CY2283PVC-1 [CYPRESS]

PentiumII, K6, 6x86 100-MHz Clock Synthesizer/Driver for Desktop PCs with ALI or VIA Chipsets, AGP and 3 DIMMs; PentiumII , K6 , 6X86 100 MHz的时钟合成器/驱动器,用于台式电脑与ALI或VIA芯片组, AGP和3个DIMM内存模块
CY2283PVC-1
型号: CY2283PVC-1
厂家: CYPRESS    CYPRESS
描述:

PentiumII, K6, 6x86 100-MHz Clock Synthesizer/Driver for Desktop PCs with ALI or VIA Chipsets, AGP and 3 DIMMs
PentiumII , K6 , 6X86 100 MHz的时钟合成器/驱动器,用于台式电脑与ALI或VIA芯片组, AGP和3个DIMM内存模块

晶体 驱动器 时钟发生器 微控制器和处理器 外围集成电路 光电二极管 电脑 PC
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中文:  中文翻译
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PRELIMINARY  
CY2283  
Pentium®/II, K6, 6x86 100-MHz Clock Synthesizer/Driver for  
Desktop PCs with ALI or VIA Chipsets, AGP and 3 DIMMs  
SDRAM outputs in place of the CY2283 and can be placed in  
Features  
close proximity to the SDRAM modules.  
• Mixed 2.5V and 3.3V operation  
The CY2283 possesses power-down, CPU stop, and PCI stop  
pins for power management control. These inputs are multi-  
plexed with SDRAM clock outputs, and are selected when the  
MODE pin is driven LOW. Additionally, the signals are synchro-  
nized on-chip, and ensure glitch-free transitions on the out-  
puts. When the CPU_STOP input is asserted, the CPU clock  
outputs are driven LOW. When the PCI_STOP input is assert-  
ed, the PCI clock outputs (except the free-running PCI clock)  
are driven LOW. When the PWR_DWN pin is asserted, the  
reference oscillator and PLLs are shut down, and all outputs  
are driven LOW.  
• Complete clock solution for Pentium® /II, Cyrix 6x86,  
and AMD K6 processor-based motherboards  
— Four CPU clocks at 2.5V or 3.3V  
[1]  
— Twelve 3.3V SDRAM clocks  
— Five synchronous PCI clocks, one free-running  
— One 3.3V 48 MHz USB clock  
— One 3.3V Ref. clock at 14.318 MHz  
— Two AGP clocks at 3.3V  
• Support for ALI (-1 option) and VIA (-2 option)  
2
• I C™ Serial Configuration Interface  
• Full EMI control with factory-EPROM programmable  
output drive and slew rate  
• Factory-EPROM programmable CPU clock frequencies  
for custom configurations  
The CY2283 outputs are designed for low EMI emissions.  
Controlled rise and fall times, unique output driver circuits and  
factory-EPROM programmable output drive and slew-rate en-  
able optimal configurations for EMI control.  
• Power-down, CPU stop, and PCI stop pins  
• Available in space-saving 48-pin SSOP package  
CY2283 Selector Guide  
Functional Description  
The CY2283 is a clock Synthesizer/Driver for Pentium, Cyrix,  
or AMD processor-based PCs using the ALI Aladdin V (-1 op-  
tion) or VIA MVP3 (-2 option) chipset.  
Clock Outputs  
CPU (66.6, 75, 83.3, 100MHz)  
SDRAM  
-1 (ALI V) -2 (VIA MVP3)  
4
4
[1]  
12  
12  
[2]  
[2]  
The CY2283 outputs four CPU clocks at 2.5V or 3.3V. There  
are five PCI clocks, running at 30 or 33.3 MHz. One of the PCI  
clocks is free-running. Additionally, the part outputs twelve  
3.3V SDRAM clocks , one 3.3V USB clock at 48 MHz, and  
one 3.3V reference clock at 14.318 MHz. Finally, the part out-  
puts two AGP clocks running at 66.66 MHz or 60 MHz.  
