2SD315AI [ETC]
Dual SCALE Driver Core for IGBTs and Power MOSFETs; 双刻度驱动核心的IGBT和功率MOSFET
| 型号： | 2SD315AI |
| 厂家： | 
ETC |
| 描述： | Dual SCALE Driver Core for IGBTs and Power MOSFETs |
| 文件： | 总15页 (文件大小：351K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SCALE Driver
2SD315AI Data Sheet
2SD315AI Dual SCALE Driver Core
for IGBTs and Power MOSFETs
Description
The SCALE drivers from CONCEPT are
based on a chip set that was
developed specifically for the reliable
driving and safe operation of IGBTs
and power MOSFETs.
The name “SCALE” is an acronym for the
most outstanding properties of the SCALE
series of drivers:
SCALE = Scaleable, Compact, All purpose,
Low cost and Easy to use.
The SCALE driver is a winning project of the
competition organized by “Technology Center
Switzerland 1998”. And ABB Switzerland AG honored the development of the SCALE
driver by distinguishing it as the “best power electronics project in 1998”.
Product Highlights
Applications
[ Suitable for 1200V and 1700V IGBTs
[ Short circuit and overcurrent protection
[ Extremely reliable, long service life
[ High gate current of ±15A
[ Inverters
[ Motor drive technology
[ Traction
[ Railroad power supplies
[ Converters
[ Electrical isolation of 4000VAC
[ Electrically isolated status acknowledgement
[ Power engineering
[ Monitoring of power supply and self-monitoring [ Switched-mode power supplies
[ Switching frequency DC to >100kHz
[ Duty cycle: 0... 100%
[ Radiology and laser technology
[ DC/DC converter
[ High dv/dt immunity, guaranteed >100,000V/µs [ Research
[ Complete with DC/DC converter
[ RF generators and converters
IGBT-Driver.com
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SCALE Driver
2SD315AI Data Sheet
Block Diagram
Rth
Rg
IGD
VDD
Viso1
LDI
Rth
Rg
GND
IGD
Viso2
VDC
Viso1
Viso2
PWM
oscillator
GND
Interface on
Electronic Level Isolation
Electrical Driver on
Power Level
Power-
Semiconductor
(external)
SCALE Driver Module
Fig. 1 Block diagram of the 2SD315AI
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INTELLIGENT POWER ELECTRONICS
SCALE Driver
2SD315AI Data Sheet
Pin Designation
Pin Des.
Function
Pin Des.
Function
1
2
3
4
5
6
7
8
9
VDD
VDD
SO1
VL
RC1
InB
RC2
MOD
SO2
+15V for electronic input side
+15V for electronic input side
Status output channel 1
Logic level/Reset
RC network dead-time channel 1
Input B
RC network dead-time channel 2
Mode input
Status output channel 2
Input A
GND for electronic input side
GND for electronic input side
+15V for DC/DC converter
+15V for DC/DC converter
+15V for DC/DC converter
+15V for DC/DC converter
+15V for DC/DC converter
44 G1
43 G1
Gate channel 1
Gate channel 1
42 COM1 Virtual common channel 1
41 COM1 Virtual common channel 1
40 Viso1
39 E1
38 E1
37 Rth1
36 C1
35 LS1
34
33
32 G2
31 G2
30 COM2 Virtual common channel 2
29 COM2 Virtual common channel 2
28 Viso2
27 E2
26 E2
25 Rth2
24 C2
Blocking capacitor channel 1
Emitter channel 1
Emitter channel 1
Reference resistor channel 1
Collector sense channel 1
Local status channel 1
Free
Free
Gate channel 2
Gate channel 2
10 InA
11 GND
12 GND
13 VDC
14 VDC
15 VDC
16 VDC
17 VDC
Blocking capacitor channel 2
Emitter channel 2
Emitter channel 2
Reference resistor channel 2
Collector sense channel 2
Local status channel 2
18 GND(dc) Ground DC/DC converter
19 GND(dc) Ground DC/DC converter
20 GND(dc) Ground DC/DC converter
21 GND(dc) Ground DC/DC converter
22 GND(dc) Ground DC/DC converter
23 LS2
Legend:
Pins with the designation “Free” are not physically present.
