PEB2075N [ETC]

?ISDN D-Channel Exchange Controller? ; ? ISDN D信道交换器?\n
PEB2075N
型号: PEB2075N
厂家: ETC    ETC
描述:

?ISDN D-Channel Exchange Controller?
? ISDN D信道交换器?\n

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ICs for Communications  
ISDN D-Channel Exchange Controller  
(IDEC®)  
PEB 2075  
User´s Manual 05.92  
PEB 2075  
Revision History:  
05.92  
Page  
Subjects (changes since last revision)  
Data Classification  
Maximum Ratings  
Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible  
damage to the integrated circuit.  
Characteristics  
The listed characteristics are ensured over the operating range of the integrated circuit. Typical  
characteristics specify mean values expected over the production spread. If not otherwise specified,  
typical characteristics apply at TA = 25 °C and the given supply voltage.  
Operating Range  
In the operating range the functions given in the circuit description are fulfilled.  
For detailed technical information about “Processing Guidelines” and “Quality Assurance” for  
ICs, see our “Product Overview”.  
Edition 05.92  
This edition was realized using the softwaresystem FrameMaker ®.  
Published by Siemens AG, Bereich Halbleiter, Marketing-Kommunikation,  
Balanstraße 73, D–8000 München 80.  
© Siemens AG 1992. All Rights Reserved.  
As far as patents or other rights of third parties are concerned, liability is only assumed for components per se,  
not for applications, processes and circuits implemented within components or assemblies.  
The information describes the type of component and shall not be considered as assured characteristics.  
Terms of delivery and rights to change design reserved.  
For questions on technology, delivery, and prices please contact the Offices of Semiconductor Group in Germany  
or the Siemens Companies and Representatives worldwide (see address list).  
Due to technical requirements components may contain dangerous substances. For information on the type in  
question please contact your nearest Siemens Office, Semiconductor Group.  
Siemens AG is an approved CECC manufacturer.  
Siemens Aktiengesellschaft  
2
PEB 2075  
Page  
Table of Contents  
1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4  
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5  
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6  
System Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10  
1.1  
1.2  
1.3  
2
2.1  
2.2  
2.3  
Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15  
General Functions and Device Architecture . . . . . . . . . . . . . . . . . . . . . . .15  
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15  
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20  
Individual Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
Channel Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
HDLC Communication Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
Collision Control and Switching Functions . . . . . . . . . . . . . . . . . . . . . . . .33  
Test Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42  
Preprocessed Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42  
2.4  
2.4.1  
2.4.2  
2.4.3  
2.4.4  
2.5  
3
Operational Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43  
Microprocessor Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43  
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43  
Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45  
Interrupt Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46  
Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48  
3.1  
3.2  
3.3  
3.4  
3.5  
4
4.1  
4.2  
Detailed Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
Register Address Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58  
5
6
7
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69  
Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80  
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81  
Semiconductor Group  
3
05.92  
ISDN D-Channel Exchange Controller  
(IDEC )  
PEB 2075  
®
CMOS IC  
1
Features  
Four independent HDLC channels  
64-byte FIFO storage per channel and direction  
Handling of basic HDLC functions  
flag detection/generation  
zero deletion/insertion  
CRC checking/generation  
check for abort  
Address recognition  
C/I channel handler  
P-LCC-44  
Single connection and quad connection modes  
IOM® interface or PCM interface  
Programmable time slots and channel data rates (up to  
4 Mbit/s)  
Different methods of contention resolution  
Standard µP- interface, multiplexed or non-multiplexed  
address and data buses  
Vectored interrupt  
Advanced CMOS technology  
Power consumption less than 50 mW during operation.  
P-DIP-28  
Type  
Version Ordering Code Package  
PEB 2075-N V.1.3  
PEB 2075-P V.1.3  
Q67100-H6189 P-LCC-44 (SMD)  
Q67100-H6188 P-DIP-28  
The ISDN Digital Exchange Controller PEB 2075 (IDEC) is a serial HDLC data communication  
circuit with four independent channels. Its telecommunication specific features make it especially  
suited for use in variable data rate PCM systems. In addition, the device contains sophisticated  
switching functions and it implements automatic contention resolution between packet data from  
different sources.  
Its applications include: communication multiplexers, peripheral ISDN line cards, packet handlers  
and X.25 packet switching devices. The IDEC is a fundamental building block for networks with  
either centralized, de-centralized or mixed signaling/packet data handling architectures.  
Semiconductor Group  
4
05.92  
Features  
1.1 Pin Configuration  
(top view)  
AD2  
AD1  
AD0  
RD  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
AD3  
AD4  
AD5  
AD6  
AD7  
VDD  
6
5
4
3
2
1
44 43 42 41 40  
2
RD/DS  
7
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
AD6  
AD7  
WR/R/W  
8
3
A2  
9
N.C.  
VDD  
4
VSS  
10  
11  
12  
13  
14  
15  
16  
17  
DCL  
A1  
A6  
WR  
VSS  
5
IDEC®  
PEB 2075  
®
IDEC  
PEB 2075  
SD3R  
N.C.  
6
A0  
FSC  
RES  
ALE  
CS  
SD3X  
SD2R  
SD2X  
SD0R  
DCL  
FSC  
RES  
ALE  
CS  
7
SD3R  
SD3X  
SD2R  
SD2X  
SD0R  
SD0X  
SD1R  
SD1X  
8
9
18 19 20 21 22 23 24 25 26 27 28  
10  
11  
12  
13  
14  
ITP03527  
INT  
CDR  
TSC  
15  
ITP00727  
P-DIP-28  
P-LCC-44  
Semiconductor Group  
5
Features  
1.2 Pin Definitions and Functions  
Pin No.  
Pin No.  
Symbol  
Input (I)  
Function  
P-LCC-44  
P-DIP-28  
Output (O)  
Open  
Drain (OD)  
4
3
1
44  
42  
41  
39  
38  
3
2
1
28  
27  
26  
25  
24  
AD0  
AD1  
AD2  
AD3  
AD4  
AD5  
AD6  
AD7  
I / O  
Address Data Bus. If the multiplexed  
address/data µP interface bus mode is  
selected these lines transfer data and  
commands between the µP and the IDEC.  
If a demultiplexed mode is used, these lines  
interface with the system data bus.  
13  
12  
9
5
2
-
-
-
-
-
-
-
A0  
A1  
A2  
A3  
A4  
A5  
A6  
I
Address Bus. These inputs interface to the  
system´s address bus to select an internal  
register for a read or write access. Only  
provided in the P-LCC package and only  
active if a demultiplexed µP interface is  
selected.  
43  
35  
17  
11  
CS  
I
I
Chip Select. A low on this line selects the  
IDEC for a read/write operation.  
8
5
WR  
Write. This signal indicates a write  
operation, active low (Siemens/Intel bus  
mode).  
8
-
R/W  
I
Read/Write. At "high", identifies a valid µP  
access as a read operation. At "low",  
identifies a µP access as a write operation  
(Motorola bus mode). Only provided in the  
P-LCC package.  
7
7
4
-
RD  
DS  
I
I
Read. This signal indicates a read operation,  
active low (Siemens/Intel bus mode).  
Data Strobe. The rising edge marks the end  
of a valid read or write operation (Motorola  
bus mode). Only provided in the P-LCC  
package.  
Semiconductor Group  
6
Features  
Pin Definitions and Functions (cont’d)  
Pin No.  
Pin No.  
Symbol  
Input (I)  
Function  
P-LCC-44  
P-DIP-28  
Output (O)  
Open  
Drain (OD)  
16  
10  
ALE  
I
Address Latch Enable. In the Siemens/  
Intel type multiplexed µP interface mode a  
"high" on this line indicates an address of an  
internal register on the external address/data  
bus.  
In the Siemens/Intel type demultiplexed µP  
interface mode this line should be connected  
to V SS, in the demultiplexed Motorola type  
µP interface mode it should be connected to  
V DD.  
19  
15  
12  
9
INT  
OD  
Interrupt Request. This signal is activated  
when the IDEC requests an interrupt.  
RES  
I
I
Reset. A "high" on this interrupt brings the  
IDEC into the reset state.  
29  
25  
31  
34  
18  
16  
20  
22  
SD0R  
SD1R  
SD2R  
SD3R  
Serial data receive.  
26  
24  
30  
32  
17  
15  
19  
21  
SD0X  
SD1X  
SD2X  
SD3X  
O
I
Serial data transmit. Serial data transmit.  
Serial data transmit. Serial data transmit.  
Serial data transmit. Collision output.  
Serial data transmit.  
-
11  
7
DCL  
Data Clock; supplies a clock signal either  
equal to or twice the data rate.  
14  
22  
8
FSC  
TSC  
I
Frame synchronization or data strobe signal.  
14  
O
Time-Slot Control. Supplies a control signal  
for an external driver.  
21  
10  
36  
13  
6
CDR  
V SS  
I
I
I
Collision data receive.  
Ground.  
23  
V DD  
Positive power supply.  
Semiconductor Group  
7
Features  
Collision  
Data  
Receive  
Tristate  
Control  
Timing  
DCL  
FSC  
CDR  
TSC  
SD0R  
SD0X  
SD1R  
SD1X  
SD2R  
SD2X  
SD3R  
SD3X  
R
PCM/IOM  
5 V  
0 V  
IDEC R  
PEB 2075  
PCM  
RD  
WR  
AD 0...7 (A 0... 6) (DS) (R/W) CS  
ALE INT RES  
ITL00726  
µ
C System  
Logic Symbol  
Semiconductor Group  
8
Features  
CDR  
SD0X  
SD0R  
SD1X  
SD1R  
SD2X  
SD2R  
SD3X  
SD3R  
Serial Interface Logic  
DCL  
FSC  
TSC  
Timing  
Timing  
Timing  
Timing  
Switching  
Collision  
Control  
Switching  
Collision  
Control  
Switching  
Collision  
Control  
Switching  
Collision  
Control  
HDLC  
HDLC  
HDLC  
HDLC  
Receiver  
Transmitter  
Receiver  
Transmitter  
Receiver  
Transmitter  
Receiver  
Transmitter  
RFIFO XFIFO  
RFIFO XFIFO  
RFIFO XFIFO  
RFIFO XFIFO  
Microcontroller Interface  
8
ITB00728  
INT  
AD0-AD7  
RD  
WR  
CS  
ALE  
RES  
Block Diagram  
Semiconductor Group  
9
Features  
1.3 System Integration  
Communication Multiplexers  
The four independent serial HDLC communication channels implemented in the IDEC make the  
circuit suitable for use in communication multiplexers.  
The collision detection/resolution capability of the circuit allows statistical multiplexing of packets in  
one or several physical data communication channels, for example in DMI (mode 3) applications.  
Centralized Signaling / Data Packet Handlers  
The IDEC can be used in central packet handlers of ISDN networks to process signaling or packet  
data of four ISDN subscribers. In this application, it may be used with or without the Extended PCM  
Interface Controller (EPlC®) PEB 2055.  
The IDEC can be connected to the IOM interface of the EPIC, which is itself connected to the PCM  
system highway. The EPIC implements concentration and time slot assignment functions. As an  
alternative, the IDEC may be directly connected to PCM highways (figure 1).  
The size (from 1 to 8 bits) and the position of the time slot associated with each HDLC controller is  
software programmable. In addition to the receive and transmit data highways, the IDEC accepts a  
third input connection for collision detection purposes. The mode of collision detection is  
programmable. A "collision highway" (or time slot) can be used for remote collision control, as a  
"clear to send" lead, or for local contention resolution among several IDECs.  
