HBP3906S6R-0-T1-G [CYSTEKEC]
Dual General Purpose PNP Transistors;
| 型号： | HBP3906S6R-0-T1-G |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | Dual General Purpose PNP Transistors |
| 文件： | 总7页 (文件大小：323K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C318S6R
Issued Date : 2003.04.11
Revised Date : 2017.08.11
Page No. : 1/7
CYStech Electronics Corp.
Dual General Purpose PNP Transistors
HBP3906S6R
Description
The HBP3906S6R is a spin-off of our popular SOT-23/SOT-323 three-leaded devices. It is designed for
general purpose amplifier applications and is housed in the SOT-363R six-leaded surface mount package.
By putting two discrete devices in one package, this device is ideal for low power surface mount
applications where board space is at a premium.
Features
• HFE, 100--300
• Low VCE(sat), ≤0.4V
• Pb-free lead plating and halogen-free package
• Reduces board space.
• Reduces component count
• Simplifies circuit design
Equivalent Circuit
Outline
HBP3906S6R
SOT-363R
Q1
Q2
Ordering Information
Device
Package
Shipping
SOT-363
HBP3906S6R-0-T1-G
3000 pcs / tape & reel
(Pb-free lead plating and halogen-free package)
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
HBP3906S6R
CYStek Product Specification
Spec. No. : C318S6R
Issued Date : 2003.04.11
Revised Date : 2017.08.11
Page No. : 2/7
CYStech Electronics Corp.
The following characteristics apply to both Tr 1 and Tr 2
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Symbol
VCBO
VCEO
VEBO
IC
Limits
-40
-40
-5
-200
Unit
V
V
V
mA
Collector Current
Total Package Dissipation @TA=25℃
PD
200 (Note 1)
mW
Operating Junction Temperature Range
Storage Temperature Range
Tj
Tstg
-55~+150
-55~+150
°C
°C
×
×
Note 1: Device is mounted on a FR-4 glass epoxy PCB with area measuring 1.0 0.75 0.062 in. 150 mW per element can’t
be exceeded
Characteristics (Ta=25°C)
Symbol
BVCBO
Min.
Typ.
Max.
Unit
Test Conditions
-40
-40
-5
-
-
-
-
-
-
-
60
80
100
60
30
250
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
nA
nA
nA
V
V
V
V
-
IC=-10μA
IC=-1mA
IE=-10μA
VCB=-30V
BVCEO
BVEBO
ICBO
ICEX
IEBO
VCE(sat)
*VCE(sat)
VBE(sat)
*VBE(sat)
hFE
hFE
hFE
*hFE
*hFE
fT
Cob
-100
-50
-100
-0.25
-0.4
-0.85
-0.95
-
VCE=-30V, VEB=-3V
VEB=-4V
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
VCE=-1V, IC=-100μA
VCE=-1V, IC=-1mA
VCE=-1V, IC=-10mA
VCE=-1V, IC=-50mA
VCE=-1V, IC=-100mA
VCE=-20V, IC=-10mA, f=100MHz
VCB=-5V, f=1MHz
-
-
-
-
300
-
-
-
4.5
MHz
pF
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
HBP3906S6R
CYStek Product Specification
Spec. No. : C318S6R
Issued Date : 2003.04.11
Revised Date : 2017.08.11
Page No. : 3/7
CYStech Electronics Corp.
Typical Characteristics
Saturation Voltage vs Collector Current
Current Gain vs Collector Current
1000
100
10
1000
HFE@VCE=1V
VCE(SAT)@IC=10IB
100
10
0.1
1
10
100
1000
0.1
1
10
100
1000
Collector Current IC-(mA)
Collector Current--- IC(mA)
Capacitance vs Reverse-Biased Voltage
Saturation Voltage vs Collector Current
10
10000
1000
100
Cob
VBE(SAT)@IC=10IB
1
0.1
1
10
100
1000
0.1
1
10
100
Collector Current---IC(mA)
Reverse-Biased Voltage---(V)
Cutoff frequency vs Collector Current
Power Derating Curve
1000
100
10
250
200
150
100
50
Dual
Single
VCE=20V
0
0.1
1
10
100
0
50
100
150
200
Collector Current---IC(mA)
Ambient Temperature---TA(℃)
HBP3906S6R
CYStek Product Specification
Spec. No. : C318S6R
Issued Date : 2003.04.11
Revised Date : 2017.08.11
Page No. : 4/7
CYStech Electronics Corp.
Recommended Soldering Footprint
HBP3906S6R
CYStek Product Specification
Spec. No. : C318S6R
Issued Date : 2003.04.11
Revised Date : 2017.08.11
Page No. : 5/7
CYStech Electronics Corp.
Reel Dimension
Carrier Tape Dimension
HBP3906S6R
CYStek Product Specification
Spec. No. : C318S6R
Issued Date : 2003.04.11
Revised Date : 2017.08.11
Page No. : 6/7
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 °C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25 °C to peak temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
HBP3906S6R
CYStek Product Specification
Spec. No. : C318S6R
Issued Date : 2003.04.11
Revised Date : 2017.08.11
Page No. : 7/7
CYStech Electronics Corp.
SOT-363 Dimension
Marking:
● A2
Date
Code
Device
Code
6-Lead SOT-363 Plastic
Surface Mounted Package
CYStek Package Code: S6R
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)
Millimeters
DIM
Inches
Min.
Millimeters
Inches
Min. Max.
0.085
0.026 TYP
0.047
DIM
Min.
Max.
1.100
0.100
1.000
0.350
0.150
2.200
1.350
Max.
0.043
0.004
0.039
0.014
0.006
0.087
0.053
Min.
Max.
A
A1
A2
b
0.900
0.000
0.900
0.150
0.080
2.000
1.150
0.035
0.000
0.035
0.006
0.003
0.079
0.045
E1
e
e1
L
L1
θ
2.150
1.200
2.450
0.650 TYP
0.096
0.055
1.400
0.525 REF
0.021 REF
c
D
0.260
0.460
0.010
0.018
0°
8°
0°
8°
E
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBP3906S6R
CYStek Product Specification
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