HBP1037S6R [CYSTEKEC]
General Purpose PNP Epitaxial Planar Transistors (dual transistors); 通用PNP外延平面型晶体管（双晶体管）
| 型号： | HBP1037S6R |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | General Purpose PNP Epitaxial Planar Transistors (dual transistors) |
| 文件： | 总5页 (文件大小：199K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C306S6R
Issued Date : 2003.09.12
Revised Date : 2006.01.19
Page No. : 1/5
CYStech Electronics Corp.
General Purpose PNP Epitaxial Planar Transistors
(dual transistors)
HBP1037S6R
Features
• Two BTA1037 chips in a SOT-363R package.
• Mounting possible with SOT-323 automatic mounting machines.
• Transistor elements are independent, eliminating interference.
• Mounting cost and area can be cut in half.
• Excellent h linearity
FE
• Complementary to HBN2412S6R.
• Pb-free package
Equivalent Circuit
Outline
HBP1037S6R
SOT-363R
Tr1
Tr2
The following characteristics apply to both Tr1 and Tr2
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limits
Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
VCBO
VCEO
VEBO
IC
-60
V
V
-50
-6
V
-150
mA
mW
°C
°C
Power Dissipation
Pd
200(total) *1
150
Junction Temperature
Storage Temperature
Tj
Tstg
-55~+150
Note : *1 150mW per element must not be exceeded
HBP1037S6R
CYStek Product Specification
Spec. No. : C306S6R
Issued Date : 2003.09.12
Revised Date : 2006.01.19
Page No. : 2/5
CYStech Electronics Corp.
Characteristics
(Ta=25°C)
Symbol
Min. Typ.
Max.
Unit
Test Conditions
BVCBO
-60
-50
-6
-
-
-
V
IC=-50µA
IC=-1mA
IE=-50µA
VCB=-60V
VEB=-6V
BVCEO
BVEBO
ICBO
-
-
V
-
-
-
-
V
-0.1
-0.1
-0.5
560
-
µA
µA
V
IEBO
-
*VCE(sat)
*hFE
-
-0.2
-
IC=-50mA, IB=-5mA
VCE=-6V, IC=-1mA
200
80
-
fT
Cob
180
2
MHz
pF
VCE=-10V, IC=-1mA, f=100MHz
VCB=-10V, f=1MHz
3.5
*Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2%
Ordering Information
Device
Package
SOT-363
(Pb-free)
Shipping
3000 pcs / Tape & Reel
Marking
A2
HBP1037S6R
HBP1037S6R
CYStek Product Specification
Spec. No. : C306S6R
Issued Date : 2003.09.12
Revised Date : 2006.01.19
Page No. : 3/5
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
100
10
1000
HFE@VCE=6V
VCE(SAT)@IC=10IB
100
10
0.1
1
10
100
1000
0.1
0.1
0
1
10
100
1000
1000
200
Collector Current---IC(mA)
Collector Current---IC(mA)
Saturation Voltage vs Collector Current
Cutoff Frequency vs Collector Current
1
10000
1000
100
VBE(SAT)@IC=10IB
FT@VCE=12V
0.1
1
10
100
1
10
100
Collector Current---IC(mA)
Collector Current---IC(mA)
Power Derating Curves
250
200
150
100
50
dual
single
0
50 150
Ambient Temperature --- Ta(℃ )
100
HBP1037S6R
CYStek Product Specification
Spec. No. : C202S6R
Issued Date : 2003.06.11
Revised Date : 2005.11.30
Page No. : 4/5
CYStech Electronics Corp.
Reel Dimension
Carrier Tape Dimension
HBN2412S6R
CYStek Product Specification
Spec. No. : C202S6R
Issued Date : 2003.06.11
Revised Date : 2005.11.30
Page No. : 5/5
CYStech Electronics Corp.
SOT-363R Dimension
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Marking:
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
A2
6-Lead SOT-363R Plastic
Surface Mounted Package
CYStek Package Code: S6R
*:Typical
Inches
DIM
Millimeters
Inches
Millimeters
DIM
Min.
Max.
0.087
0.053
0.043
0.012
Min.
1.8
Max.
2.2
Min.
0.004
0.004
Max.
0.010
0.012
Min.
Max.
0.25
0.30
A
B
C
D
G
H
0.071
0.045
0.031
0.004
J
K
N
S
Y
0.1
0.1
1.15
0.8
1.35
1.1
0.008 REF
0.20 REF
0.1
0.3
0.079
0.012
0.087
0.016
2.00
0.30
2.40
0.40
0.026BSC
0.65BSC
-
0.004
-
0.1
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBN2412S6R
CYStek Product Specification
相关型号：
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