Semiconductor Group  
10  
Features  
PCM Highway  
PCM Highway  
Line  
Line  
Transmit TS  
Receive TS  
Transmit TS  
Receive TS  
Cards  
Cards  
Transmit  
Receive  
Transmit  
Receive  
R
EPIC  
IDEC R  
IDEC R  
IDEC R  
IDEC R  
µ
C
µC  
ITS00729  
PCM Highway  
PCM Highway  
Line  
Line  
Transmit TS  
Receive TS  
Collision Detect TS  
Transmit TS  
Receive TS  
Collision Detect TS  
Cards  
Cards  
Transmit  
Receive  
Transmit  
Receive  
R
EPIC  
Collision  
Detect  
Collision  
Detect  
IDEC R  
IDEC R  
IDEC R  
IDEC R  
µ
C
µ
C
ITS00730  
Figure 1  
Use of IDEC® in Central Signaling / Data Packet Handlers  
Semiconductor Group  
11  
Features  
Line Cards in De-Centralized or Mixed Signaling / Data Packet Handling Architectures  
The IDEC can be used on peripheral line cards to process D-channel packets for ISDN subscribers.  
The PCM Controller PEB 2055 has the layer-1 controlling capacity and a B-channel switching  
capacity for a total of 32 subscribers. The B and D channels and the control information for eight  
subscribers are carried by one IOM interface. Thus a line card dimensioned for 32-ISDN  
subscribers may employ up to eight IDECs, two for each IOM connection (figure 2). A High Level  
Serial Communication Controller (HSCX) SAB 82525 with two HDLC channels, or another IDEC  
may be used to transmit and receive signaling via the system highway in a common channel. Again,  
such a common channel may be shared among several line cards, due to the statistical multiplexing  
capability of these controllers.  
In completely de-centralized D-channel processing architectures, the processing capacity of a line  
card is usually dimensioned so as to avoid blocking situations even under maximum conceivable  
D-channel traffic conditions. It may sometimes be more advantageous to perform p-packet handling  
in a centralized manner while keeping s-packet handling on the line cards. A statistical increase in  
p-packet traffic has then no effect on the line card, and can be easily dealt with by one of the  
modular architectures for a central packet handler shown in the previous section. A more effective  
sharing of the total p-packet handling capacity is the result, especially in a situation where p-packet  
traffic patterns vary widely from one subscriber group to another.  
The use of an IDEC in the mixed D-channel processing architecture is illustrated in figure 3.  
The additional "transparent data" connections supported by the IDEC enable a merging of p and s  
packets into one D channel. Possible collision situations are dealt with by the IDEC which uses  
either the additional collision detect line (figure 3) or a time slot on the system highway (figure 3)  
from the line card to the central packet handler.  
Semiconductor Group  
12  
Features  
Line Transceivers  
S/U  
R
B
IOM  
c.c.s + c.c.p  
X8  
C/I, MONITOR  
D
D
R
System  
Highways  
EPIC  
S/U  
IDEC R  
IDEC R  
s, p  
s, p  
D
HSCX/  
IDEC R  
D
µ
C
Legend:  
c.c.s/p = Common channel for signaling and for packed data, respectively  
C/I, MON = Control/Indication and MONITOR channels for the IOM R interface  
ITS00731  
Figure 2  
Line Card in a De-Centralized D-Channel Handling Architecture  
Semiconductor Group  
13  
Features  
a)  
R
B
B
IOM  
Line  
Transceivers  
System  
Highway  
R
Coll s-p  
EPIC  
D
D
µ
C
s
p
s
p(s)*  
R
p
IDEC  
ITS00732  
R
B + p  
IOM  
b)  
Line  
Transceivers  
System  
Highway  
B + p(s)* + Coll s-p  
D
D
p
R
R
IDEC  
Coll s-p  
EPIC  
s
s
µ
C
*s Packets will be discarded by the receiver  
Legend:  
p = Time-Slot for p packets  
s = Time-Slot for s packets  
Coll s-p = Time-Slot containing information about a collision between s packets and p packets  
ITS00733  
Figure 3  
IDEC® on a Line Card in a Mixed D-Channel Processing Architecture  
Semiconductor Group  
14  
Functional Description  
2
Functional Description  
2.1 General Functions and Device Architecture  
The IDEC is an HDLC controller which handles four HDLC communication channels, each channel  
fully independent and programmable by its own register set. The circuit performs the following  
functions:  
– Extraction (reception) and insertion (transmission) of the HDLC data packets in a time division  
multiplex bit stream.  
– Implementation of the basic HDLC functions of the layer-2 protocol, including address  
recognition.  
– Interfacing of the data packets to the microprocessor bus. For the temporary storage of data  
packets internal FlFOs are used.  
– Switching of data between serial interfaces.  
– Implementation of different types of collision resolution.  
– Test functions.  
2.2 Operating Modes  
Each HDLC controller of the IDEC is assigned to one time channel determined either by time slot  
assignment or by an external strobe signal.  
Two basic configurations are distinguished (figure 4):  
– In the quad connection configuration the four HDLC controllers (A - D) are connected to  
individual time multiplexed communication lines;  
– In the single connection configuration the four HDLC channels are all connected to one time  
multiplexed communication line.  
QuadConnection  
Single Connection  
a)  
b)  
A
B
C
D
A
B
C
D
Main  
Connection  
Auxiliary  
Connections  
µ
C
µ
C
ITD00734  
Figure 4  
Semiconductor Group  
15  
Functional Description  
In the quad connection configuration two modes are distinguished as follows:  
– Each connection is a time slotted highway, the lengths and positions of the time slots are  
programmable (quad connection time slot mode);  
– Each connection is a communication line, the time channels are marked by an external strobe  
signal (quad connection common control mode).  
Two modes are distinguished in turn for the single connection configuration as follows:  
– The connection is a standard IOM interface with predefined channel positions (single  
connection IOM mode);  
– The connection is a time slotted highway (single connection time slot mode).  
For simplicity, a time slotted highway will usually be referred to as a "PCM highway", or PCM for  
short.  
Table 1  
Four Basic Operation Modes of the IDEC  
MDS1  
MDS0  
Mode Description  
0
0
1
1
0
1
0
1
Single connection time slot mode  
Quad connection common control mode  
Single connection IOM mode  
Quad connection time slot mode  
To program the single connection IOM mode (CCR:MDS1, MDS0 = 10)  
with the slave mode  
with the multi master mode  
with the uncond. trans. mode  
(MODE3-0:CMS1, CMS0 = 01) or  
(MODE3-0:CMS1, CMS0 = 10) or  
(MODE3-0:CMS1, CMS0 = 00)  
this additional programming has to be made:  
MODE0:CCS1, CCS0 = 00 bin  
MODE1:CCS1, CCS0 = 00 bin  
MODE2:CCS1, CCS0 = 00 bin  
MODE3:CCS1, CCS0 = 00 bin  
TSR0 = 0C hex  
TSR1 = 1C hex  
TSR2 = 2C hex  
TSR3 = 3C hex  
The four modes of operation are illustrated in figure 5. Via channel-by-channel programming, one  
of a number of collision detection modes may be selected in each of the basic modes of operation.  
For future reference, they are also depicted in figure 5.  
Semiconductor Group  
16  
Functional Description  
a) Quad Connection TS Mode  
Programmable Time-Slots  
A
Receive  
Transmit  
A
B
C
D
B
Receive  
Transmit  
C
Receive  
Transmit  
D
Receive  
Transmit  
Collision  
Data  
Slave/Multi-Master  
Collision Mode  
ITC00735  
b) Quad Connection Common Control Mode  
Strobe  
Receive  
Transmit  
A
B
C
D
Receive  
Transmit  
Receive  
Transmit  
Receive  
Transmit  
Collision  
Data  
Slave/Multi-Master  
Collision Mode  
ITC00736  
Figure 5a, 5b  
Operating Modes of the IDEC  
Semiconductor Group  
17  
Functional Description  
c) Single Connection TS Mode  
A
B
C
D
Programmable Time-Slots  
B
A
C
D
Receive  
Transmit  
Collision  
Data  
Slave/Multi-Master  
Collision Mode  
ITC00737  
d) Single Connection IOM® Mode  
R
A
B
C
D
IOM  
A
B
C
D
Receive  
Transmit  
Collision  
Data  
Slave/Multi-Master  
Collision Mode  
ITC00738  
Figure 5c, 5c  
Operating Modes of the IDEC  
Semiconductor Group  
18  
Functional Description  
e) Single Connection TS Mode  
A
B
C
D
Programmable Time-Slots  
Programmable Time-Slots  
B
A
C
D
B
C
A
D
Transmit  
Receive  
Receive  
Transmit  
Collision  
Data  
Master Collision Mode  
ITC00739  
f) Single Connection IOM® Mode  
R
A
B
C
D
IOM  
Programmable Time-Slots  
B
A
C
D
Transmit  
Receive  
Receive  
Transmit  
Collision  
Data  
Master Collision Mode  
ITC00740  
Figure 5e, 5f  
Operating Modes of the IDEC  
Semiconductor Group  
19  
Functional Description  
2.3 Interfaces  
Microcontroller Interface  
The IDEC is programmable over an 8-bit parallel microcontroller interface. Easy and fast  
microprocessor access is provided by 8-bit address decoding on chip. The interface consists of 13  
(19) lines and is directly compatible with processors of the multiplexed and demultiplexed address/  
data bus types (Siemens/Intel or Motorola processor families). The microprocessor interface  
signals are summarized in table 2.  
Table 2  
Microcontroller Interface Signals of the IDEC  
Symbol  
Input (I)  
Function  
Output (O)  
Open Drain  
(OD)  
AD0  
AD1  
AD2  
AD3  
AD4  
AD5  
AD6  
AD7  
I/O  
Address Data Bus. If the multiplexed address/data µP interface  
bus mode is selected these lines transfer data and commands  
between the µP and the IDEC.  
If a demultiplexed mode is used, these lines interface with the  
system data bus.  
A0 ... A6  
I
Address Bus. These inputs interface to the system´s address  
bus to select an internal register for a read or write access. Only  
provided in the P-LCC package and only active if a  
demultiplexed µP interface is selected.  
CS  
I
I
Chip Select. A low on this line selects the IDEC for a read/write  
operation.  
WR  
Write. This signal indicates a write operation, active low  
(Siemens/Intel bus mode).  
R/W  
Read/Write. At "high", identifies a valid µP access as a read  
operation. At "low", identifies a µP access as a write operation  
(Motorola bus mode). Only provided in the P-LCC package.  
RD  
DS  
I
Read. This signal indicates a read operation, active low  
(Siemens/Intel bus mode).  
Data Strobe. The rising edge marks the end of a valid read or  
write operation (Motorola bus mode). Only provided in the  
P-LCC package.  
Semiconductor Group  
20  
Functional Description  
Table 2 (cont’d)  
Microcontroller Interface Signals of the IDEC  
Symbol  
Input (I)  
Function  
Output (O)  
Open Drain  
(OD)  
ALE  
I
Address Latch Enable. In the Siemens/Intel type multiplexed  
µP interface mode a "high" on this line indicates an address of  
an internal register on the external address/data bus. In the  
Siemens/Intel type demultiplexed µP interface mode this line  
should be connected to V SS. In the demultiplexed Motorola type  
µP interface mode it should be connected to V DD.  
INT  
OD  
I
Interrupt Request. The signal is activated when the IDEC  
requests an interrupt.  
RES  
Reset. A "high" on this input brings the IDEC into the reset state.  
In addition to 8-bit processors, the IDEC supports a direct connection to 16-bit processors. Thus,  
through an internal address transformation, it is possible to access all IDEC registers using either  
even microprocessor addresses only or odd microprocessor addresses only.  