PCB Layout / Mechanical Dimensions
Details of the circuit board layout
Grid of the aspect drawing on page 4 below: 1.27mm (50mil)
Recommended diameter of solder pad: Ø 1.6mm
Recommended diameter of drill holes: Ø 1.0mm
IGBT-Driver.com
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SCALE Driver
2SD315AI Data Sheet
Mechanical Dimensions
Fig 2 Front view (top) / Layout overview component side (bottom) 2SD315AI
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INTELLIGENT POWER ELECTRONICS
SCALE Driver
2SD315AI Data Sheet
Fig. 3 Side view (top) / Mechanical fixing (bottom) 2SD315AI
Height X: typ. 22mm
IGBT-Driver.com
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SCALE Driver
2SD315AI Data Sheet
Mechanical fixing
The 2SD315AI driver has two holes each 3.2mm in diameter. They allow additional
fixing of the driver for applications requiring very high resistance to shaking/vibration
(railways, traction systems, electrically-driven vehicles, etc.). See Fig. 3 (bottom).
Absolute Maximum Ratings
Parameter
Test conditions
min max
unit
Supply voltage VDC
Supply voltage VDD
Logic input voltage
Gate peak current Iout
0
0
16
16
Vdc
Vdc
Vdc
A
to GND
Gx to Ex
0 VDD
-18 +18
6
Output power DC/DC converter total for both channels
W
Operating voltage
continuous (see Note 8)
inputs to outputs (see Note 11)
(see Note 10)
1200
4000 VAC(eff)
-40 +85
-40 +90
Vdc
Test voltage (50Hz/1min)
Operating temperature
Storage temperature
°C
°C
All data refer to +25°C and VDD = VDC = 15V unless otherwise specified
Electrical Characteristics
Power supply
Test conditions
min typ max
unit
Nominal supply voltage VDC
Supply current IDC
Max. supply current IDC
to GND (see Note 1)
without load
(see Note 2)
15
30
470
6
Vdc
mA
mA
W
Output power DC/DC converter (see Note 3)
Efficiency η
Nominal supply voltage VDD to GND
Supply current IDD
Supply current IDD
internal DC/DC converter
85
15
12
%
Vdc
mA
mA
without load
at 25kHz switching frequency
15
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INTELLIGENT POWER ELECTRONICS
SCALE Driver
2SD315AI Data Sheet
Electrical Characteristics (Continuation)
Power supply monitoring
Test conditions
min typ max
unit
Turn-on threshold Vth
Hysteresis on/off
(see Note 4)
(see Note 4)
11.5
0.7
Vdc
Vdc
Logic inputs
Test conditions
min typ max
unit
Input voltage
all inputs (see Note 5)
0
VDD
Vdc
Timing characteristics
Test conditions
min typ max
unit
Delay time input to output
turn-on tpd(on)
turn-off tpd(off)
after failure (see Note 12)
300
350
1
ns
ns
s
Blocking time
Outputs
Test conditions
min typ max
unit
Output current IG
Gx to Ex (see Note 6)
Gx to Ex (see Note 7)
Gx to Ex (see Note 7)
-15
+15
100/160
80/130
A
ns
ns
mA
V
Output rise time tr(out)
Output fall time tf(out)
Output current SOx
Output voltage rating SOx
Output current LSx
1.5
SOx to GND
VDD
5
mA
Vce-Monitoring
Test conditions
min typ max
VDD
unit
Inputs Cx
to Ex
0
Vdc
Electrical isolation
Test conditions
min typ max
unit
Operating voltage
Test voltage
Partial discharge extinction volt. IEC270
Creep path input-output
continuous (see Note 8)
(50Hz/1min) (see Note 11)
1200
Vdc
4000 VAC(eff)
VAC(pk)
mm
>1700
20
Creep path output-output
Maximum 'V/'t at 'V =1000V (see Note 9)
20
mm
kV/Ps
100
All data refer to +25°C and VDD = VDC = 15V unless otherwise specified
IGBT-Driver.com
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SCALE Driver
2SD315AI Data Sheet
Operating Conditions
Operating conditions
Test conditions
min max
unit
Operating temperature
Storage temperature
(see Note 10)
-40 +85
-40 +90
°C
°C
Footnotes to the key data
1)
2)
3)
4)
The drivers have a zener diode on each channel for over-voltage protection. When the feed voltage
exceeds 16V, this protection can be subject to thermal overload.