PCI (30, 33.3 MHz)  
USB (48MHz)  
5
5
1
1
[1]  
AGP (66.6, 60MHz)  
Ref. (14.318 MHz)  
CPU-PCI delay  
2
1
2
1
2.55.5 ns  
2.55.5 ns  
The CY2283 has the flexibility to work as either a one-chip or  
as part of a two-chip clocking solution. In 100-MHz board de-  
signs based on the ALI Aladdin V chipset, it is recommended  
that the CY2283 be used with an external SDRAM buffer so-  
lution such as the CY2318NZ or CY2314NZ. In this configura-  
tion the SDRAM outputs on the CY2283 must be either turned  
AGP clock  
In phase  
with PCI  
In phase  
with CPU  
Notes:  
1. SDRAM clocks available up to 83.3MHz. In 100-MHz designs based on the  
ALI V chipset, an external CY231xNZ buffer should be used.  
2. One free-running PCI clock  
2
off using I C or left floating. The CY231xNZ family provides the  
Pin Configuration (48 SSOP)  
Logic Block Diagram  
REF0 (14.318 MHz)  
XTALIN  
AV  
DD  
V
1
2
3
4
48  
47  
46  
14.318  
DDQ3  
MHz  
REF0  
USBCLK  
SEL1  
OSC.  
XTALOUT  
V
SS  
STOP  
CPU  
PLL  
CPUCLK [0-3]  
VDDCPU  
LOGIC  
XTALIN  
45  
44  
43  
42  
41  
V
SS  
5
6
7
XTALOUT  
CPUCLK0  
CPUCLK1  
V
V
DDQ3  
PCICLK_F  
PCICLK0  
DDCPU  
SEL0  
SEL1  
SDRAM5/PWR_DWN  
SDRAM [0-4],[8-11]  
EPROM  
CPUCLK2  
CPUCLK3  
8
V
SS  
9
40  
39  
38  
10  
11  
12  
PCICLK1  
PCICLK2  
PCICLK3  
SDRAM6/CPU_STOP  
V
SS  
MODE  
SDRAM0  
SDRAM1  
V
37  
36  
35  
34  
Delay (-2 option)  
13  
AGP0  
DDQ3  
SDRAM7/PCI_STOP  
AGP  
SYS PLL  
V
DDQ3  
14  
15  
16  
17  
18  
SDRAM2  
SDRAM3  
/1, /1.25, /1.5  
Delay (-1 option)  
/2  
AGP1  
V
33  
32  
31  
30  
29  
28  
27  
26  
25  
SS  
V
SS  
SDRAM11  
SDRAM10  
SDRAM4  
SDRAM5/PWR_DWN  
STOP  
LOGIC  
PCI [0-3]  
PCICLK_F  
USBCLK  
V
19  
20  
21  
22  
23  
24  
DDQ3  
V
DDQ3  
SDRAM9  
SDRAM6/CPU_STOP  
SDRAM7/PCI_STOP  
SDRAM8  
SERIAL  
SCLK  
V
SS  
V
INTERFACE  
CONTROL  
LOGIC  
SS  
SDATA  
SCLK  
SEL0  
SDATA  
MODE  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
October 12, 1998  
PRELIMINARY  
CY2283  
Pin Summary  
Name  
Pins  
Description  
V
V
6, 14, 19, 30, 36, 48 3.3V Digital voltage supply  
DDQ3  
42  
1
CPU Digital voltage supply, 2.5V or 3.3V  
Analog voltage supply, 3.3V  
DDCPU  
AV  
DD  
V
3, 9, 16, 22, 27, 33, Ground  
39, 45  
SS  
[3]  
XTALIN  
XTALOUT  
4
5
Reference crystal input  
Reference crystal feedback  
[3]  
SDRAM7/ PCI_STOP 28  
SDRAM6/CPU_STOP 29  
SDRAM5/ PWR_DWN 31  
SDRAM clock output. Also, active LOW control input to stop PCI clocks, enabled  
when MODE is LOW.  
SDRAM clock output. Also, active LOWcontrol input to stop CPU clocks, enabled  
when MODE is LOW.  
SDRAM clock output. Also, active LOW control input to power down device,  
enabled when MODE is LOW.  
SDRAM[0:4],[8:11]  
38, 37, 35, 34, 32, SDRAM clock outputs  
21, 20, 18, 17  
SEL0  
26  
CPU frequency select input, bit 0 (see table below)  
CPU frequency select input, bit 0 (see table below)  
CPU clock outputs  
SEL1  
46  
CPUCLK[0:3]  
PCICLK[0:3]  
PCICLK_F  
AGP[0:1]  
REF0  
44, 43, 41, 40  
8, 10, 11, 12  
PCI clock outputs, at one-half the CPU frequency.  