Serial Interfaces  
Depending on the selected mode, the IDEC supports four physically separate, full duplex serial  
interfaces, or one full duplex serial interface.  
In addition to the data input and data output lines, the serial interface requires a common data clock  
(input DCL) and a frame synchronization signal (input FSC). Input data is latched on the falling edge  
of DCL and output data is clocked off on the rising edge of DCL. The IDEC may be programmed so  
that the data clock rate is either equal to the data rate, or twice the data rate.  
Semiconductor Group  
21  
Functional Description  
2.4 Individual Functions  
2.4.1 Channel Access  
The four HDLC controllers of the IDEC are connected to the serial interfaces as shown in table 3.  
The table indicates the selection of the data channel, the selectable time slot widths, the output  
driver type, and the function of the active-low Tri-State Control (TSC) output in each of the operating  
modes.  
The data output is set in a high impedance state outside the time channel where data is transmitted.  
OD = Open-drain driver,  
PP = Push-pull driver.  
The output driver type refers to the SD0X (or SD0X, SD1 X, SD2X and SD3X) outputs.  
TSC is a push-pull signal.  
Quad Connection Time-Slot Mode  
Channel selection is performed via the Time-Slot Select Registers (TSR). For each HDLC channel,  
the 8- bit TSR register gives the position of a time slot with a two-bit resolution. The length of the  
time slot, either 1, 2, 7 or 8 bits, can be selected using the MODE register (CCS1, 0). These  
parameters are common to the receive and the transmit channel.  
In the case where the number of bits in a PCM frame is 256 or 512, the frame synchronization signal  
FSC need not be provided at every PCM frame beginning, since bit counters are automatically reset  
at frame end. When the PCM frame length is not equal to either 256 or 512 bits, the frame  
synchronization signal has to be provided at the beginning of every PCM frame.  
Semiconductor Group  
22  
Functional Description  
Table 3  
HDLC Controller Channel Selection and Characteristics  
Mode  
Channel  
Input  
C
Channel  
Output  
Description  
MDS1 MDS0 A  
B
D
A
B
C
D
0
0
1
1
0
1
0
1
SD0R SD0R SD0R SD0R SD0X SD0X SD0X SD0X Single  
connection TS  
mode  
SD0R SD1R SD2R SD3R SD0X SD1X SD2X SD3X Quad connection  
common control  
mode  
SD0R SD0R SD0R SD0R SD0X SD0X SD0X SD0X Single  
connection IOM  
mode  
SD0R SD1R SD2R SD3R SD0X SD1X SD2X SD3X Quad connection  
TS mode  
Mode  
Channel Characteristics  
Tri-State Control (TSC) Output Driver  
Signal  
MDS1 MDS0 Channel Select Channel Width  
Defined by  
0
0
TSR A-D  
registers  
1, 2, 7, 8  
TSR A-D  
PP or OD  
0
1
1
0
FSC strobe  
Arbitrary  
FSC inverted  
PP or OD  
Fixed two-bit  
2
Fixed two-bit TS´s A-D  
OD  
TS´s  
1
1
TSR A-D  
registers  
1, 2, 7, 8  
TSR B  
PP or OD  
OD = Open-drain driver,  
PP = Push-pull driver.  
The output driver type refers to the SD0X (or SD0X, SD1X, SD2X and SD3X) outputs.  
TSC is a push-pull signal.  
Semiconductor Group  
23  
Functional Description  
The tristate control output line TSC marks the time slot when data is transmitted/received by the  
HDLC controller B.  
The position of a time slot with respect to FSC, as a function of the TSR register contents, is shown  
in figure 6.  
FSC  
DCL  
1Bit  
a) 1-Bit Time-Slot  
TSR = 0  
1
1
2
2
3
3
4
4
5
5
2 Bits  
b) 2-Bit Time-Slot  
TSR = 0  
c) 7-Bit Time-Slot  
TSR = 0  
7 Bits  
2
1
1
3
3
4
5
5
d) 8-Bit Time-Slot  
TSR = 0  
8 Bits  
2
4
ITD02723  
Figure 6  
Position of Time Slot for Different Channel Widths as a Function of TSR Register Contents  
Semiconductor Group  
24  
Functional Description  
Quad Connection Common Control Mode  
Channel selection is performed by an active high strobe signal provided through the FSC input. The  
strobe signal is common to all four HDLC channels.  
The TSC output is active when the FSC strobe is active.  
Single ConnectionTS Mode  
The time slots selected by the TSR registers all pertain to the same PCM highway. The  
programming of a channel otherwise proceeds exactly as explained above.  
The tristate control output line TSC marks the time slots when data is transmitted/received by any  
of the four controllers.  
Single Connection IOM - Mode  
The IOM is an interface where a frame is composed of n IOM channels (n Š 1; n = 8 in figure 7). Each  
IOM channel has a unique structure. It consists of: two eight-bit bytes, corresponding to the ISDN  
B channels, a MONITOR byte, and a control byte of which the first two bits are allocated to the ISDN  
D channel.  
In the single connection IOM mode the serial interface has an IOM frame structure and the four  
HDLC channels are assigned to the D bits of four consecutive IOM channels. The choice whether  
the four HDLC controllers are assigned to IOM channels 0 - 3 or 4 - 7 is governed by the  
microcontroller bit VIS (Common Configuration Register). See figure 7.  
Semiconductor Group  
25  
Functional Description  
a) Multiplexed Frame Structure of the IOM® Interface (n = 8)  
125 µs  
FSC  
DCL  
R
CH0  
CH0  
CH1  
CH1  
CH2  
CH2  
CH3  
CH3  
CH4  
CH4  
CH5  
CH5  
CH6  
CH6  
CH7  
CH7  
CH0  
CH0  
Data IN  
IOM  
R
Data OUT IOM  
MM  
R X  
B1  
Byte 1  
B2  
Byte 2  
MONITOR  
Byte 3  
D
C/I  
Byte 4  
ITD03562  
b) Assignment of HDLC Channels in IOM® Mode  
R
IOM  
CH0  
CH1  
CH2  
CH3  
CH4  
CH5  
CH6  
CH7  
VIS = 0  
VIS = 1  
A
B
C
D
HDLC  
Channels  
A
B
C
D
ITD03534  
Figure 7  
Semiconductor Group  
26  
Functional Description  
2.4.2 HDLC Communication Functions  
Basic HDLC Functions  
Each one of the four controller channels handles the following basic HDLC functions.  
Receive direction  
– Flag detection  
A zero followed by six consecutive ones and another zero is recognized as a flag.  
– Zero delete  
A zero after five consecutive ones within an HDLC frame is deleted.  
– Address recognition  
A frame may be accepted or rejected on the basis of a comparison of the most significant  
address byte (Service Access Point Identifier SAPI in Link Access Procedure for the D-  
channel LAPD) with three fixed SAPI values.  
– CRC checking  
The CRC field of an HDLC frame is checked according to the generator polynomial  
x16 + x12 + x5 + 1.  
– Check for abort  
Seven or more consecutive ones are interpreted as an abort sequence.  
– Check for idle  
Fifteen or more consecutive ones are interpreted as "idle", and reported to the processor via  
a status bit.  
– Minimum length checking  
Reception of frames with less than three bytes between opening and closing flag is not  
reported to the microcontroller.  
Transmit direction  
– Flag generation  
A flag is generated at the beginning and at the end of every frame.  
– Zero insert  
A zero is inserted after five consecutive ones within an HDLC frame.  
– CRC generation  
The CRC field of the transmitted frame is generated according to the generator polynomial  
x16 + x12 + x5 + 1.  
– Abort sequence generation  
An HDLC frame may be terminated with an abort sequence under software control or due to  
a FIFO underrun condition.  
– Inter-frame time fill  
As inter-frame time fill either flags or idle (continuous ones) may be transmitted.  
Semiconductor Group  
27  
Functional Description  
Reception and Transmission Functions  
FIFO Structure  
Each HDLC controller uses a 64-byte FIFO per direction for the intermediate storage of data  
packets. All data bytes between the opening flag and the CRC field of an HDLC frame are passed  
through the FIFO.  
Flag  
Flag  
CRC  
ITD03535  
Generated by HDLC Controller  
Bytes passed through FIFO  
Figure 8  
HDLC Frame Structure  
The receive and transmit FlFOs are both divided, two blocks of 32 bytes each: One accessible to  
the microcontroller and one inaccessible to the microcontroller. While the microcontroller is reading  
(receive FIFO) or writing (transmit FIFO) data in one 32-byte block, the other block is filled (receive  
FIFO) or emptied (transmit FIFO) by the IDEC. Thus the length of the received or transmitted frame  
is not limited by the FIFO size.  
Semiconductor Group  
28  
Functional Description  
Reception of Frames  
Address Compare  
Before a receive frame is stored, its address (the first byte following the opening flag) may optionally  
be compared against three fixed values.  
SAPG  
SAPS  
SAPP  
"Group SAPI"  
"Signaling SAPI"  
"Packet SAPI"  
63D  
0D  
16D  
Each address compare may be individually enabled or disabled for each HDLC channel via bits  
AC0, 1, 2 and 3 (ACR register).  
The effect of a match is programmable as shown in table 4. In the table it is assumed that the  
address compare enable bit (AC) is set for the channel in question. If AC = 0, all valid receive frames  
in that channel are accepted.  
Table 4  
Address Compare Logic  
SCM SCG  
SCS  
SGP  
Effect  
0
0
0
Accept all frames  
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
Reject frames with  
SAPP (16D)  
SAPS (0D)  
0
0
0
1
1
1
1
SAPS (0D) and SAPP (16D)  
SAPG (63D)  
SAPG (63D) and SAPP (16D)  
SAPG (63D) and SAPS (0D)  
SAPG (63D), SAPS (0D) and  
SAPP (16D)  
0
0
0
Reject all frames  
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
Accept frames with  
SAPP (16D)  
SAPS (0D)  
1
SAPS (0D) and SAPP (16D)  
SAPG (63D)  
SAPG (63D) and SAPP (16D)  
SAPG (63D) and SAPS (0D)  
SAPG (63D), SAPS (0D) and  
SAPP (16D)  
Semiconductor Group  
29  
Functional Description  
Frame Storage  
When a frame is accepted, it is stored in the receive FIFO.  
In the case of a frame of length less than to 64 bytes, the whole frame may be stored in the receive  
FIFO. After the first 32 bytes have been received, the device prompts the microcontroller to read  
data from the FIFO (Receive Pool Full RPF interrupt status). Having done this, the microcontroller  
releases the FIFO. This is done by the RMC (Receive Message Complete) software command,  
after which the rest of the frame, when ready, is made available to the microcontroller (figure 9).  
When a whole frame shorter than 32 bytes, or the final part of a frame longer than that becomes  
available, the condition is indicated by an RME (Receive Message End) interrupt status, instead of  
RPF.  
a) Prior to  
Acknowledgement  
µ
C
b) After µC  
Acknowledgement  
32 Bytes  
Inaccessible  
to µC  
Block  
B + 1  
Free  
32 Bytes  
Accessible  
to µC  
Block B  
Block  
B + 1  
ITD03536  
Figure 9  
Receive FIFO in the Case of a Frame No Longer than 64 Bytes.  
In the case of frames at least 64 bytes long, the microcontroller will repeatedly be prompted by an  
interrupt lo read out the FIFO in blocks of 32 bytes (except possibly the final block). Again, after  
reading a block, the microcontroller acknowledges the data by a software command and thus  
releases the FIFO. If this is not done before an additional 32-data bytes are received, the next data  
byte will lead to a "data overflow" condition.  