If the specified power consumption is exceeded, this indicates an overload of the DC/DC converter.
It should be noted that these DC/DC converters are not protected against overload.
This should be considered as a recommended value. Please consult the section: “Output power
and self-heating”.
Under-voltage monitoring for protecting the power semiconductors. The voltage refers to the local
supply voltage of each individual drive channel. However, this corresponds approximately to the
voltage at VDC with respect to GND.
5)
The input levels must never exceed the limits of the supply voltage (i.e. between GND and VDD),
otherwise latch-up of the integrated circuits LDI 00I can occur. Particular care must be taken when
driving via cables or longer leads.
6)
7)
The gate current must be limited to its maximum value by a gate resistor.
First value: At a load of 39nF in series with 5.6Ω/Second value: At a load of 250nF in series with
1.8Ω
8)
9)
Maximum continuous or repeatedly-applied DC voltage between all inputs and all outputs.
This specification guarantees that the drive information will be transferred reliably even at a high
DC-link voltage and fastest switching operations.
10) The application-specific self-heating of the drivers – specially at high load – must be taken into
account.
11) The test voltage of 4000 Vac(rms)/50Hz may be applied only once during one minute. It should be
noted that with this (strictly speaking obsolete) test method, some (minor) damage occurs to the
isolation layers due to the partial discharge. Consequently, this test is not performed at CONCEPT
as a series test. In the case of repeated isolation tests (e.g. module test, equipment test, system
test) the subsequent tests should be performed with a lower test voltage: the test voltage is
reduced by 400V for each additional test. The more modern if more elaborate partial-discharge
measurement is better suited than such test methods as it is almost entirely non-destructive.
12) The typical blocking time after an error is 1 second. If required, versions with other blocking times
may also be supplied.
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INTELLIGENT POWER ELECTRONICS
SCALE Driver
2SD315AI Data Sheet
Application Hints
IMPORTANT INFORMATION
This data sheet contains only product-specific data. All data that apply to
the whole type series of SCALE drivers is given in the document entitled:
“Description and Application Manual for SCALE Drivers”. In particular, this
manual contains a detailed description of the concept of the SCALE
drivers, a description of the function of all terminal pins as well as other
important application hints.
Overview and application
The SCALE driver 2SD315AI is a two channel driver for power MOSFETs and IGBTs. The
2SD315AI combines compact mechanical dimensions and a simple electrical interface
with very high output currents, high drive power and a special high isolation. This driver
can thus be used in almost all conceivable applications, especially for parallel circuits,
high-power modules and modules with reverse voltages up to 1700V. When used as a
half-bridge driver, the 2SD315AI can directly generate any dead times that may be
required.
Output power and self-heating
The specified output power of the driver totals 6W (3W per channel). In the case of a
drive power of 6W, the typical input power of the driver is about 7W; the losses due to
the driver total about 1W. Because CONCEPT cannot predict how the drivers will be
incorporated in the user’s application, no binding recommended value for self-heating
and thus for the maximum useful output power at high ambient temperatures can be
made. It is consequently recommended to check the self-heating of the system,
especially when it is used at higher temperatures.