Free-running PCI clock output  
7
13, 15  
2
AGP clock outputs  
3.3V Reference clock output  
USBCLK  
SDATA  
47  
23  
24  
25  
USB Clock output  
Serial data input for serial configuration port  
Serial clock input for serial configuration port  
Mode Select pin for enabling power management features  
SCLK  
MODE  
Note:  
3. For best accuracy, use a parallel-resonant crystal, CLOAD = 18 pF.  
Function Table  
CPU/PCI  
Ratio  
CPUCLK[0:3]  
SDRAM[0:11]  
PCICLK[0:3]  
PCICLK_F  
SEL1 SEL0  
AGP[0:1]  
66.66 MHz  
66.66 MHz  
66.66 MHz  
60.0 MHz  
REF0  
14.318 MHz  
14.318 MHz  
14.318 MHz  
14.318 MHz  
USBCLK  
48 MHz  
0
0
1
1
0
1
0
1
2.5  
83.33 MHz  
66.67 MHz  
100.0 MHz  
75.0 MHz  
33.33 MHz  
33.33 MHz  
33.33 MHz  
30.0 MHz  
2
48 MHz  
48 MHz  
48 MHz  
3.0  
2.5  
2
PRELIMINARY  
CY2283  
Actual Clock Frequency Values  
CPU and PCI Clock Driver Strengths  
Target  
Frequency  
(MHz)  
Actual  
Frequency  
(MHz)  
• Matched impedances on both rising and falling edges on  
the output drivers  
• Output impedance: 25(typical) measured at 1.5V  
Clock Output  
CPUCLK  
CPUCLK  
CPUCLK  
CPUCLK  
USBCLK  
PPM  
–2346  
66.67  
75.0  
66.51  
75.0  
0
83.33  
100.0  
48.0  
83.14  
99.77  
48.01  
-2346  
-2346  
167  
Power Management Logic[4] - Active when MODE pin is held ‘LOW’  
Other  
PCICLK_F Clocks  
CPU_STOP PCI_STOP PWR_DWN  
CPUCLK  
PCICLK  
Low  
Osc.  
Stopped Off  
PLLs  
Off  
X
0
0
1
1
X
0
1
0
1
0
1
1
1
1
Low  
Low  
Low  
Stopped  
Running  
Running  
Running  
Running  
Low  
Running Running Running  
Running Running Running  
Running Running Running  
Running Running Running  
33/30 MHz  
Low  
66/75/83/100MHz  
66/75/83/100MHz  
30/33.3 MHz  
Serial Configuration Map  
Byte 0: Functional and Frequency Select Clock  
Register (1 = Enable, 0 = Disable)  
• The Serial bits will be read by the clock driverin the following  
order:  
Bit Pin #  
Bit 7 --  
Bit 6 --  
Bit 5 --  
Bit 4 --  
Bit 3 --  
Bit 2 --  
Description  
(Reserved) drive to ‘0’  
Byte 0 - Bits 7, 6, 5, 4, 3, 2, 1, 0  
Byte 1 - Bits 7, 6, 5, 4, 3, 2, 1, 0  
(Reserved) drive to ‘0’  
(Reserved) drive to ‘0’  
(Reserved) drive to ‘0’  
(Reserved) drive to ‘0’  
(Reserved) drive to ‘0’  
Bit 1 Bit 0  
.
.
Byte N - Bits 7, 6, 5, 4, 3, 2, 1, 0  
• Reserved and unused bits should be programmed to “0”.  
2
• I C Address for the CY2283 is:  
Bit 1 --  
Bit 0  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
R/W  
1
1
0
0
1 - Three-State  
0 - N/A  
1
1
0
1
0
0
1
----  
1 - Testmode  
0 - Normal Operation  
Select Functions  
Outputs  
SDRAM  
Functional Description  
CPU  
PCI, PCI_F  
Hi-Z  
TCLK/4  
Ref  
IOAPIC  
Hi-Z  
TCLK  
USBCLK  
Hi-Z  
TCLK/2  
AGP  
Hi-Z  
TCLK/2  
Three-State  
Hi-Z  
Hi-Z  
Hi-Z  
[6]  
[5]  
Test Mode  
TCLK/2  
TCLK/2  
TCLK  
Notes:  
4. AGP clocks are free-running and stop only when the PWR_DWN pin is asserted. The frequency of the AGP clocks is as shown in the Function Table.  