In the case of several shorter frames up to seventeen may be stored inside the HDLC controller.  
After an interrupt (RME), one frame is available in the FIFO for the microcontroller to read. Up to  
sixteen other frames may be stored in the meanwhile in the upper half of the FIFO (figure 10).  
When the microcontroller releases the current data block from the FIFO by software command, the  
next frame becomes available and the corresponding space is freed in the upper half for (a)  
subsequent frame(s) (figure 10).  
Semiconductor Group  
30  
Functional Description  
a) Prior to µC  
Acknowledgement  
b) After µC  
Acknowledgement  
Frame i + n  
32 Bytes  
Inaccessible  
to µC  
Frame i + n  
Frame i + 2  
0 < n < 16  
Frame i + 1  
32 Bytes  
Accessible  
to µC  
Last Part of  
Frame i  
Frame i + 1  
ITD03537  
Figure 10  
Receive FIFO in the Case of Short Frames  
The interrupts accumulating in the process are incorporated into a queue and transferred one by  
one to the microcontroller as well as additional information about the frame. In particular, the frame  
length is stored in a register. Information such as "frame aborted yes/no" and "CRC error yes/no"  
and "data overflow yes/no", is included in an extra byte stored in the FIFO after the last byte of the  
corresponding frame.  
Every interrupt has to be acknowledged by the microcontroller. A full FIFO at the beginning of a  
frame will lead to a frame overflow condition.  
If the microcontroller does not wish to preserve an incoming frame, the possibility exists to ignore  
it. When the corresponding command (RMD) is issued, the part of the frame stored is deleted and  
the rest of the entire frame will be ignored.  
Semiconductor Group  
31  
Functional Description  
Transmission of Frames  
2 x 32 bytes of intermediate storage are provided per HDLC controller in the transmit direction. After  
up to 32 bytes have been written to the FIFO, transmission is started by a software command (XHF).  
If the previous transmission is still underway when a new transmission command is issued,  
microcontroller access to the FIFO will be blocked until the first transmission is completed  
(figure 11). This means that at most one complete frame may be written to the FIFO before a  
transmission is initiated. If a transmission request does not include a "frame end" indicator (XME),  
the HDLC controller will request the next data block via an interrupt if the FIFO contains no more  
than 32 bytes. This procedure will be repeated until the microcontroller indicates that the frame is  
to be closed.  
In the case when this indication is not given and there is no more data ready for transmission, the  
frame is terminated with an abort sequence and the microcontroller is notified via a transmit data  
underrun (XDU) interrupt. The frame may also be aborted per software command. The completed  
transmission of an HDLC frame is reported by an XPR (Transmit Pool Ready) interrupt status.  
a) Prior to Transmission  
Command for Frame n + 1  
b) After Transmission  
c) After Interrupt  
Command for Frame n + 1  
"Transmit Pool Ready"  
Inacces-  
Inacces-  
Inacces-  
Trans-  
mission  
Trans-  
mission  
Trans-  
mission  
sible  
to  
Frame n  
sible  
to  
Frame n  
sible  
to  
Frame n+1  
µ
C
µ
C
µ
C
Acces-  
sible  
Inacces-  
sible  
Acces-  
sible  
to µC  
Frame n + 1  
Frame n + 1  
to  
µ
C
to  
µ
C
ITD03538  
Figure 11  
Transmit FIFO  
Semiconductor Group  
32  
Functional Description  
2.4.3 Collision Control and Switching Functions  
The IDEC possesses flexible collision control capabilities which are totally transparent to the  
microcontroller. The collision control modes enable use of the circuit in statistical multiplexing  
applications or in centralized or de-centralized packet switches. Each of the four HDLC controllers  
is individually programmed in one of four modes by its own register bits CMS1-0 (Collision Mode  
Select).  
Table 5 lists the four collision modes that can be selected, along with the auxiliary I/O lines used in  
each case. The outputs SD1 X and SD2X can be selected to be of the open-drain or of the push-  
pull type.  
Table 5  
Collision Modes of the IDEC  
CMS1 CMS0 Description  
Auxiliary I/O  
Data IN  
Data OUT  
Coll. IN  
Coll. OUT  
0
0
Unconditional  
transmission  
0
1
1
1
0
1
Slave mode  
CDR  
CDR  
Multi-master mode  
Master mode  
CDR  
SD1X  
SD2X  
Semiconductor Group  
33  
Functional Description  
Unconditional Transmission Mode  
The HDLC controller transmits frames without collision detection on the transmit line (time channel).  
Slave Mode  
The input CDR (Collision Data Receive) is used to control transmission of frames. This input is  
common to all HDLC controllers which are programmed in the slave mode.  
Transmission is inhibited by a "low" on the CDR input. If CDR becomes "low" during the  
transmission of a frame, the frame is aborted by the HDLC controller, and the data output is set to  
high impedance. Refer to figure 12.  
DCL  
Single Connection Mode:  
SDOX  
Quad Connection Mode:  
Opening Flag  
SDiX, i = 0... 3  
CDR  
ITD03539  
Figure 12  
Transmission Control in the Slave Mode (example)  
Note:  
The CDR is evaluated  
– at the falling edge of DCL, for a DCL rate equal to the data rate;  
– at the falling edge of DCL immediately preceding the rising edge used for transmission, for a  
DCL rate twice the data rate.  
The state of CDR is evaluated by the HDLC controller only in the time channel used for transmission  
by that controller. (Figure 12 is simplified in that the grouping of bits into time slots on  
SD0X ... SD3X and CDR is not depicted, i. e. bits outside the transmit time channel are not shown.)  
When CDR is switched high, inter-frame time fill is marked in the transmit time channel if no  
transmission request is pending, otherwise transmission starts at the first available instant.  
Transmission of a previously aborted frame is automatically re-started by the HDLC controller if the  
beginning of the frame is still available in the transmit FIFO. Otherwise an interrupt (XDU) to the  
microcontroller indicates that the transmission has failed.  
Semiconductor Group  
34  
Functional Description  
The slave mode is applicable in all of the basic operation modes, in both single connection and quad  
connection applications. However, there is only one CDR line. This should especially be noted if:  
– the IDEC is configured in the quad connection common control mode and more than one  
HDLC controller is operated in the slave mode;  
– when the same time slot is used by more than one HDLC controller in the slave mode.  
In both cases more than one controller is evaluating the CDR line during the same time interval, and  
when CDR goes "low" they all stop transmitting.  
Multi-Master Mode  
In the multi-master mode the controllers perform a bus access procedure and collision detection in  
their assigned time channel(s). As a result, any number of IDECs can be assigned to one physical  
channel, where they perform statistical multiplexing.  
Collisions are detected by automatic comparison of each transmitted bit with the bit received via the  
CDR input. For this purpose a logical "and" of the bits transmitted by parallel controllers is formed  
and connected to the input CDR. This may be implemented most simply by defining the output line  
driver to be of the open drain type (ODS = 1). Consequently the logical "and" of the outputs is  
formed by simply tying them together ("wired or"). The result is returned to the CDR input of all  
parallel circuits.  
The multi-master mode is applicable in all operating modes, in both single connection and quad  
connection applications. In the quad connection mode, those output lines (SD0X ... SD3X) for which  
this collision mode is selected may be connected to CDR. The four HDLC controllers may either be  
programmed to transmit in separate time channels or in the same time channel. A prerequisite for  
the multi-master mode is that the inter-frame time fill used is "idle".  
The multi-master operation is as follows (refer to figure 13).  
When a mismatch between a transmitted bit and the bit on CDR is detected, the HDLC controller  
stops sending further data and its output is set to high impedance.  
As soon as it detects the transmit bus to be "idle" again, the controller automatically attempts to re-  
transmit its frame. By definition, the bus is assumed idle when x consecutive ones are detected in  
the transmit channel. Normally x is equal to 8.  
Semiconductor Group  
35  
Functional Description  
Time Interval for Transmission  
DCL or DCL ÷ 2  
Single Connection Mode:  
SDOX  
Quad Connection Mode:  
SDiX, i = 0... 3  
=
/
CDR  
(See Note in Figure 12)  
ITD03450  
Figure 13  
Collision Detection in the Multi-Master Mode (example)  
An automatic priority adjustment is implemented in the multimaster mode. Thus, when a complete  
frame is successfully transmitted, x is increased to ten, and its value is restored to eight when a row  
of ten1’s is detected on the bus (CDR). Furthermore, transmission of a new frame may be started  
by the HDLC controller after the tenth 1.  
This multi-master, deterministic priority management ensures an equal right of access of every  
HDLC controller to the transmission medium, thereby avoiding blocking situations.  
Master Mode  
The master mode requires three auxiliary connections: data input CDR, data output SD1X and  
collision data out SD2X.  
This mode is applicable only in single connection operation.  
In the master mode, the controller performs two functions:  
– Switching of data packets between the main connection SD0X, SD0R and the auxiliary input  
and output (CDR, SD1X)  
– Resolution of collisions between data from the auxiliary connection CDR and HDLC frames  
from the local microcontroller.  
Refer to figure14.  
Semiconductor Group  
36  
Functional Description  
Controller A  
Collision  
Control  
TS Mode  
HDLC  
Controller  
Programmable Time-Slots (TSR)  
Controller B  
Controller C  
Controller D  
IOM R Mode  
Programmable Time-Slots (TSR)  
Fixed Time-Slots  
SDIX Data OUT  
CDR Data IN  
SD0X  
SD0R  
SD2X Collision OUT  
ITS02721  
Figure 14  
I / O Connections in the Master Mode  
Semiconductor Group  
37  
Functional Description  
In the TS mode the time slot programmed via the Time-Slot Select Register TSR applies  
simultaneously to SD0X/SD0R and to the auxiliary lines CDR, SD1X and SD2X. In the IOM mode  
the TSR register selects a time channel on the auxiliary connections CDR, SD1X and SD2X only  
(however, the channel width selected should be two bits, as on the IOM interface, to ensure a  
correct data throughput).  
The switching of data from SD0R to SD1X is transparent. The switching of data from CDR to SD0X  
depends on the state of the HDLC controller (transmit/no transmit) and on selected priorities, as  
follows.  
When no transmission command is issued to the HDLC controller, data is transparently switched  
through from CDR to SD0X. When a transmit request is issued but the Force HDLC Frame (FHF)  
bit is not set to 1, the data currently being received (if any) on CDR is given priority. The HDLC  
controller starts transmitting its frame on SD0X only after CDR is detected to be idle, in other words,  
when a row of eight ones is observed on CDR. Simultaneously, SD2X is set "low" to indicate that  
no data will be accepted on CDR input data line.  
Figure 15a shows the time relation between CDR (data in) and SD2X (collision out) as well as the  
logical relation between SD2X and SD0X (data out). The figures are simplified in that the grouping  
of bits into time slots on SD0X, and on SD2X/CDR is not depicted.  
When a transmit command is issued and the Force HDLC Frame (FHF) bit is set to 1, the frame  
currently being received on CDR is aborted. Seven ones are appended to the last bit of the aborted  
frame on SD0X, after which the HDLC controller starts transmitting its frame (figure 15b).  
In both cases, SD2X is set "high" again after a delay of eight bit-times following the last "0" of the  
closing flag, to indicate that data is accepted on the CDR input data line. However, if a new transmit  
command is issued before that time, SD2X remains "low" and transmission of the new frame starts  
immediately after the eighth 1.  
