AN1003 [ETC]

陶瓷天线 Multilayer Chip Antenna for 433MHz Wireless Communication; 陶瓷天线叠层片式天线为433MHz的无线通信
AN1003
型号: AN1003
厂家: ETC    ETC
描述:

陶瓷天线 Multilayer Chip Antenna for 433MHz Wireless Communication
陶瓷天线叠层片式天线为433MHz的无线通信

无线 通信
文件: 总10页 (文件大小:311K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AN1003  
Multilayer Chip Antenna for  
2.4GHz & 5~6GHz  
Wireless Communication  
技术:+86 158-1062-2705  
销售:+86 131-4671-3331  
RainSun Corporation  
http://www.rainsun.com  
Aug, 2006  
Ver.1.1  
1 of 10  
AN1003 Multilayer Chip Antenna  
Features  
y Light weight and low profile 10.3mm(L)X3.0mm(W)X1.6mm(H)  
y Omnidirectional in azimuth  
y Lead (Pb) Free  
Applications  
y 2.4GHz & 5~6GHz wireless communications  
y 2.4GHz & 5~6GHz Modules  
y 802.11a/b/g Wireless LAN System  
Specifications  
Center frequency  
Peak gain  
2.45GHz & 5~6GHz  
1dBi  
Operation temperature  
Storage temperature  
VSWR  
40 ~ +85 °C  
40 ~ +85 °C  
2.0 (max)  
Input Impedance  
Power handling  
Bandwidth  
50 Ohm  
3W (max)  
2.45GHz 70MHz  
5~6GHz 500MHz  
Omnidirectional  
Linear  
Azimuth beamwidth  
Polarization  
RainSun Corporation  
http://www.rainsun.com  
Aug, 2006  
Ver.1.1  
2 of 10  
Pin configuration  
Top view  
Pin No  
Pin assignment  
Feed termination  
Feed point mark  
Solder termination  
1
1
2
3
2
3
Dimensions  
Symbol  
Dimensions(mm)  
10.3 ± 0.10  
3.00 ± 0.10  
0.50 ± 0.05  
1.50 ± 0.10  
0.50 ± 0.05  
1.50 ± 0.10  
1.60 ± 0.20  
A
B
C
D
E
F
H
PCB Foot Print  
Symbol  
Dimensions(mm)  
G
H
I
1.0  
1.9  
10.3  
RainSun Corporation  
http://www.rainsun.com  
Aug, 2006  
Ver.1.1  
3 of 10  
Recommended Test Board Pattern  
Top view  
Bottom view  
Ground Plane  
Ground Plane  
50 Ohm  
Transmission line  
Unit : mm  
Board thickness : 0.8mm  
Board material : FR4  
SMA connector  
Fig-1  
Testing Setup  
Measurement  
Testing Instrument:  
Anritsu 37369C VNA(Vector Network  
Analyzer)  
VNA calibrate with 1 path reflection  
only calibration sequence on test board  
feed point.  
The test board dimension and it’s  
layout is the same as Fig1.  
RainSun Corporation  
http://www.rainsun.com  
Aug, 2006  
Ver.1.1  
4 of 10  
Typical Electrical Characteristics  
Return loss  
2.45GHz Smith Chart  
Marker data:  
1 : f=2.493 GHz  
2 : f=2.375 GHz  
3 : f=2.437 GHz  
RainSun Corporation  
5 of 10  
Aug, 2006  
Ver.1.1  
http://www.rainsun.com  
5.2GHz Smith Chart  
Marker data:  
4 : f=4.998 GHz  
RainSun Corporation  
http://www.rainsun.com  
Aug, 2006  
Ver.1.1  
6 of 10  
Typical Radiation Patterns  
2.45 GHz HPlane  
2.45 GHz EPlane  
5.2 GHz HPlane  
5.2 GHz EPlane  
RainSun Corporation  
http://www.rainsun.com  
Aug, 2006  
Ver.1.1  
7 of 10  
Typical Soldering Profile for Leadfree Process  
Peak temp 340°C  
340°C  
300°C  
150°C  
5 sec.  
25 sec.  
Pre-heating  
Time (sec.)  
Do not exceed 30 secs.  
Reflow Soldering  
10 sec, max  
260°C  
230°C  
180°C  
30 sec.  
60 sec.  
Pre-heating  
Time (sec.)  
RainSun Corporation  
http://www.rainsun.com  
Aug, 2006  
Ver.1.1  
8 of 10  
Packing  
Blister Tape Specifications  
Symbol  
Dimension  
24.00  
Tolerance  
± 0.30  
Unit  
mm  
mm  
mm  
W
E
1.75  
± 0.10  
F
11.50  
± 0.10  
+ 0.10  
0.00  
D
1.50  
1.50  
mm  
mm  
+ 0.25  
0.00  
D1  
P0  
P
4.00  
8.00  
2.00  
± 0.10  
± 0.10  
± 0.10  
mm  
mm  
mm  
P2  
+ 0.10  
3.20  
A0  
3.20  
mm  
B0  
K0  
t
10.60  
2.20  
0.30  
± 0.10  
± 0.10  
± 0.05  
mm  
mm  
mm  
RainSun Corporation  
http://www.rainsun.com  
Aug, 2006  
Ver.1.1  
9 of 10  
Reel Specifications  
Quantity  
Per Reel  
Tape Width  
(mm)  
A
(mm)  
C
(mm)  
E
(mm)  
W
(mm)  
W1  
(mm)  
B
(mm)  
3,000  
24  
330±1  
13.0±0.5 100.0±0.5  
2.2±0.5 24.0±0.5 28.9±0.2  
RainSun Corporation  
http://www.rainsun.com  
Aug, 2006  
Ver.1.1  
10 of 10  

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