5. TCLK supplied on the XTALIN pin in Test Mode.  
6. Valid only for SEL1=0.  
3
PRELIMINARY  
CY2283  
Byte 1: CPU Active/Inactive Register  
(1 = Active, 0 = Inactive), Default = Active  
Byte 2: PCI Active/Inactive Register  
(1 = Active, 0 = Inactive), Default = Active  
Bit  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Pin #  
47  
Description  
Bit  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Pin #  
Description  
(Reserved) drive to ‘0’  
USBCLK  
--  
7
N/A  
N/A  
N/A  
40  
(Reserved) drive to ‘0’  
PCICLK_F (Active/Inactive)  
AGP1 (Active/Inactive)  
(Reserved) drive to ‘0’  
15  
14  
12  
11  
10  
8
Not used - drive to ‘0’  
AGP0 (Active/Inactive)  
CPUCLK3 (Active/Inactive)  
CPUCLK2 (Active/Inactive)  
CPUCLK1 (Active/Inactive)  
CPUCLK0 (Active/Inactive)  
PCICLK3 (Active/Inactive)  
PCICLK2 (Active/Inactive)  
PCICLK1 (Active/Inactive)  
PCICLK0 (Active/Inactive)  
41  
43  
44  
Byte 3: SDRAM Active/Inactive Register  
(1 = Active, 0 = Inactive), Default = Active  
Byte 4: SDRAM Active/Inactive Register  
(1 = Active, 0 = Inactive), Default = Active  
Bit Pin #  
Bit 7 28  
Bit 6 29  
Bit 5 31  
Bit 4 32  
Bit 3 34  
Bit 2 35  
Bit 1 37  
Bit 0 38  
Description  
SDRAM7 (Active/Inactive)  
SDRAM6 (Active/Inactive)  
SDRAM5 (Active/Inactive)  
SDRAM4 (Active/Inactive)  
SDRAM3 (Active/Inactive)  
SDRAM2 (Active/Inactive)  
SDRAM1 (Active/Inactive)  
SDRAM0 (Active/Inactive)  
Bit  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Pin #  
N/A  
Description  
Not used - drive to ‘0’  
N/A  
N/A  
N/A  
17  
Not used - drive to ‘0’  
Not used - drive to ‘0’  
Not used - drive to ‘0’  
SDRAM11  
18  
SDRAM10  
20  
SDRAM9  
21  
SDRAM8  
Byte 5: Peripheral Active/Inactive Register  
(1 = Active, 0 = Inactive), Default = Active  
Byte 6: Reserved, for future use  
Bit  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Pin #  
N/A  
Description  
(Reserved) drive to ‘0’  
(Reserved) drive to ‘0’  
(Reserved) drive to ‘0’  
(Reserved), drive to ‘0’  
(Reserved) drive to ‘0’  
(Reserved) drive to ‘0’  
(Reserved) drive to ‘0’  
REF0 (Active/Inactive)  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
2
4
PRELIMINARY  
CY2283  
Storage Temperature (Non-Condensing) ... –65°C to +150°C  
Max. Soldering Temperature (10 sec) ...................... +260°C  
Junction Temperature............................................... +150°C  
Package Power Dissipation .............................................. 1W  
Static Discharge Voltage ........................................... >2000V  
Maximum Ratings  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Supply Voltage..................................................–0.5 to +7.0V  
Input Voltage.............................................. –0.5V to V +0.5  
DD  
(per MIL-STD-883, Method 3015, like V pins tied together)  
DD  
Operating Conditions[7]  
Parameter  
AV , V  
Description  
Analog and Digital Supply Voltage  
Min.  
Max.  