Semiconductor Group  
38  
Functional Description  
Collision Resolution in the Master Mode with Programmable Priority (FHF)  
ITD02722  
Figure 15  
Semiconductor Group  
39  
Functional Description  
Note on Data Delay in Master Mode  
The data bits are switched from SD0R to SD1X and from CDR to SD0X with a minimum delay as  
shown in figure 16.  
Two different cases are distinguished:  
a) TS mode.  
In this case the time slots on SD0R/SD0X and on CDR/SD1X are identical. The data delay  
from CDR to SD0X is one bit, whereas the delay from SD0R to SD1 X is two bit times.  
IOM mode with identical channel (time slot) on SD0R/SD0X and CDR/SD1X. This case is  
identical to the previous one.  
b) lOM mode with a time slot on CDR/SD1X which does not coincide with the lOM channel bits  
on SD0R/SD0X. In this case, the data bits undergo (in addition to the inherent delay due to  
the different bit positions) a delay of one bit time from CDR to SD0X, whereas no additional  
bit delay is introduced when going from SDOR to SD1X.  
Semiconductor Group  
40  
Functional Description  
Bit delay for coinciding channel/time slot position on SD0R/SD0X and on CDR/SD1X.  
SD0R  
SD0X  
CDR  
SD1X  
ITD03530  
Figure 16a  
Bit Delay from SD0R/CDR to SD1X/SD0X  
Bit delay for non-identical channel/time slot position on SD0R/SD0X and on CDR/SD1X (possible  
only when SD0R/SD0X is an IOM interface).  
SD0R  
SD0X  
CDR  
SD1X  
ITD03531  
Figure 16b  
Transmit Delay from SD0R/CDR to SD1X/SD0X  
Semiconductor Group  
41  
Functional Description  
2.4.4 Test Functions  
A test loop is provided in each of the four HDLC controllers of the IDEC. When the test loop is  
activated, the input and the output of the HDLC channel are connected together. The test loop  
control is independent for each HDLC channel (bit TLP).  
The test loop is either transparent (forward data is outputted on the line) or non-transparent (forward  
data is not outputted on the line), depending on the selected mode. In the quad connection common  
control mode and in the single connection IOM mode the loops are transparent. In the other cases  
they are non-transparent. During a non-transparent loop, the data output is high impedance inside  
the assigned time channel.  
2.5 Preprocessed Channels  
The IDEC supports the  
Command/lndicate (C / l) channel at the IOM-2 interface.  
The C/l handler takes care of the C/l channels.  
C/l Channel Handler  
To activate the C / I handler, CCR:CDEN is set to "1". The C/l handler can be used in the following  
switching modes:  
– single connection IOM mode  
– single connection time-slot mode  
and in the following bus access modes:  
– unconditional transmission  
– master  
– multi master (only 1 C / l transmitter is allowed per subscriber).  
In the upstream direction the signaling handler MONITORS the received C / l channels. Upon a  
change  
– an interrupt is generated (ISTAn:CD)  
– the actual value is stored in registers CIR3 ... CIR0.  
Only single last look is carried out. The C/l channel is sampled in each frame. The change detection  
only operates on the 4-bit C/l channel.  
The ISTAn:CD interrupt is cleared when ISTAn is read.  
In the downstream direction the value written to CIX3 ... CIX0 will be sent in the C / l channels in  
each frame.  
Semiconductor Group  
42  
Operational Description  
3
Operational Description  
3.1 Microprocessor Interface Operation  
The IDEC microcontroller interface can be selected to be either of the  
1. Motorola type with control signals CS, R/W, DS; address bus A0 … 6; data bus AD0 … 7  
2. Siemens/lntel non-multiplexed bus type with control signals CS, WR, RD; Address bus A0 … 6;  
data bus AD0 … 7  
3. or of the Siemens/lntel multiplexed address/data bus type with control signals CS, WR, RD, ALE;  
address/data bus AD0 … 7  
For a non-multiplexed bus including the Motorola type µP interface the P-LCC-44 package of the  
IDEC needs to be used, since only this package provides the additional pins for a separate 7-line  
address bus.  
The ALE input is used to control the interface type as follows  
ALE tied to V DD  
ALE tied to V SS  
Edge on ALE  
(1)  
(2)  
(3)  
The occurrence of an edge on ALE, either positive or negative, at any time during the operation  
immediately selects interface type (3). A return to one of the other interface types is possible only if  
a hardware reset is issued.  
Table 6  
Microcontroller Interface Summary  
ALE  
Interface Bus Type  
Address Data Bus  
Bus  
Control Pins  
P-LCC-44  
17 7  
P-DIP-28  
11  
5
4
8
Tied to V DD Motorola  
non-  
multiplexed  
A0 … 6  
A0 … 6  
AD0 … 7  
AD0 … 7  
CS R/W DS  
Tied to V SS Siemens/ non-  
Intel multiplexed  
CS WR RD  
Switching  
Siemens/ multiplexed AD0 … 6 AD0 … 7 CS WR RD CS WR RD  
Intel  
3.2 Reset  
After a hardware reset (pin RES), the configuration/command register bits are zeroed. No interrupts  
are active and all outputs are in a high impedance state.  
Table 7 sums up the state of the IDEC immediately after a hardware reset has been applied.  
Semiconductor Group  
43  
Operational Description  
Table 7  
State of IDEC After a Hardware Reset  
Register Name  
Value after  
Hardware  
Meaning  
Reset (hex)  
Common  
registers  
ACR  
CCR  
00  
00  
Address comparison disabled.  
Single connection TS mode.  
Interrupt vector may be read on AD bus bits 0 - 3.  
Bits per frame: 257 to 512.  
Bit rate is equal to clock rate.  
Output drivers are of the push-pull type.  
VISR  
VISM  
00  
00  
No interrupt from any IDEC channel.  
All channel interrupts are enabled.  
Individual  
registers  
i = A, B, C, D  
ISTA  
ISM  
00  
00  
50  
No interrupts from channel i.  
All channel i interrupts enabled.  
STAR  
Transmit FIFO is ready to be written to.  
Receive line is idle.  
CMDR  
MODE  
00  
00  
No commands.  
Test loop not active.  
No collisions will be detected (unconditional  
transmission).  
Inter-frame time fill = idle.  
Receiver de-activated.  
Channel i disabled (high impedance output).  
Channel capacity is 2 bits/time slot.  
RFBC  
TSR  
00  
00  
Zero bytes received.  
Time slot 0 selected.  
Semiconductor Group  
44  
Operational Description  
3.3 Initialization  
The purpose of the initialization is to set the IDEC into a state where it is able to correctly transfer  
HDLC frames and to manage collisions according to the requirements of the application.  
The initialization process is divided into two phases. First, the common settings are determined via  
the registers CCR and VISM. These registers determine the number of HDLC channels used, the  
serial interface configuration and common characteristics of the serial input/output connections  
(table 8).  
Table 8  
Initialization of IDEC(common bits)  
Function  
Register Bits  
Effect  
Configuration  
CCR  
MDS1-0  
Basic configuration and timing mode  
Serial interface  
characteristics  
CCR  
ODS  
Output driver type is open-drain or push pull  
CRS  
BNS  
MIC3-0  
VIS  
Clock rate = 1 or 2 x data rate  
Number of bits per PCM frame  
Interrupt configuration VISM  
CCR  
Mask any HDLC channel(s)  
VISR may be read on AD bus bits 0-3 or 4-7  
Address compare mode: accept/reject  
HDLC address  
ACR  
SCM  
recognition features  
SCG, SCS, Selection of compare addresses  
SCP  
AC0-3  
Address compare on/off for HDLC channel 0, 1,  
2, 3  
Semiconductor Group  
45  
Operational Description  
Secondly, each of the HDLC channels is initialized via its own register set as shown in table 9.  
The optional address comparison mode for each HDLC channel is selected by programming the  
ACR register, located in the common address space (table 8).  
Table 9  
Initialization of HDLC Channels (channel-per-channel)  
Function  
Register Bits  
Effect  
Serial interface  
MODE  
CMS1-0  
Collision mode  
CCS1-0  
Channel capacity  
TSR  
TSR7-0  
ITF  
Time slot  
HDLC Controller  
MODE  
Inter-frame time fill pattern  
TLP  
Test loop  
CAC  
Active channel (enable receiver + transmitter,  
enable data outputs)  
RAC  
Activate HDLC receiver  
3.4 Interrupt Structure  
Special events are reported to the processor by an interrupt logic in the IDEC. This logic allows the  
connection of more than one IDEC to one interrupt input of a microcontroller.  
The interrupt structure of the IDEC is depicted in figure 17. Each HDLC channel of the circuit has  
its own Interrupt Status Register (ISTA) where up to five possible interrupt causes may be read  
directly. When an interrupt occurs in one of the HDLC channels, the corresponding bit is set in the  
ISTA register and the interrupt line (INT) is activated. Simultaneously, a bit in the Vectored Interrupt  
Status Register (VISR) is set which indicates which of the four HDLC channels initiated the  
interrupt. Thus, to determine the cause of an interrupt, the microcontroller performs successively a  
read of the VISR register (address 36/3F) and a read of that ISTA register which was indicated by  
the contents of VISR.  
Semiconductor Group  
46  
Operational Description  
INT  
Mask VISM.VISR  
Vector (4 Bits)  
Mask ISM.ISTA  
Int. Status A  
Int. Status B  
Int. Status C  
Int. Status D  
ITD03532  
Figure 17  
Interrupt Structure of the IDEC  
A read of the ISTA clears the register and deactivates the INT line.  
The position which the four bits of the Vectored Interrupt Status Register occupy on the AD7-0 bus  
when the register is read, is programmable via the Vectored Interrupt Selection bit VIS (CCR  
register). Thus, when VIS = 0, the VISR bits are read on AD bit positions 0-3, and when VIS = 1,  
VISR bits are read on AD bit positions 4-7. Unoccupied bit positions on the bus remain in a high  
impedance state.  
The bits in VISR can be selectively masked by setting the corresponding bits in the Vectored  
Interrupt Status Mask (VISM) register to prevent one or several controllers from generating an  
interrupt. In that case, interrupts remain internally stored (pending) but are not displayed in the VISR  
or ISTA registers. Further, ISTA interrupts pertaining to a particular channel may be selectively  
masked via the Interrupt Status Mask register of that channel. Pending interrupts will cause the INT  
line to be activated and will be reported via ISTA (and VISR) only when the mask bits in ISM (and  
VISM) have been reset.  
Semiconductor Group  
47  
Operational Description  
3.5 Processing  
After being initialized via the configuration/mode registers listed in tables 8 and 9 the IDEC is  
operational.  
The control of the data transfer is performed by commands from the microcontroller written in the  
Command Register (CMDR). Events pertaining to the data transfer are reported via the Interrupt  
Status Register (ISTA) pointed to by the Vectored Interrupt Status Register (VISR). Other events  
which do not lead to interrupts may be monitored via the Status Register (STAR) and information  
about the receive frames is found in the RFIFO and in the Receive Frame Byte Counter (RFBC)  
register.  
The powerful FIFO logic, which consists of a 2 x 32 byte receive and a 2 x 32 byte transmit FIFO  
per channel, as well as an intelligent FIFO controller, builds a flexible interface to the upper protocol  
layers implemented in the microcontroller.  
Receive Frame Processing  
Reception of HDLC frames with three or more bytes between the opening and closing flags is  
always reported to the microcontroller if address comparison is not enabled (AC = 0). If address  
comparison is enabled, the reception of the frame is dependent on the first byte of the received  
HDLC frame address field and the selected features of the address compare function (table 4).  
All bytes between the opening flag and the CRC field are stored in the RFIFO.  
