AN1003 [ETC]
陶瓷天线 Multilayer Chip Antenna for 433MHz Wireless Communication; 陶瓷天线叠层片式天线为433MHz的无线通信
| 型号： | AN1003 |
| 厂家： | 
ETC |
| 描述： | 陶瓷天线 Multilayer Chip Antenna for 433MHz Wireless Communication |
| 文件： | 总10页 (文件大小：311K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AN1003
Multilayer Chip Antenna for
2.4GHz & 5~6GHz
Wireless Communication
技术：+86 158-1062-2705
销售：+86 131-4671-3331
RainSun Corporation
http://www.rainsun.com
Aug, 2006
Ver.1.1
1 of 10
AN1003 Multilayer Chip Antenna
◆ Features
y Light weight and low profile 10.3mm(L)X3.0mm(W)X1.6mm(H)
y Omni‐directional in azimuth
y Lead (Pb) Free
◆ Applications
y 2.4GHz & 5~6GHz wireless communications
y 2.4GHz & 5~6GHz Modules
y 802.11a/b/g Wireless LAN System
Specifications
Center frequency
Peak gain
2.45GHz & 5~6GHz
1dBi
Operation temperature
Storage temperature
VSWR
‐40 ~ +85 °C
‐40 ~ +85 °C
2.0 (max)
Input Impedance
Power handling
Bandwidth
50 Ohm
3W (max)
2.45GHz 70MHz
5~6GHz 500MHz
Omni‐directional
Linear
Azimuth beamwidth
Polarization
RainSun Corporation
http://www.rainsun.com
Aug, 2006
Ver.1.1
2 of 10
Pin configuration
Top view
Pin No
Pin assignment
Feed termination
Feed point mark
Solder termination
1
1
2
3
2
3
Dimensions
Symbol
Dimensions(mm)
10.3 ± 0.10
3.00 ± 0.10
0.50 ± 0.05
1.50 ± 0.10
0.50 ± 0.05
1.50 ± 0.10
1.60 ± 0.20
A
B
C
D
E
F
H
PCB Foot Print
Symbol
Dimensions(mm)
G
H
I
1.0
1.9
10.3
RainSun Corporation
http://www.rainsun.com
Aug, 2006
Ver.1.1
3 of 10
Recommended Test Board Pattern
Top view
Bottom view
Ground Plane
Ground Plane
50 Ohm
Transmission line
Unit : mm
Board thickness : 0.8mm
Board material : FR4
SMA connector
Fig-1
Testing Setup
Measurement
Testing Instrument:
Anritsu 37369C VNA(Vector Network
Analyzer)
VNA calibrate with 1 path reflection
only calibration sequence on test board
feed point.
The test board dimension and it’s
layout is the same as Fig‐1.
RainSun Corporation
http://www.rainsun.com
Aug, 2006
Ver.1.1
4 of 10
Typical Electrical Characteristics
Return loss
2.45GHz Smith Chart
Marker data:
1 : f=2.493 GHz
2 : f=2.375 GHz
3 : f=2.437 GHz
RainSun Corporation
5 of 10
Aug, 2006
Ver.1.1
http://www.rainsun.com
5.2GHz Smith Chart
Marker data:
4 : f=4.998 GHz
RainSun Corporation
http://www.rainsun.com
Aug, 2006
Ver.1.1
6 of 10
Typical Radiation Patterns
2.45 GHz H‐Plane
2.45 GHz E‐Plane
5.2 GHz H‐Plane
5.2 GHz E‐Plane
RainSun Corporation
http://www.rainsun.com
Aug, 2006
Ver.1.1
7 of 10
Typical Soldering Profile for Lead‐free Process
Peak temp 340°C
340°C
300°C
150°C
5 sec.
25 sec.
Pre-heating
Time (sec.)
Do not exceed 30 secs.
Reflow Soldering
10 sec, max
260°C
230°C
180°C
30 sec.
60 sec.
Pre-heating
Time (sec.)
RainSun Corporation
http://www.rainsun.com
Aug, 2006
Ver.1.1
8 of 10
Packing
Blister Tape Specifications
Symbol
Dimension
24.00
Tolerance
± 0.30
Unit
mm
mm
mm
W
E
1.75
± 0.10
F
11.50
± 0.10
+ 0.10
‐ 0.00
D
1.50
1.50
mm
mm
+ 0.25
‐ 0.00
D1
P0
P
4.00
8.00
2.00
± 0.10
± 0.10
± 0.10
mm
mm
mm
P2
+ 0.10
3.20
A0
3.20
mm
B0
K0
t
10.60
2.20
0.30
± 0.10
± 0.10
± 0.05
mm
mm
mm
RainSun Corporation
http://www.rainsun.com
Aug, 2006
Ver.1.1
9 of 10
Reel Specifications
Quantity
Per Reel
Tape Width
(mm)
A
(mm)
C
(mm)
E
(mm)
W
(mm)
W1
(mm)
B
(mm)
3,000
24
330±1
13.0±0.5 100.0±0.5
2.2±0.5 24.0±0.5 28.9±0.2
RainSun Corporation
http://www.rainsun.com
Aug, 2006
Ver.1.1
10 of 10
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