For the calculation of the exact output power, reference should be made to Application
Note AN-9701 “IGBT drivers correctly calculated” on www.igbt-driver.com/go/app-note.
IGBT-Driver.com
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SCALE Driver
2SD315AI Data Sheet
Collector sense and dimensioning of Rth
The 2SD315AI dual driver has a collector-sense circuit to protect the power semicon-
ductors. It is shown in Fig. 4
Its basic operating mode can be obtained from the brochure entitled: “Description and
Application Manual for Scale Drivers”.
To correspond more effectively to the turn-on characteristic of the IGBTs, the SCALE
drivers do not use a static reference voltage to compare the voltage at the collector.
Instead, the reference is used as shown in Fig. 5.
In order to ensure that the 2SD315AI can be applied as universally as possible, the
components Ca (response time capacitor) and Rm (attenuation resistor) are not
integrated in the driver as shown in Fig. 4, but must be connected externally. Whereas
Ca can be matched to the specific application, a standard value of 180Ω is
recommended for Rm. The ground terminal of Ca should be connected to the COMx
pin.
+VDD +VDD
Dm
Rm
180R (2 x 1N4007)
1,4mA
150uA
Cx
COMx
Rthx
Gx
OVERCURRENT
Ca
RGx
MEASURING
Rthx
Ex
SCALE Driver 2SD315A
Fig. 4 Collector-sense circuit principle
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INTELLIGENT POWER ELECTRONICS
SCALE Driver
2SD315AI Data Sheet
Notes on Table 1
+Vdc
0V
The values for “Vth1” and “Vth2” are
listed in Table 1 as a function of the
reference resistance Rth.
Vce
Detail
Vth
The value in the “Vth1” column cor-
responds to the voltage threshold
after the response time has elapsed.
The value in the “Vth2” column cor-
responds to the voltage which is set
up statically across the resistor Rth.
This static value is typically reached
after between 10 and 15 µs.
Response time
The value in the “VCE(off)” column
corresponds to the collector-emitter
voltage value at which the protection
function is activated when the
external circuit is used as shown in
Fig. 4 with one or two Dm diodes of
type 1N4007 connected in series.
Detail view
Vth1
Vce
Vth2
A value of 1n5 is used for the
response time capacitor Ca. If this
capacitor is rated higher or lower, the
response time changes in proportion
to the change in capacitance, whereas
the thresholds Vth1 and Vth2 remain
practically unchanged (they are
specified by Rth).
0V
Fig. 5 Collector-sense voltage curve
Value Rth Reaction
time
Vth1
Vth2
VCE(off)
22k
27k
33k
39k
47k
2.35V (1 Diode)
3.05V (1 Diode)
3.25V (2 Diodes)
4.15V (2 Diodes)
5.35V (2 Diodes)
4.9Ps
5.7Ps
6.8Ps
7.6Ps
9Ps
4.8V
5.6V
6.5V
7.3V
8.4V
3.2V
3.9V
4.7V
5.6V
6.8V
Table 1 Reference resistor, reaction time and turn-off threshold with Ca = 1n5
IGBT-Driver.com
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SCALE Driver
2SD315AI Data Sheet
Double or multiple pins
Due to the high output currents, several pins are present in duplicate or as multiples. It
is recommended to connect these in parallel on the layout so that the voltage drop
across the lead frames (contact pins) is minimized.
Special terminal pins
The 2SD315AI half-bridge driver is optimized for universal use and high driver
performance and thus contains more terminal pins than the compact SCALE drivers.
These pins will be described below:
Visox and COMx pins: external support capacitor
Note: The “x“ in Visox and COMx stands for the channel number.
Like the compact SCALE drivers, the 2SD315AI also has blocking capacitors on the
secondary side of the DC/DC converter for each drive channel. IGBTs with gate charges
up to 3PC (corresponding typically to about a 1200V/300A module) and gate currents
up to about 10A can be driven without external blocking capacitors. At higher gate
charges or gate currents, external blocking capacitors are required between Visox and
COMx. These capacitors should be rated at between 47 and 120PF (but no more than
220 PF) and a dielectric strength of 20V. It is important that the capacitors are
suitable for switched-mode power supply applications (low inductance and high current
handling capacity). They must be connected as close as possible to the driver’s terminal
pins with minimum inductance.