When the frame (excluding the CRC field) is not longer than 31 bytes, the whole frame is transferred  
in one block. The reception of the frame is reported via the Receive Message End (RME) interrupt.  
The length of the frame can be read out from an 8-bit register (RFBC). A status byte is appended  
to the data in the RFIFO after an RME interrupt. It includes information about the frame, such as  
frame aborted yes/no or CRC valid yes/no. The frame and the status byte remain stored until the  
microcontroller issues an acknowledgment (Receive Message Complete: RMC).  
A frame longer than 31 bytes is transferred to the microcontroller in blocks of 32 bytes plus one  
remainder block of length 0 to 31 bytes plus status byte. The reception of a 32-byte block is reported  
by a Receive Pool Full (RPF) interrupt and the data in RFIFO remains valid until this interrupt is  
acknowledged (RMC). This process is repeated until the reception of the remainder block reported  
by RME (figure 18). Bits 0-4 of the RFBC register represent the number of bytes stored in the  
RFIFO, including the status byte. Bits 7-5 indicate the total number of 32-byte blocks which were  
stored until the reception of the remainder block. Bits 7-5 do not overflow when the counter status  
7 has been reached and indicate in this case a message length greater than 223 bytes.  
The contents of the RFBC register are valid only after the occurrence of the RME interrupt, and  
remain valid until the microprocessor issues an acknowledgment (RMC). All receive interrupts  
accumulated in the meantime are stored (along with the status bytes and respective frame lengths)  
inside the controller and transferred one by one to the microcontroller after each RMC  
acknowledgment. If a frame could not be stored due to a full FIFO, the microcontroller is informed  
of this via the Receive Frame Overflow interrupt (RFO).  
Semiconductor Group  
48  
Operational Description  
RPF  
RMC  
(Reception of 32 Bytes)  
RPF  
RMC  
t
(Reception of 32 Bytes)  
R
IDEC  
µ
C
HDLC  
Receiver  
System  
RPF  
RMC  
(Reception of Remainder)  
RME  
RMC  
ITD02720  
Data Transfer  
Data and Status Information (Status Byte, RFBC) Transfer  
Figure 18  
Reception of an HDLC Frame  
Transmit Frame Processing  
After checking the XFIFO status by polling the Transmit FIFO Write Enable (XFW) bit or after a  
Transmit Pool Ready (XPR) interrupt, up to 32 bytes may be entered by the microcontroller in the  
XFIFO. Transmission of an HDLC frame is started when the Transmit HDLC Frame (XHF)  
command is issued. The HDLC controller will request another data block by an XPR interrupt if there  
are no more than 32 bytes in the XFIFO and the frame close command bit (Transmit Message End  
XME) has not been set. When XME is set, all remaining bytes in the XFIFO are transmitted, the  
CRC field and the closing flag of the HDLC frame are appended and the controller generates a new  
XPR interrupt (figure19).  
Semiconductor Group  
49  
Operational Description  
XPR  
XHF  
XPR  
XHF  
(Transmission of Flag plus 32 Bytes)  
t
XPR  
R
IDEC  
µ
C
HDLC  
Transmitter  
System  
XHF  
(Transmission of 32 Bytes)  
XPR  
XHF - XME  
(Transmission of Remainder  
plus CRC plus Flag)  
XPR  
ITD02718  
Data Transfer  
Figure 19  
Transmission of an HDLC Frame  
The microcontroller does not necessarily have to transfer a frame in blocks of 32 bytes. As a matter  
of fact, the sub-blocks issued by the microcontroller and separated by an XHF command, can be  
between 1 and 32 bytes long.  
If the XFIFO runs out of data and the XME command bit has not been set, the frame will be  
terminated with an abort sequence (seven 1‘s) followed by inter-frame time fill, and the  
microcontroller will be advised by a Transmit Data Underrun (XDU) interrupt. An HDLC frame may  
also be aborted by setting the Transmit Reset (XRES) command bit.  
Table 10 gives a summary of possible interrupts from the HDLC controller and the appropriate  
reaction to these interrupts.  
Semiconductor Group  
50  
Operational Description  
Table 10  
Possible Interrupt Causes and Reactions  
Mnemonic Meaning  
Reaction  
RPF  
Receive Pool Full  
Read 32 bytes from RFIFO and acknowledge with RMC.  
RME  
Receive Message End  
Read “RFBC4-0” bytes from RFIFO and acknowledge with  
RMC.  
RFO  
XPR  
Receive Frame Overflow Error report for statistical purposes (loss of a complete  
frame). Probable cause: deficiency in software.  
Transmit Pool Ready  
Write data bytes in the XFIFO if the frame currently being  
transmitted is not finished or a new frame is to be  
transmitted, and issue an XHF (and possible XME)  
command.  
XDU  
Transmit Data Underrun Acknowledged by a read of the ISTA. Possible causes:  
Excessive software reaction times, or transmit data  
collision.  
Semiconductor Group  
51  
Operational Description  
Table 11 lists the most important commands which are issued by a microcontroller by setting one  
or several bits in the Command Register (CMDR).  
Table 11  
List of Commands  
Command Hex Bit 7 … 0  
Meaning  
Mnemonic  
RMC  
RRES  
RMD  
80  
40  
20  
1000  
0100  
0010  
0000  
0000  
0000  
Receive Message Complete. Acknowledges a block  
(RPF) or a frame (RME) stored in the RFIFO.  
Reset HDLC Receiver. The RFIFO is cleared and the  
receiver is ready for reception.  
Receiver Message Delete. The part of the frame in the  
RFIFO is deleted and the rest of the frame will be ignored  
by the receiver.  
XHF  
08  
0A  
0000  
0000  
1000  
1010  
Transmit HDLC Frame. Enables the transmission of the  
block entered last into the XFIFO. The frame is not yet  
complete.  
XHFC  
Transmit a HDLC Frame and close it with CRC and flag.  
F_XHF  
F_XHFC  
0C  
0E  
0000  
0000  
1100  
1110  
Same as preceding, but used in master mode to enforce a  
transmission even in the case of a collision.  
XRES  
01  
0000  
0001  
Reset Transmitter. Clears the XFIFO; any frame currently  
being transmitted is aborted.  
Semiconductor Group  
52  
Register Description  
4
Detailed Register Description  
The following symbols are used throughout chapter 4  
x... don’t care  
n... not used. It has to be set to logical "0" in write accesses but may be switched by the IDEC to  
either logical level in read accesses.  
4.1 Register Address Layout  
The register set consists of:  
– one configuration register common to all four channels (CCR)  
– a maskable vectored interrupt status register (VISR, VISM)  
– a register for setting the HDLC address recognition mode for the four channels (ACR)  
and, for each of the four channels, a set of individual registers.  
Multiplexed Address Bus  
In order to support the use of a 16-bit microcontroller with multiplexed address bus, each register  
can be accessed with an even and an odd address value (figure 20).  
Semiconductor Group  
53  
Register Description  
Read  
Write  
00  
Channel-A  
Register Locations  
2
F
34, 3  
37, 3  
36, 3  
D
E
F
ACR  
CCR  
VISR  
ACR  
CCR  
VISM  
40  
Channel-B  
Register Locations  
6
F
80  
Channel-C  
Register Locations  
AF  
CO  
Channel-D  
Register Locations  
EF  
ITD00741  
Figure 20  
IDEC Register Map for a Multiplexed Address Bus  
Semiconductor Group  
54  
Register Description  
The address map of the individual registers of each channel is shown in table 12. In order to obtain  
the actual address of a register, a "base" has to be added to the address given in the table, as  
follows:  
base = 00 for channel A  
20 for channel B  
40 for channel C  
C0 for channel D.  
Table 12  
Address Map of HDLC Channel Registers (multiplexed address bus)  
Address  
Even  
00 to 1F  
20  
Read  
Write  
Odd  
RFIFO  
ISTA  
XFIFO  
ISM  
29  
21  
2B  
25  
23  
28  
STAR  
MODE  
RFBC  
CIR  
CMDR  
MODE  
TSR  
22  
2C  
2A  
CIX  
Semiconductor Group  
55  
Register Description  
Non-Multiplexed Address Bus  
The address layout is shown in figure 21.  
The address map of the individual registers of each channel is shown in table 13. In order to obtain  
the actual address of a register, a "base" has to be added to the address given in the table, as  
follows:  
base = 00 for channel A  
20 for channel B  
40 for channel C  
60 for channel D.  
Table 13  
Address Map of HDLC Channel Registers  
Address  
Read  
RFIFO  
ISTA  
Write  
XFIFO  
ISM  
00 to 0F  
10  
11  
STAR  
MODE  
RFBC  
CIR  
CMDR  
MODE  
TSR  
12  
15  
13  
CIX  
Note:  
The address values in the multiplexed A/D bus and non-multiplexed address bus cases are related  
to each other as follows.  
Let AD0...7 be the multiplexed address bits and let A0...6 be the non-multiplexed address bits.  
Then: A0 = AD0 exor AD3  
A1 = AD1  
A2 = AD2  
A3 = AD4  
A4 = AD5  
A5 = AD6  
A6 = AD7.  
Semiconductor Group  
56  
Register Description  
Read  
Write  
00  
15  
Channel-A  
Register Locations  
1C  
1D  
1E  
ACR  
ACR  
VISR  
CCR  
VISM  
CCR  
1F  
20  
Channel-B  
Register Locations  
35  
40  
Channel-C  
Register Locations  
55  
60  
Channel-D  
Register Locations  
75  
ITD03533  
Figure 21  
IDEC Register Map for Non-Multiplexed Address Bus  
Semiconductor Group  
57  
Register Description  
4.2 Register Description  
Common Registers  
Common Configuration Register (CCR)  
Address: 37/3EH (1FH)  
Read/Write  
Value after reset: 000n0000B  
7
0
MDS1  
MDS0  
VIS  
n
CDEN  
BNS  
CRS  
ODS  
MDS1,0 Mode Select  
MDS1  
MDS0  
Description  
0
0
1
1
0
1
0
1
Single connection  
Quad connection  
Single connection  
Quad connection  
TS mode  
common control mode  
IOM mode  
TS mode  
VIS  
0
Vectored Interrupt Selection  
IOM channel 0 to 3 (IOM mode), µP data bus bits 0 to 3 for VISR.  
IOM channel 4 to 7 (IOM mode), µP data bus bits 4 to 7 for VISR.  
1
CDEN  
Change Detection Enable.  
BNS  
Bit Number Select.  
0
1
PCM frame is at most 256 bits long.  
PCM frame is between 257 and 512 bits long.  
CRS  
Clock Rate Selection.  
0
1
DCL clock rate is equal to the data rate.  
DCL clock rate is equal to twice the data rate.  
ODS  
Output Driver Selection.  
Tristate.  
0
1
Open Drain.  
Semiconductor Group  
58  
Register Description  
The ODS bit selects the driver type simultaneously on all data outputs (and control output SD2X in  
master mode). However, in the single connection IOM mode SD0X is open-drain independent of the  
value of ODS.  
Address Compare Register (ACR)  
Address: 34/3DH (1CH)  
Read/Write  
Value after reset: 00H  
7
0
AC3  
AC2  
AC1  
AC0  
SCM  
SCG  
SCS  
SCP  
AC0-3 Address Compare for channel A-D on (1) or off (0). The first byte following the opening flag of  
a receive frame will be compared against reference values if ACi = 1 and the frame is accepted  
or rejected on the basis of the comparison. If ACi = 0, all valid HDLC frames in that channel are  
stored.  
SCM SAPI Compare Mode  
1: Accept HDLC frames for which the first address byte matches selected SAPI values.  
