PEB2070-P [ETC]

?ISDN Communication Controller? ; ? ISDN通信控制器?\n
PEB2070-P
型号: PEB2070-P
厂家: ETC    ETC
描述:

?ISDN Communication Controller?
? ISDN通信控制器?\n

通信控制器 综合业务数字网
文件: 总168页 (文件大小:775K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ICs for Communications  
ISDN Communication Controller  
ICC  
PEB 2070  
PEF 2070  
User’s Manual 01.94  
PEB 2070; PEF 2070  
Revision History:  
01.94  
Previous Releases:  
06.92  
Page  
Subjects (changes since last revision)  
Update  
Data Classification  
Maximum Ratings  
Maximum ratings are absolute ratings; exceeding only one of these values may cause irrevers-  
ible damage to the integrated circuit.  
Characteristics  
The listed characteristics are ensured over the operating range of the integrated circuit. Typical  
characteristics specify mean values expected over the production spread. If not otherwise  
specified, typical characteristics apply at T = 25 °C and the given supply voltage.  
A
Operating Range  
In the operating range the functions given in the circuit description are fulfilled.  
For detailed technical information about “Processing Guidelines” and  
Quality Assurance” for ICs, see our “Product Overview”.  
Edition 01.94  
This edition was realized using the software system FrameMaker®.  
Published by Siemens AG, Bereich Halbleiter, Marketing-Kommunikation,  
Balanstraße 73, D-81541 München  
© Siemens AG 1994. All Rights Reserved.  
As far as patents or other rights of third parties are concerned, liability is only assumed for components , not for  
applications, processes and circuits implemented within components or assemblies.  
The information describes the type of component and shall not be considered as assured characteristics.  
Terms of delivery and rights to change design reserved.  
For questions on technology, delivery, and prices please contact the Offices of Semiconductor Group in Germany  
or the Siemens Companies and Representatives worldwide (see address list).  
Due to technical requirements components may contain dangerous substances. For information on the type in  
question please contact your nearest Siemens Office, Semiconductor Group.  
Siemens AG is an approved CECC manufacturer.  
Packing  
Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales  
office. By agreement we will take packing material back, if it is sorted. You must bear the costs of  
transport.  
For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have  
to invoice you for any costs incurred.  
General Information  
Table of Contents  
Page  
1
1.1  
1.2  
1.3  
1.4  
1.5  
1.5.1  
1.5.2  
1.5.3  
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
System Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
ISDN Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Other Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Microprocessor Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2
2.1  
2.2  
Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
General Functions and Device Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Serial Interface Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
IOM®-1 Mode (IMS = 0, DIM2 = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
IOM®-2 Mode (IMS = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
HDLC Controller Mode (IMS = 0, DIM2 = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
mP Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
ISDN Oriented Modular (IOM®) Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
SSI (Serial Port A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
SLD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Individual Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
Layer-2 Functions for HDLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
2.2.1  
2.2.2  
2.2.3  
2.3  
2.3.1  
2.3.2  
2.3.3  
2.3.4  
2.4  
2.4.1  
2.4.1.1 Message Transfer Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
2.4.1.2 Protocol Operations (auto mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
2.4.1.3 Reception of Frames . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
2.4.1.4 Transmission of Frames . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47  
2.4.2  
2.4.3  
2.4.4  
2.4.5  
2.4.6  
2.4.7  
2.4.8  
B-Channel Switching (IOM®-1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50  
Access to B / IC Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52  
C/I Channel Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
MONITOR Channel Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
Terminal Specific Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62  
Test Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63  
Documentation of the Auto Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64  
3
Operational Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91  
Microprocessor Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91  
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91  
Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93  
IOM® Interface Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95  
Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100  
Interrupt Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100  
Data Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103  
3.1  
3.2  
3.3  
3.4  
3.5  
3.5.1  
3.5.2  
3.5.2.1 HDLC Frame Reception . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107  
3.5.2.2 HDLC Frame Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109  
Semiconductor Group  
3
General Information  
Table of Contents  
Page  
4
4.1  
Detailed Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112  
HDLC Operation and Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117  
Receive FIFO RFIFO Read Address 00-1FH . . . . . . . . . . . . . . . . . . . . . . . . 117  
Transmit FIFO XFIFO Write Address 00-1FH . . . . . . . . . . . . . . . . . . . . . . . . 117  
Interrupt Status Register ISTA Read Address 20H . . . . . . . . . . . . . . . . . . . . . 117  
Mask Register MASK Write Address 20H . . . . . . . . . . . . . . . . . . . . . . . . . . . 119  
Status Register STAR Read Address 2H . . . . . . . . . . . . . . . . . . . . . . . . . . . 119  
Command Register CMDR Write Address 2H . . . . . . . . . . . . . . . . . . . . . . . . 120  
Mode Register MODE Read/Write Address 22H . . . . . . . . . . . . . . . . . . . . . . 121  
Timer Register TIMR Read/Write Address 23H . . . . . . . . . . . . . . . . . . . . . . . 124  
Extended Interrupt Register EXIR Read Address 24H . . . . . . . . . . . . . . . . . 126  
4.1.1  
4.1.2  
4.1.3  
4.1.4  
4.1.5  
4.1.6  
4.1.7  
4.1.8  
4.1.9  
4.1.10 Transmit Address 1 XAD1 Write Address 24H . . . . . . . . . . . . . . . . . . . . . . . 127  
4.1.11 Receive Frame Byte Count Low RBCL Read Address 25H . . . . . . . . . . . . . 128  
4.1.12 Transmit Address 1 XAD2 Write Address 25H . . . . . . . . . . . . . . . . . . . . . . . 128  
4.1.13 Received SAPI Register SAPR Read Address 26H . . . . . . . . . . . . . . . . . . . 129  
4.1.14 SAPI1 Register SAP1 Write Address 26H . . . . . . . . . . . . . . . . . . . . . . . . . . . 129  
4.1.15 Receive Status Register RSTA Read Address 27H . . . . . . . . . . . . . . . . . . . . . . 130  
4.1.16 SAP12 Register SAP2 Write Address 27H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131  
4.1.17 TEI1 Register 1 TEI1 Write Address 28H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132  
4.1.18 Receive HDLC Control Register RHCR Read Address 29H . . . . . . . . . . . . . . . . 132  
4.1.19 TEI2 Register TEI2 Write Address 29H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134  
4.1.20 Receive Frame Byte Count High RBCH Read Address 30H . . . . . . . . . . . . . . 134  
4.1.21 Status Register 2 STAR2 Read Address 2BH . . . . . . . . . . . . . . . . . . . . . . . . . . . 135  
4.2  
Special Purpose Registers: IOM-1Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135  
Serial Port Control Register SPCR Read/Write Address 30H . . . . . . . . . . . . . . . 135  
Command/Indication Receive Register CIRR Read Address 31H . . . . . . . . . . . 137  
Command/Indication Transmit Register CIXR Write Address 31H . . . . . . . . . . . 138  
MONITOR Receive Register MOR Read Address 32H . . . . . . . . . . . . . . . . . . . . 139  
MONITOR Transmit Register MOX Write Address 32H . . . . . . . . . . . . . . . . . . . 139  
SIP Signaling Code Receive SCR Read Address 33H . . . . . . . . . . . . . . . . . . . . 139  
SIP Signaling Code Transmit SSCX Write Address 33H . . . . . . . . . . . . . . . . . . 139  
SIP Feature Control Read SFCR Read Address 34H . . . . . . . . . . . . . . . . . . . . 140  
SIP Feature Control Write SFCW Write Address 34H . . . . . . . . . . . . . . . . . . . . . 140  
4.2.1  
4.2.2  
4.2.3  
4.2.4  
4.2.5  
4.2.6  
4.2.7  
4.2.8  
4.2.9  
4.2.10 Channel Register 1 C1R Read/Write Address 35H . . . . . . . . . . . . . . . . . . . . . . . 140  
4.2.11 Channel Register 2 C2R ead/Write Address 36H . . . . . . . . . . . . . . . . . . . . . . . . 140  
4.2.12 B1 Channel Register B1CR Read Address 37H . . . . . . . . . . . . . . . . . . . . . . . . . 141  
4.2.13 Synchronous Transfer Control Register STCR Write Address 37H . . . . . . . . . . 141  
4.2.14 B2 Channel Register B2CR Read Address 38H . . . . . . . . . . . . . . . . . . . . . . . . . 142  
4.2.15 Additional Feature Register 1 ADF1 Write Address 38H . . . . . . . . . . . . . . . . . . 142  
4.2.16 Additional Feature Register 2 ADF2 Read/Write Address 39H . . . . . . . . . . . . . . 143  
Semiconductor Group  
4
General Information  
Table of Contents  
Page  
4.3  
Special Purpose Registers: IOM-2 Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144  
Serial Port Control Register SPCR Read/Write Address 30H . . . . . . . . . . . . . . . 144  
Command/Indication Receive 0 CIR0 Read Address 31H . . . . . . . . . . . . . . . . . 146  
Command/Indication Transmit 0 CIX0 Write Address 31H . . . . . . . . . . . . . . . . . 146  
MONITOR Receive Channel 0 MOR0 Read Address 32H . . . . . . . . . . . . . . . . . 147  
MONITOR Transmit Channel 0 MOX0 Write Address 32H . . . . . . . . . . . . . . . . . 148  
Command/Indication Receive 1 CIR1 Read Address 33H . . . . . . . . . . . . . . . . . 148  
Command/Indication Transmit 1 CIX1 Write Address 33H . . . . . . . . . . . . . . . . . 148  
MONITOR Receive Channel 1 MOR1 Read Address 34H . . . . . . . . . . . . . . . . . 149  
Channel Register 1 C1R Read/Write Address 35H . . . . . . . . . . . . . . . . . . . . . . . 149  
4.3.1  
4.3.2  
4.3.3  
4.3.4  
4.3.5  
4.3.6  
4.3.7  
4.3.8  
4.3.9  
5
6
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156  
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168  
Figure 24a until figure 26d are CCITT recommendations for comparison.  
IOM®, IOM®-1, IOM®-2, SICOFI®, SICOFI®-2, SICOFI®-4, SICOFI®-4µC, SLICOFI®, ARCOFI® , ARCOFI®-BA, ARCOFI®-SP,  
EPIC®-1, EPIC®-S, ELIC®, IPAT®-2, ITAC®, ISAC®-S, ISAC®-S TE, ISAC®-P, ISAC®-P TE, IDEC®, SICAT®, OCTAT®-P,  
QUAT®-S are registered trademarks of Siemens AG.  
MUSAC-A, FALC54, IWE, SARE, UTPT, ASM, ASPare trademarks of Siemens AG.  
Purchase of Siemens I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C-system  
provided the system conforms to the I2C specifications defined by Philips. Copyright Philips 1983.  
Semiconductor Group  
5
General Information  
Introduction  
The transmission and protocol functions in an ISDN basis access can  
all be implemented  
be  
using the CMOS circuits of the ISDN Oriented Modular (IOM®) chip set. While three chips, the  
S Bus interface Circuit SBC (PEB 2080), the ISDN Echo Cancellation circuit IEC (PEB 2090)  
and the ISDN Burst Controller IBC (PEB 2095) perform the transmission functions in different  
applications (S and U interface), the ISDN Communication Controller ICC (PEB 2070) acts as  
the D-channel-link-access protocol controller.  
The IOM® architecture makes possible a wide range of configurations for the Basic Access,  
using the basic devices. These configurations essentially differ in the implementation of the  
layer-1 OSI functions, while the layer-2 functions are provided by the ICC for all configurations.  
In addition to that, the PEB 2070 provides the interface to B-channel sources in the terminal  
and to a peripheral board controller (PEB 2050, 51, 52 etc.) at the exchange.  
The HDLC packets of the ISDN D channel are handled by the ICC which transfers them to the  
associated microcontroller. The ICC has on-chip buffer memories (64 bytes per direction) for  
the temporary storage of data packets. Because of the overlapping I/O operations the  
maximum length of the D-channel packets is not limited. In one of its operating modes the  
device offers high level support of layer-2 functions of the LAPD protocol.  
Aside from ISDN applications, the ICC can be used as a general purpose communication  
controller in all applications calling for LAPD, LAPB or other HDLC/SDLC based  
protocols.  
Semiconductor Group  
6
ISDN Communication Controller  
(ICC)  
PEB 2070  
PEF 2070  
Preliminary Data  
CMOSIC  
1
Features  
Support of LAPD protocol  
Different types of operating modes  
for increased flexibility  
FIFO buffer (2 x 64 bytes) for efficient  
transfer of data packets  
Serial interfaces:  
IOM®-1, SLD, SSI  
IOM®-2  
P-LCC-28-R  
General purpose HDLC communication interface  
Implementation of IOM-1/IOM-2 MONITOR  
and C/I channel protocol to control layer 1  
and peripheral devices  
D-channel access with contention  
resolution mechanism  
µP access to B channel and  
intercommunication channels  
P-DIP-24  
B-channels switching  
Watchdog timer  
Test loops  
Advanced CMOS technology  
Low power consumption:  
active  
: 17 mW  
: 8 mW  
: 3 mW  
(IOM-2)  
(IOM-1)  
standby  
Type  
Ordering Code  
Package  
PEB 2070-N  
PEB 2070-P  
PEF 2070-N  
Q67100-H6213  
Q67100-H6212  
H67100-H6246  
P-LCC-28-R (SMD)  
P-DIP-24  
P-LCC-28-R (SMD)  
Semiconductor Group  
7
01.94  
Features  
1.1 Pin Configuration  
(top view)  
P-LCC-28-R  
P-DIP-24  
AD4  
AD5  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
AD3  
AD2  
AD1  
AD0  
RD  
2
3
2
1 28 27  
AD6  
3
AD7 (D7)  
4
5
6
7
8
9
26 AD1(D1)  
25 AD0 (D0)  
24 RD (DS)  
23 WR (R/W)  
A1  
SDAR/A2  
SDAX/SDS1  
SCA/FSD/SDS2  
RES  
AD7  
4
SDAR  
5
PEB 2070  
ICC  
VDD  
22  
SDAX/SDS1  
SCA/FSD/SDS2  
RES  
6
WR  
VDD  
21 CS  
20 ALE  
19 A0  
18 INT  
PEB 2070  
ICC  
FSC  
10  
7
A3  
11  
12  
A4  
8
CS  
13 14 15 16 17  
FSC  
9
ALE  
INT  
V
ITP00697  
SIP/EAW  
DCL  
10  
11  
12  
IDP0  
IDP1  
VSS  
13  
ITP00696  
Semiconductor Group  
8
Features  
1.1 Pin Definitions and Functions  
Pin No.  
P-DIP  
Pin No.  
P-LCC  
Symbol  
Input (I)  
Output (O)  
Function  
21  
22  
23  
24  
1
2
3
4
25  
26  
27  
28  
1
2
3
4
AD0/D0  
AD1/D1  
AD2/D2  
AD3/D3  
AD4/D4  
AD5/D5  
AD6/D6  
AD7/D7  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
MultiplexedBusMode: Address/Data  
bus. Transfers addresses from the µP  
system to the ICC and data between  
the µP system and the ICC.  
Non Multiplexed Bus Mode: Data  
bus. Transfers data between the µP  
system and the ICC.  
17  
21  
CS  
I
Chip Select. A “Low” on this line se-  
lects the ICC for read/write operation.  
23  
R/W  
I
Read/Write. When “High”, identifies a  
valid µP access as a read operation.  
When “Low”, identifies a valid µP  
access as a write operation (Motorola  
bus mode).  
19  
23  
24  
WR  
DS  
I
Write. This signal indicates a write  
operation (Siemens/Intel bus mode).  
I
Data Strobe. The rising edge marks  
the end of a valid read or write  
operation (Motorola bus mode).  
Read. This signal indicates a read  
operation (Siemens/Intel bus mode).  
20  
15  
24  
18  
RD  
I
INT  
OD  
Interrupt Request. The signal is  
activated when the ICC request an  
interrupt. It is an open drain output.  
Address Latch Enable. A high on this  
line indicates an address on the  
external address bus (Multiplexed bus  
typ only).  
16  
20  
ALE  
I
Semiconductor Group  
9
Features  
Pin Definitions and Functions (cont’d)  
Pin No.  
P-DIP  
Pin No.  
P-LCC  
Symbol  
Input (I)  
Output (O)  
Function  
7
8
SCA  
O
Serial Clock Port A, IOM-1 timing  
mode. A 128-kHz data clock signal for  
serial portA (SSI).  
7
8
FSD  
O
Frame Sync Delayed, IOM-1 timing  
mode1. An 8-kHz synchronization  
signal, delayed by 1/8 of a frame, for  
IOM-1 is supplied. In this mode a  
minimal round-trip delay for B1 and B2  
channels is guaranteed.  
7
8
SDS2  
O
Serial Data Strobe 2, IOM-2 mode. A  
programmable strobe signal, selecting  
either one or two B or IC channels on  
IOM-2 interface, is supplied via this  
line.  
After reset, SCA/FSD/SDS2 takes on  
the function of SDS2 until a write  
access to SPCR is made.  
8
9
9
RES  
FSC  
I/O  
Reset. A “High” on this input forces the  
ICC into reset state. The minimum  
pulse length is four clock periods.  
If the terminal specific functions are  
enabled, the ICC may also supply a  
reset signal.  
10  
I
Frame Sync.  
Input synchronization signal.  
IOM-2 mode: Indicates the be-  
ginning of IOM frame.  
IOM-2 mode: Indicates the be-  
ginning of IOM and,  
if TSF = 0, frame  
(timing mode 0).  
Indicates the be-  
ginning of SLD frame  
(timing mode 1).  
HDLC-mode: Strobe signal of  
programmable pola-  
rity.  
Semiconductor Group  
10  
Features  
Pin Definitions and Functions (cont’d)  
Pin No.  
P-DIP  
Pin No.  
P-LCC  
Symbol  
Input (I)  
Output (O)  
Function  
11  
14  
DCL  
I
Data Clock.  
IOM modes: Clock of the frequen-  
cy equal to twice the  
data on the IOM in-  
terface.  
HDLC mode: Clock of frequency  
equal to the data on  
serial port B.  
19  
5
A0  
A1  
I
I
Address bit 0 (Non-multiplexed bus  
type).  
Address bit 1 (Non-multiplexed bus  
type).  
6
6
A2  
I
I
Address bit 2 (Non-multiplexed bus  
type)  
Serial Data Port Receive.  
6
SDAR  
Serial data is received on this pin at  
standard TTL or CMOS level. An  
integrated pull-up circuit enables  
connection of an open-drain/ open  
collector driver without an external pull-  
up resistor. SDAR is used only if IOM-1  
mode is selected.  
11  
12  
A3  
A4  
I
I
Address bit 3 (Non-multiplexed bus  
type).  
Address bit 4 (Non-multiplexed bus  
type).  
13  
13  
A5  
I
Address bit 5 (Non-multiplexed bus  
type).  
10  
10  
SIP  
I/O  
SLD Interface Port, IOM-1 mode. This  
line transmits and receives serial data  
at standard TTL or CMOS levels.  
External Awake (terminal specific  
function). If a falling edge on this input  
is detected, the ICC generates an  
interrupt and, if enabled, a reset pulse..  
13  
EAW  
I
Semiconductor Group  
11  
Features  
Pin Definitions and Functions (cont’d)  
Pin No.  
P-DIP  
Pin No.  
P-LCC  
Symbol  
Input (I)  
Output (O)  
Function  
6
7
SDAX  
0
Serial Data Port A transmit, IOM-1  
mode. Transmit data is shifted out via  
this pin at standard TTL or CMOS  
levels.  
6
7
SDS1  
0
Serial Data Strobe 1, IOM-2 mode. A  
programmable strobe signal, selecting  
either one or two B or IC channels on  
IOM-2 interface, is supplied via this  
line.  
After reset, SDAX/SDS1 takes on the  
function of SDS1 until a write access to  
SPCR is made.  
12  
18  
14  
13  
15  
22  
17  
16  
V
V
SS  
DD  
Ground (0 V)  
Power supply (5 V ± 5%)  
IOM Data Port 0  
IOM Data Port 1  
IDP0  
IDP1  
I/O  
I/O  
Semiconductor Group  
12  
Features  
1.2 Logic Symbol  
+ 5 V  
VDD  
0 V  
VSS  
RESET  
RES  
SDAX/SDS1  
SDAR  
SSI  
(Serial Port A)  
SLD  
SIP/EAW  
IDP0  
IDP1  
R
IOM  
(Serial Port B)  
DCL  
FSC  
Clock/Frame  
Synchronization  
SCA/FSD/SDS2  
AD0 - 7  
WR  
RD  
(D0 - 7) (A0 - 5)  
CS (R/W) (DS) INT ALE  
ITL00695  
µP  
Semiconductor Group  
13  
Features  
1.3 Functional Block Diagram  
SSI  
B-Channel  
Switching  
Serial  
Port A  
R
IOM  
R
Interface  
IOM  
SLD  
D-Channel  
Handling  
SIP  
(Serial Port B)  
FIFO  
µP Interface  
ITB00698  
µP  
Semiconductor Group  
14  
Features  
1.4 System Integration  
1.4.1 ISDN Applications  
The reference model for the ISDN basic access according to CCITT I series recommendations  
consists of  
– an exchange and trunk line termination in the central office (ET, LT)  
– a remote network termination in the user area (NT)  
– a two-wire loop (U interface) between NT and LT  
– a four-wire link (S interface) which connects subscriber terminals and the NT in the user  
area as depicted in figure 1.  
ISDN User Area  
TE  
ISDN Central Office  
S
U
NT  
LT  
ET  
NT1  
NT2  
NT1  
T
TE  
ITS00699  
Figure 1  
ISDN Subscriber Basic Access Architecture  
The NT equipment serves as a converter between the U interface at the exchange and the S  
interface at the subscriber premises. The NT may consist of either an NT1 only or an NT1 to-  
gether with an NT2 connected via the T interface which is physically identical to the S interface.  
The NT1 is a direct transformation between layer 1 of S and layer 1 of U. NT2 may include  
higher level functions like multiplexing and switching as in a PABX.  
Semiconductor Group  
15  
Features  
In terms of channels the ISDN access consists of:  
a number of 64 kbit/s bearer channels (n x B)  
e.g. n = 2 for basic rate ISDN access  
n = 30 or 23 for primary rate ISDN access;  
and a signaling channel (D), either 16 (basic rate) or 64 (primary rate) kbit/s  
(figure 2).  
Layer 3 and Up  
Layer 2  
Layer 1  
Layer 2  
B
B
B
D
B
D
ISDN-  
Network  
ISDN  
User  
Mainframe  
Terminals  
Telemetry  
Q.930/1  
Q.920/1  
Q.910/1; I.430  
I.431  
ITS00700  
Figure 2  
ISDN Basic Access Channel Structure  
Semiconductor Group  
16  
Features  
The B channels are used for end-to-end circuit switched digital connections between  
communicating stations.  
The D channel is used to carry signaling and data via protocols defined by the CCITT. These  
protocols cover the network services layers of the open system interconnection model (Layers  
1-3). At layer 2, the data link layer, an HDLC type protocol is employed, the link access  
procedure on the D channel LAPD (CCITT Rec. Q. 920/1).  
The ISDN Communication Controller PEB 2070 can be used in all ISDN applications involving  
establishment and maintenance of the data link connection in either the D channel or B  
channel. It also provides the interface to layer-1 functions controlled via the IOM which links  
the ICC to any transceiver or peripheral device. Depending on the interface mode, the ICC  
supports three serial interfaces and offers switching functions and µP access to voice/ data  
channels.  
The applications comprise:  
– Use as a signaling controller for the D channel  
– Access to the D channel for data transmission  
– Source/ sink for secured B-channel data  
and the target equipment include:  
– ISDN terminal  
– ISDN PABX (NT2) and Central Office (ET) line card  
– ISDN packet switches  
– “Intelligent” NT1.  
Terminal Applications  
The concept of the ISDN basic access is based on two circuit-switched 64 kbit/s B channels  
and a message oriented 64 kbit/s D channel for packetized data, signaling and telemetry  
information.  
Figure 3 shows an example of an integrated multifunctional ISDN terminal using the ICC.  
The transceiver provides the layer-1 connection to the transmission line, either an S or U  
interface, and is connected to the ICC and other, peripheral modules via the IOM-2 interface.  
The D channel, containing signaling data and packet switched data, is processed by the ICC  
LAPD controller and routed via a parallel µP interface to the terminal processor. The high level  
support of the LAPD protocol which is implemented by the ICC allows the use of a low cost  
processor in cost sensitive applications.  
The IOM-2 interface is used to connect diverse voice/data application modules:  
– sources/ sinks for the D channel  
– sources/ sinks for the B1 and B2 channels.  
Semiconductor Group  
17  
Features  
IOM R -2  
Speech  
D, C/I  
MON  
D, C/I  
B1  
IC1  
B2  
IC2  
SBCX PEB 2081  
IBC PEB 2095  
or  
R
ICC  
PEB 2070  
ICC  
PEB 2070  
ARCOFI  
Data  
Encryption  
HSCX  
SAB 8252X  
Processing  
PSB 2160  
IEC PEB 2090  
s Packets  
p Packets  
µC  
µC  
µC  
Terminal  
Controller  
Packet Data  
Module  
Data Modules  
Speech Modules  
ITD00701  
Figure 3  
Example of ISDN Voice/Data Terminal  
Different D-channel services (for different SAPI’s) can be simply implemented by connecting  
an additional ICC in parallel to the first one, for instance for transmitting p-packets in the D  
channel.  
Up to eight ICCs may thus be connected to the D and C/I (Command/Indication) channels via  
the TIC bus. The ICCs handle contention autonomously.  
Data transfer between the terminal controller and the different modules are done with the help  
of the IOM-2 MONITOR channel protocol. Each voice/data module can be accessed by an  
individual address. The same protocol enables the control of terminal modules that do not have  
an associated microcontroller (such as the Audio Ringing Codec Filter ARCOFI® : PSB 2160)  
and the programming of intercommunication inside the terminal. Two intercommunication  
channels IC1 and IC2 allow a 2 x 64 kbit/s transfer rate between voice/data modules.  
In the example above (figure 3), one ICC is used for data packets in the D channel. A voice  
processor is connected to a programmable digital signal processing codec filter via IC1 and a  
data encryption module to a data device via IC2. B1 is used for voice communication, B2 for  
data communication.  
The ICC ensures full upward compatibility with IOM-1 devices. It provides the additional strobe,  
clock and data lines for connecting standard combos or data devices via IOM, or serial SLD  
and SSI interfaces. The strobe signals and the switching of B channels is programmable.  
Semiconductor Group  
18  
Features  
Line Card Application  
An example of the use of the ICC on an ISDN LT + ET line card (decentralized architecture)  
is shown in figure 4.  
The transceivers (ISDN Cancellation Circuit IEC: PEB 2090) are connected to an Extended  
PCM Interface Controller (EPIC® PEB 2055) via an IOM interface.  
This interface carries the control and data for up to eight subscribers using time division  
multiplexing. The ICCs are connected in parallel on IOM, one ICC per subscriber.  
The EPIC performs dynamic B- and D-channel assignment on the PCM highways. Since this  
component supports four IOM interfaces, up to 32 subscribers may be accommodated.  
1.4.2 Other Applications  
If programmed in non-ISDN mode, the ICC serial port B operates as an HDLC communication  
link without IOM frame structure. This allows the use of the ICC has a general purpose com-  
munication controller. The valid HDLC data is marked by a strobe signal on serial port B. Ex-  
amples of the use of the ICC are: X.25 packet controllers, terminal adaptors, and packet trans-  
mission e.g. in primary rate/ DMI systems.  