Unit  
V
3.135  
3.465  
DD DDQ3  
V
CPU Supply Voltage  
2.375  
3.135  
2.9  
3.465  
V
DDCPU  
T
Operating Temperature, Ambient  
0
70  
°C  
A
C
Max. Capacitive Load on  
CPUCLK, USBCLK, IOAPIC  
PCICLK, AGP, SDRAM  
REF0  
pF  
L
10  
20  
20  
20  
30  
45  
f
Reference Frequency, Oscillator Nominal Value  
14.318  
14.318  
MHz  
(REF)  
Electrical Characteristics Over the Operating Range  
Parameter  
Description  
Test Conditions  
Min. Max. Unit  
V
High-level Input Voltage  
Low-level Input Voltage  
Low-level Input Voltage  
High-level Output Voltage  
Except Crystal Inputs  
Except Crystal Inputs  
2.0  
V
V
V
V
IH  
V
V
V
0.8  
0.7  
IL  
2
I C inputs only  
ILiic  
OH  
V
V
V
= V  
= 2.375V  
I
I
I
I
I
I
I
I
I
I
I
I
I
I
= 16 mA CPUCLK 2.0  
= 18 mA IOAPIC  
= 27 mA CPUCLK  
= 29 mA IOAPIC  
= 16 mA CPUCLK 2.4  
= 36 mA SDRAM  
= 32 mA PCICLK  
= 26 mA USBCLK  
= 36 mA REF0  
DDCPU  
DDCPU  
DDQ2  
DDQ2  
OH  
OH  
OL  
OL  
OH  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
V
Low-level Output Voltage  
High-level Output Voltage  
= V  
= 2.375V  
0.4  
V
V
OL  
V
, AV , V = 3.135V  
DD DDCPU  
OH  
DDQ3  
DDQ3  
V
Low-level Output Voltage  
V
, AV , V  
= 3.135V  
= 27 mA CPUCLK  
= 29 mA SDRAM  
= 26 mA PCICLK  
= 21 mA USBCLK  
= 29 mA REF0  
0.4V  
V
OL  
DD DDCPU  
I
I
I
I
Input High Current  
Input Low Current  
V
V
= V  
DD  
–10 +10 µA  
10 µA  
IH  
IH  
IL  
= 0V  
IL  
Output Leakage Current  
Three-state  
= 3.465V, V = 0 or V , Loaded Outputs,  
–10 +10 µA  
OZ  
DD  
[8]  
Power Supply Current  
V
300 mA  
DD  
IN  
DD  
CPU clocks = 66.67 MHz  
[8]  
I
I
Power Supply Current  
V
= 3.465V, V = 0 or V , Unloaded Outputs  
120 mA  
DD  
DD  
IN  
DD  
Power-down Current  
Current draw in power-down state  
500 µA  
DDS  
Notes:  
7. Electrical parameters are guaranteed with these operating conditions.  
8. Power supply current will vary with number of outputs that are running.  
5
PRELIMINARY  
CY2283  
Switching Characteristics for CY2283-1[9, 10]  
Parameter  
Output  
All  
Description  
Test Conditions  
Min. Typ. Max. Unit  
[11]  
t
Output Duty Cycle  
t = t ÷ t  
1B  
45  
50  
55  
%
1
2
1
1A  
t
t
t
t
t
t
t
t
t
t
CPUCLK  
CPU Clock Rising and  
Falling Edge Rate  
Between 0.4V and 2.0V, V  
Between 0.4V and 2.4V, V  
= 2.5V 0.75  
= 3.3V  
4.0  
V/ns  
DDCPU  
DDCPU  
AGP,  
REF0  
AGP, REF0 Clock Rising  
and Falling Edge Rate  
Between 0.4V and 2.4V  
0.85  
4.0  
4.0  
V/ns  
V/ns  
ns  
2
PCI  
PCI Rising and Falling  
Edge Rate  
Between 0.4V and 2.4V  
0.85  
2
CPUCLK  
CPUCLK  
CPUCLK  
CPU Clock Rise Time  
CPU Clock Fall Time  
CPU-CPU Clock Skew  
Between 0.4V and 2.0V, V  
Between 0.4V and 2.4V, V  
= 2.5V 0.4  
= 3.3V 0.5  
2.13  
2.67  
3
DDCPU  
DDCPU  
Between 2.0V and 0.4V, V  
Between 2.4V and 0.4V, V  
= 2.5V 0.4  
= 3.3V 0.5  
2.13  
2.67  
ns  
4
DDCPU  
DDCPU  
Measured at 1.25V, V  
= 2.5V  
100  
3.5  
500  
ps  
5
DDCPU  
Measured at 1.5V, V  
= 3.3V  
DDCPU  
CPUCLK, CPU-PCI Clock Skew  
PCICLK  
Measured at 1.25V for 2.5V clocks, and  
at 1.5V for 3.3V clocks  
2.5  
5.5  
ns  
6
PCICLK,  
PCICLK  
PCI-PCI Clock Skew  
PCI-AGP Clock Skew  
Cycle-Cycle Clock Jitter  
Measured at 1.5V  
500  
ps  
8
PCICLK,  
AGP  
Measured at 1.5V  
1,200  
500  
ps  
9
CPUCLK  
Measured at 1.25V for 2.5V clocks, and  
at 1.5V for 3.3V clocks  
ps  
10  
t
t
t
PCICLK  
AGP  
Cycle-Cycle Clock Jitter  
Cycle-Cycle Clock Jitter  
Measured at 1.5V  
Measured at 1.5V  
750  
800  
3
ps  
ps  
10  
10  
11  
CPUCLK, Power-up Time  
PCICLK,  
AGP  
CPU, PCI, AGP clock stabilization from  
power-up  
ms  
Notes:  