The anode of the capacitor is connected to Visox, its cathode to COMx. The COMx pin is
always present in duplicate.
VDC and GND pins: supply for DC/DC Converter
It is recommended to connect a blocking capacitor of approximately 220µF to the driver
input. This capacitor should also be of the switched-mode power supply type.
Pin LSx: Local status
Note: The “x“ in LSx stands for the channel number.
The status of the IGD 001 for each channel is available at this output. It is an open-
collector output to which approximately 5mA may be applied. A LED can be connected
here, for example, as shown in Fig. 6. The LED lights up in normal operation
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INTELLIGENT POWER ELECTRONICS
SCALE Driver
2SD315AI Data Sheet
(everything OK) and goes out when the driver detects an undervoltage or during the
blocking time.
isolated +16V Visox
3k3
SCALE driver
Okay LED
LSx
Ds
COMx
Fig. 6 Status display with LED at pin LSx
Attention:
The Schottky diode Ds should not be omitted if the local status outputs are used. If the
local status outputs are not used, LS1 should be connected to COM1 and LS2 to COM2
in order to increase the noise immunity of the driver.
Configuration within the Power Section
The drivers should be located as closely as possible to the power transistors. The
connecting leads to the transistors should be as short as possible and as low inductance
as possible, i.e. they can be up to 3cm to 10cm long depending on the gate current and
switching speed.
IGBT-Driver.com
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SCALE Driver
2SD315AI Data Sheet
If you need any help, simply call our technical support
CONCEPT provides expert help with your questions and problems:
www.IGBT-Driver.com/go/support
Quite special: customized SCALE drivers
If you need a power MOSFET or IGBT driver that is not included in the delivery range,
don’t hesitate to contact CONCEPT or your CONCEPT sales partner.
CONCEPT engineers have more than 20 years experience in the development and
manufacture of intelligent drivers for power MOSFETs and IGBTs and have already
implemented a large number of customized solutions.
Important Notice
The data contained in this product data sheet is intended exclusively for technically
trained staff. Handling all high-voltage equipment involves risk to life. Strict compliance
with the respective safety regulations is mandatory!
Any handling of electronic devices is subject to the general specifications for protecting
electrostatic-sensitive devices according to international standard IEC 747-1, Chapter IX
or European standard EN 100015 (i.e. the workplace, tools, etc. must comply with
these standards). Otherwise, this product may be damaged.
Legal Disclaimer
This data sheet specifies devices but cannot promise to deliver any specific
characteristics. No warranty or guarantee is given – either expressly or implicitly –
regarding delivery, performance or suitability.
CT-Concept Technologie AG reserves the right to make modifications to its technical
data and product specifications at any time without prior notice. The general terms and
conditions of delivery of CT-Concept Technologie AG apply.
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INTELLIGENT POWER ELECTRONICS
SCALE Driver
2SD315AI Data Sheet
Ordering Information
Dual SCALE driver with ±15A gate current / 0/+15V or ±15V gate voltage
2SD315AI
Information about Other Products
For other drivers, product documentation, and application support
Direct link: Please click: www.IGBT-Driver.com
Manufacturer
CT-Concept Technologie AG
Intelligent Power Electronics
Renferstrasse 15
CH-2504 Biel-Bienne
Switzerland
Tel.
Fax
+41 - 32 - 344 47 47
+41 - 32 - 344 47 40
E-mail
Info@IGBT-Driver.com
Internet www.IGBT-Driver.com
© Copyright 1998…2009 by CT-Concept Technologie AG - Switzerland.
All rights reserved.
We reserve the right to make any technical modifications without prior notice. Version from 2009-09-15
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