PEB 2070  
System  
ICC  
Interface  
R
IOM  
PEB 2090  
IEC-T  
U Interface  
U Interface  
PCMHW0  
PCMHW1  
B + D  
PEB 2055  
EPICTM  
D
PEB 2090  
IEC-T  
PEB 2070  
ICC  
D
SAB 82520  
HSCC or  
SAB 82525  
HSCX  
PCMHW0  
PCMHW1  
µP  
ITS00702  
Figure 4  
ISDN Line Card Implementation  
Semiconductor Group  
19  
Features  
1.4.3 Microprocessor Environment  
The ICC is especially suitable for cost-sensitive applications with single-chip microcontrollers  
(e.g. SAB 8048 / 8031 / 8051). However, due to its programmable micro interface and non-  
critical bus timing, if fits perfectly into almost any 8-bit microprocessor system environment.  
The microcontroller interface can be selected to be either of the Motorola type (with control  
signals CS, R/W, DS) of the Siemens/Intel non-multiplexed bus type (with control signals CS,  
WR, RD) or of the Siemens/Intel multiplexed address/data bus type (CS, WR, RD, ALE).  
SLD  
SSI  
+ 5 V  
INT(INTX)  
RD  
INT  
RD  
RD  
WR  
ALE  
WR  
WR  
ALE  
SAB  
80C51,  
(80C188)  
ALE  
ICC  
PEB 2070  
R
IOM  
(PSCX)  
CS  
A15  
A8  
AD7...AD0  
AD7... AD0  
AD0 - AD7  
Latch  
Common Bus A15 - A0, D7 - D0  
ITS00703  
Memory  
Figure 5  
Example of ICC Microcontroller Environment  
Semiconductor Group  
20  
Functional Description  
12ds Functional Description  
2.1 General Functions and Device Architecture  
DCL FSC  
Timing Unit  
B-Channel  
SDAR  
SSI  
(Serial  
SDAX/SDS1  
Switching  
R
Port A)  
IDP0  
IDP1  
IOM  
SCA/FSD/SDS2  
(Serial  
Port B)  
SLD  
SIP/EAW  
HDLC  
Receiver  
HDLC  
Transmitter  
LAPD  
Controller  
Status/  
Command  
Registers  
R-FIFO  
2 x 32 byte  
X-FIFO  
2 x 32 byte  
FIFO  
Controller  
RES  
VSS  
VDD  
µP-Interface  
ITS00704  
AD0 - AD7  
(D0 - D7)  
(A0 - A5)  
RD (DS)  
WR (R/W)  
ALE  
Figure 6  
Architecture of the ICC  
Semiconductor Group  
21  
Functional Description  
The functional block diagram in figure 6 shows the ICC to consist of:  
– serial interface logic for the IOM and the SLD and SSI interfaces, with B-channel switching  
capabilities  
– logic necessary to handle the D-channel messages (layer 2)  
The latter consists of an HDLC receiver and an HDLC transmitter together with 64-byte deep  
FIFO’s for efficient transfer of the messages to/ from the user’s CPU.  
In a special HDLC controller operating mode, the auto mode, the ICC processes protocol  
handshakes (I and S frames) of the LAPD (Link Access Procedure on the D channel)  
autonomously.  
Control and MONITOR functions as well as data transfers between the user’s CPU and the D  
and B channel are performed by the 8-bit parallel µP interface logic.  
The IOM interface allows interaction between layer-1 and layer-2 functions. It implements D-  
channel collision resolution for connecting other layer-2 devices to the IOM interface, and the  
C/I and MONITOR channel protocols (IOM-1/IOM-2) to control peripheral devices.  
This function is called TIC-Bus-Access-Procedure.  
The timing unit is responsible for the system clock and frame synchronization.  
2.2 Serial Interface Modes  
The PEB 2070 can be used in different modes of operation:  
IOM-1 Mode  
IOM-2 Mode  
HDLC Controller Mode.  
These modes are selected via bit IMS (Interface Mode Select) in ADF2 register and bits  
DIM2-0 (Digital Interface Mode) in MODE register. See table 1.  
Table 1  
Interface Modes  
IMS  
DIM2  
Mode  
0
1
IOM-1 Mode  
HDLC Mode  
0
1
X
IOM-2 Mode  
Semiconductor Group  
22  
Functional Description  
2.2.1 IOM®-1 Mode (IMS = 0, DIM2 = 0)  
Serial port B is used as the IOM-1 interface, which connects the ICC to layer-1 component.  
The HDLC controller is always connected to the D channel of the IOM-1 interface.  
Two additional serial interfaces are available in this mode, the Synchronous Serial Interface  
SSI (Serial Port A) and the Subscriber Line Datalink (SLD) interface.  
The SSI is used especially in ISDN terminal applications for the connection of B-channel  
sources/sinks. It is available if timing mode 0 (Bit SPM = 0, SPCR register) is programmed.  
The SLD is used:  
– in ISDN terminal applications for the connection of SLD compatible B-channel devices  
– in line card applications for the connection of a peripheral line board controller (e.g.  
PEB 2050).  
The connections of the serial interfaces in both terminal and exchange applications are shown  
in figure 7.  
The SSI interface is only available in timing mode 0 (SPM = 0). Timing mode 1 (SPM = 1) is  
only applicable in exchange applications figure 7b and is used to minimize the B channel  
round-trip delay time for the SLD interface. Refer to section 2.3.2.  
Semiconductor Group  
23  
Functional Description  
ISDN  
Basic Access  
S or Interface  
R
R
IOM  
e.g. ITAC  
ICC  
PSB 2110  
SDAX  
SDAR  
SCA  
SBC PEB 2080  
SSI  
IDP0  
or  
R
IBC PEB 2095  
or  
IEC PEB 2090  
IOM  
IDP1  
SIP  
SLD  
R
ARCOFI  
PSB 2160  
FSC  
DCL  
(a) Timing Mode 0 (SPM = 0)  
ISDN  
Basic Access  
S or Interface  
System  
Interface  
R
IOM  
ICC  
SBC PEB 2080  
IDP0  
IDP1  
Peripheral  
SIP  
or  
R
Board Controller  
SLD  
IBC PEB 2095  
or  
IOM  
PEB 2050/52/55  
IEC PEB 2090  
System Clock  
Sync Pulse  
FSD  
FSC  
DCL  
( b)Timing Mode 1 (SPM = 1)  
ITS00705  
Figure 7  
ICC Interfaces in IOM®-1 Mode  
Semiconductor Group  
24  
Functional Description  
The characteristics of the IOM interface are determined by bits DIM1, 0 as shown in table 2.  
Table 2  
IOM®-1 Interface Mode Characteristics  
DIM1  
DIM0 Characteristics  
0
0
1
MONITOR channel upstream is used for TIC bus access.  
0
MONITOR channel upstream is used for TIC bus access. Bit  
3 of MONITOR channel downstream is evaluated to control  
D-channel transmission.  
1
1
0
1
MONITOR channel is used for TIC bus access and for data  
transfer.  
MONITOR channel is used for TIC bus access, for data  
transfer and for D-channel access control.  
2.2.2 IOM®-2 Mode (IMS = 1)  
Serial port B is operated as an IOM-2 interface for the connection of layer-1 devices, and as a  
general purpose backplane bus in terminal equipment. The auxiliary serial SSI and SLD  
interfaces are not available in this case.  
The functions carried out by the IOM are determined by bits SPCR:SPM (terminal mode/non-  
terminal mode) and DIM2-0, as shown in table 3.  
Table 3  
IOM®-2 Interface Mode Characteristics  
DIM2  
DIM1  
DIM0 Characteristics  
HDLC in D channel:  
Last octet of IOM channel 2 is used for TIC bus access.  
0
0
0
0
0
1
Applicable in terminal mode (SPM = 0).  
Last octet of IOM channel 2 is used for TIC bus access, bit  
5 of last octet is evaluated to control D-channel  
transmission. Applicable in terminal mode (SPM = 0).  
No TIC bus access and no S bus D-channel access control.  
Applicable in terminal and non-terminal mode.  
0
0
1
1
0
1
Bit 5 of last octet is evaluated to control D-channel  
transmission. Applicable in terminal mode (SPM = 0).  
HDLC in B or IC channel:  
No transmission/reception in D channel.  
HDLC channel selected by ADF2:D1C2-0.  
1
1
0
Semiconductor Group  
25  
Functional Description  
Note: In IOM-2 terminal mode (SPM = 0, 12-byte IOM-2 frame), all DIM2 – 0 combinations  
are meaningful. When IOM-2 non-terminal mode is programmed (SPM = 1), the only  
meaningful combination is “10”.  
2.2.3 HDLC Controller Mode (IMS = 0, DIM2 = 1)  
In this case serial port B has no fixed frame structure, but is used as a serial HDLC port. The  
valid HDLC data is market by a strobe signal input via pin FSC. The data rate is determined by  
the clock input DLC (maximum 4096 Mbit/s). The characteristic of the serial port B are  
determined by bits DIM1, 0 as shown in table 4.  
Table 4  
HDLC Mode Characteristics  
DIM1  
DIM0 Characteristics  
0
0
1
0
1
reserved  
0
1
1
FSC strobe active low  
FSC strobe active high  
FSC strobe ignored  
2.3 Interfaces  
The ICC serves three different user-oriented interface types:  
– parallel processor interface to higher layer functions  
– IOM interface: between layer 1 and 2, and as a universal backplane for terminals  
– SSI and SLD interfaces for B-channel sources and destinations (in IOM-1 mode only).  
Semiconductor Group  
26  
Functional Description  
2.3.1 µP Interface  
The ICC is programmed via an 8-bit parallel microcontroller interface. Easy and fast  
microprocessor access is provided by 8-bit address decoding on chip. The interface consists  
of 13 (18) lines and is directly compatible with multiplexed and non-multiplexed microcontroller  
interfaces (Siemens/Intel or Motorola type buses). The microprocessor interface signals are  
summarized in table 5.  
Table 5  
Interface of the ICC  
Pin No.  
P-DIP  
Pin No.  
P-LCC  
Symbol  
Input (I)  
Output (O)  
Function  
21  
22  
23  
24  
1
2
3
4
25  
26  
27  
28  
1
2
3
4
AD0/D0  
AD1/D1  
AD2/D2  
AD3/D3  
AD4/D4  
AD5/D5  
AD6/D6  
AD7/D7  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
Multiplexed Bus Mode: Address/  
Data bus. Transfers addresses from  
the µP system to the ICC and data  
between the µP system and the ICC.  
Non Multiplexed Bus Mode: Data  
bus. Transfers data between the µP  
system and the ICC.  
CS  
17  
21  
23  
I
Chip Select. A 0 “low” on this line  
selects the ICC for read/write  
operation.  
R/W  
I
Read/Write. At 1 “high”, identifies a  
valid µP access as a read operation.  
At 0, identifies a valid µP access as a  
write operation (Motorola bus mode).  
Write. This signal indicates a write  
operation (Siemens/Intel bus mode).  
19  
23  
WR  
DS  
I
24  
I
Data Strobe. The rising edge marks  
the end of a valid read or write  
operation (Motorola bus mode).  
Read. This signal indicates a read  
operation (Siemens/Intel bus mode).  
20  
24  
RD  
I
Semiconductor Group  
27  
Functional Description  
Interface of the ICC (cont’d)  
Pin No.  
P-DIP  
Pin No.  
P-LCC  
Symbol  
Input (I)  
Output (O)  
Function  
15  
18  
INT  
OD  
I
Interrupt Request. The signal is  
activated when the ICC requests an  
interrupt. It is an open drain output.  
16  
20  
ALE  
Address Latch Enable. A high on this  
line indicates an address on the  
external address bus (Multiplexed bus  
typ only).  
19  
5
A0  
A1  
A2  
A3  
A4  
A5  
I
I
I
I
I
I
Address bit 0 (Non-multiplexed bus  
type).  
Address bit 1 (Non-multiplexed bus  
type).  
6
Address bit 2 (Non-multiplexed bus  
type).  
11  
12  
13  
Address bit 3 (Non-multiplexed bus  
type).  
Address bit 4 (Non-multiplexed bus  
type).  
Address bit 5 (Non-multiplexed bus  
type).  
2.3.2 ISDN Oriented Modular (IOM®) Interface  
IOM®-1  
This interface consists of one data line per direction (IOM Data Ports 0 and 1: IDP0,1). Three  
additional signals define the data clock (DCL) and the frame synchronization (FSC/FSD) at this  
interface. The data clock has a frequency of 512 kHz (twice the data rate) and the frame sync  
clock has a repetition rate of 8 kHz.  
Via this interface four octets are transmitted per 125 µs frame (figure 8):  
– The first two octets constitute the two 64 kbit/s B channels.  
– The third octet is the MONITOR channel. It is used for the exchange of data using the IOM-  
1 MONITOR channel protocol which involves the E bit as a validation bit. In addition, it  
carries a bit which enables/inhibits the transmission of HDLC frames (IDP0) and it serves to  
arbitrate the access to the last octet. (IDP1).  
– The fourth octet is called the Telecom IC (TIC) bus because of the offered busing capability.  
It is constituted of the 16 kbit/s D channel (2 bits), a four-bit Command/Indication channel  
and the T and E bits. The C/I channel serves to control and MONITOR layer-1 functions (e.g.  
activation/deactivation of a transmission line...). The T bit is a transparent 8-kbit/s channel  
which can be accessed from the ICC, and the E bit is used in MONITOR byte transfer.  
Semiconductor Group  
28  
Functional Description  
125  
µs  
Bits  
8
8
8
2
4
1
T
1
Frame  
R
IOM  
D
C/1  
E
B1  
B2  
MONITOR  
Layer 2  
Layer 1  
8 kbit/s  
8 kbit/s  
32 kbit/s  
16 kbit/s  
64 kbit/s  
64 kbit/s  
64 kbit/s  
TIC-Bus  
D
Channel  
MONITOR  
Channel  
B
Channels  
ITD00706  
Figure 8  
IOM®-1 Frame Structure  
TIC Bus and Arbitration via MONITOR Channel  
The arbitration mechanism implemented in the MONITOR channel allows the access of more  
than one (up to eight) ICC to the last octet of IOM (TIC). This capability is useful for the modular  
implementation of different ISDN services (different Service Access Points) e.g. in ISDN voice/  
data terminals. The IDP1 pins are connected together in a wired-or configuration, as shown in  
figure 9.  
Semiconductor Group  
29  
Functional Description  
IDP1  
IDP0  
FSC  
DCL  
ICC  
ISDN Basic  
Access S or  
U Interface  
Layer 1  
SBS,IBC  
or IEC  
or  
1  
IDP1  
IDP00  
ICC  
Layer 1+ 2  
FSC  
DCL  
ISAC R -S or ISAC R -P  
ITS00707  
Figure 9  
IOM® Bus (TIC Bus) Configuration  
The arbitration mechanism is described in the following.  
An access request to the TIC bus may either be generated by software (µP access to the C/I  
channel) or by the ICC itself (transmission of an HDLC frame). A software access request to  
the bus is effected by setting the BAC bit (CIXR/CIX0 register) to “1”.  
Semiconductor Group  
30  
Functional Description  
In the case of an access request, the ICC checks the bus accessed-bit (bit 3 of IDP1  
MONITOR octet) for the status “bus free”, which is indicated by a logical “1”. If the bus is free,  
the ICC transmits its individual TIC bus address programmed in STCR register. The TIC bus  
is occupied by the device which is able to send its address error-free. If more than one device  
attempt to seize the bus simultaneously, the one with the lowest address value wins.  
MONITOR Channel Structure on IDP1  
7
6
5
4
3
2
1
0
TIC Bus Address TBA2-0  
-Bus accessed = “1” (no TIC bus  
access) if  
-BAC = 0  
(CIXR/CIX0  
register) and  
- no HDLC  
transmission is in  
progress  
When the TIC bus is seized by the ICC, the bus is identified to other devices as occupied via  
the IDP1 MONITOR channel bus accessed bit state “0” until the access request is withdrawn.  
After a successful bus access, the ICC is automatically set into a lower priority class, that is, a  
new bus access cannot be performed until the status “bus free” is indicated in two successive  
frames.  
If none of the devices connected to the IOM interface request access to the D and C/I  
channels, the TIC bus address 7 will be present. The device with this address will therefore  
have access, by default, to the D and C/I channels.  
Note: Bit BAC (CIXR/CIX0 register) should be reset by the µP when access to the C/I channel  
is no more requested, to grant other devices access to these channels.  
Semiconductor Group  
31  
Functional Description  
MONITOR Channel  
The MONITOR channel protocol for data transfer is described in section 2.4.5.  
When the ICC is used in connection with an S interface layer-1 transceiver, an indication must  
be given to the ICC whether the D channel is available for transmission (TE applications with  
short passive or extended bus configuration).  
This indication is assumed to be given in bit 3 “Stop/Go” (S/G) of the MONITOR input channel  
on IDP0. When a HDLC frame is to be transmitted in the D channel, the ICC automatically  
starts, proceeds with, or stops frame transmission according to the S/G bit value:  
S/G = 1 : stop  
S/G = 0 : go  
MONITOR Channel Structure IDP0  
7
6
5
4
3
2
1
0
1
1
1
1
S/G  
1
1
1
IOM®-1 Timing  
In IOM-1 mode, the ICC may be operated either in timing mode 0 or timing mode 1. The  
selection is via bit SPM in SPCR register.  
Timing mode 0 (SPM = 0) is used in terminal applications. Timing mode 1 (SPM = 1) is only  
meaningful in exchange applications when the SLD is used. Programming timing mode 1  
minimizes the B-channel round-trip delay time on the SLD interface.  
In timing mode 0 the IOM frame begin is marked by a rising edge on the FSC input. It  
simultaneously marks the beginning of the SLD frame.  
In timing mode 1 the IOM frame begins is marked by a rising edge on FSD output. The FSD  
output is delayed by the ICC by 1/8 th of a frame with respect to FSC (figure 10).  
Semiconductor Group  
32  
Functional Description  
( )  
Ι
DCL  
(512 kHz)  
( )  
Ι
FSC  
(8 kHz)  
125 µs  
SLD OUT  
B2 FC  
SLD IN  
FC  
B1  
SIG  
B1  
B2  
SIG  
SIP  
IOM R Frame  
IDP0/1  
B1  
B2  
MONITOR  
TIC  
SSI Frame  
SDAR/SDAX  
B2  
B1  
( a) Timing Mode 0  
( )  
Ι
DCL  
(512 kHz)  
( )  
Ι
FSC  
(8 kHz)  
125 µs  
( )  
FSD 0  
SIP  
1/8 Frame Period  
SLD OUT  
SLD IN  
B1  
B2  
FC  
SIG  
B1  
B2  
FC  
SIG  
IOM R Frame  
IDP0/1  
B1  
B2  
MONITOR  
TIC  
( b) Timing Mode 1  
ITD00708  
Figure 10  
Interface Timing in IOM®-1 Mode  
Note: The up-arrows show the position, where register contents are transferred to the sender,  
the down-arrows show the position, where the receiver transfers data to the registers.  
Semiconductor Group  
33  
Functional Description  
IOM®-2  
The IOM-2 is a generalization and enhancement of the IOM-1. While the basic frame structure  
is very similar, IOM-2 offers further capacity for the transfer of maintenance information. In  
terminal applications, the IOM-2 constitutes a powerful backplane bus offering  
intercommunication and sophisticated control capabilities for peripheral modules.  
The channel structure of the IOM-2 is depicted below.  
Channel Structure of the IOM®-2  
B1  
B2  
MONITOR  
D
C/I  
MR  
MX  
The first two octets constitute the two 64 kbit/s B channels.  
The third octet is the MONITOR channel. It is used for the exchange of data between the  
ICC and the other attached device(s) using the IOM-2 MONITOR channel protocol.  
The fourth octet (control channel) contains  
– two bits for the 16 kbit/s D channel  
– a four-bit Command/Indication channel  
– two bits MR and MX for supporting the MONITOR channel protocol.  
In the case of an IOM-2 interface the frame structure depends on whether TE- or non-TE mode  
is selected, via bit SPM in SPCR register.  
Non-TE Timing Mode (SPM = 1)  
In this case the frame is a multiplex of eight IOM-2 channels (figure 11), each channel has the  
same structure.  
Thus the data rate per subscriber connection (corresponding to one channel) is  
256 kbit/s, whereas the bit rate is 2048 kbit/s. The IOM-2 interface signals are:  
IDP0,1  
DCL  
:
:
:
2048 kbit/s  
4096 kHz input  
8 kHz input  
FSC  
Semiconductor Group  
34  
Functional Description  
s
125 µ  
FCS  
DCL  
DU  
R
CH0  
CH0  
CH1  
CH1  
CH2  
CH2  
CH3  
CH3  
CH4  
CH5  
CH5  
CH6  
CH6  
CH7  
CH7  
CH0  
CH0  
IOM  
IOM  
R
CH4  
DD  
MM  
RX  
B1  
B2  
MONITOR  
D
C/I  
ITD00709  
Figure 11  
Multiplexed Frame Structure of the IOM®-2 Interface in Non-TE Timing Mode  
The ICC is assigned to one of the eight channels (0 to 7) via register programming.  
This mode is used in ISDN exchange/line card applications.  
TE Timing Mode (SPM = 0)  
The frame is composed of three channels (figure 11):  
Channel 0 contains 144 kbit/s (for 2B + D) plus MONITOR and command/indication  
channels for layer-1 devices.  
Channel 1 contains two 64-kbit/s intercommunication channels plus MONITOR and  
command/indication channels for other IOM-2 devices.  
Channel 2 is used for enabling/inhibiting the transmission of HDLC frames. This bit is  
typically generated by an S-bus transceiver (stop/go: bit 5, or 3rd MSB of the last octet on  
IDP0). On IDP1, bits 2 to 5 of the last octet are used for TIC bus access arbitration.  
As in the IOM-1 case (figure 9), up to eight ICCs can access the TIC bus (D and C/I channels).  
The bus arbitration mechanism is identical to that described previously, except that it involves  
bits 2 to 5 in channel 2.  
Semiconductor Group  
35  
Functional Description  
FSC  
IOM R CH0  
IOM R CH0  
IOM R CH0  
IDP0  
B1  
B1  
B2  
MON0  
D
D
C/I0  
IC1  
MX  
IC1  
IC2  
MON1 C/I1  
MR  
MR  
MX  
MX  
S/G  
IDP1  
B2  
MON0  
C/I0  
IC2  
MON1 C/I1  
MR  
C/I2  
TIC-Bus  
SDS1/2  
ITD00710  
Figure 12  
Definition of the IOM®-2 Channels in Terminal Timing Mode  
The IOM-2 signals are:  
IDP0,1  
DCL  
:
:
:
768 kbit/s  
1536 kHz input  
8 kHz input.  
FSC  
In addition, to support standard combos/data devices the following signals are generated as  
outputs:  
SDS1/2 :  
8 kHz programmable data strobe signals for selecting one or both B/IC  
channel(s).  
2.3.3 SSI (Serial Port A)  
The SSI (Serial Synchronous Interface) is available in IOM-1 interface mode. Timing mode 0  
(SPM = 0) has to be programmed.  
The serial port SSI has a data rate of 128 kbit/s. It offers a full duplex link for B channels in  
ISDN voice/data terminals. Examples: serial synchronous transceiver devices (USART’s,  
HSCX SAB 82525, ITAC PSB 2110, …), and CODEC filters.  
The port consists of one data line in each direction (SDAX and SDAR) and the 128-kHz clock  
output (SCA). The beginning of B2 is marked by a rising edge on FSC, see figure12.  
The µC system has access to B-channel data via the ICC registers BCR1/2 and BCX1/2.  
The µC access must be synchronized to the serial transmission by means of the Synchronous  
Transfer Interrupt (STCR see chapter 4).  
Semiconductor Group  
36  
Functional Description  
2.3.4 SLD  
The SLD is available in IOM-1 interface mode.  
( )  
Ι
FSC  
(8 kHz)  
( )  
SDAR  
Ι
B2  
B2  
B1  
B1  
SDAX (0)  
SCA (0)  
128 kHz  
a) SSI  
SLD OUT  
SLD IN  
SIP (Ι)  
B1  
B2  
FC  
SIG  
B1  
B2  
FC  
SIG  
DCL ( Ι )  
512 kHz  
b) SLD  
ITD00711  
Figure 13  
SSI (a) and SLD (b) Interface Lines  
The standard SLD interface is a three-wire interface with a 512-kHz clock input (DCL), an 8-  
kHz frame direction signal input (FSC), and a serial ping-pong data lead (SIP) with an effective  
full duplex data rate of 256 kbit/s.  
The frame is composed of four octets per direction. Octets 1 and 2 contain the two B channels,  
octet 3 is a feature control byte, and octet 4 is a signaling byte (figure 13).  
The SLD interface can be used in:  
Terminal applications as a full duplex time-multiplexed (ping-pong) connection to B-  
channel sources/destinations. CODEC filters, such as the SICOFI® (PEB 2060) or the  
ARCOFI® (PSB 2160) as well as other SLD compatible voice/data modules may be  
connected directly to the ICC as depicted in figure 13a. Terminal specific functions have to  
be deselected (TSF = 0), so that pin SIP/EAW takes on its proper function as SLD data line.  
Moreover, in TE applications timing mode 0 has to be programmed.  
Semiconductor Group  
37  
Functional Description  
Digital exchange applications as a full duplex time-multiplexed connection to convey the  
B channels between the layer-1 devices and a Peripheral Board Controller (e.g. PBC PEB  
2050 or PIC PEB 2052), which performs time-slot assignment on the PCM highways,  
forming a system interface to a switching network (figure 13b).  
Timing mode 1 (SPM = 1) can be programmed in order to minimize the B-channel round-  
trip delay.  
The µC system has access to B-channel data, the feature control byte and the signaling byte  
via the ICC registers:  
– C1R, C2R  
B1/B2  
FC  
– CFCR and SFCX  
– SSCR and SSCX  
SIG  
The µP access to C1R, C2R, SFCR, SFCX, SSCR and SSCX must be synchronized to the  
serial transmission by means of the Synchronous Transfer Interrupt (STCR) and the BVS-bit  
(STAR).  
2.4 Individual Functions  
2.4.1 Layer-2 Functions for HDLC  
The HDLC controller in the ICC is responsible for the data link layer using HDLC/SDLC based  
protocols.  
The ICC can be made to support that data link layer to a degree that best suits system  
requirements. When programmed in auto mode, it handles elements of procedure of an  
acknowledged, balanced class of HDLC protocol autonomously (window size equal to “1”).  
Multiple links may be handled simultaneously due to the address recognition capabilities, as  
explained in section 2.4.1.1.  
The ICC supports point-to-point protocols such as LAPB (Link Access Procedure Balanced)  
used in X.25 networking.  
For ISDN, one particularly important protocol is the Link Access Procedure for the D  
channel (LAPD).  
Semiconductor Group  
38  
Functional Description  
LAPD, layer 2 of the ISDN D-channel protocol (CCITT I.441) includes functions for:  
– Provision of one or more data link connections on a D channel (multiple LAP).  
Discrimination between the data link connections is performed by means of a data link  
connection identifier (DLCI = SAPI + TEI)  
– HDLC-framing  
– Application of a balanced class of procedure in point-multipoint configuration.  
The simplified block diagram in figure 6 shows the functional blocks of the ICC which support  
the LAPD protocol.  
The HDLC transceiver in the ICC performs the framing functions used in HDLC/SDLC based  
communication: flag generation/recognition, bit stuffing, CRC check and address recognition.  
The FIFO structure with two 64-byte pools for transmit and receive directions and an intelligent  
FIFO controller permit flexible transfer of protocol data units to and from the µC system.  
2.4.1.1Message Transfer Modes  
The HDLC controller can be programmed to operate in various modes, which are different in  
the treatment of the HDLC frame in receive direction. Thus, the receive data flow and the  
address recognition features can be programmed in a flexible way, to satisfy different system  
requirements.  
In the auto mode the ICC handles elements of procedure of the LAPD (S and I frames)  
according to CCITT I.441 fully autonomously.  
For the address recognition the ICC contains four programmable registers for individual SAPI  
and TEI values SAP1-2 and TEI1-2, plus two fixed values for “group” SAPI and TEI, SAPG and  
TEIG.  
There are 5 different operating modes which can be set via the MODE register:  
Auto mode (MDS2, MDS1 = 00)  
Characteristics:  
– Full address recognition (1 or 2 bytes).  