0: Reject HDLC frames for which the first address byte matches selected SAPI values.  
SCG SAPI Compare Group  
1: The first byte of a received HDLC frame is compared with "Group SAPI" SAPG (63D).  
0: The first byte of a received HDLC frame is not compared with SAPG.  
SCS SAPI Compare Signaling  
1: The first byte of a received HDLC frame is compared with "Signaling SAPI" SAPS (0D).  
0: The first byte of a received HDLC frame is not compared with SAPS.  
SCP SAPI Compare Packet  
1: The first byte of a received HDLC frame is compared with "Packet SAPI" SAPP (16D).  
0: The first byte of a received HDLC frame is not compared with SAPP.  
Semiconductor Group  
59  
Register Description  
The HDLC address compare logic is summarized in the table below.  
SCM  
SCG  
SCS  
SGP  
Effect  
0
0
0
Accept all frames  
Reject frames with SAPP (16D)  
SAPS (0D)  
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
SAPS (0D) and SAPP (16D)  
SAPG (63D)  
SAPG (63D) and SAPP (16D)  
SAPG (63D) and SAPS (0D)  
SAPG (63D) and SAPS (0D) and  
SAPP (16D)  
0
0
0
Reject all frames  
Accept frames with SAPP (16D)  
SAPS (0D)  
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
1
SAPS (0D) and SAPP (16D)  
SAPG (63D)  
SAPG (63D) and SAPP (16D)  
SAPG (63D) and SAPS (0D)  
SAPG (63D) and SAPS (0D) and  
SAPP (16D)  
Semiconductor Group  
60  
Register Description  
Vectored Interrupt Status Register (VISR)  
Address: 36/3FH (1EH)  
Read  
Value after reset: xxxx0000B  
7
0
0
X
X
X
X
IC3  
IC2  
IC1  
IC0  
or  
7
IC3  
IC2  
IC1  
IC0  
X
X
X
X
IC0-3 Interrupt from Channel A-D  
When VISR is read, these four bits are placed on the µP data bus with an offset determined by bit VIS  
(register CCR). Other bit positions on the bus remain in high impedance.  
Mask for Vectored Interrupt Status Register (VISM)  
Address: 36/3FH (1 EH)  
Write  
Value after reset: nnnn0000B  
7
0
n
n
n
n
MIC3  
MIC2  
MIC1  
MIC0  
MIC0-3 Mask for Interrupt from Channel A-D.  
The mask bits are active high.  
A masked interrupt is not visible when VISR is read. Instead, it remains internally stored (pending). Any  
pending interrupt will be generated and the corresponding IC0-3 bit will be set when the mask bit is reset  
to zero.  
You are recommended to set bits 7-4 to 1 during write accesses.  
Semiconductor Group  
61  
Register Description  
Individual Channel Registers  
FlFOs  
RFIFO (read), XFIFO (write)  
Address: Base + 00 to 1 FH (Base + 00 to 0FH)  
The FlFO’s have an identical address range. All the 32 addresses give access to the ‘current’ FIFO  
location.  
Note on RFIFO The RFBC register bits 0 to 4 indicate the number of bytes currently accessible to  
the microcontroller in the visible 32-byte RFIFO pool. If more bytes are read, the  
data read after "RFBC" accesses is the "old" data loaded in that part of the RFIFO  
previous to the current data. For more than 32 accesses, the RFIFO will be read  
cyclically (modulo 32). This will not disturb the next received frame.  
Note on XFIFO If more than 32 bytes are written to the XFIFO (without a transmit command), an  
XDOV interrupt is generated. The byte that was entered first (first byte to be sent)  
will be continuously overwritten by the extra write operations.  
When the closing flag of a receive frame is detected, a status byte is appended to the data in the  
RFIFO.  
This byte has the following format:  
7
0
RBC  
RDO  
CRC  
RAB  
0
0
0
0
RBC: Receive Byte Count  
The length of the received frame (excluding flags and Frame Check Sequence FCS) is  
N x 8 bits if RBC = 1 (N {1,2,3,...}). The length is not a multiple of 8 bits if RBC = 0.  
RDO: Receive Data Overflow  
If RDO = 1, part of the frame has been lost because the receive FIFO was full.  
CRC: CRC Check  
The received FCS bytes were correct if CRC = 1.  
RAB: Receive Abort  
RAB = 1 implies that the received frame was aborted.  
A status byte equal to A0H indicates a correctly received frame.  
Semiconductor Group  
62  
Register Description  
Status / Command Registers  
Interrupt Status Register (ISTA)  
Address: Base + 20/29H (Base + 10H)  
Read  
Value after reset: 00H  
7
0
RME  
RPF  
RFO  
XPR  
XDU  
n
CD  
n
RME Receive Message End.  
One complete frame of length less than 32 bytes, or the last part of a frame at least 32 bytes  
long is stored in the receive FIFO, including the status byte. The number of bytes stored is  
given by RFBC bits 0-4.  
RPF Receive Pool Full.  
32 bytes of a frame have arrived in the receive FIFO. The frame is not yet completely  
received.  
RFO Receive Frame Overflow.  
At least one complete frame was lost because no storage space was available in the RFIFO.  
XPR Transmit Pool Ready.  
One data block may be entered into the XFIFO.  
XDU Transmit Data Underrun.  
Transmitted frame was terminated with an abort sequence because  
either 1)  
or 2)  
no data was available for transmission in XFIFO and no XME command was  
issued,  
a collision has occurred after at least one block of data has been completely  
transmitted, and thus an automatic retransmission cannot be attempted.  
CD  
Change detection interrupt. A new value has been entered into the CIR register.  
Note:  
It is not possible to transmit frames when an XDU interrupt remains unacknowledged.  
Mask for Interrupt Status Register (ISM) Address: Base + 20/29H (Base + 10H)  
Write  
Value after reset: 00H  
7
0
RME  
RPF  
RFO  
XPR  
XDU  
n
CD  
n
Each interrupt source in ISTA register can be selectively masked by setting to "1" the corresponding  
bit in ISM. Masked interrupts are not indicated when ISTA is read. Instead, they remain internally  
stored and pending. An interrupt is generated after the mask is reset to zero.  
Semiconductor Group  
63  
Register Description  
Status Register (STAR)  
Address: Base + 21 /28H (Base + 11H)  
Read  
Value after reset: 50H  
7
0
XDOV  
XFW  
BSY  
RNA  
VN3  
VN2  
VN1  
VN0  
XDOV Transmit Data Overflow.  
More than 32 bytes have been written into the XFIFO.  
XFW Transmit FIFO Write Enable.  
Data can be entered into the XFIFO.  
BSY Busy state on the receive line.  
A "0" in this bit position indicates an "idle" state on the input data line (15 or more  
consecutive ones).  
RNA Receive line Not Active.  
Indicates whether flags/frames are being received on the line (0) or not (1). RNA takes on  
the value "1" after seven consecutive ones are received on the line.  
VN3-0 Version Number of chip  
0... A1 version  
1... A2 version  
2... 1.3 version  
Semiconductor Group  
64  
Register Description  
Command Register (CMDR)  
Address: Base + 21/28H (Base + 11H)  
Write  
Value after reset: 00H  
7
0
RMC  
RRES  
RMD  
X
XHF  
FHF  
XME  
XRES  
RMC Receive Message Complete.  
Reaction to RPF or RME internupt. The receive FIFO pool currently accessible by the  
microcontroller is released for a subsequent frame (or 32-byte block of data).  
RRES Receiver Reset.  
The HDLC receiver is reset, the receive FIFO is cleared of any data.  
RMD Receive Message Delete.  
Reaction to RPF or RME interrupt. The entire frame is to be ignored by the receiver. The  
part of the frame already stored is discarded.  
XHF Transmit HDLC Frame.  
Transmission of an HDLC frame (or of a block thereof) is initiated.  
FHF Force HDLC Frame.  
Used in the master collision mode (CMS1,0 = 11). When this bit is set and a Transmit HDLC  
Frame (XHF) command is issued, the controller aborts the frame from CDR (if any) by  
sending seven 1’s on SD0X and then starts transmission. SD2X is set "low" to indicate that  
no data will be accepted on CDR input data line.  
XME Transmit Message End.  
Indicates that the current transmit frame is to be closed with CRC and flag.  
XRES Transmitter Reset.  
The HDLC transmitter is reset, XFIFO is cleared of any data and the HDLC frame currently  
being transmitted (if any) is aborted.  
Semiconductor Group  
65  
Register Description  
Mode Register (MODE)  
Address: Base + 22/2BH (Base + 12H)  
Read/Write  
Value after reset: 00H  
7
0
TLP  
TLP  
CMS1  
CMS0  
ITF  
RAC  
CAC  
CCS1  
CCS0  
Test Loop  
Input and output of HDLC channel are connected together when TLP = 1. The test loop is  
either transparent (if MDS1,0 = 01, 10) or not (if MDS1,0 = 00, 11).  
CMS1,0 Collision Mode Select.  
CMS1  
CMS0  
Description  
0
0
1
1
0
1
0
1
Unconditional transmission  
Slave mode  
Multi-master mode  
Master mode  
ITF  
Interframe Time Fill  
Idle (ITF = 0) or flags (ITF = 1 ) are used as interframe time fill.  
RAC  
CAC  
Receiver Active.  
Receiver is activated (1 ) or deactivated (0).  
Channel Active.  
A channel is completely disabled (receiver and transmitter are inactive, transmit line is  
high impedance, no TSC is output) as long as CAC is "0".  
CCS1,0 Channel Capacity Select.  
These bits select the number of bits in the time slot where data are received and  
transmitted. They have a significance only when MDS1,0 = 00 or 11 (Single connection  
TS mode and Quad connection TS mode).  
The bit rates given below assume a channel repetition rate of 8 kHz.  
CCS1  
CCS0  
Time - Slot Width  
Channel Data Rate  
0
0
1
1
0
1
0
1
2 bits  
1 bit  
8 bits  
7 bits  
16 kbit/s  
8 kbit/s  
64 kbit/s  
56 kbit/s  
Semiconductor Group  
66  
Register Description  
Command/lndicate Channel Receive Channel 0 - 3 (CIR0 - 3) (read)  
Address: 23,2A + offset (multiplexed), 13 + offset (demux)  
Reset value: nnnn1111 B  
bit 7  
bit0  
n
n
n
n
CI3  
CI2  
CI1  
CI0  
bit7:  
bit6:  
bit5:  
bit4:  
CI3-0:  
Not used.  
Not used.  
Not used.  
Not used.  
Received C/I code, will be updated in each frame.  
CI3 is the bit received first.  
Command/lndicate Channel Receive Channel 0 - 3 (CIX0 - 3) (write)  
Address: 23,2A + offset (multiplexed), 13 + offset (demux)  
Reset value: nnnn1111 B  
bit 7  
bit0  
n
n
n
n
CI3  
CI2  
CI1  
CI0  
bit7:  
bit6:  
bit5:  
bit4:  
CI3-0:  
Not used.  
Not used.  
Not used.  
Not used.  
Received C/I code, will be updated in each frame.  
CI3 is the bit received first.  
Semiconductor Group  
67  
Register Description  
Recelve Frame Byte Counter (RFBC)  
Address: Base + 25/2CH (Base + 15H)  
Read  
Value after reset: 00H  
7
0
RDC7  
RDC6  
RDC5  
RDC4  
RDC3  
RDC2  
RDC1  
RDC0  
RDC7-0 Receive Data Count  
Total number of bytes of received frame, including the status byte. The contents of the  
register are valid after an RME interrupt. RDC4-0 indicate the length of the data block  
currently available in the receive FIFO. RDC7-5 count the number of full 32-byte blocks  
of a frame which have already been received. If the frame length exceeds 223 bytes,  
RDC7-5 hold the value "111", only RDC4-0 continue to count modulo 32.  
