HBP2907S6R [CYSTEKEC]

General Purpose PNP Epitaxial Planar Transistors(dual transistors); 通用PNP外延平面型晶体管(双晶体管)
HBP2907S6R
型号: HBP2907S6R
厂家: CYSTECH ELECTONICS CORP.    CYSTECH ELECTONICS CORP.
描述:

General Purpose PNP Epitaxial Planar Transistors(dual transistors)
通用PNP外延平面型晶体管(双晶体管)

晶体 晶体管
文件: 总5页 (文件大小:194K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Spec. No. : C317S6R  
Issued Date : 2006.11.08  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 1/5  
General Purpose PNP Epitaxial Planar Transistors  
(dual transistors)  
HBP2907S6R  
Features  
Two BTP2907 chips in a SOT-363 package.  
Mounting possible with SOT-323 automatic mounting machines.  
Transistor elements are independent, eliminating interference.  
Mounting cost and area can be cut in half.  
Excellent HFE linearity.  
Complementary to HBN2222S6R.  
Pb-free package  
Equivalent Circuit  
Outline  
SOT-363R  
HBP2097S6R  
Tr1  
Tr2  
The following characteristics apply to both Tr1 and Tr2  
Absolute Maximum Ratings (Ta=25°C)  
Parameter  
Symbol  
Limits  
Unit  
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Collector Current  
VCBO  
VCEO  
VEBO  
IC  
-60  
-60  
-5  
V
V
V
-600  
mA  
Power Dissipation  
Pd  
200(total) (Note)  
mW  
Junction Temperature  
Storage Temperature  
Tj  
Tstg  
150  
-55~+150  
°C  
°C  
Note: 150mW per element must not be exceeded.  
HBP2907S6R  
CYStek Product Specification  
Spec. No. : C317S6R  
Issued Date : 2006.11.08  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 2/5  
Characteristics (Ta=25°C)  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Test Conditions  
BVCBO  
BVCEO  
BVEBO  
ICBO  
-60  
-60  
-6  
-
-
-
-
-
-
75  
100  
100  
100  
50  
200  
-
-
-
-
-
-
-
-
V
V
V
nA  
nA  
V
V
V
V
-
IC=-100μA  
IC=-10mA  
IE=-10μA  
VCB=-50V  
VCE=-30V, VBE(OFF)=-0.5V  
IC=-150mA, IB=-15mA  
IC=-500mA, IB=-50mA  
IC=-150mA, IB=-15mA  
IC=-500mA, IB=-50mA  
VCE=-10V, IC=-100μA  
VCE=-10V, IC=-1mA  
-10  
-50  
-0.4  
-1.6  
-1.3  
-2.6  
-
ICEX  
-
*VCE(sat)  
*VCE(sat)  
*VBE(sat)  
*VBE(sat)  
*hFE 1  
*hFE 2  
*hFE 3  
*hFE 4  
*hFE 5  
fT  
-0.2  
-0.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
VCE=-10V, IC=-10mA  
300  
-
-
VCE=-10V, IC=-150mA  
VCE=-10V, IC=-500mA  
VCE=-20V, IC=-50mA, f=100MHz  
VCB=-30V, IE=0A,f=1MHz  
MHz  
pF  
Cob  
-
8
*Pulse Test: Pulse Width 380μs, Duty Cycle2%  
Ordering Information  
Marking  
2F  
Device  
Package  
SOT-363  
(Pb-free)  
Shipping  
3000 pcs / Tape & Reel  
HBP2907S6R  
HBP2907S6R  
CYStek Product Specification  
Spec. No. : C317S6R  
Issued Date : 2006.11.08  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 3/5  
Characteristic curves  
Current Gain vs Collector Current  
Saturation Voltage vs Collector Current  
1000  
100  
10  
1000  
100  
10  
HFE@VCE=3V  
VCE(SAT)@IC=10IB  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
Collector Current---IC(mA)  
Collector Current---IC(mA)  
Saturation Voltage vs Collector Current  
Cutoff Frequency vs Collector Current  
1
1000  
FT@VCE=5V  
VBE(SAT)@IC=10IB  
0.1  
100  
1
10  
100  
0.1  
1
10  
100  
1000  
Collector Current---IC(mA)  
Collector Current---IC(mA)  
Power Derating Curves  
250  
200  
150  
100  
50  
Dual  
Single  
0
0
50  
100  
150  
200  
Ambient Temperature --- Ta(℃ )  
HBP2907S6R  
CYStek Product Specification  
Spec. No. : C317S6R  
Issued Date : 2006.11.08  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 4/5  
Reel Dimension  
Carrier Tape Dimension  
HBP2907S6R  
CYStek Product Specification  
Spec. No. : C317S6R  
Issued Date : 2006.11.08  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 5/5  
SOT-363R Dimension  
Style:  
Pin 1. Emitter1 (E1)  
Pin 2. Base1 (B1)  
Marking:  
Pin 3. Collector2 (C2)  
Pin 4. Emitter2 (E2)  
Pin 5. Base2 (B2)  
Pin 6. Collector1 (C1)  
2F  
6-Lead SOT-363R Plastic  
Surface Mounted Package  
CYStek Package Code: S6R  
*:Typical  
Millimeters  
Inches  
DIM  
Millimeters  
Inches  
Min.  
0.004  
0.004  
DIM  
Min.  
Max.  
0.087  
0.053  
0.043  
0.012  
Min.  
1.8  
Max.  
2.2  
Max.  
0.010  
0.012  
Min.  
0.1  
0.1  
Max.  
0.25  
0.30  
A
B
C
D
G
H
0.071  
0.045  
0.031  
0.004  
J
K
N
S
Y
1.15  
0.8  
1.35  
1.1  
0.008 REF  
0.20 REF  
0.1  
0.3  
0.079  
0.012  
0.087  
0.016  
2.00  
0.30  
2.40  
0.40  
0.026BSC  
-
0.65BSC  
0.004  
-
0.1  
Notes : 1.Controlling dimension : millimeters.  
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.  
Material :  
Lead : 42 Alloy ; solder plating  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.  
CYStek reserves the right to make changes to its products without notice.  
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
HBP2907S6R  
CYStek Product Specification  

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