– Normal (mod 8) or extended (mod 128) control field format  
– Automatic processing of numbered frames of an HDLC procedure  
(see 2.4.1.2).  
If a 2-byte address field is selected, the high address byte is compared with the fixed value FEH  
or FCH (group address) as well as with two individually programmable values in SAP1 and  
SAP2 registers. According to the ISDN LAPD protocol, bit 1 of the high byte address will be  
interpreted as COMMAND/RESPONSE bit (C/R) dependent on the setting of the CRI bit in  
SAP1, and will be excluded from the address comparison.  
Similarly, the low address byte is compared with the fixed value FFH (group TEI) and two  
compare values programmed in special registers (TEI1, TEI2). A valid address will be  
recognized in case the high and low byte of the address field match one of the compare values.  
The ICC can be called (addressed) with the following address combinations:  
Semiconductor Group  
39  
Functional Description  
– SAP1/TEI1  
– SAP1/FFH  
– SAP2/TEI2  
– SAP2/FFH  
– FEH(FCH)/TEI1  
– FEH(FCH)/TEI2  
– FEH(FCH)/FFH  
Only the logical connection identified through the address combination SAP1, TEI1 will be  
processed in the auto mode, all others are handled as in the non-auto mode. The logical  
connection handled in the auto mode must have a window size 1 between transmitted and  
acknowledged frames. HDLC frames with address fields that do not match with any of the  
address combinations, are ignored by the ICC.  
In case of a 1-byte address, TEI1 and TEI2 will be used as compare registers. According to  
the X.25 LAPB protocol, the value in TEI1 will be interpreted as COMMAND and the value in  
TEI2 as RESPONSE.  
The control field is stored in RHCR register and the I field in RFIFO. Additional information is  
available in RSTA.  
Non-Auto Mode (MDS2, MDS1 = 01)  
Characteristics: Full address recognition (1 or 2 bytes)  
Arbitrary window sizes  
All frames with valid addresses (address recognition identical to auto mode) are accepted and  
the bytes following the address are transferred to the µP via RHCR and RFIFO. Additional  
information is available in RSTA.  
Transparent Mode 1 (MDS2, MDS1, MDS0 = 101).  
Characteristics: TEI recognition  
A comparison is performed only on the second byte after the opening flag, with TEI1, TEI2 and  
group TEI (FFH). In case of a match, the first address byte is stored in SAPR, the (first byte of  
the) control field RHCR, and the rest of the frame in the RFIFO. Additional information is  
available in RSTA.  
Semiconductor Group  
40  
Functional Description  
Transparent Mode 2 (MDS2, MDS1, MDS0 = 110).  
Characteristics: non address recognition.  
Every received frame is stored in RFIFO (first byte after opening flag to CRC field). Additional  
information can be read from RSTA.  
Transparent Mode 3 (MDS2, MDS1, MDS0 = 111)  
Characteristics: SAPI recognition  
A comparison is performed on the first byte after the opening flag with SAP1, SAP2 and group  
SAPI (FE/FCH). In the case of a match, all the following bytes are stored in RFIFO. Additional  
information can be read from RSTA.  
2.4.1.2Protocol Operations (auto mode)  
In addition to address recognition all S and I frames are processed in hardware in the auto  
mode. The following functions are performed:  
– update of transmit and receive counter  
– evaluation of transmit and receive counter  
– processing of S commands  
– flow control with RR/RNR  
– response generation  
– recognition of protocol errors  
– transmission of S commands, if an acknowledgment is not received  
– continuous status query of remote station after RNR has been received  
– programmable timer/repeater functions.  
The processing of frames in auto mode is described in detail in section 2.4.8.  
Semiconductor Group  
41  
Functional Description  
2.4.1.3Reception of Frames  
A 2x32-byte FIFO buffer (receive pools) is provided in the receive direction.  
The control of the data transfer between the CPU and the ICC is handled via interrupts.  
There are two different interrupt indications concerned with the reception of data:  
– RPF (Receive Pool Full) interrupt, indicating that a 32-byte block of data can be read from  
the RFIFO and the received message is not yet complete.  
– RME (Receive Message End) interrupt, indicating that the reception of one message is  
completed, i.e. either  
one message 32 bytes, or  
the last part of a message 32 bytes  
is stored in the RFIFO.  
Depending on the message transfer mode the address and control fields of received frames  
are processed and stored in the receive FIFO or in special registers as depicted in figure 14.  
The organization of the RFIFO is such that, in the case of short ( 32 bytes), successive  
messages, up to two messages with all additional information can be stored. The contents of  
the RFIFO would be, for example, as shown in figure 15.  
RFIFO  
Interrupts in  
Wait Line  
0
Receive  
Message 1  
_
<
(
32 bytes)  
31  
0
RME  
Receive  
Message 2  
_
<
(
32 bytes)  
RME  
31  
ITS01502  
Figure 14  
Contents of RFIFO (short message)  
Semiconductor Group  
42  
Functional Description  
Address  
High  
Address  
Low  
Flag  
Control  
Information  
CRC  
Flag  
Auto-Mode  
(U and I frames)  
SAP1,SAP2  
FE,FC  
TEI1,TEI2  
FF  
RHCR  
RFIFO  
RFIFO  
RFIFO  
RSTA  
RSTA  
RSTA  
RSTA  
RSTA  
(Note 1)  
(Note 2)  
(Note 3)  
Non-Auto  
Mode  
SAP1,SAP2  
FE,FC  
TEI1,TEI2  
FF  
RHCR  
(Note 1)  
(Note 2)  
(Note 4)  
Transparent  
Mode 1  
TEI1,TEI2  
FF  
SAPR  
SAPR  
RFIFO  
RFIFO  
Transparent  
Mode 2  
Transparent  
Mode 3  
SAP1,SAP2  
FE,FC  
ITD02872  
Description of Symbols:  
Checked automatically by ICC  
Compared with register or fixed value  
Stored into register or RFIFO  
Figure 15  
Receive Data Flow  
Note 1  
Note 2  
Only if a 2-byte address field is defined (MDS0 = 1 in MODE register).  
Comparison with Group TEI (FFH) is only made if a 2-byte address field is  
defined (MDS0 = 1 in MODE register).  
Note 3  
Note 4  
In the case of an extended, modulo 128 control field format (MCS = 1  
in SAP2 register) the control field is stored in RHCR in compressed  
form (I frames).  
In the case of extended control field, only the first byte is stored in RHCR, the  
second in RFIFO.  
Semiconductor Group  
43  
Functional Description  
When 32 bytes of a message longer than that are stored in RFIFO, the CPU is prompted to  
read out the data by an RPF interrupt. The CPU must handle this interrupt before more than  
32 additional bytes are received, which would cause a “data overflow” (figure 16). This  
corresponds to a maximum CPU reaction time of 16 ms (data rate 16 kbit/s).  
After a remaining block of less than or equal to 16 bytes has been stored, it is possible to store  
the first 16 bytes of a new message (see figure 16b).  
The internal memory is now full. The arrival of additional bytes will result in “data overflow” and  
a third new message in “frame overflow”.  
The generated interrupts are inserted together with all additional information into a wait line to  
be individually passed to the CPU.  
After an RPF or RME interrupt has been processed, i.e. the received data has been read from  
the RFIFO, this must be explicitly acknowledged by the CPU issuing a RMC (Receive  
Message Complete) command.  
The ICC can then release the associated FIFO pool for new data. If there is an additional  
interrupt in the wait line it will be generated after the RMC acknowledgment.  
Semiconductor Group  
44  
Functional Description  
RFIFO  
the Queue  
Interrupts in  
RFIFO  
Interrupts in  
the Queue  
0
0
Long  
Long  
Message  
Message 1  
_
<
46 bytes)  
(
31  
0
31  
0
RPF  
RPF  
15  
16  
RME  
Message 2  
_
<
(
32 bytes)  
31  
31  
RPF  
RME  
ITS01501  
Figure 16  
Contents of RIFIFO (long message)  
Information about the received frame is available for the µP when the RME interrupt is  
generated, as shown in table 6.  
Semiconductor Group  
45  
Functional Description  
Table 6  
Receive Information at RME Interrupt  
Information  
Register  
Bit  
Mode  
First byte after SAPR  
flag (SAPI of  
LAPD address  
field)  
Transparent mode 1  
Control field  
RHCR  
RHCR  
Auto mode, I (modulo 8) and U frames  
Auto mode, I frames (modulo 128)  
Compressed  
control field  
2nd byte after  
flag  
3rd byte after  
flag  
RHCR  
RHCR  
Non-auto mode, 1-byte address field  
Non-auto mode, 2-byte address field  
Transparent mode 1  
Type of frame STAR  
(Command/  
Response)  
C/R  
Auto mode, 2-byte address field  
Non-auto mode, 2-byte address field  
Transparent mode 3  
Recognition of STAR  
SAPI  
SA1-0  
Auto mode, 2-byte address field  
Non-auto mode, 2-byte address field  
Transparent mode 3  
Recognition of STAR  
TEI  
TA  
All expect Transparent mode 2,3  
Result of CRC STAR  
check (correct/  
incorrect)  
CRC  
ALL  
Data available STAR  
in RFIFO (yes/  
no)  
RDA  
RAB  
RDO  
ALL  
ALL  
ALL  
Abort condition STAR  
detected  
(yes/no)  
Data overflow  
during recep-  
tion of a frame  
(yes/no)  
STAR  
Number of  
bytes recei-  
ved in RFIFO  
RBCL  
RBC4-0  
ALL  
ALL  
Message  
length  
RBCL  
RBCH  
RBC11-  
50V  
Semiconductor Group  
46  
Functional Description  
2.4.1.4Transmission of Frames  
A 2x32 byte FIFO buffer (transmit pools) is provided in the transmit direction.  
If the transmit pool is ready (which is true after an XPR interrupt or if the XFW bit in STAR is  
set), the CPU can write a data block of up to 32 bytes to the transmit FIFO. After this, data  
transmission can be initiated by command.  
Two different frame types can be transmitted:  
– Transparent frames (command: XTF), or  
– I frames (command: XIF)  
as shown in figure 17.  
* Transmit  
Transparent  
Frame  
XFIFO  
* Transmit  
I Frame  
(auto-mode only!)  
XAD1  
XAD2  
XFIFO  
Transmitted  
HDLC Frame  
Address  
High  
Address  
Low  
Flag  
Control  
INFORMATION  
CRC  
Flag  
If 2 byte  
address  
field  
Appended if CPU  
has issued  
transmit message  
end (XME)  
selected  
commend.  
ITD02862  
Description of Symbols:  
Generated automatically by ICC  
Written initially by CPU (into register)  
Loaded (repeatedly) by CPU upon ICC request (XPR interrupt)  
Figure 17  
Transmit Data Flow  
Semiconductor Group  
47  
Functional Description  
For transparent frames, the whole frame including address and control field must be written to  
the XFIFO.  
The transmission of I frames is possible only if the ICC is operating in the auto mode. The  
address and control field is autonomously generated by the ICC and appended to the frame,  
only the data in the information field must be written to the XFIFO.  
If a 2-byte address field has been selected, the ICC takes the contents of the XAD 1 register  
to build the high byte of the address field, and the contents of the XAD 2 register to build the  
low byte of the address field.  
Additionally the C/R bit (bit 1 of the high byte address, as defined by LAPD protocol) is set to  
“1” or “0” dependent on whether the frame is a command or a response.  
In the case of a 1-byte address, the ICC takes either the XAD 1 or XAD 2 register to  
differentiate between command or response frame (as defined by X.25 LAP B).  
The control field is also generated by the ICC including the receive and send sequence number  
and the poll/final (P/F) bit. For this purpose, the ICC internally manages send and receive  
sequence number counters.  
In the auto mode, S frames are sent autonomously by the ICC. The transmission of U frames,  
however, must be done by the CPU. U frames must be sent as transparent frames (XTF), i.e.  
address and control field must be defined by the CPU.  
Once the data transmission has been initiated by command (XTF or XIF), the data transfer  
between CPU and ICC is controlled by interrupts.  
The ICC repeatedly requests another data packet or block by means of an XPR interrupt, every  
time no more than 32 bytes are stored in the XFIFO.  
The processor can then write further data to the XFIFO and enable the continuation of frame  
transmission by issuing an XIF/XTF command.  
If the data block which has been written last to the XFIFO completes the current frame, this  
must be indicated additionally by setting the XME (Transmit Message End) command bit. The  
ICC then terminates the frame properly by appending the CRC and closing flag.  
If the CPU fails to respond to an XPR interrupt within the given reaction time, a data underrun  
condition occurs (XFIFO holds no further valid data). In this case, the ICC automatically aborts  
the current frame by sending seven consecutive “ones” (ABORT sequence).  
The CPU is informed about this via an XDU (Transmit Data Underrun) interrupt.  
It is also possible to abort a message by software by issuing an XRES (Transmitter RESet)  
command, which causes an XPR interrupt.  
After an end of message indication from the CPU (XME command), the termination of the  
transmission operation is indicated differently, depending on the selected message transfer  
mode and the transmitted frame type.  
If the ICC is operating in the auto mode, the window size (= number of outstanding  
unacknowledged frames) is limited to 1; therefore an acknowledgment is expected for every I  
frame sent with an XIF command. The acknowledgment may be provided either by a received  
S or I frame with corresponding receive sequence number (see figure 14).  
Semiconductor Group  
48  
Functional Description  
If no acknowledgment is received within a certain time (programmable), the ICC requests an  
acknowledgment by sending an S frame with the poll bit set (P = 1) (RR or RNR). If no  
response is received again, this process is repeated in total CNT times (retry count,  
programmable via TIMR register).  
The termination of the transmission operation may be indicated either with:  
– XPR interrupt, if a positive acknowledgment has been received,  
– XMR interrupt, if a negative acknowledgment has been received, i.e. the transmitted  
message must be repeated (XMR = Transmit Message Repeat),  
– TIN interrupt, if no acknowledgment has been received at all after CNT times the expiration  
of the time period t1 (TIN = Timer INterrupt, XPR interrupt is issued additionally).  
Note: Prerequisite for sending I frames in the auto mode (XIF) is that the internal operational  
mode of the timer has been selected in the MODE register (TMD bit = 1).  
The transparent transmission of frames (XTF command) is possible in all message transfer  
modes. The successful termination of a transparent transmission is indicated by the XPR  
interrupt.  
In the case where an IOM interface mode is programmed (see section 2.2), a transmission  
may be aborted from the outside by setting the stop/go bit to 1, provided DIM1 - 0 are  
programmed appropriately, see tables 2 and 3. An example of this is the occurrence of an S  
bus D-channel collision. - If this happens before the first FIFO pool has been completely  
transmitted and released, the ICC will retransmit the frame automatically as soon as  
transmission is enabled again. Thus no µP interaction is required.  
On the other hand, if a transmission is inhibited by the stop/go bit after the first pool has already  
been released (and XPR generated), the ICC aborts the frame and requests the processor to  
repeat the frame with an XMR interrupt.  
Semiconductor Group  
49  
Functional Description  
2.4.2 B-Channel Switching (IOM®-1)  
The ICC contains two serial interfaces, SLD and SSI, which can serve as interfaces to B-  
channel sources/destinations. Both channels B1 and B2 can be switched independently of one  
another to the IOM interface (figure 18).  
The following possibilities are provided:  
– Switching from/to SSI  
– Switching from/to SLD  
– IOM looping  
– SLD looping  
The microcontroller can select the B-channel switching in the SPCR register. In figure 19 all  
possible selections of the B-channel routes and access to B-channel data via the  
microprocessor interface are illustrated. This access from the microcontroller is possible by  
writing or reading the C1R/C2R register or reading the B1CR/B2CR register (cf. Synchronous  
Transfer, paragraph 2.4.3).  
SSI  
SSI  
R
B-Channel  
Sources/Destinations  
IOM  
Interface  
SLD  
SLD  
Registers: C1R/C2R  
B1CR/B2CR  
SPCR  
µP-Interface  
ITS02863  
Figure 18  
Semiconductor Group  
50  
Functional Description  
FF  
H
SSI  
SSI  
R
R
IOM  
IOM  
)
*
FF  
SLD  
SLD  
H
µP  
µP  
SSI Switching  
SLD Switching  
= µP Access  
= B-Channel Route  
FF  
FF  
H
SSI  
SSI  
H
R
R
FF  
IOM  
IOM  
H
)
*
FF  
SLD  
SLD  
H
µP  
µP  
IOM R Loop  
SLD Loop  
) B1 = FF  
*
H
ITS00863  
B2 = Undefines Value  
Figure 19  
Semiconductor Group  
51  
Functional Description  
2.4.3 Access to B / IC Channels  
IOM®-1 mode (IMS = 0)  
The B1 and/or B2 channel is accessed by reading the B1CR/B2CR or by reading and writing  
the C1R/C2R registers. The µP access can be synchronized to the serial interface by means  
of a Synchronous Transfer programmed in the STCR register.  
The read/write access possibilities are shown in table 7.  
Table 7  
C_R  
B_CR  
C_C1  
C_C0  
Read  
SLD  
SLD  
SSI  
Write  
SLD  
Read Application(s)  
0
0
1
1
0
1
0
1
IOM  
IOM  
IOM  
B_not switched, SLD looping  
B_switched to/from SLD  
B_switched to/from SSI  
IOM looping  
IOM  
IOM  
The Synchronous Transfer Interrupt (SIN, ISTA register) can be programmed to occur at either  
the beginning of a 125 µs frame or at its center, depending on the channel(s) to be accessed  
and the current configuration, see figure 20a.  
Semiconductor Group  
52  
Functional Description  
(a) C_C1, C_C0 = 00  
SLD Loop  
R
SIP  
SLD  
IOM  
IDP1  
B_CR  
C_R  
µP  
FSC  
BVS  
IDP1  
B1  
B2  
SLD  
B1  
B2  
B1  
B2  
OUT  
IN  
µP Access  
SIN (STO)  
ITS02864  
Figure 20a  
Semiconductor Group  
53  
Functional Description  
(b) C_C1, C_C0 = 01  
R
SLD - IOM Connection  
IDP0  
C_R  
R
SIP  
SLD  
IOM  
IDP1  
B_CR  
µP  
FSC  
BVS  
IDP0  
SIP  
B1  
B2  
B1  
B2  
B1  
B2  
µP Access  
IDP1  
B1  
B2  
ITS02969  
SIN (STO)  
Figure 20b  
Semiconductor Group  
54  
Functional Description  
(c) C_C1, C_C0 = 10  
R
SSI - IOM Connection  
SDAR  
SDAX  
IDP0  
C_R  
R
SSI  
IOM  
IDP1  
B_CR  
µP  
FSC  
SDAR  
IDP0  
B2  
B1  
B1  
B2  
IDP1  
B1  
B2  
SDAX  
B1  
B2  
BCHAN 3  
µP Access  
B1/2 IOM  
B2 SSI  
SIN (STO)  
µP Access  
R
B1  
SSI  
SIN (STI)  
ITS02865  
Figure 20c  
Semiconductor Group  
55  
Functional Description  
IOM®-2 mode (IMS = 1)  
The B1, B2 and/or IC1, IC2 channels are accessed by reading the B1CR/B2CR or by reading  
and writing the C1R/C2R registers. The µP access can be synchronized to the IOM interface  
by means of a Synchronous Transfer programmed in the STCR register.  
The read/write access possibilities are shown in table 8.  
Table 8  
C_C1  
C_C0 C_R  
Read  
C_R  
B_CR Output Application(s)  
to  
Write  
Read  
IOM2  
0
0
1
1
0
IC_  
B_  
B_monitoring, IC_monitoring  
1
IC_  
IC_  
B_  
B_  
B_  
B_  
IC_ B_monitoring, IC_looping from/to  
IOM  
0
B_  
B_  
B_access from/to IOM;  
transmission of a constant  
value in B_channel to IOM.  
B_  
1
B_looping from IOM;  
transmission of a variable  
pattern in B_channel to IOM.  
The general sequence of operations to access the B/IC channels is:  
(set configuration, register SPCR)  
Program Synchronous Interrupt (ST0)  
Read Register (B_CR, C_R)  
SIN  
(Write register)  
Acknowledge SIN (SC0)  
Note: The data transfer itself works independent of the Synchronous Transfer Interrupt. In  
case of a SOV e.g. transfer is still possible.  
Semiconductor Group  
56  
Functional Description  
2.4.4 C/I Channel Handling  
The Command/Indication channel carries real-time status information between the ICC and  
another device connected to the IOM.  
1) One C/I channel conveys the commands and indications between a layer-1  
device and a layer-2 device. This channel is available in all timing modes (IOM-1  
or IOM-2). It can be accessed from the microcontroller e.g. to control the layer-1  
activation/deactivation procedures. Access is arbitrated via the TIC bus  
access protocol:  
– in IOM-1 mode, this arbitration is done in the MONITOR channel  
– in IOM-2 TE timing mode (SPM = 0), this arbitration is done in C/I channel 2  
(see figure 11).  
This C/I channel is access via register CIRR/CIR0 (in receive direction layer 1-  
to-layer 2) and register CIXR/CIX0 (in transmit direction, layer 2-to-layer 1).  
The code is four bits long.  
In the receive direction, the code from layer 1 is continuously monitored, with an  
interrupt being generated anytime a change occurs. A new code must be found  
in two consecutive IOM frames to be considered valid and to trigger a C/I  
code change interrupt status (double last look criterion).  
In the transmit direction, the code written in CIXR/CIX0 is continuously transmitted  
in the channel.  
2) A second C/I channel (called C/I1) can be used to convey real time status  
information between the ICC and various non-layer 1 peripheral devices.  
The channel consists of six bits in each direction. It is available only in the  
IOM-2 terminal timing mode (see figure 11).  
The C/I1 channel is accessed via registers CIR1 and CIX1. A change in  
the received C/I1 code is indicated by an interrupt status without double  
last look criterion.  
2.4.5 MONITOR Channel Handling  
IOM®-1  
The MONITOR channel protocol can be used to exchange one byte of information at a time  
between the ICC and another device (e.g. layer-1 transceiver).  
The procedure is as follows:  
MONITOR Transmit Channel (MOX) register is loaded with the value to be sent in the outgoing  
MONITOR channel. (Bytes of the form FxH are not allowed for this purpose because of the TIC  
bus collision resolution procedure).  
Semiconductor Group  
57  
Functional Description  
The receiving device interprets the incoming MONITOR value as a control/information byte,  
FxH excluded. If no response is expected, the procedure is complete. If the receiving device  
shall react by transmitting information to the ICC, it should set the E bit to 0 and send the  
response in the MONITOR channel of the following frame. The ICC  
– latches the value in the MONITOR channel of the frame immediately following a frame with  
“E = 0” into MOR register.  
– generates a MONITOR Status interrupt MOS (EXIR register) to indicate that the MOR  
register has been loaded. See figure 21.  
MON  
IDP1  
IDP0  
X
X
Y
E
0
MON  
E
0
MON  
=
F
H
MOR Load, MOS Int.  
MOR Load, MOS Int.  
ITD00868  
Figure 21  
IOM®-2  
In this case, the MONITOR channel protocol is a handshake protocol used for high speed  
information exchange between the ICC and other devices, in MONITOR channel 0 or 1 (see  
figure 11). In the non-TE mode, only one MONITOR channel is available (“MONITOR channel  
0”).  
The MONITOR channel protocol is necessary (see figure 22):  
For programming and controlling devices attached to the IOM. Examples of such devices  
are: layer-1 transceivers (using MONITOR channel 0), and peripheral V/D modules that do  
not have a parallel microcontroller interface (MONITOR channel 1), such as the Audio  
Ringing Codec Filter PSB 2160.  
For data exchange between two microcontroller systems attached to two different devices  
on one IOM-2 backplane. Use of the MONITOR channel avoids the necessity of a dedicated  
serial communication path between the two systems. This greatly simplifies the system  
design of terminal equipment (figure 22).  
Semiconductor Group  
58  
Functional Description  
Data Communication (MONITOR 1)  
Control  
Control  
(MONITOR 1)  
(MONITOR 0)  
V/D Module e.g.  
Layer 1 e.g.  
PEB  
IEC PEB 2090  
V/D Module  
ARCOFI R PSB 2160  
ITAC R PSB 2110  
ICC  
IBC  
2095  
ITS02866  
µC  
µC  
Figure 22  
Examples of MONITOR Channel Applications  
The MONITOR channel operates on an asynchronous basis. While data transfers on the bus  
take place synchronized to frame sync, the flow of data is controlled by a handshake procedure  
using the MONITOR Channel Receive (MR0 or 1) and MONITOR Channel Transmit (MX0 or  
1) bits. For example: data is placed onto the MONITOR channel and the MX bit is activated.  
This data will be transmitted repeatedly once per 8-kHz frame until the transfer is  
acknowledged via the MR bit.  
The microprocessor may either enforce a “1” (idle) in MR, MX by setting the control bit MRC1,0  
or MXC1,0 to “0” (MONITOR Control Register MOCR), or enable the control of these bits  
internally by the ICC according to the MONITOR channel protocol. Thus, before a data  
exchange can begin, the control bit MRC(1,0), or MXC(1,0) should be set to “1” by the  
microprocessor.  
The MONITOR channel protocol is illustrated in figure 23. Since the protocol is identical in  
MONITOR channel 0 and MONITOR channel 1 (available in TE mode only), the index 0 or 1  
has been left out in the illustration.  
The relevant status bits are:  
MONITOR Channel Data Received MDR (MDR0, MDR1)  
MONITOR Channel End of Reception MER (MER0, MER1)  
for the reception of MONITOR data, and  
MONITOR Channel Data Acknowledged MDA (MDA0, MDA1)  
MONITOR Channel Data Abort MAB (MAB0, MAB1)  
for the transmission of MONITOR data (Register: MOSR).  
Semiconductor Group  
59  
Functional Description  
In addition, the status bit:  
MONITOR Channel Active MAC (MAC0, MAC1)  
indicates whether a transmission is in progress (Register: STAR).  
MX  
0 1  
MR  
0 1  
µ
µ
P :  
P :  
Transmitter  
Receiver  
MRE=1  
WR Data  
MXC =1, MIE =1  
MAC = 1 Status  
MDR Int.  
MDR Int.  
~
~
RD Data  
MRC =1, MIE =1  
MDA Int.  
~
~
~
~
WR Data  
~
~
~
~
RD Data  
RD Data  
MDA Int.  
~
~
~
~
WR Data  
MDR Int.  
MER Int.  
~
~
~
~
MDA Int.  
~
~
~
~
MXC = 0  
~
~
MRC = 0, MIE = 0  
MAC = 0 Status  
ITD03481  
Figure 23  
Before starting a transmission, the microprocessor should verify that the transmitter is inactive,  
i.e. that a possible previous transmission has been terminated. This is indicated by an “0” in  
the MONITOR Channel Active MAC status bit.  
After having written the MONITOR Data Transmit (MOX) register, the microprocessor sets the  
MONITOR Transmit Control bit MXC to 1. This enables the MX bit to go active (0), indicating  
the presence of valid MONITOR data (contents of MOX) in the corresponding frame.  
Semiconductor Group  
60  
Functional Description  
As a result, the receiving device stores the MONITOR byte in its MONITOR Receive MOR  
register and generates a MDR interrupt status.  
Alerted by the MDR interrupt, the microprocessor reads the MONITOR Receive (MOR)  
register. When it is ready to accept data (e.g. based on the value in MOR, which in a point-to-  
multipoint application might be the address of the destination device), it sets the MR control bit  
MRC to “1” to enable the receiver to store succeeding MONITOR channel bytes and  
acknowledge them according to the MONITOR channel protocol. In addition, it enables other  
MONITOR channel interrupts by setting MONITOR Interrupt Enable to “1”.  
As a result, the first MONITOR byte is acknowledged by the receiving device setting the MR  
bit to “0”. This causes a MONITOR Data Acknowledge MDA interrupt status at the transmitter.  