Time-Slot Register (TSR)  
Address: Base + 25/2CH (Base + 15H)  
Write  
Value after reset: 00H  
7
0
TS7  
TS6  
TS5  
TS4  
TS3  
TS2  
TS1  
TS0  
TS7-0  
Time-Slot Select  
Determine the particular time slot where the HDLC controller is to receive and transmit.  
This register has a significance only when MDS1,0 = 00,10 or 11 (single connection  
modes and quad connection TS mode).  
The register gives the position of a time slot (either 1, 2, 7 or 8 bits wide, cf. CCS1,0) in  
two-bit increments (two-bit resolution).  
The position of the time slot is relative to a frame sync signal that marks the beginning of  
a PCM frame.  
Semiconductor Group  
68  
Electrical Characteristics  
5
Electrical Characteristics  
Absolute Maximum Ratings  
Parameter  
Symbol  
TA  
Limit Values  
0 to 70  
Unit  
°C  
°C  
V
Ambient temperature under bias  
Storage temperature  
Tstg  
– 65 to 125  
Voltage on any pin with respect to ground  
V S  
– 0.4 to V DD + 0.4  
DC Characteristics  
TA = 0 to 70 °C; V DD = 5 V ± 5 %, V SS = 0 V  
Parameter  
Symbol Limit Values Unit Test Condition  
min. max.  
L-input voltage  
H-input voltage  
V IL  
V IH  
– 0.4 0.8  
V
V
2.0  
V CC  
+ 0.4  
L-output voltage  
V OL  
0.45  
V
V
I
I
OL = 7 mA (SD0X…SD3X)  
OL = 2 mA (all other pins)  
H-output voltage  
H-output voltage  
V OH  
V OH  
2.4  
V DD  
– 0.5  
I
I
OH = – 400 µA  
OH = – 100 µA  
Power supply current operational I CC  
10  
1
mA  
mA  
V DD = 5 V,  
DCL = 4096 kHz  
Inputs at 0 V/V DD,  
No output loads  
power down  
Input leakage current  
Output leakage current  
I LI  
I LO  
+ 10  
µA 0 V < V IN < V DD to 0 V  
0 V < V OUT < V DD to 0 V  
Capacitances  
TA = 25 °C; V DD = 5 V ± 5 %, V SS = 0 V  
Parameter  
Symbol Limit Values Unit  
min. max.  
Test Condition  
Input capacitance  
I/O capacitance  
C IN  
C IO  
5
10  
20  
pF  
pF  
10  
Semiconductor Group  
69  
Electrical Characteristics  
AC Characteristics  
T A = 0 to 70 °C, V DD = 5 V ± 5 %  
Inputs are driven to 2.4 V for a logical "1" and to 0.4 V for a logical "0". Timing measurements are  
made at 2.0 V for a logical "1" and at 0.8 V for a logical "0".  
The AC testing input/output waveforms are shown below.  
2.4  
2.0  
0.8  
2.0  
0.8  
Device  
Under  
Test  
Test Points  
C Load = 150 pF  
0.45  
ITS00621  
Figure 22  
Input/Output Waveforms for AC Tests  
Semiconductor Group  
70  
Electrical Characteristics  
Microcontroller Interface TimingmP Read Cycle  
Siemens/Intel Bus ModemP Read CyclemP Read CyclemP Read Cycle  
µP Read Cycle  
t RR  
t RI  
RD x CS  
t DF  
t RD  
Data  
AD0 - AD7  
ITT00712  
Figure 23  
µP Write Cycle  
t WW  
t WI  
WR x CS  
t WD  
t DW  
Data  
AD0 -AD7  
ITT00713  
Figure 24  
Multiplexed Address Timing  
t AA  
tAD  
ALE  
WR x CS or  
RD x CS  
t ALS  
t AL  
t LA  
AD0 - AD7  
Address  
ITT00714  
Figure 25  
Semiconductor Group  
71  
Electrical Characteristics  
Non - Multiplexed Address Timing  
WR x CS or  
RD x CS  
t AS  
t AH  
A0 - A5  
Address  
ITT00715  
Figure 26  
Motorola Bus Mode  
µP Read Cycle  
R/W  
t DSD  
tRWD  
t RI  
t RR  
CS x DS  
t DF  
t RD  
Data  
D0 - D7  
ITT00716  
Figure 27  
Semiconductor Group  
72  
Electrical Characteristics  
µP Write Cycle  
R/W  
t DSD  
t RWD  
t WW  
t WI  
CS x DS  
t WD  
t DW  
AD0 - AD7  
Data  
ITT00717  
Figure 28  
Address Timing  
CS x DS  
t AS  
t AH  
AD0 - AD5  
ITT00718  
Figure 29  
Semiconductor Group  
73  
Electrical Characteristics  
Interface Timing  
Parameter  
Symbol Limit Values  
Unit  
min.  
50  
20  
35  
35  
10  
25  
15  
0
max.  
ALE pulse width  
tAA  
tAL  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address setup time to ALE  
Address hold time from ALE  
Address latch setup time to WR, RD  
Address setup time  
tLA  
tALS  
tAS  
tAH  
tAD  
tDSD  
tRR  
tRD  
tDF  
tRI  
Address hold time  
ALE guard time  
RD Delay after WR setup  
RD pulse width  
120  
Data output delay from RD  
Data float from RD  
120  
25  
RD control interval  
75  
60  
30  
10  
70  
WR pulse width  
tWW  
t DW  
t WD  
tWI  
Data setup time to WR x CS  
Data hold time from WR x CS  
WR control interval  
Semiconductor Group  
74  
Electrical Characteristics  
Serial Interface Timing  
DCL Characteristics  
2.0 V  
0.8 V  
t WH  
t WL  
ITT00744  
t P  
Figure 30  
Definition of DCL Period and Width  
Parameter  
Symbol  
Limit Values  
typ.  
Unit Test Condition  
min.  
DCL period  
DCL high  
DCL low  
t P  
230  
160  
ns  
ns  
single clock rate  
double clock rate  
t WH  
t WL  
90  
50  
ns  
ns  
single clock rate  
double clock rate  
70  
ns  
Semiconductor Group  
75  
Electrical Characteristics  
Input/Output Characteristics  
FSC in Single Connection Modes and Quad Connection in TS Mode  
DCL  
tFH  
tFS  
tFH  
FSC  
tODF  
tFS  
tODD  
tODD  
1st Bit of Frame  
2nd Bit of Frame  
tIDH  
Data OUT  
Data IN  
DCL Rate  
equal to  
Data Rate  
tIDH  
tIDS  
tIDS  
1st Bit  
of Frame  
2nd Bit  
of Frame  
tODD  
tODF  
tODD  
1st Bit of Frame  
tIDS  
Data OUT  
Data IN  
DCL Rate  
equal to  
twice the  
Data Rate  
tIDH  
1st Bit  
of Frame  
ITD00745  
Figure 31  
FSC Timing Characteristics  
Semiconductor Group  
76  
Electrical Characteristics  
FSC Timing Characteristics  
Parameter  
Symbol  
Limit Values  
max.  
Unit  
min.  
60  
FSC set-up time  
t FS  
ns  
FSC setup time*  
t FS2  
t FH  
110  
30  
FSC hold time  
ns  
ns  
ns  
ns  
ns  
Output data delay from DCL  
Input data set-up  
t ODD  
t IDS  
t IDH  
t ODF  
60  
25  
20  
Input data hold  
Output data delay from FSC*  
160  
*Note:  
This delay is applicable in two cases when the first time slot has been programmed:  
1) When FSC appears for the first time, e.g. at system power-up.  
2) When the number of bits in the PCM frame is not equal to either 256 or 512.  
Semiconductor Group  
77  
Electrical Characteristics  
FSC in Quad Connection Common Control Mode  
DCL  
tFH1  
tFS1  
tFH1  
FSC  
tOZD  
tOZD  
tODD  
High Impedance  
High Impedance  
Data OUT  
Data IN  
tIDH  
tIDS  
ITD00746  
Figure 32  
FSC Characteristics (strobe)  
Parameter  
Symbol  
Limit Values  
Unit  
min.  
max.  
FSC set-up time  
FSC hold time  
t FS1  
t FH1  
60  
30  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Output data from high impedance to active t OZD  
Output data from active to high impedance t ODZ  
80  
40  
60  
Output data delay from DCL  
Input data set up  
t ODD  
t IDS  
t IDH  
25  
20  
Input data hold  
Semiconductor Group  
78  
Electrical Characteristics  
DCL  
tODD  
Data OUT  
Data IN  
TSC  
tIDS  
tIDH  
tTCD  
ITD00747  
Figure 33  
Data I/O Characteristics  
Parameter  
Symbol  
Limit Values  
Unit  
min.  
max.  
Output data delay from DCL  
Input data set-up  
t ODD  
t IDS  
t IDH  
t TCD  
60  
ns  
ns  
ns  
ns  
25  
20  
Input data hold  
TSC delay from DCL  
60  
Data OUT: SD0X in single connection modes  
SD0X, SD1X, SD2X, SD3X in quad connection modes  
SD1X, SD2X in master mode  
Data IN:  
SD0R in single connection mode  
SD0R, SD1X, SD2R, SD3R in quad connection modes  
CDR in slave, multi-master and master modes  
RES Characteristics  
Parameter  
Symbol  
Limit Values  
max.  
Unit  
min.  
16 x t P  
RES high  
t RWL  
ns  
Semiconductor Group  
79  
Appendix  
6
Appendix  
1. The version number (STAR0-3:VN1, VN0) has been incremented to 10 bin.  
2. IDEC version A3 has a C/I channel handler implemented. If CCR:bit3 is set to “0” in all write  
accesses as specified in the IDEC Technical Manual for version A1 and A2, upward compability  
is ensured.  
When CCR:bit3 is programmed to 1, the C/I channel handler is active. To support the C/I channel  
handler, these changes have been made:  
ISTA0-3:bit1 Change detection interrupt (maskable, reset when the appropriate ISTA is read).  
Register  
Address  
(Multiplexed  
busses)  
Address  
(Separate  
busses)  
Reset Value  
Access  
CIR0  
CIR1  
CIR2  
CIR3  
CIX0  
CIX1  
CIX2  
CIX3  
23,2A hex  
63,6A hex  
A3,AA hex  
E3,EA hex  
23,2A hex  
63,6A hex  
A3,AA hex  
E3,EA hex  
13 hex  
33 hex  
53 hex  
73 hex  
13 hex  
33 hex  
53 hex  
73 hex  
xF hex  
xF hex  
xF hex  
xF hex  
xF hex  
xF hex  
xF hex  
xF hex  
RD  
RD  
RD  
RD  
WR  
WR  
WR  
WR  
Please refer to IDEC C/I channel handling 2/90 for details.  
Semiconductor Group  
80  
Package Outlines  
7
Package Outlines  
Plastic Dual-in-Line Package, P-DIP-28  
±0.2  
15.24  
0.25+0.1  
2.54  
28  
1.5 max  
0.45 +0.1  
1.5  
15  
14-0.3  
15.24+1.2  
1
14  
0.25 max  
35.9-0.4  
Index Marking  
Plastic-Leaded Chip Carrier, P-LCC-44 (SMD)  
SMD = Surface Mounted Device  
Dimensions in mm  
Semiconductor Group  
81  

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