9. Guaranteed by Design and Characterization, not 100% tested in production.  
10. Device characterized and parameters guaranteed with SDRAM outputs turned off. All other outputs at maximum load.  
11. Duty cycle is measured at 1.5V when VDD = 3.3V. When VDDCPU = 2.5V, CPUCLK duty cycle is measured at 1.25V.  
6
PRELIMINARY  
CY2283  
Switching Characteristics for CY2283-2  
Parameter  
Output  
Description  
Test Conditions  
Min. Typ. Max. Unit  
t
t
All  
Output Duty Cycle  
t = t ÷ t  
1B  
TBD TBD TBD  
%
1
2
1
1A  
CPUCLK  
CPU Clock Rising and  
Falling Edge Rate  
Between 0.4V and 2.0V, V  
Between 0.4V and 2.4V, V  
= 2.5V TBD TBD TBD V/ns  
= 3.3V  
DDCPU  
DDCPU  
t
SDRAM,  
SDRAM, AGP, REF0 Clock Between 0.4V and 2.4V  
TBD TBD TBD V/ns  
2
AGP, REF0  
Rising and Falling Edge  
Rate  
t
t
t
t
t
t
t
t
t
PCI  
PCI Rising and Falling  
Edge Rate  
Between 0.4V and 2.4V  
TBD TBD TBD V/ns  
2
CPUCLK  
CPUCLK  
CPUCLK  
CPU Clock Rise Time  
CPU Clock Fall Time  
CPU-CPU Clock Skew  
CPU-PCI Clock Skew  
Between 0.4V and 2.0V, V  
Between 0.4V and 2.4V, V  
= 2.5V TBD TBD TBD  
= 3.3V  
ns  
ns  
ps  
ns  
ps  
ps  
ps  
ps  
3
DDCPU  
DDCPU  
Between 2.0V and 0.4V, V  
Between 2.4V and 0.4V, V  
= 2.5V TBD TBD TBD  
= 3.3V  
4
DDCPU  
DDCPU  
Measured at 1.25V, V  
= 2.5V  
DDCPU  
TBD TBD TBD  
5
Measured at 1.5V, V  
= 3.3V  
DDCPU  
CPUCLK,  
PCICLK  
Measured at 1.25V for 2.5V clocks, and TBD TBD TBD  
at 1.5V for 3.3V clocks  
6
CPUCLK,  
SDRAM  
CPU-SDRAM Clock Skew Measured at 1.25V for 2.5V clocks, and TBD TBD TBD  
at 1.5V for 3.3V clocks  
7
PCICLK,  
PCICLK  
PCI-PCI Clock Skew  
PCI-AGP Clock Skew  
Cycle-Cycle Clock Jitter  
Measured at 1.5V  
TBD TBD TBD  
8
PCICLK,  
AGP  
Measured at 1.5V  
TBD TBD TBD  
9
CPUCLK,  
SDRAM  
Measured at 1.25V for 2.5V clocks, and TBD TBD TBD  
at 1.5V for 3.3V clocks  
10  
t
t
t
PCICLK  
AGP  
Cycle-Cycle Clock Jitter  
Cycle-Cycle Clock Jitter  
Power-up Time  
Measured at 1.5V  
Measured at 1.5V  
TBD TBD TBD  
TBD TBD TBD  
ps  
ps  
10  
10  
11  
CPUCLK,  
PCICLK,  
CPU, PCI, AGP, and SDRAM clock sta- TBD TBD TBD  
bilization from power-up  
ms  
AGP,SDRAM  
2
Timing Requirement for the I C Bus  
Parameter  
Description  
Min.  