A new MONITOR data byte can now be written by the microprocessor in MOX. The MX bit is  
still in the active (0) state. The transmitter indicates a new byte in the MONITOR channel by  
returning the MX bit active after sending it once in the inactive state. As a result, the receiver  
stores the MONITOR byte in MOR and generates anew a MDR interrupt status. When the  
microprocessor has read the MOR register, the receiver acknowledges the data by returning  
the MR bit active after sending it once in the inactive state. This in turn causes the transmitter  
to generate a MDA interrupt status.  
This “MDA interrupt - write data - MDR interrupt - read data - MDA interrupt” handshake is  
repeated as long as the transmitter has data to send. Note that the MONITOR channel protocol  
imposes no maximum reaction times to the microprocessor.  
When the last byte has been acknowledged by the receiver (MDA interrupt status), the  
microprocessor sets the MONITOR Transmit Control bit MXC to 0. This enforces an inactive  
(“1”) state in the MX bit. Two frames of MX inactive signifies the end of a message. Thus, a  
MONITOR Channel End of Reception MER interrupt status is generated by the receiver when  
the MX is received in the inactive state in two consecutive frames. As a result, the  
microprocessor sets the MR control bit MRC to 0, which in turn enforces an inactive state in  
the MR bit. This marks the end of the transmission, making the MONITOR Channel Active  
MAC bit return to “0”.  
During a transmission process, it is possible for the receiver to ask a transmission to be  
aborted by sending an inactive MR bit value in two consecutive frames. This is effected by the  
microprocessor writing the MR control bit MRC to 0. An aborted transmission is indicated by a  
MONITOR Channel Data Abort MAB interrupt status at the transmitter.  
Semiconductor Group  
61  
Functional Description  
2.4.6 Terminal Specific Functions  
In addition to the standard functions supporting the ISDN basic access, the ICC contains  
optional functions, useful in various terminal configurations.  
The terminal specific function are enabled by setting bit TSF (STCR register) to “1”. This has  
two effects:  
The SIP/EAW line is defined as External Awake input (and not as SLD line);  
Second, the interrupts SAW and WOV (EXIR register) are enabled:  
– SAW (Subscriber Awake) generated by a falling edge on the EAW line  
– WOV (Watchdog Timer Overflow) generated by the watchdog timer. This occurs when  
the processor fails to write two consecutive bit patterns in ADF1:  
WTC1  
WTC2  
ADF1  
Watchdog Timer Control 1,0.  
The WTC1 and WTC2 bits have to be successively written in the following manner within 128  
ms:  
WTC1  
WTC2  
1.  
2.  
1
0
0
1
As a result the watchdog timer is reset and restarted. Otherwise a WOV is generated.  
Deactivating the terminal specific functions is only possible with a hardware reset.  
Having enable the terminal specific functions via TSF = 1, the user can make the ICC generate  
a reset signal by programming the Reset Source Select RSS bit (CIX0 register), as follows:  
0
A reset signal is generated as a result of  
– a falling edge on the EAW line (subscriber awake)  
– a C/I code change (exchange awake).  
A falling edge on the EAW line also forces the IDP1 line of the  
IOM interface to zero.  
Note: This should normally induce the attached layer-1 device to  
leave the power down state and supply clocking to ICC  
via DCL and FSC.  
A corresponding interrupt status (CIC or SAW) is also generated.  
Semiconductor Group  
62  
Functional Description  
1
A reset signal is generated as a result of the expiration of the  
watchdog timer (indicated by the WOV interrupt status).  
Note: That the watchdog timer is not running when the ICC is in  
the power-down state (IOM not clocked).  
Note: Bit RSS has a significance only if terminal specific functions are activated (TSF = 1).  
The RSS bit should be set to “1” by the user when the ICC is in power-up to prevent an edge  
on the EAW line or a change in the C/I code from generating a reset pulse.  
Switching RSS from 0 to 1 or from 1 to 0 resets the watchdog timer.  
The reset pulse generated by the ICC (output via RES pin) has a pulse width of 5 ms and is  
an active high signal.  
2.4.7 Test Functions  
The ICC provides the following test and diagnostic functions:  
digital loop via TLP (Test Loop, SPCR register) command bit: IDP1 is internally connected  
with IDP0, external input on IDP0 is ignored: this is used in system tests, to test layer-2  
functionality independent of layer 1;  
special loops programmed via C2C1-0 and C1C1-0 bits (register SPCR, cf. 2.4.3).  
Semiconductor Group  
63  
Functional Description  
2.4.8 Documentation of the Auto Mode  
The Auto Mode of the ICC and ISAC-S is only applicable for the states 7 and 8 of the LAPD  
protocol. All other states (1 to 6) have to be performed in Non-Auto Mode (NAM). Therefore  
this documentation gives an overview of how the device reacts in the states 7 and 8, which  
reactions require software programming and which are done by the hardware itself, when  
interrupts and status register contents are set or change. The necessary software actions are  
also detailed in terms of command or mode register access.  
The description is based on the SDL-Diagrams of the ETSI TS 46-20 dated 1989.  
The diagrams are only annotated by documentary signs or texts (mostly register descriptions)  
and can therefore easily be interpreted by anyone familiar with the SDL description of LAPD.  
All deviations that occur are specially marked and the impossible actions, path etc. are crossed  
out.  
To get acquainted with this documentation, first read through the legend-description and the  
additional general considerations, then start with the diagrams, referring to the legend and the  
register description in the Technical Manual if necessary.  
We hope you will profit from this documentation and use our software-saving auto mode.  
Legend of the Auto Mode Documentation  
a.  
Symbols within a path  
There are 3 symbols within a path  
a.1  
In the auto mode the device processes all subse-  
quent state transitions branchings etc. up to the  
next symbol.  
a.2  
a.3  
In the auto mode the device does not process the  
state transitions, branchings, etc. Within the path  
appropriate directions are given with which the  
software can accomplish the required action.  
A path cannot be implemented and no software  
or hardware action can change this. These path  
are either optional or only applicable for  
window-size > 1.  
Semiconductor Group  
64  
Functional Description  
b.  
Symbols at a path  
There is 1 symbol at a path  
b.1  
c
marks the beginning of a path, for which a.3  
applies  
Symbols at an internal or external message box.  
There are 2 symbols at a message box.  
c.1  
This symbol means, that the action described in  
the box is not possible. Either the action specified  
is not done at all (box crossed out) or an additional  
action is taken (written into the box).  
box  
Note: The impossibility to perform the optional  
T203 timer-procedure is not explicitly  
mentioned; the corresponding actions  
are only crossed out.  
box  
c.2  
This symbol means, that within a software-path, by  
taking the prescribed register actions the contents  
of the box will be done automatically.  
d.  
Text within boxes  
Text within boxes can be grouped in one of two classes.  
d.1  
The text denotes an interrupt which is always  
Text  
box  
associated with the event (but can also be  
associated with other events). (See ISTA and  
EXIR register description in the Technical  
Manual for an interrupt description)  
box  
or  
Text  
d.2  
The text describes a register access  
either a register read access to discriminate this  
state from others or to reach a branching condi-  
tion.  
box  
Text  
or a register write access to give a command.  
The text is placed in the box that describes the functions for which  
the register access is needed.  
Semiconductor Group  
65  
Functional Description  
e.  
Text at the side of boxes  
e.1  
The text describes an interrupt associated with the  
contents of the box. The interrupt is always asso-  
ciated with the box contents, if the interrupt name  
is not followed by a “/”, it is associated only  
Text  
Box  
under appropriate conditions if a “/” is behind it.  
e.1  
The text describes a possible or mandatory chan-  
ge of a bit in a status-register associated with the  
contents of the box.  
Box  
Text  
(The attached texts can also be placed on the left side.)  
Text above and below boxes  
f.  
f.1  
Text describes a mandatory action to performed  
on the contents of the box.  
Text  
box  
f.2  
Text describes a mandatory action to be taken as  
a result of the contents of the box.  
Action here means register access.  
Box  
Text  
g.  
Shaded boxes  
Box  
The box describes an impossible state or action  
for the device.  
Semiconductor Group  
66  
Functional Description  
Additional General Considerations when Using the Auto Mode  
a)  
Switching from Auto Mode to Non-Auto Mode.  
As mentioned in the introduction the Auto Mode is only applicable in the states  
7 and 8 of the LAPD. Therefore whenever these states have to be left (which is  
indicated by a “Mode:NAM” text) there are several actions to be taken that could  
not all be detailed in the SDL-diagrams:  
a.1)  
a.2)  
write Non Auto Mode and TMD = 0 into the mode register.  
write the timer register with an arbitrary value to stop it. The timer T200 as  
specified in the LAPD-Protocol is implemented in the hardware only in the  
states 7 and 8; in all other states this or any other timer-procedure  
has to be done by the software with the possible use of the timer in  
external timer mode  
a.3)  
read the WFA bit of the STAR2 register and store it in a software variable.  
The information in this bit may be necessary for later decisions. When  
switching from Auto Mode to Non-Auto Mode XPR interrupts may be lost.  
a.4)  
a.5)  
a.6)  
In the Non-Auto Mode the software has to decode I, U and S-frames  
because I and S frames are only handled autonomously in the Auto Mode.  
The RSC and PCE interrupts, the contents of the STAR2 register and the  
RRNR bit in the STAR register are only meaningful within the Auto Mode.  
leave some time before RHR or XRES is written to reset the counters, as a  
currently sent frame may not be finished yet.  
b)  
What has to be written to the XFIFO?  
In the legend description when the software has to write contents of a frame to the  
XFIFO only “XFIFO” is shown in the corresponding box. We shall given here a  
general rule of what has to be written to the XFIFO:  
a)  
For sending an I frame with CMDR:XIF, only the information field content,  
i.e. no SAPI, TEI, control field should be written to the XFIFO  
b)  
For sending an U frame or any other frame with CMDR:XTF, the SAPI,  
TEI and the control field has to be written to the XFIFO.  
c)  
The interrupts XPR and XMR.  
The occurrence of an XPR interrupt in Auto Mode after an XIF command  
indicates that the I frame sent was acknowledged and the next I frame can  
be sent, if STAR2:TREC indicates state 7 and STAR:RRNR indicates Peer  
Rec not busy. If Peer Rec is busy after an XPR, the software should wait  
for the next RSC interrupt before sending the next I-frame. If the XPR hap-  
pens to be in the Timer Recovery state, the software has to poll the  
STAR2 register until the state Multiple Frame Established is reached or a  
TIN interrupt is issued which requires Auto Mode to be left (One of these  
two conditions will occur before the time T200xN200). In Non-Auto  
Mode or after an XTF command the XPR just indicates, that the frame  
was sent successfully.  
Semiconductor Group  
67  
Functional Description  
The occurrence of an XMR interrupt in Auto Mode after an XIF command indicates  
that the I frame sent was either rejected by the Peer Entity or that a collision occu-  
red on the S interface. In both cases the I frame has to be retransmitted (after an  
eventual waiting for the RSC interrupt if the Peer Rec was busy; after an XMR the  
device will always be in the state 7). In Non-Auto Mode or after an XTF command  
the XMR indicates that a collision occurred on the S interface and the frame has  
to be retransmitted.  
d)  
e)  
The resetting of the RC variable:  
The RC variable is reset in the ICC and ISAC-S when leaving the state Timer  
Recovery. The SLD diagrams indicate a reset in the state Multiple Frame  
Established when T200 expires. There is no difference to the outside world between  
these implementations however our implementation is clearer.  
The timer T203 procedure:  
We do not fully support the optional timer T203 procedure, but we can still find out  
whether or not S frames are sent on the link in the Auto Mode. By polling the  
STAR2:SDET bit and (re)starting a software timer whenever a one is read we can  
build a quasi T203 procedure which handles approximately the same task. When  
T203 expires one is supposed to go into the Timer Recovery State with RC = 0.  
This is possible for the ICC and ISAC-S by just writing the STI bit in the CMDR  
register (Auto Mode and Internal Timer Mode assumed).  
f)  
The congestion procedure as defined in the 1 TR 6 of the “Deutsche Bundespost".  
In the 1 TR 6a variable N2x4 is defined for the maximum number of Peer Busy  
requests. The 1 TR is in this respect not compatible with the Q921 of CCITT or the  
ETSI 46 – 20 but it is, nevertheless, sensible to avoid getting into a hangup  
situation. With the ICC and ISAC-S this procedure can be implemented:  
After receiving an RSC interrupt with RRNR set one starts a software – timer. The  
timer is reset and stopped if one either receives another RSC interrupt with a reset  
RRNR, if one receives a TIN interrupt or if other conditions occur that result in a  
reestablishment of the link. The timer expires after N2x4xT200 and in this case the 1  
TR 6 recommends a reestablishment of the link.  
g)  
Dealing with error conditions: The SLD diagrams do not give a very detailed  
description of how to deal with errors. Therefore we prepared a special Application  
Note:  
“How to deal with an error condition of the LAPD-Protocol with your ICC  
or ISAC-S”  
Semiconductor Group  
68  
Functional Description  
7
MULTIPLE  
FRAME  
ESTABLISHED  
DL  
DL  
RELEASE  
REQUEST  
DL-DATA  
REQUEST  
I FRAME  
QUEUED UP  
ESTABLISH  
REQUEST  
PEER  
RECEIVER  
BUSY  
YES  
DISCARD  
I QUEUE  
DISCARD  
I QUEUE  
PUT IN  
I QUEUE  
STAR:RRNR  
NO  
I FRAME  
QUEUED UP  
ESTABLISH  
DATA LINK  
RC = 0  
P = 1  
YES  
(V)S = V(A) + K  
STAR2:WFA  
NO  
SET  
LAYER 3  
INITIATED  
TX DISC  
7
GET NEXT  
I QUEUE  
ENTRY  
I FRAME  
QUEUED UP  
MULTIPLE  
FRAME  
ESTABLISHED  
XFIFO  
CMDR XTF  
XFIFO  
MODE NAM  
STOP T203  
RESTART T200  
P = 0  
5
AWAITING  
ESTABLISHM.  
TXI  
COMMAND  
MODE NAM  
6
CMDR:XIF  
AWAITING  
RELEASE  
V(S) = V(S) + 1  
CLEAR  
ACKNOWLEDGE  
PENDING  
YES  
T200  
RUNNING  
NO  
STOP T203  
START T200  
7
MULTIPLE  
FRAME  
ESTABLISHED  
Note: The regeneration of this signal does not affect  
the sequence integrity of the I queue.  
ITD02365  
Figure 24a  
Semiconductor Group  
69  
Functional Description  
7
MULTIPLE  
FRAME  
ESTABLISHED  
TIMER  
T200  
EXPIRY  
TIMER  
T203  
EXPIRY  
MDL  
REMOVE  
REQUEST  
PERSISTENT  
DEACTIVATION  
CMDR STI  
RC = 0  
DISCARD  
I AND UI  
QUEUES  
DISCARD  
I AND UI  
QUEUES  
TRANSMIT  
ENQUIRY  
DL RELEASE  
INDICATION  
DL RELEASE  
INDICATION  
RC = 0  
YES  
PEER  
BUSY  
NO  
GET LAST  
TRANSMITTED  
I FRAME  
8
TRANSMIT  
ENQUIRY  
STOP T200  
STOP T203  
STOP T200  
STOP T203  
TIMER  
RECOVERY  
STAR2:  
TREC  
V(S) = V(S) - 1  
P = 1  
1
TEI  
4
TEI  
UNASSIGNED  
ASSIGNED  
ITD02366  
TX I  
COMMAND  
V(S) = V(S) + 1  
CLEAR  
ACKNOWLEDGE  
PENDING  
START T200  
RC = RC + 1  
8
TIMER  
RECOVERY  
STAR2:  
TREC  
Figure 24b  
Semiconductor Group  
70  
Functional Description  
7
MULTIPLE  
FRAME  
ESTABLISHED  
RME  
RME  
RME  
SABME  
RCHR:  
DISC  
UA  
RCHR:  
RCHR:  
MDL-ERROR  
INDICATION  
(C,D)  
DISCARD  
I QUEUE  
F=P  
STORE  
STAR2:  
WFA  
TX UA  
7
MULTIPLE  
FRAME  
ESTABLISHED  
F = P  
XFIFO  
CMDR XTF  
CLEAR  
TX UA  
EXCEPTION  
CONDITIONS  
XFIFO  
CMDR XTF  
MDL-ERROR  
INDICATION  
(F)  
DL-RELEASE  
INDICATION  
STOP T200  
STOP T203  
V(S) = V(A)  
YES  
STAR2:WFA = 0  
MODE NAM  
NO  
4
TEI  
ASSIGNED  
DISCARD  
I QUEUE  
DL  
ESTABLISH  
INDICATION  
STOP T200  
STOP T203  
CMDR:RHR;XRES  
V(S) = 0  
V(A) = 0  
V(R) = 0  
7
MULTIPLE  
FRAME  
ESTABLISHED  
ITD02367  
Figure 24c  
Semiconductor Group  
71  
Functional Description  
7
MULTIPLE  
FRAME  
ESTABLISHED  
RME  
SET OWN  
RECEIVER  
BUSY  
CLEAR OWN  
RECEIVER  
BUSY  
DM  
RHCR:  
CLEAR  
RECEIVER  
BUSY  
CLEAR  
NO  
F = 1  
YES  
YES  
RECEIVER  
RHCR  
BUSY  
NO  
NO  
YES  
SET OWN  
RECEIVER  
BUSY  
CLEAR OWN  
RECEIVER  
BUSY  
MDL-ERROR  
INDICATION  
(E)  
MDL-ERROR  
INDICATION  
(B)  
CMDR:RNR = 1  
STAR:XRNR  
CMDR:RNR = 0  
STAR:XRNR  
7
ESTABLISH  
DATA LINK  
MULTIPLE  
FRAME  
F = 0  
F = 0  
ESTABLISHED  
CLEAR  
LAYER 3  
INITIATED  
TX RNR  
RESPONSE  
TX RR  
RESPONSE  
MODE NAM  
5
CLEAR  
ACKNOWLEDGE  
PENDING  
CLEAR  
ACKNOWLEDGE  
PENDING  
AWAITING  
ESTABLISHM.  
7
MULTIPLE  
FRAME  
ESTABLISHED  
Note: These signals are generated outside of this SDL representation,  
and may be generated by the connection management entity.  
ITD02368  
Figure 24d  
Semiconductor Group  
72  
Functional Description  
7
MULTIPLE  
FRAME  
ESTABLISHED  
RR  
REJ  
RSC /  
RSC /  
CLEAR PEER  
RECEIVER  
BUSY  
CLEAR PEER  
RECEIVER  
BUSY  
STAR:RRNR  
STAR:RRNR  
NO  
NO  
COMMAND  
YES  
COMMAND  
YES  
YES  
YES  
F = 1  
F = 1  
NO  
NO  
NO  
NO  
P = 1  
P = 1  
MDL-ERROR-  
INDICATION  
(A)  
YES  
YES  
MDL-ERROR-  
INDICATION  
(A)  
ENQUIRY  
RESPONSE  
ENQUIRY  
RESPONSE  
STAR2:SDET  
STAR2:SDET  
1
2
Figure 24f  
Figure 24f  
ITD03482  
Figure 24e  
Semiconductor Group  
73  
Functional Description  
1
2
NO  
NO  
NO  
_
_
_
_
<
<
<
<
V(A) N(R) V(S)  
V(A) N(R) V(S)  
YES  
YES  
PCE  
XPR /  
N(R) ERROR  
RECOVERY  
V(A) = N(R)  
N(R) = V(S)  
STAR2:WFA  
YES  
MODE NAM  
XPR /  
5
STOP T200  
YES  
V(A) = N(R)  
AWAITING  
ESTABLISHM.  
N(R) = V(A)  
NO  
START T203  
STAR2:WFA  
XMR /  
INVOKE  
RETRANS-  
MISSION  
STOP T200  
START T203  
V(A) = N(R)  
7
MULTIPLE  
FRAME  
RESTART T200  
ESTABLISHED  
7
MULTIPLE  
FRAME  
ESTABLISHED  
ITD02370  
Figure 24f  
Semiconductor Group  
74  
Functional Description  
7
MULTIPLE  
FRAME  
ESTABLISHED  
RME  
RNR  
FRMR  
RHCR:  
RSC /  
SET PEER  
RECEIVER  
BUSY  
MDL-ERROR  
INDICATION  
(K)  
STAR:RRNR  
NO  
COMMAND  
YES  
ESTABLISH  
DATA LINK  
YES  
F = 1  
CLEAR  
LAYER 3  
INITIATED  
NO  
NO  
P = 1  
YES  
MODE NAM  
MDL-ERROR-  
INDICATION  
(A)  
5
AWAITING  
ESTABLISHM.  
ENQUIRY  
RESPONSE  
STAR2:SDET  
NO  
_
_
<
<
V(A) N(R) V(S)  
YES  
XPR /  
PCE  
N(R)  
ERROR  
RECOVERY  
V(A) = N(R)  
STAR2:WFA  
MODE NAM  
STOP T203  
5
RESTART T200  
RC = 0  
AWAITING  
ESTABLISHM.  
7
MULTIPLE  
FRAME  
ESTABLISHED  
ITD02371  
Figure 24g  
Semiconductor Group  
75  
Functional Description  
7
MULTIPLE  
FRAME  
ESTABLISHED  
I
COMMAND  
OWN  
RECEIVER  
BUSY  
YES  
NO  
NO  
DISCARD  
INFORMATION  
N(S) = V(R)  
YES  
NO  
DISCARD  
INFORMATION  
P = 1  
V(R) = V(R) + 1  
YES  
REJECT  
EXCEPTION  
NO  
CLEAR REJECT  
EXCEPTION  
NOTE 2  
F = 1  
YES  
RME  
DL-DATA  
INDICATION  
NO  
SET  
REJECT  
P = 1  
TX RNR  
RFIFO, RHCR  
EXCEPTION  
STAR2:SDET  
YES  
YES  
YES  
CLEAR  
ACKNOWLEDGE  
PENDING  
P = 1  
NO  
F = P  
ACKNOWLEDGE  
PENDING  
TX REJ  
F = P  
STAR2:SDET  
NO  
CLEAR  
ACKNOWLEDGE  
PENDING  
ACKNOWLEDGE  
PENDING  
TX RR  
STAR2:SDET  
NOTE 1  
SET  
CLEAR  
ACKNOWLEDGE  
PENDING  
ACKNOWLEDGE  
PENDING  
ITD03483  
3
Figure 24i  
Note 1: Processing of acknowledge pending is described figure 24i  
Note 2: This SDL representation does not include the optional procedure in Appendix I.  
Figure 24h  
Semiconductor Group  
76  
Functional Description  
3
Figure 24h  
NO  
NO  
V(A) N(R) V(S)  
YES  
PCE  
N(R)  
ERROR  
RECOVERY  
PEER  
RECEIVER  
BUSY  
YES  
MODE NAM  
XPR /  
5
NO  
V(A) = N(R)  
N(R) = V(S)  
AWAITING  
ESTABLISHM.  
STAR2:WFA  
YES  
XPR /  
YES  
V(A) = N(R)  
N(R) = V(A)  
STAR2:WFA  
NO  
STOP T200  
V(A) = N(R)  
RESTART T203  
RESTART T200  
7
MULTIPLE  
FRAME  
ESTABLISHED  
ITD03484  
Figure 24i  
Semiconductor Group  
77  
Functional Description  
7
MULTIPLE  
FRAME  
ESTABLISHED  
ACKNOWLEDGE  
PENDING  
NO  
ACKNOWLEDGE  
PENDING  
YES  
CLEAR  
ACKNOWLEDGE  
PENDING  
F = 0  
TX RR  
STAR2:SDET  
7
MULTIPLE  
FRAME  
ESTABLISHED  
ITD02374  
Figure 24j  
Semiconductor Group  
78  
Functional Description  
8
TIMER  
RECOVERY  
DL  
DL  
DL-DATA  
REQUEST  
I FRAME  
QUEUED UP  
ESTABLISH  
REQUEST  
ESTABLISH  
REQUEST  
DISCARD  
I QUEUE  
DISCARD  
I QUEUE  
PUT IN  
I QUEUE  
I FRAME  
QUEUED UP  
ESTABLISH  
DATA LINK  
RC = 0  
P = 1  
TX DISC  
8
SET  
TIMER  
RECOVERY  
LAYER 3  
INITIATED  
XFIFO  
CMDR XTF  
MODE NAM  
5
AWAITING  
ESTABLISHM.  
RESTART T200  
MODE NAM  
6
AWAITING  
RELEASE  
ITD02375  
Figure 25a  
Semiconductor Group  
79  
Functional Description  
8
TIMER  
RECOVERY  
MDL  
REMOVE  
REQUEST  
TIMER  
T200  
EXPIRY  
PERSISTENT  
DEACTIVATION  
YES  
DISCARD  
I AND UI  
QUEUES  
DISCARD  
I AND UI  
QUEUES  
RC = N200  
NO  
V(S) = V(A)  
NO  
TIN  
MDL-ERROR  
INDICATION(I)  
YES  
DL-RELEASE  
INDICATION  
DL-RELEASE  
INDICATION  
ESTABLISH  
DATA LINK  
STOP T200  
TIMR  
STOP T200  
TIMR  
YES  
PEER  
BUSY  
NO  
MODE NAM  
MODE NAM  
CLEAR  
LAYER 3  
INITIATED  
GET LAST  
TRANSMITTED  
I FRAME  
1
TEI  
4
TEI  
ASSIGNED  
TRANSMIT  
ENQUIRY  
UNASSIGNED  
MODE NAM  
V(S) = V(S) - 1  
P = 1  
ITD02376  
5
AWAITING  
ESTABLISHM.  
TX I  
COMMAND  
V(S) = V(S) + 1  
CLEAR  
ACKNOWLEDGE  
PENDING  
START T200  
RC = RC + 1  
8
TIMER  
RECOVERY  
Figure 25b  
Semiconductor Group  
80  
Functional Description  
8
TIMER  
RECOVERY  
RME  
RME  
RME  
SABME  
RHCR:  
DISC  
UA  
RHCR:  
RHCR:  
MDL-ERROR  
INDICATION  
(C, D)  
DISCARD  
I QUEUE  
F = P  
TX UA  
8
STORE  
STAR2:  
WFA  
TIMER  
RECOVERY  
F = P  
XFIFO  
CMDR XTF  
CLEAR  
TX UA  
EXCEPTION  
CONDITIONS  
XFIFO  
CMDR XTF  
MDL-ERROR  
INDICATION  
(F)  
DL-RELEASE  
INDICATION  
V(S) = V(A)  
YES  
STOP T200  
STAR2:WFA = 0  
NO  
MODE NAM  
4
TEI  
ASSIGNED  
DISCARD  
I QUEUE  
DL  
ESTABLISH  
INDICATION  
STOP T200  
START T203  
CMDR:RHR;XRES  
V(S) = 0  
V(A) = 0  
V(R) = 0  
7
MULTIPLE  
FRAME  
ESTABLISHED  
STAR2:TREC  
ITD02377  
Figure 25c  
Semiconductor Group  
81  
Functional Description  
8
TIMER  
RECOVERY  
RME  
SET OWN  
RECEIVER  
BUSY  
CLEAR OWN  
RECEIVER  
BUSY  
DM  
RHCR:  
CLEAR  
RECEIVER  
BUSY  
OWN  
NO  
F = 1  
YES  
YES  
RECEIVER  
RHCR  
BUSY  
NO  
NO  
YES  
SET OWN  
RECEIVER  
BUSY  
CLEAR OWN  
RECEIVER  
BUSY  
MDL-ERROR  
INDICATION  
(E)  
MDL-ERROR  
INDICATION  
(B)  
CMDR:RNR = 1  
STAR:XRNR  
CMDR:RNR = 0  
STAR:XRNR  
ESTABLISH  
DATA LINK  
F = 0  
F = 0  
CLEAR  
LAYER 3  
INITIATED  
TX RR  
RESPONSE  
TX RNR  
RESPONSE  
MODE NAM  
5
CLEAR  
ACKNOWLEDGE  
PENDING  
CLEAR  
ACKNOWLEDGE  
PENDING  
AWAITING  
ESTABLISHM.  
