative or the factory.
3 The recommended peak reflow temperature for some
large body packages (i.e. PLCC-44 / MQFP64) is
250°C +0/-5°C. If unsure, contact the sales
representative for details.
When a new device is to be mounted into an SMD
assembly, the tool must perform the reverse
procedure. The new part must be fluxed prior to
local reflow as described.
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