8
TIMER  
RECOVERY  
Note: These signals are generated outside of this SDL representation,  
and may be generated by the connection management entity.  
ITD02378  
Figure 25d  
Semiconductor Group  
82  
Functional Description  
8
TIMER  
RECOVERY  
RR  
REJ  
RSC /  
CLEAR PEER  
RECEIVER  
BUSY  
STAR:RRNR  
NO  
COMMAND  
YES  
YES  
F = 1  
NO  
NO  
P = 1  
YES  
NO  
_
_
<
<
V(A) N(R) V(S)  
ENQUIRY  
YES  
RESPONSE  
STAR2:SDET  
XPR /  
V(A) = N(R)  
STAR2:WFA  
NO  
STOP T200  
_
_
<
<
V(A) N(R) V(S)  
YES  
XPR /  
PCE  
XMR /  
INVOKE  
RETRANS-  
MISSION  
N(R) ERROR  
RECOVERY  
V(A) = N(R)  
STAR2:WFA  
MODE NAM  
8
7
5
TIMER  
RECOVERY  
MULTIPLE  
FRAME  
ESTABLISHED  
AWAITING  
ESTABLISHM.  
STAR2:TREC  
ITD02867  
Figure 25e  
Semiconductor Group  
83  
Functional Description  
8
TIMER  
RECOVERY  
RME  
RNR  
FRMR  
RCHR:  
RSC /  
MDL-ERROR  
INDICATION  
(K)  
BUSY  
STAR:RRNR  
NO  
ESTABLISH  
DATA LINK  
COMMAND  
YES  
YES  
F = 1  
CLEAR  
LAYER 3  
INITIATED  
NO  
NO  
NO  
MODE NAM  
_
_
<
<
P = 1  
YES  
V(A) N(R) V(S)  
5
AWAITING  
ESTABLISHM.  
YES  
XPR /  
ENQUIRY  
RESPONSE  
V(A) = N(R)  
STAR2:SDET  
STAR2:WFA  
NO  
_
_
<
<
V(A) N(R) V(S)  
RESTART T200  
RC = 0  
YES  
XPR /  
PCE  
XMR /  
N(R)  
ERROR  
RECOVERY  
INVOKE  
RETRANS-  
MISSION  
V(A) = N(R)  
STAR2:WFA  
MODE NAM  
8
7
5
TIMER  
RECOVERY  
MULTIPLE  
FRAME  
ESTABLISHED  
AWAITING  
ESTABLISHM.  
STAR2:TREC  
ITD02380  
Figure 25f  
Semiconductor Group  
84  
Functional Description  
8
TIMER  
RECOVERY  
I
COMMAND  
OWN  
RECEIVER  
BUSY  
YES  
NO  
NO  
DISCARD  
INFORMATION  
N(S) = V(R)  
YES  
NO  
DISCARD  
INFORMATION  
P = 1  
V(R) = V(R) + 1  
YES  
NO  
REJECT  
EXCEPTION  
CLEAR REJECT  
EXCEPTION  
NOTE 2  
F = 1  
YES  
RME  
DL-DATA  
INDICATION  
NO  
SET  
REJECT  
P = 1  
TX RNR  
RFIFO, RHCR  
EXCEPTION  
STAR2:SDET  
YES  
YES  
YES  
CLEAR  
ACKNOWLEDGE  
PENDING  
P = 1  
NO  
F = P  
ACKNOWLEDGE  
PENDING  
F = P  
TX REJ  
STAR2:SDET  
NO  
CLEAR  
ACKNOWLEDGE  
PENDING  
ACKNOWLEDGE  
PENDING  
TX RR  
STAR2:SDET  
NOTE 1  
SET  
CLEAR  
ACKNOWLEDGE  
PENDING  
ACKNOWLEDGE  
PENDING  
ITD03485  
4
Figure 25h  
Note 1: Processing of acknowledge pending is descripted on figure 25i  
Note 2: This SDL representation does not include the optional procedure in Appendix I.  
Figure 25g  
Semiconductor Group  
85  
Functional Description  
4
NO  
_
_
<
<
V(A) N(R) V(S)  
YES  
XPR /  
PCE  
N(R)  
V(A) = N(R)  
ERROR  
RECOVERY  
STAR2:WFA  
MODE NAM  
8
5
TIMER  
RECOVERY  
AWAITING  
ESTABLISHM.  
ITD02382  
Figure 25h  
8
TIMER  
RECOVERY  
ACKNOWLEDGE  
PENDING  
NO  
ACKNOWLEDGE  
PENDING  
YES  
CLEAR  
ACKNOWLEDGE  
PENDING  
F = 0  
TX RR  
STAR2:SDET  
8
TIMER  
RECOVERY  
ITD02383  
Figure 25i  
Semiconductor Group  
86  
Functional Description  
RELEVANT  
STATES  
(NOTE 1)  
RME  
DL  
UI  
FRAME  
QUEUED UP  
UI COMMAND  
UNIT DATA  
REQUEST  
RHCR  
REMOVE UI  
FRAME FROM  
QUEUE  
DL  
PLACE IN  
UI QUEUE  
UNIT DATA  
INDICATION  
UI  
FRAME  
P = 0  
NOTE 2  
QUEUED UP  
TX UI  
COMMAND  
NOTE 2  
XFIFO  
CMDR: XTF  
NOTE 2  
Note 1: The relevant states are as follows  
4 TEI-assigned  
5 Awaiting-establishement  
6 Awaiting-release  
7 Multiple-frame-established  
8 Timer-recovery  
Note 2: The data link layer returns to the state it was in prior to the events shown.  
ITD02384  
Figure 26a  
Semiconductor Group  
87  
Functional Description  
RELEVANT  
STATES  
(NOTE 1)  
CONTROL  
FIELD  
ERROR (W)  
INFO NOT  
PERMITTED  
(X)  
INCORRECT  
LENGHT  
(X)  
1 FRAME  
TOO LONG  
(Y)  
PCE /  
MDL-ERROR  
INDICATION  
(L,M,N,O)  
ESTABLISH  
DATA LINK  
CLEAR  
LAYER 3  
INITIATED  
5
AWAITING  
ESTABLISHM.  
Note 1: The relevant states are as follows  
7 Multiple-frame-established  
8 Timer-recovery  
ITD02385  
Figure 26b  
Semiconductor Group  
88  
Functional Description  
N(R)  
ERROR  
RECOVERY  
CLEAR  
EXCEPTION  
CONDITIONS  
ESTABLISH  
DATA LINK  
TRANSMIT  
ENQUIRY  
CMDR:RHR,XRES  
CLEAR  
MDL-ERROR  
INDICATION(J)  
EXCEPTION  
CLEAR PEER  
RECEIVER  
BUSY  
P = 1  
CONDITION  
CMDR:RHR,XRES  
MODE: NAM  
PCE  
CLEAR  
REJECT  
EXCEPTION  
OWN  
RECEIVER  
BUSY  
YES  
ESTABLISH  
DATA LINK  
RC = 0  
P = 1  
NO  
CLEAR  
LAYER 3  
INITIATED  
CLEAR OWN  
RECEIVER  
BUSY  
TX SABME  
TX RR  
COMMAND  
TX RNR  
COMMAND  
XFIFO  
CMDR:XTF  
CMDR:RNR = 0  
CLEAR  
ACKNOWLEDGE  
PENDING  
RESTART T200  
STOP T203  
CLEAR  
ACKNOWLEDGE  
PENDING  
START T200  
ITD02386  
Figure 26c  
Semiconductor Group  
89  
Functional Description  
INVOKE  
RETRANS-  
MISSION  
ENQUIRY  
RESPONSE  
YES  
F = 1  
V(S) = N(R)  
NO  
XMR  
OWN  
RECEIVER  
BUSY  
YES  
V(S) =V(S) - 1  
NO  
TX RR  
TX RNR  
I FRAME  
RESPONSE  
RESPONSE  
QUEUED UP  
STAR2:SDET  
STAR2:SDET  
NOTE  
CLEAR  
ACKNOWLEDGE  
PENDING  
BACK TRACK  
ALONG  
I QUEUE  
Note: The generation of the correct number of signals in order to cause the required  
.
retransmission of I frames does not alter their sequence integrity  
ITD02387  
Figure 26d  
Semiconductor Group  
90  
Operational Description  
3
Operational Description  
3.1 Microprocessor Interface Operation  
The ICC microcontroller interface can be selected to be either of the  
(1) – Motorola type with control signals CS, R/W, DS 1)  
(2) – Siemens/Intel non-multiplexed bus type with control signals CS, WR, DS 1)  
(3) – or of the Siemens/Intel multiplexed address/data bus type with control signals  
CS, WR, RD, ALE  
The selection is performed via pin ALE as follows:  
ALE tied to V DD  
ALE tied to V SS  
Edge on ALE  
(1)  
(2)  
(3).  
The occurrence of an edge on ALE, either positive or negative, at any time during the operation  
immediately selects interface type (3). A return to one of the other interface types is possible  
only if a hardware reset is issued.  
3.2 Reset  
After a hardware reset (pin RES), the ICC is in an idle state, and its registers are loaded with  
specified values. A subset of ICC registers with defined reset values is listed in table 9.  
During the reset pulse pins SDAX/SDS1 and SCA/FSD/SDS2 are “low”, all other pins are in  
high impedance state.  
1) Note:  
These µp-interface-modes only make sense for a 28 pin package, as the address pins  
are needed.The multifunctional pins SDAR and SIP are automatically interpreted as  
A2 and A5 resp. and should therefore not be used for SSI or SLD interface or  
terminal specific functions.  
Semiconductor Group  
91  
Operational Description  
Table 9  
State of ICC Registers after Hardware Reset  
Register  
Value after  
Reset (hex)  
Meaning  
ISTA  
00  
no interrupts  
MASK  
EXIR  
STAR  
00  
all interrupts enabled  
no interrupts  
00  
48 (4A)  
- XFIFO is ready to be written to  
- RFIFO is ready to receive at least 16 octets of a new  
message  
CMDR  
MODE  
00  
00  
no command  
- auto mode  
- 1-octet address field  
- external timer mode  
- receiver inactive  
- IOM-1 interface, MONITOR channel used for TIC bus  
access only  
RBCL  
RBCH  
00  
- no frame bytes received  
XXX000002  
SPCR  
00  
- IDP1 pin = “High”  
- SIP pin “High impedance”  
- Timing mode 0  
- IOM interface test loop deactivated  
- SLD B channel loop selected  
- SDAX/SDS1, SCA/FSD/SDS2 pins = “Low”  
CIRR/CIR0  
CIXR/CIX0  
7C  
BF  
- another device occupies the D and C/I channels  
- received C/I code = “1111”  
- no C/I code change  
- TIC bus is not requested for transmitting a C/I code  
- transmitted C/I code = “1111”  
- T, E = logical “1”  
STCR  
00  
- terminal specific functions disabled  
- TIC bus address = “0000”  
- no synchronous transfer  
ADF1  
ADF2  
00  
00  
- inter-frame time fill = continuous “1”  
- IOM-1 interface mode selected  
- SDS1/2 low  
Semiconductor Group  
92  
Operational Description  
3.3 Initialization  
During initialization a subset of registers have to be programmed to set the configuration  
parameters according to the application and desired features. They are listed in table 10.  
In table 10 the ISDN applications are denoted using the following abbreviations:  
TE  
Terminal Equipment TE1, TA  
e.g. ISDN feature telephone  
ISDN voice/data workstation  
Terminal Adaptor for non-ISDN terminals (TE2)  
LT  
Line Termination  
NT  
Intelligent Network Termination  
Table 10  
Configuration Parameters for Initialization  
Register  
Bit  
Effect  
Application Restricted to  
ADF 2  
IMS  
Program IOM-1 or IOM-2  
interface mode  
D2C2-0 Polarity of SDS2/1 (and/or  
D1C2-0 selection of HDLC channel)  
IOM-2  
IOM-2  
ODS  
IOM output driver  
tri-state/open drain  
SPCR  
(note)  
SPU  
Pull IDP1 low (to request  
clocking from layer-1 device).  
TE  
IOM  
SAC  
SPM  
SLD port inactive/active  
IOM-1  
IOM-1  
0 Timing mode 0  
1 Timing mode 1  
TE/NT  
LT only  
0 Terminal timing mode  
1 Non-terminal timing mode  
TE  
LT  
IOM-2  
TLP  
Serial port B-test loop  
C2C1-0 B-channel switching  
C1C1-0 or  
IOM-1  
IOM-2  
B/IC channel connect  
Semiconductor Group  
93  
Operational Description  
Configuration Parameters for Initialization (cont’d)  
Register  
Bit  
Effect  
Application  
Restricted to  
MODE  
DIM2-0  
IOM interface configuration for  
D + C/I channel arbitration  
Stop/Go bit monitoring for  
HDLC transmission yes/no  
HDLC interface  
IOM  
IOM  
characteristics  
Serial HDLC  
HDLC  
communication  
ADF1  
IDC  
IOM Data Port IDP1,0  
direction control  
IOM-2  
CSEL2-0 IOM channel select (Time slot) non-TE  
IOM-2  
IOM  
CIXR/CIX0  
STCR  
RSS  
Hardware reset generated by  
either subscriber/exchange  
awake or watchdog timer  
TE specific  
functions  
(TSF = 1)  
TSF  
Terminal specific function  
enable/SLD interface enable  
IOM  
IOM  
TBA2-0  
TIC bus address  
Bus  
configuration  
for D+C/I (TIC)  
MODE  
TIMR  
MDS2-0 HDLC message transfer mode 2  
octet/(1 octet) address  
TMD  
Timer mode external/internal  
Auto mode only  
Auto mode only  
CNT  
VALUE  
N1 and T1 in internal timer  
mode (TMD = 1)  
T2 in external timer mode  
XAD1  
XAD2  
SAPI, TEI  
Transmit frame address  
SAPI1/2  
TEI1/2  
Receive SAPI, TEI address  
values for internal address  
recognition  
Note: After a hardware reset the pins SDAX/SDS1 and SCA/FSD/SDS2 are both “low” and  
have the functions of SDS1 and SDS2 in terminal timing mode (since SPM = 0),  
respectively, until the SPCR is written to for the first time. From that moment on, the  
function taken on by these pins depends on the state of IOM Mode Select bit IMS (ADF2  
register).  
Semiconductor Group  
94  
Operational Description  
3.4 IOM® Interface Connections  
IOM®-1  
In IOM-1 interface mode  
– pin IDP0 carries B channel, MONITOR, D and C/I data from layer 1 to layer 2  
– pin IDP1 carries B channel, MONITOR, D and C/I data from layer 2 to layer 1.  
IDP1 is an open drain output. The B channels can be set inactive (FFH) by setting the B  
channel connect bits C1C1-0 and C2C1-0 in SPCR register to 0 (SLD loop), which is the state  
after a hardware reset.  
The MONITOR channel is inactive (FFH) if:  
– no MONITOR channel transfer is programmed  
– and the TIC bus (i.e. the fourth octet of IOM frame: D and C/I channels) is not accessed.  
IOM®-2  
Because of the enhanced communication capabilities offered by the IOM-2, e.g. for the control  
of peripheral devices via the MONITOR channel, the direction of IDP0 and IDP1 is  
programmable.  
The type of the IOM output is selectable via bit ODS (ADF2) register. Thus, the driver is of the  
open drain type if ODS = 0, and of the push-pull type when ODS = 1.  
Non-Terminal Mode (SPM = 1)  
Outside the programmed 4-byte subscriber channel (bits CSEL2-0, ADF1 register), both IDP1  
and IDP0 are inactive.  
Inside the programmed 4-byte subscriber channel:  
– IDP1 carries the 2B+D channels as output toward the subscriber and the MONITOR and C/  
I channel as output to the layer 1  
– IDP1 is inactive during B1 and B2  
– IDP0 carries the 2B + D channels coming from the subscriber line, and the MONITOR and  
C/I channels from layer 1.  
If IDC (IOM Direction Control, ADF1 register) is set to “1”, IDP0 sends the MONITOR, D and  
C/I channels normally carried by IDP1, i.e. normally destined to the subscriber. This feature  
can be used for test purposes, e.g. to send the D channel towards the system instead of the  
subscriber. See figure 27.  
Semiconductor Group  
95  
 
Operational Description  
(a) IDC = 0  
IDP0  
M M  
B1  
B1  
B2  
B2  
MONITOR  
MONITOR  
D
C/I  
C/I  
R
X
1
1
From Layer  
ICC Idle  
From Layer  
ICC Receives  
M M  
D
IDP1  
R
X
1
2
To Layer  
ICC Idle  
From Layer  
ICC Transmits  
(b) IDC = 1  
IDP0  
M
R
M
X
B1  
B1  
B2  
B2  
MONITOR  
MONITOR  
D
From Layer  
C/I  
C/I  
1
2
From Layer  
ICC Idle  
ICC Transmits  
M
X
M
R
D
IDP1  
1
2
To Layer  
ICC Idle  
To Layer  
ITD02868  
ICC Receives  
Not Sending (high impendance or open drain "1")  
Figure 27  
IOM® Data Ports 0, 1 in Non-Terminal Mode (SPM = 1)  
Terminal Mode (SPM = 0)  
In this case the IOM has the12-byte frame structure consisting of channels 0, 1, and 2 (see  
figure 11):  
– IDP0 carries the 2B + D channels from the subscriber line, and the MONITOR 0 and C/I 0  
channels coming from layer 1;  
– IDP1 carries the MONITOR 0 and C/I 0 channels to the layer 1.  
Channel 1 of the IOM interface is used for internal communication in terminal applications. Two  
cases have to be distinguished, according to whether the ICC is operated as a master device  
(communication with slave devices via MONITOR 1 and C/I 1), or as a slave device  
(communication with one master via MONITOR 1 and C/I 1).  
Semiconductor Group  
96  
Operational Description  
2B+ D  
2B+ D  
MON0,C/I0  
MON0,C/I0  
MON1,C/I1  
MON1,C/I1  
IDP0  
IDP1  
V/D Module  
L1  
ICC  
Master  
ITS02873  
ISDN  
Basic  
Access  
Interface  
(a) ICC Master Mode (IDC = 0)  
CH0  
CH1  
CH2  
IDP0  
B1  
B2  
MON0 D C/I0  
IC1  
IC2  
MON1 C/I1  
From  
Layer 1  
From  
Layer 1  
IC Transmit  
if Prog.  
To V/D  
Modules  
D-Channel  
State  
IDP1  
B1  
B2  
MON0 D C/I0  
To  
Layer 1  
To  
Layer 1  
TIC-Bus  
Arbitration  
ITD02875  
Figure 28a  
IOM® Data Ports 0, 1 in Terminal Mode (SPM = 0)  
Semiconductor Group  
97  
Operational Description  
2B+ D  
2B+ D  
MON0, C/I0,  
MON1, C/I1  
MON0, C/I0,  
MON1, C/I1  
IDP0  
IDP1  
L1  
Master  
ICC  
Slave  
ITS02874  
ISDN  
Basic  
Access  
Interface  
(b) ICC Slave Mode (IDC = 1)  
CH0  
CH1  
CH2  
IDP0  
B1  
B2  
MON0 D C/I0  
From  
Layer 1  
From  
Layer 1  
D-Channel  
State  
IDP1  
B1  
B2  
MON0 D C/I0  
IC1  
IC2  
MON1 C/I1  
To  
Layer 1  
To  
Layer 1  
IC Transmit  
if Prog.  
To V/D  
Modules  
TIC-Bus  
Arbitration  
ITD02876  
Figure 28b  
IOM® Data Ports 0, 1 in Terminal Mode (SPM = 0)  
Semiconductor Group  
98  
Operational Description  
If IDC is set to “0” (Master Mode):  
– IDP0 carries the MONITOR 1 and C/I 1 channels as output to peripheral (voice/data)  
devices;  
– IPD0 carries the IC channels as output to other devices, if programmed (CxC1-0 = 01 in  
register SPCR).  
If IDC is set to “1” (Slave mode):  
– IDP1 carries the MONITOR 1 and C/I 1 channels as output to a master device;  
– IPD0 carries the IC channels as output to other devices, if programmed (CxC1-0 = 01 in  
register SPCR).  
If required (cf. DIM2-0, MODE register), bit 5 of the last byte in channel 2 on IDP0 is used to  
indicate the D-channel state (Stop/Go bit) on and bits 2 to 5 of the last byte are used for TIC  
bus access arbitration.  
Figure 28 shows the connections in a multifunctional terminal with the ICC as a master  
(figure 28a) or a slave device (figure 28b).  
Semiconductor Group  
99  
Operational Description  
3.5 Processing  
3.5.1 Interrupt Structure  
Since the ICC provides only one interrupt request output (INT), the cause of an interrupt is  
determined by the microprocessor by reading the Interrupt Status Register ISTA. In this  
register, seven interrupt sources can be directly read. The LSB of ISTA points to eight non-  
critical interrupt sources which are indicated in the Extended Interrupt Register EXIR  
(figure 29).  
INT  
ICC  
ISTA RME RPF RSC XPR TIN CIC SIN EXI  
MASK  
EXIR XMR XDU PCE RFO SOV MOS SAW WOV  
ITD02869  
Figure 29  
ICC Interrupt Structure  
A read of the ISTA register clears all bits except EXI and CIC. CIC is cleared by reading CIRR/  
CIR0. A read of EXIR clears the EXI bit in ISTA as well as the EXIR register.  
When all bits in ISTA are cleared, the interrupt line (INT) is deactivated.  
Each interrupt source in ISTA register can be selectively masked by setting to “1” the  
corresponding bit in MASK. Masked interrupt status bits are not indicated when ISTA is read.  
Instead, they remain internally stored and pending, until the mask bit is reset to zero. Reading  
the ISTA while a mask bit is active has no effect on the pending interrupt.  
In the event of an extended interrupt EXIR, EXI is set even when the corresponding mask bit  
in MASK is active, but no interrupt (INT) is generated. In the event of a C/I channel interrupt  
CIC is set, even when the corresponding mask bit in MASK is active, but no interrupt (INT) is  
generated.  
Except for CIC and MOS all interrupt sources are directly determined by a read of ISTA and  
(possibly) EXIR.  
Semiconductor Group  
100  
 
Operational Description  
Figure 30 shows the CIC and MOS interrupt logic.  
CIC Interrupt Logic  
A CIC interrupt may originate  
– from a change in received C/I channel (0) code (CIC0)  
or (in the case of IOM-2 terminal mode only)  
– from a change in received C/I channel 1 code (CIC 1).  
The two corresponding status bits CIC0 and CIC1 are read in CIR0 register. CIC1 can be  
individually disabled by clearing the enable bit CI1E (ADF1 register). In this case the  
occurrence of a code change in CIR1 will not be displayed by CIC1 until the corresponding  
enable bit has been set to one.  
Bits CIC0 and CIC1 are cleared by a read of CIR0.  
An interrupt status is indicated every time a valid new code is loaded in CIR0 or CIR1. But in  
the case of a code change, the new code is not loaded until the previous contents have been  
read. When this is done and a second code change has already occurred, a new interrupt is  
immediately generated and the new code replaces the previous one in the register. The code  
registers are buffered with a FIFO size of two. Thus, if several consecutive codes are detected,  
only the first and the last code is obtained at the first and second register read, respectively.  
Semiconductor Group  
101  
Operational Description  
(a)  
C/I0 Code  
C/I1 Code  
C
O
D
R
1
CIR1  
CI1E ADF1  
CIRO  
BAS  
C
O
D
R
O
CIC0 CIC1  
ISTA  
CIC  
MASK  
INT  
(b)  
MOR1  
MOX1  
MOR0  
MOX0  
MOCR MRE1 MRC1  
MOSR MDR1  
MIE1  
MER1 MDA1 MAB1  
MRE0 MRC0  
MDR0  
MIE0  
MER0 MDA0 MAB0  
EXIR MOS  
ISTA  
EXI  
MASK  
ITD02870  
INT  
Figure 30  
a) CIC Interrupt Structure  
b) MOS Interrupt Structure (IOM®-2 Mode)  
Semiconductor Group  
102  
Operational Description  
MOS Interrupt Logic  
The MOS interrupt logic shown in figure 30 is valid only in the case of IOM-2 interface mode.  
Further, only one MONITOR channel is handled in the case of IOM-2 non-terminal timing  
modes. In this case, MOR1 and MOX1 are unused.  
The MONITOR Data Receive interrupt status MDR has two enable bits, MONITOR Receive  
interrupt Enable (MRE) and MR bit Control (MRC). The MONITOR channel End of Reception  
MER, MONITOR channel Data Acknowledged MDA and MONITOR channel Data Abort MAB  
interrupt status bits have a common enable bit MONITOR Interrupt Enable MIE.  
MRE prevents the occurrence of MDR status, including when the first byte of a packet is  
received. When MRE is active (1) but MRC is inactive, the MDR interrupt status is generated  
only for the first byte of a receive packet. When both MRE and MRC are active, MDR is always  
generated and all received MONITOR bytes - marked by a 1-to-0 transition in MX bit - are  
stored. (Additionally, an active MRC enables the control of the MR handshake bit according to  
the MONITOR channel protocol.)  
In IOM-1 mode the reception of a MONITOR byte is directly indicated by MOS interrupt status,  
and registers MOCR and MOSR are not used.  
3.5.2 Data Transfer  
The control of the data transfer phase is mainly done by commands from the µP to ICC via the  
Command Register (CMDR).  
Table 11 gives a summary of possible interrupts from the HDLC controller and the appropriate  
reaction to these interrupts.  
Table 12 lists the most important commands which are issued by a microprocessor by setting  
one or more bits in CMDR.  
The powerful FIFO logic, which consists of a 2 x 32 byte receive and a 2 x 32 byte transmit  
FIFO, as well as an intelligent FIFO controller, builds a flexible interface to the upper protocol  
layers implemented in the microcontroller.  
The extent of LAPD protocol support is dependent on the selected message transfer mode,  
see section 2.4.1.  
Semiconductor Group  
103  
 
Operational Description  
Table 11  
Interrupts from ICC HDLC Controller  
Mnemonic  
Register Meaning  
Reaction  
Layer-2 Receive  
RPF  
ISTA  
ISTA  
Receive Pool Full. Request to  
read received octets of an  
uncompleted HDLC frame from  
RFIFO.  
Read 32 octets from RFIFO and  
acknowledge with RMC.  
RME  
Receive Message End.  
Read RFIFO (number of octets  
Request to read received octets given by RBCL4-0) and status  
of a complete HDLC frame (or information and acknowledge  
the last part of a frame) from  
RFIFO.  
with RMC.  
RFO  
PCE  
EXIR  
EXIR  
Receive Frame Overflow. A  
complete frame has been lost  
because storage space in  
RFIFO was not available.  
Error report for statistical  
purposes. Possible cause:  
deficiency in software.  
Protocol Error. S or I frame with Link re-establishment.  
incorrect N(R) or S frame with I Indication to layer 3.  
field received (in auto mode  
only).  
Layer-2 Transmit  
XPR  
XMR  
XDU  
ISTA  
Transmit Pool Ready. Further  
octets of an HDLC frame can be the frame currently being  
written to XFIFO.  
If XIFC was issued (auto  
mode), indicates that the  
message was successfully  
acknowledged with S frame.  
Write data bytes in the XFIFO if  
transmitted is not finished or a  
new frame is to be transmitted,  
and issue an XIF, XIFC, XTF or  
XTFC command.  
EXIR  
EXIR  
Transmit Message Repeat.  
Frame must be repeated  
Transmission of the frame must  
be repeated. No indication to  
because of a transmission error layer 3.  
(all HDLC message transfer  
modes) or a received negative  
acknowledgement (auto mode  
only) from peer station.  
Transmit Data Underrun.  
Frame has been aborted  
because the XFIFO holds no  
Transmission of the frame must  
be repeated. Possible cause:  
excessively long soft-  
further data and XME (XIFC or ware reaction times.  
XTFC) was not issued.  
Semiconductor Group  
104  
Operational Description  
Layer-2 Transmit (cont’d)  
Mnemonic  
Register Meaning  
Reaction  
RSC  
ISTA  
Receive Status Change. A  
status change from peer station  
has been received (RR or RNR  
frame), auto mode only.  
Stop sending new I frames.  
TIN  
ISTA  
Timer Interrupt. External timer Link re-established. Indication  
expired or, in auto mode,  
to layer 3. (Auto mode)  
internal timer (T200) and repeat  
counter (N200) both expired.  
Semiconductor Group  
105  
Operational Description  
Table 12  
List of Commands  
Command  
Mnemonic  
HEX  
Bit 7 … 0  
Meaning  
RMC  
RRES  
RNR  
80  
1000 0000 Receive Message Complete. Acknowledges a  
block (RPF) or a frame (RME) stored in the  
RFIFO).  
40  
20  
0100 0000 Reset HDLC Receiver. The RFIFIO is cleared.  
the transmit and receive counters (V(S), V(R)) are  
reset (auto mode).  
0010 0000 Receiver Not Ready (auto mode). An I or S  
frame will be acknowledged with RNR frame.  
STI  
10  
0A  
0001 0000 Start Timer.  
XTFC  
0000 1010 Transmit Transparent Frame and Close.  
Enables the “transparent” transmission of the  
block entered last in the XFIFO. The frame is  
closed with a CRC and a flag.  
XIFC  
06  
0000 0110 Transmit I Frame and Close. Enables the “auto  
mode” transmission of the block entered last in the  
XFIFO. The frame is closed with a CRC and a flag.  
XTF  
XIF  
08  
04  
01  
0000 1000 Transmit Transparent Frame. Enables the  
“transparent” transmission of the block entered  
last in the XFIFO without closing the frame.  
0000 0100 Transmit I Frame. Enables the “auto mode”  
transmission of the block entered last in the  
XFIFO without closing the frame.  
XRES  
0000 0001 Reset HDLC Transmitter. The XFIFO is cleared.  
Semiconductor Group  
106  
Operational Description  
3.5.2.1HDLC Frame Reception  
Assuming a normally running communication link (layer 1 activated, layer 2 link established),  
figure 31 illustrates the transfer of an I frame. The transmitter is shown on the left and the  
receiver on the right, with the interaction between the microcontroller system and the ICC in  
terms of interrupt and command stimuli.  
When the frame (excluding the CRC field) is not longer than 32 bytes, the whole frame is  
transferred in one block. The reception of the frame is reported via the Receive Message End  
(RME) interrupt. The number of bytes stored in RFIFO can be read out from RBCL. The  
Receive Status Register (RSTA) includes information about the frame, such as frame aborted  
yes/no or CRC valid yes/no and, if complete or partial address recognition is selected, the  
identification of the frame address.  
Depending on the HDLC message transfer mode, the address and control field of the frame  
can be read from auxiliary registers (SAPR and RHCR), as shown in figure 32.  
LAPD Link  
RPF  
RMC  
RPF  
µC-  
System  
µC-  
System  
ICC  
ICC  
RMC  
RME  
RMC  
ITD02871  
:
= Data Transfer  
*)  
In Auto Mode the "RR" Response will be Transmitted Autonomously  
Figure 31  
Transmission of an I Frame in the D Channel (Subscriber to Exchange)  
Note 1 Only if a 2-byte address field is defined (MDS0 = 1 in MODE register).  
Semiconductor Group  
107  
 
Operational Description  
Address  
High  
Address  
Low  
Flag  
Control  
Information  
CRC  
Flag  
Auto-Mode  
(U and I frames)  
SAP1,SAP2  
FE,FC  
TEI1,TEI2  
FF  
RHCR  
RFIFO  
RFIFO  
RFIFO  
RSTA  
RSTA  
RSTA  
RSTA  
RSTA  
(Note 1)  
(Note 2)  
(Note 3)  
Non-Auto  
Mode  
SAP1,SAP2  
FE,FC  
TEI1,TEI2  
FF  
RHCR  
(Note 1)  
(Note 2)  
(Note 4)  
Transparent  
Mode 1  
TEI1,TEI2  
FF  
SAPR  
SAPR  
RFIFO  
RFIFO  
Transparent  
Mode 2  
Transparent  
Mode 3  
SAP1,SAP2  
FE,FC  
ITD02872  
Description of Symbols:  
Checked automatically by ICC  
Compared with register or fixed value  
Stored into register or RFIFO  
Figure 32  
Receive Data Flow  
Note 2 Comparison with group TEI (FFH) is only made if a 2-byte address field is defined  
MDS0 = 1 in MODE register).  
Note 3 In the case of an extended, modulo 128 control field format (MCS = 1 in SAP2 register)  
the control field is stored in RHCR in compressed form (I frames).  
Note 4 In the case of extended control field, only the first byte is stored in RHCR, the second  
in RFIFO.  
Semiconductor Group  
108  
Operational Description  
A frame longer than 32 bytes is transferred to the microcontroller in blocks of 32 bytes plus one  
remainder of length 1 to 32 bytes. The reception of a 32-byte block is reported by a Receive  
Pool Full (RPF) interrupt and the data in RFIFO remains valid until this interrupt is  
acknowledged (RMC). This process is repeated until the reception of the remainder block is  
completed, as reported by RME (figure 31). If the second RFIFO pool has been filled or an  
end-of frame is received while a previous RPF or RME interrupt is not yet acknowledged by  
RMC, the corresponding interrupt will be generated only when RMC has been issued. When  
RME has been indicated, bits 0-4 of the RBCL register represent the number of bytes stored  
in the RFIFO. Bits 7 to 5 of RBCL and bits 0 to 3 of RBCH indicate the total number of 32-byte  
blocks which where stored until the reception of the remainder block. When the total frame  
length exceeds 4095 bytes, bit OV (RBCH) is set but the counter is not blocked.  
The contents of RBCL, RBCH and RSTA registers are valid only after the occurrence of the  
RME interrupt, and remain valid until the microprocessor issues an acknowledgment (RMC).  
The contents of RHCR and/or SAPR, also remain valid until acknowledgment.  
If a frame could not be stored due to a full RFIFO, the microcontroller is informed of this via the  
Receive Frame Overflow interrupt (RFO).  
3.5.2.2HDLC Frame Transmission  
After the XFIFO status has been checked by polling the Transmit FIFO Write Enable (XFW) bit  
or after a Transmit Pool Ready (XPR) interrupt, up to 32 bytes may be entered in XFIFO.  
Transmission of an HDLC frame is started when a transmit command (see table 12) is issued.  
The opening flag is generated automatically. In the case of an auto mode transmission (XIF or  
XIFC), the control field is also generated by the ICC, and the contents of register XAD1 (and,  
for LAPD, XAD2) are transmitted as the address, as shown in figure 33.  
Semiconductor Group  
109  
 
Operational Description  
* Transmit  
Transparent  
Frame  
XFIFO  
* Transmit  
I Frame  
(auto-mode only!)  
XAD1  
XAD2  
XFIFO  
Transmitted  
HDLC Frame  
Address  
High  
Address  
Low  
Flag  
Control  
INFORMATION  
CRC  
Flag  
If 2 byte  
address  
field  
Appended if CPU  
has issued  
transmit message  
end (XME)  
selected  
commend.  
ITD02862  
Description of Symbols:  
Generated automatically by ICC  
Written initially by CPU (into register)  
Loaded (repeatedly) by CPU upon ICC request (XPR interrupt)  
Figure 33  
Transmit Data Flow  
Semiconductor Group  
110  
Operational Description  
The HDLC controller will request another data block by an XPR interrupt if there are no more  
than 32 bytes in XFIFO and the frame close command bit (Transmit Message End XME) has  
not been set. To this the microcontroller responds by writing another pool of data and re-  
issuing a transmit command for that pool. When XME is set, all remaining bytes in XFIFO are  
transmitted, the CRC field and the closing flag of the HDLC frame are appended and the  
controller generates a new XPR interrupt.  
The microcontroller does not necessarily have to transfer a frame in blocks of 32 bytes. As a  
matter of fact, the sub-blocks issued by the microcontroller and separated by a transmit  
command, can be between 0 and 32 bytes long.  
If the XFIFO runs out of data and the XME command bit has not been set, the frame will be  
terminated with an abort sequence (seven 1’s) followed by inter-frame time fill, and the  
microcontroller will be advised by a Transmit Data Underrun (XDU) interrupt. An HDLC frame  
may also be aborted by setting the Transmitter Reset (XRES) command bit.  
Semiconductor Group  
111  
Register Description  
4
Detailed Register Description  
The parameterization of the ICC and the transfer of data and control information between the  
µP and ICC is performed through two register sets.  
The register set in the address range 00-2 BH pertains to the HDLC transceiver and LAPD con-  
troller. It includes the two FIFOs having an identical address range from 00-1 FH.  
The register set ranging from 30-3 AH pertains to the control of layer-1 functions and of the IOM  
interface. Since the meaning of most register bits depends on the select IOM mode (IOM-1 or  
IOM-2), the description of this register set is divided into two sections:  
Special Purpose Registers: IOM-1 mode  
Special Purpose Registers: IOM-2 mode  
The address map and a register summary are shown in the following tables:  
Table 13  
ICC Address Map 00-2BH  
Address Read  
(hex)  
Write  
Name  
Description  
Name  
Description  
00  
.
RFIFO  
Receive FIFO  
XFIFO  
Transmit FIFO  
.
1F  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
2A  
2B  
ISTA  
Interrupt Status Register  
Status Register  
MASK  
CMDR  
Mask Register  
STAR  
MODE  
TIMR  
EXIR  
Command Register  
Mode Register  
Timer Register  
Extended Interrupt Register  
Receive Frame Byte Count Low  
Receive SAPI  
XAD1  
XAD2  
SAP1  
SAP2  
TEI1  
Transmit Address 1  
Transmit Address 2  
Individual SAPI 1  
Individual SAPI 2  
Individual TEI 1  
RBCL  
SAPR  
RSTA  
Receive Status Register  
RHCR  
RBCH  
STAR2  
Receive HDLC Control  
Receive Frame Byte Count High  
Status Register 2  
TEI2  
Individual TEI 2  
Semiconcuctor Group  
112  
Register Description  
Table 14  
ICC Address Map 30-3AH  
Address Read  
(hex)  
Write  
Name  
Name  
Description  
Description  
30  
31  
SPCR  
Serial Port Control Register  
CIRR/  
CIR0  
Command /Indication Receive (0)  
CIXR/  
CIX0  
Command/Indication Transmit (0)  
MONITOR Transmit (0)  
32  
33  
34  
MOR/  
MOR0  
MONITOR Receive (0)  
MOX/  
MOX0  
SSCR/  
CIR1  
SIP Signaling Code Receive  
Command/Indication Receive 1  
SSCX/  
CIX1  
SIP Signaling Code Transmit  
Command/Indication Transmit 1  
SFCR/  
MOR1  
SIP Feature Control Read/  
MONITOR Receive 1  
SFCW/  
MOX1  
SIP Feature Control Write/  
MONITOR Transmit 1  
35  
36  
37  
38  
39  
3A  
C1R  
Channel Register 1  
C2R  
Channel Register 2  
B1CR  
B2CR  
ADF2  
MOSR  
B1 Channel Register  
B2 Channel Register  
Additional Feature Register 2  
MONITOR Status Register  
STCR  
ADF1  
Sync Transfer Control Register  
Additional Feature Register 1  
MOCR  
MONITOR Control Register  
Semiconcuctor Group  
113  
Register Description  
Table 15  
Register Summary: HDLC Operation and Status Registers  
20H  
RME RPF  
RSC  
XPR  
TIN  
CIC  
SIN  
EXI  
ISTA  
MASK W  
MAC0 STAR R  
CMD  
DIM2 DIM1 DIM0 MOD R/W  
R
20H  
21H  
21H  
XFW  
XRNR RRNR MBR  
MAC1 BVS  
XIF XME  
W
RMC RRES RNR  
STI  
XTF  
XRES  
22H  
23H  
24H  
MDS1 MDS0 TMD  
CONT  
RAC  
TIMR R/W  
VAL-  
MOS  
EXIR  
R
R
XMR XDU  
PCE  
RFO  
SOV  
SAW  
WOV  
XAD1  
24H  
25H  
RBCL R  
XAD2  
SAPR R  
RBC7 RBC6 RBC5 RBC4 RBC3 RBC2 RBC1 RBC0  
25H  
26H  
26H  
27H  
27H  
28H  
29H  
29H  
2AH  
2BH  
W
SAPI1  
CRC RAB  
SAPI2  
TEI1  
CRI  
0
SAP1  
W
RSTA R  
RDA RDO  
SA1  
SA0  
C/R  
TA  
0
MCS  
SAP2  
TEI1  
W
W
EA  
RHCR R  
TEI2  
W
TEI2  
OV  
0
EA  
XAC VN1  
VN0  
0
RBC1 RBC1 RBC9 RBC8 RHCR R  
WFA TREC SDET STAR R  
0
0
0
Semiconcuctor Group  
114  
Register Description  
Table 16  
Register Summary: Special Purpose Register IOM®-1 Mode  
IOM®-1:  
30H  
SPU SAC  
BAS  
RSS BAC  
SPM  
TLP  
CODR  
CODX  
C1C1 C1C0 C2C1 C2C0 SPCR R/W  
31H  
31H  
32H  
0
CIC0  
TCX  
0
CIRR  
CIXR  
MOR  
R
ECX  
W
R
32H  
33H  
MOX  
W
SSCR R  
SSCX W  
SFCR R  
33H  
34H  
34H  
35H  
36H  
37H  
37H  
38H  
38H  
39H  
SFC  
C1R  
C2R  
W
R/W  
R/W  
B1CR R  
STCR W  
B2CR R  
TSF  
IMS  
TBA2 TBA1 TBA0 ST1  
ST0  
SC1  
SC0  
WTC2 0  
0
0
0
0
0
0
0
0
ITF  
0
ADF1  
W
0
0
ADF2 R/W  
Semiconcuctor Group  
115  
Register Description  
Table 17  
Register Summary: Special Purpose Register IOM®-2 Mode  
IOM®-2:  
30H  
SPU  
0
0
SPM  
TLP  
C1C1 C1C0 C2C1 C2C0 SPCR R/W  
31H  
31H  
32H  
BAS  
CODR0  
CODX0  
CIC0  
1
CIC1  
1
CIR0  
CIX0  
R
RSS BAC  
W
MOR0 R  
MOX0 W  
32H  
33hH  
33hH  
34H  
CIR1  
CIXR1  
R
C
C
O
CODR1  
CODX1  
R
R
1
1
MR1  
1MR1  
MX1  
1MX1  
WR  
MOR1 R  
MOX1 W  
34H  
35H  
36H  
37H  
37H  
38H  
38H  
39H  
3AH  
3AH  
C1R  
C2R  
R/W  
R/W  
B1CR R  
STCR W  
B2CR R  
TSF  
IMS  
TBA2 TBA1 TBA0 ST1  
ST0  
SC1  
SC0  
WTC2 CI1E  
IDC  
CSEL CSEL CSEL ITF  
ADF1  
W
D2C2 D2C1 D2C0 ODS  
D1C2 D1C1 D1C0 ADF2 R/W  
MER1 MDA1 MAB1 MDR0 MER0 MDA0 MAB0 MOS  
MRC1 MIE1 MXC1 MRE0 MRC0 MIE0 MXC0 MOC  
R
W
Semiconcuctor Group  
116  
Register Description  
4.1 HDLC Operation and Status Registers  
4.1.1 Receive FIFO  
RFIFO  
Read  
Address 00-1FH  
A read access to any address within the range 00-1FH gives access to the “current” FIFO lo-  
cation selected by an internal pointer which is automatically incremented after each read ac-  
cess. This allows for the use of efficient “moving string” type commands by the processor.  
The RFIFO contains up to 32 bytes of received frame.  
After an ISTA:RPF interrupt, exactly 32 bytes are available.  
After an ISTA:RME interrupt, the number of bytes available can be obtained by reading the  
RBCL register.  
4.1.2 Transmit FIFO  
XFIFO  
Write  
Address 00-1FH  
A write access to any address within the range 00-1FH gives access to the “current” FIFO lo-  
cation selected by an internal pointer which is automatically incremented after each write ac-  
cess. This allows for the use of efficient “move string” type commands by the processor.  
Up to 32 bytes of transmit data can be written into the XFIFO following an ISTA:XPR interrupt.  
4.1.3 Interrupt Status Register  
ISTA  
Read  
Address 20H  
Value after reset: 00H  
7
0
RME RPF  
RSC XPR  
TIN  
CIC  
SIN  
EXI  
RME  
RPF  
Receive Message End  
One complete frame of length less than or equal to 32 bytes, or the last part  
of a frame of length greater than 32 bytes has been received. The contents  
are available in the RFIFO. The message length and additional information  
may be obtained from RBCH+RBCL and the RSTA register.  
Receive Poll Full  
A 32-byte block of a frame longer than 32 bytes has been received and is  
available in the RFIFO. The frame is not yet complete.  
Semiconcuctor Group  
117  
Register Description  
RSC  
XPR  
Receive Status Change. Used in auto mode only.  
A status change in the receiver of the remote station – Receiver  
Ready/Receiver Not Ready - has been detected (RR or RNR S-frame).  
The actual status of the remote station can be read from the STAR  
register (RRNR bit).  
Transmit Pool Ready  
A data block of up to 32 bytes can be written to the XFIFO.  
An XPR interrupt will be generated in the following cases:  
– after an XTF or XIF command, when one transmit pool is emptied and  
the frame is not yet complete  
– after an XTF together with an XME command is issued, when the  
whole transparent frame has been transmitted  
– after an XIF together with an XME command is issued, when the  
whole I frame has been transmitted and a positive acknowledgment from  
the remote station has been received, (auto mode).  
TIN  
CIC  
Timer Interrupt  
The internal timer and repeat counter has expired (see TIMR register).  
Channel Change  
A change in C/I channel 0 or C/I channel 1 (only in IOM-2 TE mode)  
has been recognized. The actual value can be read from CIR0 or CIR1.  
SIN  
Synchronous Transfer Interrupt  
When programmed (STCR register), this interrupt is generated to enable  
the processor to lock on to the IOM timing, for synchronous transfers.  
EXI  
Extended Interrupt  
This bit indicates that one of six non-critical interrupts has been generated.  
The exact interrupt cause can be read from EXIR.  
Note:  
A read of the ISTA register clears all bits except EXI and CISQ. EXI is  
cleared by the reading of EXIR register, CISQ is cleared by reading  
CIRR/CIR0.  
Semiconcuctor Group  
118  
Register Description  
4.1.4 Mask Register  
MASK  
Write  
Address 20H  
Value after reset: 00H  
7
0
RME RPF  
RSC XPR  
TIN  
CIC  
SIN  
EXI  
Each interrupt source in the ISTA register can be selective masked by setting  
to “1” the corresponding bit in MASK. Masked interrupt status bits are not  
indicated when ISTA is read. Instead, they remain internally stored and  
pending, until the mask bit is reset to zero.  
Note: In the event of an extended interrupt and of a C/I or S/Q channel change,  
EXI and CIC are set in ISTA even if the corresponding mask bits in MASK  
are active, but no interrupt (INT pin) is generated.  
4.1.5 Status Register  
STAR  
Read  
Address 2H  
Value after reset: 48H  
7
0
XDOV XFW XRNR RRN  
MBR MAC BVS MAC0  
XDOV  
XFW  
Transmit Data Overflow  
More than 32 bytes have been written in one pool of the XFIFO, i.e.  
data has been overwritten.  
Transmit FIFO Write Enable  
Data can be written in the XFIFO. This bit may be polled instead of (or in  
addition to) using the XPR interrupt.  
XRNR  
Transmit RNR. Used in auto mode only  
In auto mode, this bit indicates whether the ICC-B receiver is in the “ready”  
(0) or “not ready” (1) state. When “not ready”, the ICC-B sends an  
RNR S-frame autonomously to the remote station when an I frame or an  
S frame is received.  
RRNR  
Receive RNR. Used in auto mode only.  
In the auto mode, this bit indicates whether the ICC-B has received an RR  
or an RNR frame, this being an indication of the current state of the remote  
station: receiver ready (0) or receiver not ready (1).  
Semiconcuctor Group  
119  
Register Description  
MBR  
Message Buffer Ready  
This bit signifies that temporary storage is available in the RFIFO to receive  
at least the first 16 bytes of a new message.  
MAC1  
MONITOR Transmit Channel 1 Active (IOM-2 terminal mode only)  
Data transmission is in progress in MONITOR channel 1.  
BVS  
B channel valid on SIP (IOM-1 mode only). B channel on SIP (SLD)  
can be accessed.  
MAC0  
MONITOR Transmit Channel 0 Active. Used in IOM-2 mode only.  
Data transmission is in progress in MONITOR channel 0.  
4.1.6 Command Register  
CMDR  
Write  
Address 2H  
Value after reset: 00H  
7
0
RMC RRE  
RNR STI  
XTF  
XIF  
XME XRES  
Note: The maximum time between writing to the CMDR register and the execution  
of the command is 2.5 DCL clock cycles. During this time no further  
commands should be written to the CMDR register to avoid any loss of  
commands.  
RMC  
Receive Message Complete  
Reaction to RPF (Receive Pool Full) or RME (Receive Message End)  
interrupt. By setting this bit, the processor confirms that it has fetched the  
data, and indicates that the corresponding space in the RFIFO may be  
released.  
RRES  
RNR  
STI  
Receiver Reset  
HDLC receiver is reset, the RFIFO is cleared of any data.  
In addition, in auto mode, the transmit and receive counters (V(S), V(R))  
are reset.  
Receiver Not Ready. Used in auto mode only.  
Determines the state of the ICC-B HDLC receiver.  
When RNR=“0”, a received I or S-frame is acknowledged by an RR  
supervisory frame, otherwise by an RNR supervisory frame.  
Start Timer.  
The ICC-B hardware timer is started when STI is set to one. In the internal  
timer mode (TMD bit, MODE register) an S Command (RR, RNR) with poll bit  
set is transmitted in addition. The timer may be stopped by a write of the  
TIMR register.  
Semiconcuctor Group  
120  
Register Description  
XTF  
XIF  
Transmit Transparent Frame  
After having written up to 32 bytes in the XFIFO, the processor initiates  
the transmission of a transparent frame by setting this bit to “1”. The  
opening flag is automatically added to the message by the ICC-B.  
Transmit I Frame. Used in auto mode only  
After having written up to 32 bytes in the XFIFO, the processor initiates  
the transmission of an I frame by setting this bit to “1”. The opening flag,  
the address and the control field are automatically added by the ICC-B.  
XME  
Transmit Message End  
By setting this bit to “1” the processor indicates that the data block written last  
in the XFIFO complete the corresponding frame. The ICC-B terminates  
the transmission by appending the CRC and the closing flag sequence  
to the data.  
XRES  
Transmitter Reset  
HDLC transmitter is reset and the XFIFO is cleared of any data.  
This command can be used by the processor to abort a frame  
currently in transmission.  
Notes: After an XPR interrupt further data has been written in the  
XFIFO and the appropriate Transmit Command (XTF or XIF) has  
to be written in the CMDR register again to continue transmission,  
when the current frame is not yet complete (see also XPR in ISTA).  
During frame transmission, the 0-bit insertion according  
to the HDLC bit-stuffing mechanism is done automatically.  
4.1.7 Mode Register  
MODE  
Read/Write  
Address 22H  
Value after reset: 00H  
7
0
MDS MDS MDS TMD RAC DIM2 DIM1 DIM0  
MDS2-0  
Mode Select  
Determines the message transfer mode of the HDLC controller,  
as follows:  
Semiconcuctor Group  
121  
Register Description  
Number  
of  
Address  
Bytes  
MDS2  
MDS1  
MDS0  
Mode  
Address Comparison  
1.Byte 2.Byte  
Remark  
Auto mode  
TEI1,TEI2  
0
0
0
1
One-byte address  
compare. HDLC proto-  
col handling for frames  
with address TEI1  
Auto mode  
SAP1,SAP2,SAPG  
TEI1,TEI2,TEIG  
0
1
0
2
Two-byte address com-  
pare. LAPD protocol  
handling for frames  
with address SAP1 +  
TEI1  
Non-Auto  
mode  
TEI1,TEI2  
0
0
1
1
0
0
1
1
1
2
One-byte address  
compare.  
Non-Auto  
mode  
SAP1,SAP2,SAPG  
TEI1,TEI2,TEIG  
0
1
Two-byte address  
compare.  
Reserved  
1
0
Transparent  
mode 1  
TEI1,TEI2,TEIG  
1
1
>1  
Low-byte address com-  
pare.  
Transparent  
mode 2  
1
0
No address compare.  
All frames accepted.  
Transparent  
mode 3  
SAP1,SAP2,SAPG  
1
1
>1  
High-byte address  
compare.  
Note:  
TMD  
SAP1, SAP2: two programmable address values for the first received  
address byte (in the case of an address field longer than 1 byte);  
SAPG = fixed value FC / FEH.  
TEI1, TEI2: two programmable address values for the second (or the only,  
in the case of a one-byte address) received address byte;  
TEIG = fixed value FFH.  
Timer Mode  
Sets the operating mode of the ICC-B timer. In the external mode (0) the  
timer is controlled by the processor. It is started by setting the STI bit in  
CMDR and it is stopped by a write of the TIMR register.  
In the internal mode (1) the timer is used internally by the ICC-B for timeout  
and retry conditions (handling of LAPD/HDLC protocol in auto mode).  
Semiconcuctor Group  
122  
Register Description  
RAC  
Receiver Active  
The HDLC receiver is activated when this bit is set to “1”.  
DIM2-0  
Digital Interface Mode  
These bits define the characteristics of the IOM Data Ports (IDP0, IDP1)  
according to following tables:  
IOM®-1 Modes (ADF2:IMS = 0)  
DIM2-0  
Characteristics  
0
1
2
3
4
5-7  
IOM frame structure  
x
x
x
x
HDLC interface  
x
MONITOR channel  
used for TIC  
x
x
x
x
x
x
bus access 1)  
MONITOR channel  
used for data transfer  
x
x
MONITOR channel  
stop/go bit evaluated  
for D-channel  
access handling 2)  
Reserved  
x
1)  
Notes:  
If the TIC bus access handling is not required, i.e. if only one layer-2  
device occupies the D and C/I channel, the TIC bus address should be  
programmed to “111” e.g. STCR = 70H.  
2)  
This function must be selected if the ICC controls an S layer-1 device  
(SBC PEB 2080) in a TE configuration.  
Semiconcuctor Group  
123  
Register Description  
IOM®-2 Modes (ADF2:IMS = 1)  
Characteristics  
0
1
2
3
4-7  
IOM -2 terminal mode  
SPCR:SPM = 0  
x
x
x
x
IOM -2 non-terminal mode  
SPCR:SPM = 1  
x
x
x
Last octet of IOM channel 2  
used for TIC bus access  
x
x
x
Stop/go bit evaluated for  
D-channel access handling1)  
Reserved  
x
1)  
Note:  
This function must be selected if the ICC controls an S layer-1 device  
(SBCX PEB 2081) in a TE configuration.  
4.1.8 Timer Register  
TIMR  
Read/Write  
Address 23H  
Value after reset: undefined (previous value)  
7
0
CONT  
VALUE  
CNT  
The meaning depends on the selected timer mode (TMD bit, MODE register).  
* Internal Timer Mode (TMD = 1)  
CNT indicates the maximum number of S commands “N1” which are  
transmitted autonomously by the ICC after expiration of time period T1  
(retry, according to HDLC).  
Semiconcuctor Group  
124  
Register Description  
The internal timer procedure will be started in auto mode:  
– after start of an I-frame transmission  
or  
– after an “RNR” S frame has been received.  
After the last retry, a timer interrupt (TIN-bit in ISTA) is generated.  
The timer procedure will be stopped when  
– a TIN interrupt is generated. The time between the start of an I-frame  
transmission or reception of an “RNR” S frame and the generation of a  
TIN interrupt is equal to: (CNT + 1) x T1.  
– or the TIMR is written  
– or a positive or negative acknowledgement has been received.  
Note: The maximum value of CNT can be 6. If CNT is set to 7, the number  
of retries is unlimited.  
* External Timer Mode (TMD = 0)  
CNT together with VALUE determine the time period T2 after which  
a TIN interrupt will be generated:  
CNT x 2.048 s + T1  
with T1 = (VALUE + 1) x 0.064 s,  
in the normal case, and  
T2 = 16348 x CNT x DCL + T1  
with T1 = 512 x (VALUE + 1) x DCL  
when TLP = 1 (test loop activated, SPCR register).  
DCL denotes the period of the DCL clock.  
The timer can be started by setting the STI-bit in CMDR and will be  
stopped when a TIN interrupt is generated or the TIMR register is written.  
Note: If CNT is set to 7, a TIN interrupt is indefinitely generated after  
every expiration of T1.f  
VALUE  
Determines the time period T1:  
T1 = (VALUE + 1) x 0.064 s (SPCR:TLP = 0, normal mode)  
T1 = 512 x (VALUE + 1) x DCL (SPCR:TLP = 1, test mode).  
Semiconcuctor Group  
125  
Register Description  
4.1.9 Extended Interrupt Register  
EXIR  
Read  
Address 24H  
Value after reset: 00H.  
7
0
XMR XDU PCE  
RFO SOV MOS SAW WOV  
XMR  
XDU  
Transmit Message Repeat  
The transmission of the last frame has to be repeated because:  
– the ICC-B has received a negative acknowledgment to an I frame in  
auto mode (according to HDLC/LAPD)  
– or a collision on the S bus has been detected after the 32nd data byte  
of a transmit frame.  
Transmit Data Underrun  
The current transmission of a frame is aborted by transmitting seven “1’s”  
because the XFIFO holds no further data. This interrupt occurs whenever  
the processor has failed to respond to an XPR interrupt (ISTA register)  
quickly enough, after having initiated a transmission and the message  
to be transmitted is not yet complete.  
Note:  
PCE  
When a XMR or an XDU interrupt is generated, it is not possible to send  
transparent frames or I frames until the interrupt has been acknowledged  
by reading EXIR.  
Protocol Error. Used in auto mode only.  
A protocol error has been detected in auto mode due to a received  
– S or I frame with an incorrect sequence number N (R) or  
– S frame containing an I field.  
RFO  
Receive Frame Overflow  
The received data of a frame could not be stored, because the RFIFO is  
occupied. The whole message is lost.  
This interrupt can be used for statistical purposes and indicates that the  
processor does not respond quickly enough to an RPF or RME interrupt (ISTA).  
SOV  
MOS  
Synchronous Transfer Overflow  
The synchronous transfer programmed in STCR has not been  
acknowledged in time via the SC0/SC1 bit.  
MONITOR Status  
A change in the MONITOR Status Register (MOSR) has occurred (IOM-2).  
A new MONITOR channel byte is stored in MOR0 (IOM-1).  
Semiconcuctor Group  
126  
Register Description  
SAW  
WOV  
Subscriber Awake. Used only if terminal specific functions are  
enabled (STCR:TSF = 1).  
Indicates that a falling edge on the EAW line has been detected, in case  
the terminal specific functions are enabled (TSF-bit in STCR).  
Watchdog Timer Overflow. Used only if terminal specific functions  
are enabled (STCR:TSF = 1).  
Signals the expiration of the watchdog timer, which means that the  
processor has failed to set the watchdog timer control bits WTC1 and  
WTC2 (ADF1 register) in the correct manner. A reset pulse has been  
generated by the ICC-B.  
4.1.10  
Transmit Address 1  
XAD1  
Write  
Address 24H  
7
0
Used in auto mode only.  
XAD1 contains a programmable address byte which is appended  
automatically to the frame by the ICC-B in auto mode. Depending on  
the selected address mode XAD1 is interpreted as follows:  
* 2-Byte Address Field  
XAD1 is the high byte (SAPI in the ISDN) of the 2-byte address field. Bit  
1 is interpreted as the command/response bit “C/R”. It is automatically  
generated by the ICC-B following the rules of ISDN LAPD protocol and the  
CRI bit value in SAP1 register. Bit 1 has to be set to “0”.  
C/R Bit  
Command  
Response  
Transmitting End  
subscriber  
CRI Bit  
0
1
1
0
0
0
network  
In the ISDN LAPD the address field extension bit “EA”, i.e. bit 0 of XAD1  
has to be set to “0”.  
* 1-Byte Address Field  
According to the X.25 LAPB protocol, XAD1 is the address of  
a command frame.  
Note: In standard ISDN applications only 2-byte address fields are used.  
Semiconcuctor Group  
127  
Register Description  
4.1.11  
Receive Frame Byte Count Low RBCL  
Read  
Address 25H  
Value after reset: 00H  
7
0
RBC7 ...  
...  
...  
...  
...  
...  
RBC0  
RBC7-0  
Receive byte Count  
Eight least significant bits of the total number of bytes in a received  
message. Bits RBC4-0 indicate the length of a data block currently  
available in the RFIFO, the other bits (together with RBCH) indicate  
the number of whole 32-byte blocks received.  
If exactly 32 bytes are received RBCL holds the value 20H.  
4.1.12  
Transmit Address 1  
XAD2  
Write  
Address 25H  
7
0
Used in auto mode only.  
XAD2 contains the second programmable address byte, whose function  
depends on the selected address mode:  
* 2-Byte Address Field  
XAD2 is the low byte (TEI in the ISDN) of the 2-byte address field.  
* 1-Byte Address Field  
According to the X.25 LAPB protocol, XAD2 is the address of  
a response frame.  
Note: See note to XAD1 register description.  
Semiconcuctor Group  
128  
Register Description  
4.1.13  
Received SAPI Register  
SAPR  
Read  
Address 26H  
7
0
When a transparent mode 1 is selected SAPR contains the value of the  
first address byte of a receive frame.  
4.1.14  
SAPI1 Register  
SAP1  
Write  
Address 26H  
7
0
SAPI1  
CRI  
0
SAPI1  
CRI  
SAPI1 value  
Value of the first programmable Service Access Point Identifier (SAPI)  
according to the ISDN LAPD protocol.  
Command/Response Interpretation  
CRI defines the end of the ISDN user-network interface the ICC-B is used  
on, for the correct identification of “Command” and “Response” frames.  
Depending on the value of CRI the C/R-bit will be interpreted by the  
ICC-B, when receiving frames in auto mode, as follows:  
C/R Bit  
CRI Bit  
Receiving End  
Command  
Response  
0
1
subscriber  
network  
1
0
0
1
For transmitting frames in auto mode, the C/R-bit manipulation will also  
be done automatically, depending on the value of the CRI-bit  
(refer to XAD1 register description).  
In message transfer modes with SAPI address recognition the first received  
address byte is compared with the programmable values in SAP1, SAP2  
and the fixed group SAPI.  
In 1-byte address mode, the CRI-bit is to be set to “0”.  
Semiconcuctor Group  
129  
Register Description  
4.1.15  
Receive Status Register  
RSTA  
Read  
Address 27H  
Value after reset: undefined  
7
0
RDA RDO CRC RAB SA1  
SA0  
C/R  
TA  
RDA  
RDO  
Receive Data  
A “1” indicates that data is available in the RFIFO. After an RME-interrupt,  
a “0” in this bit means that data is available in the internal registers RHCR  
or SAPR only (e.g. S-frame). See also RHCR-register description table.  
Receive Data Overflow  
At least one byte of the frame has been lost, because it could not be  
stored in RFIFO (1).  
CRC  
RAB  
CRC Check  
The CRC is correct (1) or incorrect (0).  
Receive Message Aborted  
The receive message was aborted by the remote station (1), i.e. a sequence  
of 7 1’s was detected before a closing flag.  
SA1-0  
TA  
SAPI Address Identification  
TEI Address Identification  
SA1-0 are significant in auto-mode and non-auto-mode with a two-byte  
address field, as well as in transparent mode 3. TA is significant in all modes  
except in transparent modes 2 and 3.  
Two programmable SAPI values (SAP1, SAP2) plus a fixed group SAPI  
(SAPG of value FC/FEH), and two programmable TEI values (TEI1, TEI2)  
plus a fixed group TEI (TEIG of value FFH), are available for address  
comparison.  
Semiconcuctor Group  
130  
Register Description  
The result of the address comparison is given by SA1-0 and TA, as follows:  
Address Match with  
st  
nd  
SA1  
SA0  
TA  
1 Byte  
2
Byte  
Number of Address  
Bytes=1  
x
x
x
x
0
1
TEI2  
TEI1  
-
-
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
x
SAP2  
SAP2  
SAPG  
SAPG  
SAP1  
SAP1  
TEIG  
TEI2  
TEIG  
TEI1 or TEI2  
TEIG  
Number of address  
Bytes=2  
TEI1  
reserved  
Notes: If the SAPI values programmed to SAP1 and SAP2 are identical the reception  
of a frame with SAP2/TEI2 results in the indication SA1=1, SA0-0, TA=1.  
Normally RSTA should be read by the processor after an RME-interrupt in  
order to determine the status of the received frame. The contents of RSTA are  
valid only after an RME-interrupt, and remain so until the frame is acknowled-  
ged via the RMC-bit.  
C/R  
Command/Response  
The C/R-bit identifies a receive frame as either a command or a response,  
according to the LAPD-rules:  
Command  
Response  
Direction  
0
1
1
0
Subscriber to network  
Network to subscriber  
4.1.16  
SAP12 Register  
SAP2  
Write  
Address 27H  
7
0
S
A
P
I
2
MCS  
0
SAP12  
SAP12 value  
Value of the second programmable Service Access Point Identifier (SAPI)  
according to the ISDN LAPD-protocol.  
Semiconcuctor Group  
131  
Register Description  
MCS  
Modulo Count Select. Used in auto-mode only.  
This bit determines the HDLC-control field format as follows:  
0: One-byte control field (modulo 8)  
1: Two-byte control field (modulo 128)  
4.1.17  
TEI1 Register 1  
TEI1  
Write  
Address 28H  
7
0
T
E
I
1
EA  
EA  
Address field Extension bit  
This bit is set to “1” according to HDLC/LAPD.  
In all message transfer modes except in transparent modes 2 and 3,  
TEI1 is used by the ICC-B for address recognition. In the case of a two-byte  
address field, it contains the value of the first programmable Terminal  
Endpoint Identifier according to the ISDN LAPD-protocol.  
In the auto-mode with a two-byte address field, numbered frames with the  
address SAPI1-TEI1 are handled autonomously by the ICC-B according  
to the LAPD-protocol.  
Note: If the value FFH is programmed in TEI1, received numbered frames  
with address SAPI1-TEI1 (SAPI1-TEIG) are not handled autono-  
mously by the ICC-B.  
In auto and non-auto-modes with one-byte address field, TEI1 is a command  
address, according to X.25 LAPB.  
4.1.18  
Receive HDLC Control Register  
RHCR  
Read  
Address 29H  
7
0
In all modes except transparent modes 2 and 3, this register contains the control field of a re-  
ceived HDLC-frame. In transparent modes 2 and 3, the register is not used.  
Semiconcuctor Group  
132  
Register Description  
Contents of RHCR  
Mode  
Modulo 8 (MCS=0) Modulo 128  
(MCS=1)  
Contents of RFIFO  
From 3rd byte after flag  
(Note 4)  
Auto-mode,  
1-byte address  
(U/I frames)  
Control field  
U-frames only:  
Control field  
(Note 2)  
(Note 1)  
From 4th byte after flag  
(Note 4)  
Auto-mode,  
2-byte address  
(U/I frames)  
Control field  
U-frames only:  
Control field  
(Note 2)  
(Note 1)  
From 4th byte after flag  
(Note 4)  
Auto-mode,  
1-byte address  
(I frames)  
Control field  
compressed form  
(Note 3)  
From 5th byte after flag  
(Note 4)  
Auto-mode,  
2-byte address  
(I frames)  
Control field in  
compressed form  
(Note 3)  
2nd byte after flag  
3rd byte after flag  
From 3rd byte after flag  
From 4th byte after flag  
Non-auto-mode,  
1-byte address  
Non-auto-mode,  
2-byte address  
3rd byte after flag  
From 4th byte after flag  
From 1st byte after flag  
From 2nd byte after flag  
Transparent mode 1  
Transparent mode 2  
Transparent mode 3  
Note 1  
S-frames are handled automatically and are not transferred to the micropro-  
cessor.  
Note 2  
Note 3  
For U-frames (bit 0 of RHCR = 1) the control field is as in the modulo 8 case.  
For I-frames (bit 0 of RHCR = 0) the compressed control field has the same  
format as in the modulo 8 case, but only the three LSB’s of the receive and  
transmit counters are visible:  
bit  
7
6
5
4
3
2
1
0
0
N (R)  
2-0  
P
N (S)  
2-0  
Note 4  
I-field.  
Semiconcuctor Group  
133  
Register Description  
4.1.19  
TEI2 Register  
TEI2  
Write  
Address 29H  
7
0
T
E
I
2
EA  
EA  
Address field Extension bit  
This bit is to be set to “1” according to HDLC/LAPD.  
In all message transfer modes except in transparent modes 2 and 3, TEI2 is used by the ICC-B  
for address recognition. In the case of a two-byte address field, it contains the value of the sec-  
ond programmable Terminal Endpoint Identifier according of the ISDN LAPD-protocol.  
In auto and non-auto-modes with one-byte address field, TEI2 is a response address, according  
to X.25 LAPD.  
4.1.20 Receive Frame Byte Count High  
RBCH  
Read  
Address 30H  
Value after reset: 0XXX000002.  
7
0
XAC  
VN1  
VN0  
OV  
RBC11 RBC10 RBC9 RBC8  
XAC  
Transmitter Active  
The HDLC-transmitter is active when XAC = 1. This bit may be polled.  
The XAC-bit is active when  
– either an XTF/XIF-command is issued and the frame has not been completely  
transmitted  
– or the transmission of an S-frame is internally initiated and not yet completed.  
Version Number of Chip  
VN1-0  
OV  
0 ... A1 or A3 version  
1 ... B1 version  
2 ... B2 & B3 version  
3 ... Version 2.4  
Overflow  
A “1” in this bit position indicates a message longer than 4095 bytes.  
RBC8-11 Receive Byte Count  
Four most significant bits of the total number of bytes in a received message.  
Semiconcuctor Group  
134  
Register Description  
Note:  
4.1.21  
Normally RBCH and RBCL should be read by the processor after an RME-  
interrupt in order to determine the number of bytes to be read from the RFIFO,  
and the total message length. The contents of the registers are valid only after  
an RME-interrupt, and remain so until the frame is acknowledged via the  
RMC-bit.  
Status Register 2  
STAR2  
Read  
Address 2BH  
7
0
0
0
0
0
WFA  
0
TREC SDET  
SDET  
TREC  
S-frame detected: this bit is set to “1” by the first received correct I-frame or  
S-command with p = 1.  
It is reset by reading the STAR2 register.  
Timer recovery status:  
0: The device is not in the Timer Recovery state.  
1: The device is in the Timer Recovery state.  
WFA  
Waiting for Acknowledge. This bit shows, if the last transmitted I-frame was  
acknowledged, i.e. V(A) = V(S) (=> WFA= 0) or was not yet acknowledged,  
i.e. V(A)< V(S) (=> WFA = 1).  
4.2 Special Purpose Registers: IOM-1Mode  
The following register description is only valid if IOM-1 Mode is selected (ADF2:IMS = 0).  
For IOM-2 Mode refer to chapter 4.3.  
4.2.1  
Serial Port Control Register  
SPCR  
Read/Write  
Address 30H  
Value after reset: 00H  
7
0
SPU  
SAC  
SPM  
TLP  
C1C1  
C1C0  
C2C1  
C2C0  
Important Note  
After a hardware reset the pins SDAX/SDS1 and SCA/FSD/SDS2 are  
both “low” and have the functions of SDS1 and SDS2 in terminal timing  
mode (since SPM = 0), respectively, until the SPCR is written to for the  
first time. From that moment, the function taken on by these pins  
depends on the state of the IOM Mode Select bit IMS (ADF2 register).  
Semiconcuctor Group  
135  
Register Description  
SPU  
Software Power Up. Used in TE-mode only.  
Setting this bit to 1 will pull the IDP1-line low. This will enforce the connected  
layer-1 device to deliver IOM-clocking.  
After power down in TE-mode the SPU-bit has to be set to “1” and then cleared  
again.  
After a subsequent CIC-interrupt (C/I-code change; ISTA) and reception of the  
C/I-code “PU” (Power Up indication in TE-mode) the reaction of the processor  
would be:  
– to write an Activate Request command as C/I-code in the CIXR-register  
– to reset the SPU-bit and wait for the following CIC-interrupt.  
SAC  
SPM  
SIP-port activation; SIP-port is in high impedance state (SAC=0) or operating  
(SAC=1).  
Serial Port Timing Mode; Depending on the interface mode, the following timing  
options are provided.  
0 Timing mode 0; SIP (SLD) operates in master mode, SCA-supplies the 128-kHz  
data clock signal for port A (SSI).  
Typical applications: TE, NT-modes  
1 Timing mode 1; SIP (SLD) operates in slave mode, FSD supplies a delayed  
frame synchronization signal for the IOM interface, serial port A (SSI) is not  
used.  
Typical applications: LT-T, LT-S-modes.  
TLP  
Test Loop  
When set to 1 the IDP1 and IDP0 lines are internally connected together, and the  
times T1 and T2 are reduced (cf. TIMR).  
C1C1, C1C0  
Channel 1 Connect  
Switching of B1 channel  
C1R  
B1CR  
Read  
C1C1  
C1C0  
Read  
Write  
Application(s)  
0
0
1
1
0
1
0
1
SIP  
SIP  
SDAR  
IOM  
SIP  
IOM  
IOM  
IOM  
B1 not switched, SIP-looping  
B1 switched to/from SIP  
B1 switched to/from SPa (SSI)  
IOM-looping  
IOM  
Semiconcuctor Group  
136  
Register Description  
C2C1, C2C0  
Channel 2 Connect  
Switching of B2-channel  
C2R  
B2CR  
Read  
C2C1  
C2C0  
Read  
Write  
Application(s)  
0
0
1
1
0
1
0
1
SIP  
SIP  
SDAR  
IOM  
SIP  
IOM  
IOM  
IOM  
B2 not switched, SIP-looping  
B2 switched to/from SIP  
B2 switched to/from SPa (SSI)  
IOM-looping  
IOM  
4.2.2  
Command/Indication Receive Register  
CIRR  
Read  
Address 31H  
Value after reset: 7CH.  
7
0
0
BAS  
C
O
D
R
CIC0  
0
BAS  
Bus Access Status  
Indicates the state of the TIC-bus:  
0: the ICC-B itself occupies the D-and C/I-channel  
1: another device occupies the D-and C/I-channel  
CODR  
CIC0  
C/I-code Receive  
Value of the receive Command/Indication code. A C/I-code is loaded in CODR  
only after being the same in two consecutive IOM-frames and the previous  
code has been read from CIRR.  
C/I-Code Change  
A change in the received Command/Indication code has been recognized.  
This bit is set only when a new code is detected in two consecutive IOM-  
frames. It is reset by a read of CIRR.  
Note:  
The BAS and CODR bits are updated every time a new C/I-code is detected  
in two consecutive IOM-frames.  
If several consecutive codes are detected and CIRR is not read, only the first  
and the last C/I-code (and BAS bit) is made available in CIRR at the first and  
second read of that register, respectively.  
Semiconcuctor Group  
137  
Register Description  
4.2.3  
Command/Indication Transmit Register  
CIXR  
Write  
Address 31H  
Value after reset: 3CH.  
7
0
RSS  
BAC  
C
O
D
X
TCX  
ECX  
RSS  
Reset Source Select  
Only valid if the terminal specific functions are activated (STCR:TSF).  
0 Subscriber or Exchange Awake  
As reset source serves:  
– a falling edge on the EAW-line (External Subscriber Awake)  
– a C/I-code change (Exchange Awake).  
A logical zero on the EAW-line activates also the IOM-interface clock  
and frame signal, just as the SPU-bit (SPCR) does.  
1 Watchdog Timer  
The expiration of the watchdog timer generates a reset pulse.  
The watchdog timer will be reset and restarted, when two specific bit  
combinations are written in the ADF1-register within the time period of  
128 ms (see also ADF1 register description).  
After a reset pulse generated by the ICC-B and the corresponding  
interrupt (WOV, SAW or CIC) the actual reset source can be read from  
the ISTA and EXIR-register.  
BAC  
Bus Access Control  
Only valid if the TIC-bus feature is enabled (MODE:DIM2-0).  
If this bit is set, the ICC-B will try to access the TIC-bus to occupy the  
C/I-channel even if no D-channel frame has to be transmitted. It should be reset  
when the access has been completed to grant a similar access to other devices  
transmitting in that IOM-channel.  
Note: Access is always granted by default to the ICC-B with TIC-bus Address  
(TBA2-0, STCR register) “7”, which is the lowest priority in a bus configuration.  
CODX C/I-Code Transmit  
Code to be transmitted in the C/I-channel.  
T-channel transmit  
TCX  
ECX  
Output on IOM in T-channel.  
E-channel transmit  
Output on IOM in E-channel.  
Semiconcuctor Group  
138  
Register Description  
4.2.4  
4.2.5  
4.2.6  
MONITOR Receive Register  
MOR  
Read  
Address 32H  
7
0
Contains the MONITOR data received according to the MONITOR chan-  
nel protocol (E-bit = 0).  
MONITOR Transmit Register  
MOX  
Write  
Address 32H  
7
0
The byte written into MOX is transmitted once in the MONITOR  
channel.  
SIP Signaling Code Receive  
SSCR  
Read  
Address 33H  
7
0
SSCR SIP-signaling code received; only valid in timing mode 0 (SPCR:SPM = 0).  
The signaling byte received on SIP can be read from this register.  
4.2.7  
SIP Signaling Code Transmit  
SSCX  
Write  
Address 33H  
Value after reset: FFH  
7
0
Semiconcuctor Group  
139  
Register Description  
SSCX SIP signaling code transmit; significant only in timing mode 0 (SPCR:SPM = 0).  
The contents of SSCX are continuously output in the signaling byte on SIP (SLD).  
4.2.8  
SIP Feature Control Read  
SFCR  
Read  
Address 34H  
7
0
Contains the FC-data received on SIP (timing mode 0 only,  
SPCR:SPM = 0).  
4.2.9  
SIP Feature Control Write  
SFCW  
Write  
Address 34H  
7
0
The byte written into SFCW is output once on SIP in the FC-channel  
(timing mode 0 only, SPCR:SPM = 0).  
4.2.10 Channel Register 1  
C1R  
Read/Write  
Address 35H  
7
0
Contains the value received/transmitted in the B1-channel  
(cf. C1C1, C1C0, SPCR-register).  
4.2.11 Channel Register 2  
C2R  
Read/Write  
Address 36H  
7
0
Contains the value received/transmitted in the B2-channel  
(cf. C2C1, C2C0, SPCR-register).  
Semiconcuctor Group  
140  
 
 
Register Description  
4.2.12 B1 Channel Register  
B1CR  
Read  
Address 37H  
7
0
Contains the value received in the B1-channel, as if programmed  
(cf. C1C1, C1C0, SPCR-register).  
4.2.13 Synchronous Transfer Control Register  
STCR  
Write  
Address 37H  
Value after reset: 00H  
7
0
TSF  
TBA2  
TBA1 TBA0  
ST1  
ST0  
SC1  
SC0  
TSF  
Terminal Specific Functions  
0
1
No terminal specific functions  
The terminal specific functions are activated, such as  
– Watchdog Timer  
– Subscriber/Exchange Awake (SIP/EAW).  
In this case the SIP/EAW-line is always an input signal which can serve  
as a request signal from the subscriber to initiate the awake function in  
a terminal.  
A falling edge on the EAW-line generates an SAW interrupt (EXIR).  
When the RSS-bit in the CIXR-register is zero, a falling edge on the  
EAW-line (Subscriber Awake) or a C/I-code change (Exchange Awake)  
initiates a reset pulse.  
When the RSS-bit is set to one a reset pulse is triggered only by the  
expiration of the watchdog timer (see also CIXR-register description).  
Note:  
The TSF-bit will be cleared only by hardware reset.  
TBA2-0 TIC Bus Address  
Defines the individual address for the ICC-B on the IOM-bus.  
This address is used to access the C/I and D-channel on the IOM.  
Note:  
One device liable to transmit in C/I and D-fields on IOM should always be given  
the address value “7”.  
Semiconcuctor Group  
141  
 
Register Description  
ST1  
ST0  
SC1  
Synchronous Transfer 1  
When set, causes the ICC-B to generate an SIN-interrupt status (ISTA register)  
at the beginning of an IOM-frame.  
Synchronous Transfer 0  
When set, causes the ICC-B to generate an SIN-interrupt status (ISTA register)  
at the middle of an IOM-frame.  
Synchronous Transfer 1 Completed  
After an SIN-interrupt the processor has to acknowledge the interrupt by  
setting the SC1-bit before the middle of the IOM-frame, if the interrupt was  
originated from a Synchronous Transfer 1 (ST1).  
Otherwise an SOV-interrupt (EXIR register) will be generated.  
Synchronous Transfer 0 Completed  
SC0  
After an SIN-interrupt the processor has to acknowledge the interrupt by  
setting the SC0-bit before the start of the next IOM-frame, if the interrupt was  
originated from a Synchronous Transfer 0 (ST0).  
Otherwise an SOV-interrupt (EXIR register) will be generated.  
Note:  
ST0/1 and SC0/1 are useful for synchronizing MP-accesses and receive/  
transmit operations.  
4.2.14 B2 Channel Register  
B2CR  
Read  
Address 38H  
7
0
Contains the value received in the B2-channel, as if programmed  
(cf. C2C1, C2C0, SPCR-register).  
4.2.15 Additional Feature Register 1  
ADF1  
Write  
Address 38H  
Value after reset: 00H  
7
0
WTC1 WTC2  
0
0
0
0
0
ITF  
Semiconcuctor Group  
142  
 
Register Description  
WTC1, WTC2 Watchdog Timer Control 1, 2  
After the watchdog timer mode has been selected (STCR:TSF = CIXR:RSS = 1)  
the watchdog timer is started.  
During every time period of 128 ms the processor has to program the WTC1- and  
WTC2-bit in the following sequence:  
WTC1  
WTC2  
1.  
2.  
1
0
0
1
to reset and restart the watchdog timer.  
If not, timer expires and a WOV-interrupt (EXIR) together with a reset pulse is  
generated.  
ITF  
Inter-frame Time Fill  
Selects the inter-frame time fill signal which is transmitted between HDLC-frames.  
0: idle (continuous 1 s),  
1: flags (sequence of patterns: “0111 1110”)  
Note:  
In TE- and LT-T-applications with D-channel access handling (collision  
resolution), the only possible inter-frame time fill signal is idle (continuous 1s).  
Otherwise the D-channel on the S/T-bus cannot be accessed.  
4.2.16 Additional Feature Register 2  
ADF2  
Read/Write  
Address 39H  
Value after reset: 00H  
7
0
IMS  
0
0
0
0
0
0
0
IMS  
IOM-mode selection  
IOM-1 interface mode is selected when IMS = 0.  
Semiconcuctor Group  
143  
 
Register Description  
4.3 Special Purpose Registers: IOM-2 Mode  
The following register description is only valid if IOM-2 is selected (ADF2:IMS-1).  
For IOM-1 mode refer to chapter 4.2.  
4.3.1  
Serial Port Control Register  
SPCR  
Read/Write  
Address 30H  
Value after reset: 00H  
7
0
SPU  
0
SPM  
TLP  
C1C1  
C1C0  
C2C1 C2C0  
Important Note: After a hardware reset the pins SDAX/SDS1 and SCA/FSD/SDS2 are  
both “low” and have the functions of SDS1 and SDS2 in terminal  
timing mode (since SPM = 0), respectively, until the SPCR is written  
to for the first time. From that moment, the function taken on by  
these pins depends on the state of the IOM Mode Select bit IMS  
(ADF2 register).  
SPU  
Software Power UP. Used in TE-mode only.  
Setting this bit to 1 and ADF1:IDC to 1 will pull the IDP1-line to low. This will  
enforce connected layer 1 devices to deliver IOM-clocking.  
After power down in TE-mode the SPU-bit and the ADF1:IDC bit have to be  
set to “1” and then cleared again.  
After a subsequent CIC-interrupt (C/I-code change; ISTA) and reception of the  
C/I-code “PU” (Power Up indication in TE-mode) the reaction of the processor  
would be:  
– to write an Activate Request command as C/I-code in the CIX0-register.  
– to reset the SPU and SQXR:IDC bits and wait for the following CIC-interrupt.  
Serial Port Timing Mode  
SPM  
TLP  
0 Terminal mode; all three channels of the IOM-2 interface are used  
application: TE-mode  
1 Non-terminal mode; the programmed IOM-channel (ADF1:CSEL2-0) is used  
applications: LT-T, LT-S modes (8 channels structure IOM-2)  
Test Loop  
When set to 1 the IDP1 and IDP0-lines are internally connected together, and  
the times T1 and T2 are reduced (cf. TIMR).  
Semiconcuctor Group  
144  
Register Description  
C1C1, C1C0 Channel 1 Connect  
Determines which of the two channels B1 or IC1 is connected to register  
C1R and/or B1CR, for monitoring, test-looping and switching data to/from  
the processor.  
C1R  
Read  
IC1  
B1CR  
Read  
B1  
C1C1  
C1C0  
Write  
Application(s)  
0
0
B1-monitoring + IC1-monitoring  
0
1
1
1
0
1
IC1  
IC1  
B1  
B1  
B1  
B1  
B1-monitoring + IC1-looping  
from/to IOM  
B1-access from/to S0; transmission of a  
constant value in B1-channel to S0.  
B1  
B1-looping from S0; transmission of a  
variable pattern in B1-channel to S0.  
C2C1, C2C0 Channel 2 Connect  
Determines which of the two channels B2 or IC2 is connected to register  
C2R and/or B2CR, for monitoring, test-looping and switching data  
to/from the processor.  
C2R  
Read  
IC2  
B2CR  
Read  
B2  
C2C1  
C2C0  
Write  
Application(s)  
0
0
B2-monitoring + IC2-monitoring  
0
1
1
1
0
1
IC2  
IC2  
B2  
B2  
B2  
B2  
B2-monitoring + IC2-looping  
from/to IOM  
B2-access from/to S0; transmission of a  
constant value in B2-channel to S0.  
B2  
B2-looping from S0; transmission of a  
variable pattern in B2-channel to S0.  
Note: B-channel access is only possible in TE-mode.  
Semiconcuctor Group  
145  
Register Description  
4.3.2  
Command/Indication Receive 0  
CIR0  
Read  
Address 31H  
Value after reset: 7CH  
7
0
0
BAS  
C
O
D
R
0 CIC0  
CIC1  
BAS  
Bus Access Status  
Indicates the state of the TIC-bus:  
0: the ICC-B itself occupies the D- and C/I-channel  
1: another device occupies the D- and C/I-channel  
CODR0  
CIC0  
C/I code 0 Receive  
Value of the received Command/Indication code. A C/I-code is loaded in  
CODR0 only after being the same in two consecutive IOM-frames and the  
previous code has been read from CIR0.  
C/I Code 0 Change  
A change in the received Command/Indication code has been recognized.  
This bit is set only when a new code is detected in two consecutive  
IOM-frames. It is reset by a read of CIR0.  
CIC1  
C/I Code 1 Change  
A change in the received Command/Indication code in IOM-channel 1 has  
been recognized. This bit is set when a new code is detected in one  
IOM-frame. It is reset by a read of CIR0.  
CIC1 is only used if Terminal Mode is selected.  
Note:  
The BAS and CODR0 bits are update every time a new C/I-code is detected  
in two consecutive IOM-frames.  
If several consecutive valid new codes are detected and CIR0 is not read,  
only the first and the last C/I code (and BAS bit) is made available in CIR0  
at the first and second read of that register, respectively.  
4.3.3  
Command/Indication Transmit 0  
CIX0  
Write  
Address 31H  
Value after reset: 3FH  
7
0
RSS  
BAC  
C
O
D
X
0 1  
1
Semiconcuctor Group  
146  
Register Description  
RSS  
Reset Source Select  
Only valid if the terminal specific functions are activated (STCR:TSF).  
0 Subscriber or Exchange Awake  
As reset source serves:  
– a falling edge on the EAW-line (External Subscriber Awake)  
– a C/I code change (Exchange Awake).  
A logical zero on the EAW-line activates also the IOM-interface clock  
and frame signal, just as the SPU-bit (SPCR) does.  
1 Watchdog Timer  
The expiration of the watchdog timer generates a reset pulse.  
The watchdog timer will be reset and restarted, when two specific bit  
combinations are written in the ADF1-register within the time period of  
128 ms (see also ADF1 register description).  
After a reset pulse generated by the ICC-B and the corresponding inter-  
rupt (WOV, SAW or CIC) the actual reset source can be read from the  
ISTA and EXIR-register.  
BAC  
Bus Access Control  
Only valid if the TIC-bus feature is enabled (MODE:DIM2-0).  
If this bit is set, the ICC-B will try to access the TIC-bus to occupy the  
C/I-channel even if no D-channel frame has to be transmitted. It should be  
reset when the access has been completed to grant a similar access to other  
devices transmitting in that IOM-channel.  
Note: Access is always granted by default to the ICC-B with TIC-Bus Address  
(TBA2-0, STCR register) “7”, which has the lowest priority in a bus  
configuration.  
CODX0  
4.3.4  
C/I-Code 0 Transmit  
Code to be transmitted in the C/I-channel / C/I-channel 0.  
MONITOR Receive Channel 0  
MOR0  
Read  
Address 32H  
7
0
Contains the MONITOR data received in IOM-MONITOR Channel/  
MONITOR channel 0 according to the MONITOR channel protocol.  
Semiconcuctor Group  
147  
Register Description  
4.3.5  
MONITOR Transmit Channel 0  
MOX0  
Write  
Address 32H  
7
0
Contains the MONITOR data transmitted in IOM-MONITOR Channel/  
MONITOR channel 0 according to the MONITOR channel protocol.  
4.3.6  
Command/Indication Receive 1  
CIR1  
Read  
Address 33H  
7
0
C
O
D
R
1
MR1  
MX1  
CODR1  
MR1  
C/I-Code 1 Receive; only valid in terminal mode (SPCR:SPM = 0)  
Bits 7-2 of C/I-channel 1  
MR Bit  
Bit 1 of C/I-channel 1  
MX Bit  
MX1  
Bit 0 of C/I/channel 1  
4.3.7  
Command/Indication Transmit 1  
CIX1  
Write  
Address 33H  
Value after reset: FFH  
7
0
C
O
D
X
1
1
1
CODX1  
C/I-Code 1 Transmit; significant only in terminal mode (SPCR:SPM = 0).  
Bits 7-2 of C/I-channel 1  
Semiconcuctor Group  
148  
Register Description  
4.3.8  
MONITOR Receive Channel 1  
MOR1  
Read  
Address 34H  
7
0
Used only in terminal mode (SPCR:SPM = 0).  
Contains the MONITOR data received in IOM-channel 1 according to the  
MONITOR channel protocol.  
MONITOR Transmit Channel 1MOX1WriteAddress 34H  
7
0
Used only in terminal mode (SPCR:SPM = 0).  
Contains the MONITOR data to be transmitted in IOM-channel 1 according to  
the MONITOR channel protocol.  
4.3.9  
Channel Register 1  
C1R  
Read/Write  
Address 35H  
7
0
Used only in terminal mode (SPCR:SPM = 0).  
Contains the value received/transmitted in IOM-channel B1 or IC1, as the case  
may be (cf. C1C1, C1C0, SPCR-register).  
4.3.11 Channel Register 2  
C2R  
Read/Write  
Address 36H  
7
0
Used only in terminal mode (SPCR:SPM = 0).  
Contains the value received/transmitted in IOM-channel B2 or IC2, as the case  
may be (cf. C2C1, C2C0, SPCR-register).  
Semiconcuctor Group  
149  
Register Description  
4.3.12 B1 Channel Register  
B1CR  
Read  
Address 37H  
7
0
Used only in terminal mode (SPCR:SPM = 0).  
Contains the value received in IOM-channel B1, if programmed  
(cf. C1C1, C1C0, SPCR-register).  
4.3.13 Synchronous Transfer Control Register STCR Write  
Address 37H  
Value after reset: 00H  
7
0
TSF  
TBA2  
TBA1 TBA0  
ST1  
ST0  
SC1  
SC0  
TSF  
Terminal Specific Functions  
0 No terminal specific functions  
1 The terminal specific functions are activated, such as  
– Watchdog Timer  
– Subscriber/Exchange Awake (SIP/EAW).  
In this case the SIP/EAW-line is always an input signal which can serve  
as a request signal from the subscriber to initiate the awake function in  
a terminal.  
A falling edge on the EAW-line generates an SAW-interrupt (EXIR).  
When the RSS-bit in the CIX0-register is zero, a falling edge on the  
EAW-line (Subscriber Awake) or a C/I-code change (Exchange Awake)  
initiates a reset pulse.  
When the RSS-bit is set to one a reset pulse is triggered only by the  
expiration of the watchdog timer (see also CIX0-register description).  
Note:  
The TSF-bit will be cleared only by a hardware reset.  
Semiconcuctor Group  
150  
Register Description  
TBA2-0  
TIC Bus Address  
Defines the individual address for the ICC-B on the IOM-bus.  
This address is used to access the C/I- and D-channel on the IOM.  
Note:  
ST1  
One device liable to transmit in C/I- and D-fields on the IOM should always  
be given the address value “7”.  
Synchronous Transfer 1  
When set, causes the ISAC-S to generate an SIN-interrupt status (ISTA-  
register) at the beginning of an IOM-frame.  
ST0  
Synchronous Transfer 0  
When set, causes the ICC-B to generate an SIN-interrupt status (ISTA-  
register) at the middle of an IOM-frame.  
SC1  
Synchronous Transfer 1 Completed  
After an SIN-interrupt the processor has to acknowledge the interrupt by  
setting the SC1-bit before the middle of the IOM-frame, if the interrupt was  
originated from a Synchronous Transfer 1 (ST1).  
Otherwise an SOV-interrupt (EXIR-register) will be generated.  
SC0  
Synchronous Transfer 0 Completed  
After an SIN-interrupt the processor has to acknowledge the interrupt by  
setting the SC0-bit before the start of the next IOM-frame, if the interrupt was  
originated from a Synchronous Transfer 0 (ST0).  
Otherwise an SOV-interrupt (EXIR-register) will be generated.  
Note:  
ST0/1 and SC0/1 are useful for synchronizing MP-accesses and receive/  
transmit operations.  
4.3.14 B2 Channel Register  
B2CR  
Read  
Address 38H  
7
0
Used only in terminal mode (SPCR:SPM = 0).  
Contains the value received in the IOM-channel B2, if programmed (cf. C2C1,  
C2C0, SPCR-register).  
Semiconcuctor Group  
151  
Register Description  
4.3.15 Additional Feature Register 1  
ADF1  
Write  
Address 38H  
Value after reset: 00H  
7
0
WTC1 WTC2 CI1E  
IDC  
CSEL2 CSEL1 CSEL0 ITF  
WTC1, WTC2 Watchdog Timer Control 1, 2  
After the watchdog timer mode has been selected (STCR:TSF = CIX0:RSS = 1)  
the watchdog timer is started.  
During every time period of 128 ms the processor has to program the WTC1-  
and WTC2-bit in the following sequence:  
WTC1  
WTC2  
1.  
2.  
1
0
0
1
to reset and restart the watchdog timer.  
If not, the timer expires and a WOV-interrupt (EXIR) together with a reset  
pulse is generated.  
CI1E  
IDC  
C/I-channel 1 interrupt enable  
Interrupt generation of CIR0:CIC1 is enabled (1) or masked (0).  
IOM-direction control  
Terminal mode (SPCR:SPM = 0)  
0 ... Master mode  
Layer-2 transmits IOM-channel 0 and 2 on IDP1, channel 1 on IDP0.  
1 ... Slave mode  
Layer-2 transmits IOM-channel 0, 1 and 2 on IDP1.  
Non-Terminal mode (SPCR:SPM = 1)  
0 ... normal mode  
MONITOR, D- and C/I-channels are transmitted on IDP1 from layer-2 to  
layer-1  
1 ... reversed mode  
MONITOR, D- and C/I-channels are transmitted on IDP0 from layer-2 to  
the system.  
Semiconcuctor Group  
152  
Register Description  
CSEL2-0 Channel Select. Used in non-terminal mode (SPCR:SPM = 1).  
Select one IOM-channel out of 8, where the ICC-B is to receive/transmit.  
“000” channel 0 (first channel in IOM-frame)  
“001” channel 1  
...  
“111” channel 7 (last channel in IOM-frame)  
Inter-Frame Time Fill  
ITF  
Selects the inter-frame time fill signal which is transmitted between  
HDLC-frames.  
0: idle (continuous 1 s),  
1: flags (sequence of patterns: “0111 1110”)  
Note: In TE- and LT-T-applications with D-channel access handling  
(collision resolution), the only possible inter-frame time fill signal is  
idle (continuous 1s). Otherwise the D-channel on the S/T-bus  
cannot be accessed.  
4.3.16 Additional Feature Register 2  
ADF2  
Read/Write  
Address 39H  
Value after reset: 00H  
7
0
IMS  
D2C2  
D2C1 D2C0  
ODS  
D1C2  
D1C1 D1C0  
Semiconcuctor Group  
153  
Register Description  
IMS  
IOM-mode selection  
IOM-2 interface mode is selected when IMS = 1.  
Data strobe control; used in IOM-2 mode only.  
D2C2-0  
D1C2-0  
These bits determine the polarity of the two independent strobe signals SDS1  
and SDS2 as follows:  
DxC2  
DxC1  
DxC0  
SDSx  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
always low  
high during B1  
high during B2  
high during B1 + B2  
always low  
high during IC1  
high during IC2  
high during IC1 + IC2  
The strobe signals allow standard combos or data devices to access a  
programmable channel.  
Note: In non-terminal mode (SPCR:SPM = 1) IC1, IC2 correspond to B1,  
B2 channels of the IOM-channel as programmed to ADF1:CSEL  
2 - 0 + 1.  
ODS  
Output driver selection;  
Tristate drivers (1) or open drain drivers (0) are used for the IOM-interface.  
4.3.17 MONITOR Status Register  
MOSR  
Read  
Address 3AH  
Value after reset: 00H  
7
0
MDR1 MER1 MDA1 MAB1 MDR0 MER0 MDA0 MAB0  
Semiconcuctor Group  
154  
Register Description  
MDR1  
MER1  
MDA1  
MONITOR channel 1 Data Received  
MONITOR channel 1 End of Reception  
MONITOR channel 1 Data Acknowledged  
The remote end has acknowledged the MONITOR byte being transmitted.  
MONITOR channel 1 Data Abort  
MAB1  
MDR0  
MER0  
MDA0  
MONITOR channel 0 Data Received  
MONITOR channel 0 End of Reception  
MONITOR channel 0 Data Acknowledged  
The remote end has acknowledged the MONITOR byte being transmitted.  
MONITOR channel 0 Data Abort  
MAB0  
4.3.18 MONITOR Control Register  
MOCR  
Write  
Address 3AH  
Value after reset: 00H  
7
0
MRE1 MRC1 MIE1  
MXC1 MRE0 MRC0 MIE0  
MXC0  
MRC1,0  
MR Bit Control (IOM-channel 1,0)  
Determines the value of the MR-bit:  
0.. MR always “1”. In addition, the MDR1/MDR0 interrupt is blocked, except for  
the first byte of a packet (if MRE 1/0=1).  
1.. MR internally controlled by the ICC-B according to MONITOR channel  
protocol. In addition, the MDR1/MDR0-interrupt is enabled for all received bytes  
according to the MONITOR channel protocol (if MRE1,0=1).  
MXC1,0  
MX Bit Control (IOM-channel 1,0)  
Determines the value of the MX-bit:  
0.. MX always “1”.  
1.. MX internally controlled by the ICC-B according to MONITOR channel  
protocol.  
MIE1,0  
MONITOR transmit interrupt enable (IOM-channel 1,0)  
MONITOR interrupt status MER1/0, MDA1/0, MAB1/0 generation is  
enabled (1) or masked (0).  
MRE1,0  
MONITOR receive interrupt enable (IOM-channel 1,0)  
MONITOR interrupt status MDR1/MDR0 generation is enabled (1) or  
masked (0).  
Semiconcuctor Group  
155  
Electrical Characteristics  
5
Electrical Characteristics  
Absolute Maximum Ratings  
Parameter  
Symbol Limit Values  
Unit  
Voltage on any pin with respect to ground  
V
S
– 0.4 to V DD + 0.4  
V
o C  
o C  
Ambient temperature under bias  
PEB 2070  
PEF 2070  
T
T
A
A
0 to 70  
- 40 to 85  
o C  
Storage temperature  
T
stg  
– 65 to 125  
Note: Stresses above those listed here may cause permanent damage to the device.  
Exposure to absolute maximum rating conditions for extended periods may affect  
device reliability.  
DC Characteristics  
PEB 2070: T  
PEF 2070: T  
A
A
= 0 to 70 oC, V DD = 5 V, V SS = 0 V.  
= - 40 to 85oC, V DD = 5 V, V SS = 0 V.  
Limit Values  
Parameter  
Symbol  
Unit Test Condition  
min.  
max.  
L-input voltage  
H-input voltage  
V
V
IL  
– 0.4  
2.0  
0.8  
V
V
IH  
V
DD  
+ 0.4  
L-output voltage  
V
OL  
0.45  
V
I
I
OL =7 mA pin IDP0, IDP1  
OL = 2 mA all other pins  
H-output voltage  
H-output voltage  
V
V
OH  
OH  
2.4  
V
V
I
I
OH =400 µA  
OH =100 µA  
V
DD  
– 0.5  
DLC: 512 kHz V DD = 5 V  
DLC: 1536 kHz inputs at  
DLC: 4096 kHz 0 V/V DD  
no output  
Power operational  
supply  
current  
I
CC  
1.6  
3.5  
8.0  
mA  
mA  
mA  
loads  
power down  
0.6  
10  
mA  
Input leakage current  
Output leakage current  
I
I
LI  
LO  
µA  
0 V < V IN, V DD to 0 V  
0 V < V OUT < V DD to 0 V  
Semiconductor Group  
156  
Electrical Characteristics  
Capacitances  
= 25oC, V DD = 5 V ± 5 %, V SS = 0 V, f  
T
A
C
= 1 MHz, unmeasured pins returned to GND.  
Parameter  
Symbol  
Limit Values  
Unit  
typ.  
5
max.  
10  
Input capacitance  
Output capacitance  
C
C
IN  
pF  
pF  
OUT  
8
15  
f
C
= 1 MHz  
I/O capacitance  
= 1 MHz  
C
IO  
10  
20  
pF  
f
C
AC Characteristics  
PEB 2070: T  
PEF 2070: T  
A
A
= 0 to 70 oC, V DD = 5 V ± 5%  
= - 40 to 85 oC, V DD = 5 V ± 5%  
Inputs are driven to 2.4 V for logical “1” and to 0.4 V for a logical “0”. Timing measurements  
are made at 2.0 V for a logical “1” and 0.8 V for a logical “0”. The AC testing input/output  
waveforms are shown below.  
2.4  
2.0  
0.8  
2.0  
0.8  
Device  
Under  
Test  
Test Points  
C Load = 150 pF  
0.45  
ITS00621  
Figure 34  
Input/Output Waveform and Load Circuit for AC Tests  
Semiconductor Group  
157  
Electrical Characteristics  
Microprocessor Interface Timing  
Siemens/Intel Bus Mode  
t RR  
t RI  
RD x CS  
t DF  
t RD  
Data  
AD0 - AD7  
ITT00712  
Figure 35  
µP Write Cycle  
t WW  
t WI  
WR x CS  
AD0 -AD7  
t WD  
t DW  
Data  
ITT00713  
Figure 36  
µP Write Cycle  
Semiconductor Group  
158  
Electrical Characteristics  
t AA  
tAD  
ALE  
WR x CS or  
RD x CS  
t ALS  
t AL  
t LA  
AD0 - AD7  
Address  
ITT00714  
Figure 37  
Multiplexed Address Timing  
WR x CS or  
RD x CS  
t AS  
t AH  
A0 - A5  
Address  
ITT00715  
Figure 38  
Non-Multiplexed Address Timing  
Semiconductor Group  
159  
Electrical Characteristics  
Motorola Bus Mode  
R/W  
t DSD  
tRWD  
t RI  
t RR  
CS x DS  
D0 - D7  
t DF  
t RD  
Data  
ITT00716  
Figure 39  
µP Read Cycle  
R/W  
t DSD  
t RWD  
t WW  
t WI  
CS x DS  
t WD  
t DW  
AD0 - AD7  
Data  
ITT00717  
Figure 40  
µP Write Cycle  
CS x DS  
t AS  
t AH  
AD0 - AD5  
ITT00718  
Figure 41  
Address Timing  
Semiconductor Group  
160  
Electrical Characteristics  
Parameter and Values of the Bus Modes  
Parameter  
Symbol  
Limit Values  
max.  
Unit  
min.  
30  
20  
10  
0
ALE pulse width  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
AA  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address setup time to ALE  
Address hold time from ALE  
Address latch setup time to WR, RD  
Address setup time to WR, RD  
Address hold time from WR, RD  
ALE pulse delay  
AL  
LA  
ALS  
AS  
35  
20  
15  
0
AH  
AD  
DSD  
RR  
RD  
DF  
DS delay after R/W setup  
RD pulse width  
110  
Data output delay from RD  
Data float from RD  
110  
25  
RD control interval  
RI  
70  
60  
25  
10  
70  
WR pulse width  
WW  
DW  
WD  
WI  
Data setup time to WR x CS  
Data hold time from WR x CS  
WR control interval  
Semiconductor Group  
161  
Electrical Characteristics  
Serial Interface Timing  
IOM® Timing  
DCL  
FSC  
tFSS  
tFSH  
tFSW  
tFDD  
FSD  
tIIH  
tIIS  
IDPO/1(I)  
IOM R -1 Mode  
1st Bit  
tIIH  
tIIS  
IDPO/1(I)  
IOM R -2 Mode  
1st Bit  
tIOD  
IDPO/1(O)  
SDS1/ 2  
1st Bit  
tIOF  
tSDF  
tSDD  
ITT00719  
Figure 42  
IOM® Timing  
Semiconductor Group  
162  
Electrical Characteristics  
IOM® Mode  
Parameters and Values of IOM Mode  
Limit Values  
Parameter  
Symbol  
Unit Test Condition  
min.  
max.  
IOM output data delay  
IOM input data setup  
t
t
IOD  
IIS  
20  
20  
140  
100  
ns  
ns  
IOM-1  
IOM-2  
40  
20  
IOM-1  
IOM-2  
IOM input data hold  
IOM output from FSC  
Strobe signal delay  
Strobe delay from FSC  
Frame sync setup  
Frame sync hold  
Frame sync width  
FSD delay  
t
t
t
t
t
t
t
t
IIH  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
IOF  
80  
See note  
See note  
SDD  
SDF  
FSS  
FSH  
FSW  
FDD  
120  
120  
50  
30  
40  
20  
140  
Note: This delay is applicable in two cases only:  
1) When FSC appears for the first time, e.g. at system power-up  
2) When FSC appears before the excepted start of a frame  
Semiconductor Group  
163  
Electrical Characteristics  
HDLC Mode  
DCL (I)  
FSC (I)  
tFH1  
t FS1  
t FH1  
t ODZ  
t ODD  
t ODZ  
High Impedance  
High Impedance  
SDBX  
SDBR  
t IDH  
t IDS  
ITT00720  
Figure 43  
FSC (Strobe) Characteristics  
Parameter  
Symbol  
Limit Values  
max.  
Unit  
min.  
100  
30  
FSC set-up time  
FSC hold time  
t
t
t
FS1  
FH1  
OZD  
t
CPH + 70  
ns  
ns  
ns  
Output data from high impedance  
to active  
80  
Output data from active to  
high impedance  
t
ODZ  
40  
ns  
Output data delay from DCL  
Input data setup  
t
t
t
ODD  
IDS  
20  
10  
30  
100  
ns  
ns  
ns  
Input data hold  
IDH  
Semiconductor Group  
164  
Electrical Characteristics  
Serial Port A (SSI) Timing  
B1Channel  
B2 Channel  
tFSW  
FSC  
DCL  
tFSH  
tFSS  
tSCD  
tSCD  
SCA  
tSSS  
tSSH  
SDAR  
SDAX  
tSSD  
ITT00721  
Figure 44  
SSI Timing  
Parameter  
Symbol  
Limit Values  
max.  
Unit  
min.  
20  
SCA clock delay  
SSI data delay  
SSI data setup  
SSI data hold  
t
t
t
t
t
t
t
SCD  
SSD  
SSS  
SSH  
FSS  
FSH  
FSW  
140  
140  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
20  
40  
20  
Frame sync setup  
Frame sync hold  
Frame sync width  
50  
30  
40  
Semiconductor Group  
165  
Electrical Characteristics  
SLD Timing  
FSC  
tFSW  
tFSS  
tFSH  
DCL  
tSLD  
tSLD  
tSLD  
SIP(I/O)  
Last Bit OUT  
First Bit IN  
ITT00722  
Figure 45  
SLD Timing  
Parameter  
Symbol  
Limit Values  
max.  
Unit  
min.  
20  
SLD data delay  
SLD data setup  
SLD data hold  
t
t
t
t
t
t
SLD  
SLS  
SLH  
FSS  
FSH  
FSW  
140  
ns  
ns  
ns  
ns  
ns  
ns  
30  
30  
Frame sync setup  
Frame sync hold  
Frame sync width  
50  
30  
40  
Semiconductor Group  
166  
Electrical Characteristics  
Clock Timing  
3.5 V  
0.8 V  
t WH  
t WL  
ITT00723  
t P  
Figure 46  
Definition of Clock Period and Width  
Limit Values  
Parameter  
Symbol  
Unit Test Condition  
min.  
max.  
Clock period  
t
t
t
t
t
t
P
1000  
200  
200  
240  
100  
100  
ns  
ns  
ns  
ns  
ns  
ns  
IOM-1  
IOM-1  
IOM-1  
IOM-2  
IOM-2  
IOM-2  
Clock width high  
Clock width low  
Clock period  
WH  
WL  
P
Clock width high  
Clock width low  
WH  
WL  
Reset  
t RES  
RES  
ITT00724  
Figure 47  
Reset Signal Characteristics  
Parameter  
Symbol  
Limit Values  
min.  
Test Condition  
Length of active  
high state  
t
RES  
2 x DCL  
clock  
During power up  
cycles  
Semiconductor Group  
167  
Package Outlines  
6
Package Outlines  
Plastic Package, P-DIP-24  
(Plastic Dual-In-Line Package)  
Plastic Package, P-LCC-28-R (SMD)  
(Plastic-Leaded Chip Carrier)  
Sorts of Packing  
Package outlines for tubes, trays etc. are contained in our  
Data Book “Package Information”  
Dimensions in mm  
SMD = Surface Mounted Device  
Semiconductor Group  
168  

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