0
Max.  
Unit  
t
t
t
t
t
t
t
SCLK Clock Frequency  
100  
kHz  
µs  
µs  
µs  
µs  
µs  
µs  
12  
13  
14  
15  
16  
17  
18  
Time the bus must be free before a new transmission can start  
Hold time start condition. After this period the first clock pulse is generated.  
The LOW period of the clock  
4.7  
4
4.7  
4
The HIGH period of the clock  
Set-up time for start condition. (Only relevant for a repeated start condition.)  
4.7  
Hold time DATA  
for CBUS compatible masters  
for I C devices  
5
0
2
t
t
t
t
DATA input set-up time  
250  
ns  
µs  
ns  
µs  
19  
20  
21  
22  
Rise time of both SDATA and SCLK inputs  
Fall time of both SDATA and SCLK inputs  
Set-up time for stop condition  
1
300  
4.0  
7
PRELIMINARY  
CY2283  
Switching Waveforms  
Duty Cycle Timing  
t
1B  
t
1A  
OUTPUT  
All Outputs Rise/Fall Time  
VDD  
0V  
OUTPUT  
t
2
t
3
t
2
t
4
CPU-CPU Clock Skew  
CPUCLK  
CPUCLK  
t
5
CPU-SDRAM Clock Skew  
CPUCLK  
SDRAM  
t
7
CPU-PCI Clock Skew  
CPUCLK  
PCICLK  
t6  
PCI-PCI Clock Skew  
PCICLK  
PCICLK  
t
8
8
PRELIMINARY  
CY2283  
Switching Waveforms (continued)  
AGP-PCI Clock Skew  
AGPCLK  
PCICLK  
t9  
[12, 13]  
CPU_STOP  
CPUCLK  
(Internal)  
PCICLK  
(Internal)  
PCICLK  
(Free-Running)  
CPU_STOP  
CPUCLK  
(External)  
[14, 15]  
PCI_STOP  
CPUCLK  
(Internal)  
PCICLK  
(Internal)  
PCICLK  
(Free-Running)  
PCI_STOP  
PCICLK  
(External)  
PWR_DOWN  
CPUCLK  
(Internal)  
PCICLK  
(Internal)  
PWR_DWN  
CPUCLK  
(External)  
PCICLK  
(External)  
VCO  
Crystal  
Shaded section on the VCO and Crystal waveforms indicates that the VCO and crystal oscillator are active, and there is a valid clock.  
2
Timing Requirements for the I C Bus  
SDA  
t
t
t
21  
13  
t
14  
20  
SCL  
t
14  
t
t
17  
22  
t
t
t
19  
t
16  
15  
18  
Notes:  
12. CPUCLK on and CPUCLK off latency is 2 or 3 CPUCLK cycles.  
13. CPU_STOP may be applied asynchronously. It is synchronized internally.  
14. PCICLK on and PCICLK off latency is 1 rising edge of the external PCICLK.  
15. PCI_STOP may be applied asynchronously. It is synchronized internally.  
9
PRELIMINARY  
CY2283  
Application Circuit  
Clock traces must be terminated with either series or parallel termination, as they are normally done  
Summary  
• A parallel-resonant crystal should be used as the reference to the clock generator. The operating frequency and C  
of  
LOAD  
this crystal should be as specified in the data sheet. Optional trimming capacitors may be needed if a crystal with a different  
is used. Footprints must be laid out for flexibility.  
C
LOAD  
• Surface mount, low-ESR, ceramic capacitors should be used for filtering. Typically, these capacitors have a value of 0.1 µF.  
In some cases, smaller value capacitors may be required.  
• The value ofthe series terminating resistor satisfies the following equation, where R  
is the loaded characteristic impedance  
trace  
ofthe trace, R is theoutputimpedanceofthe clockgenerator(specified in the datasheet), and R  
is theseries terminating  
out  
series  
resistor.  
R
> R  
– R  
trace out  
series  
• Footprints must be laid out for optional EMI-reducing capacitors, which should be placed as close to the terminating resistor  
as is physically possible. Typical values of these capacitors range from 4.7 pF to 22 pF.  
• A Ferrite Bead may be used to isolate the Board V from the clock generator V island. Ensure that the Ferrite Bead offers  
DD  
DD  
greater than 50impedance at the clock frequency, under loaded DC conditions. Please refer to the application note “Layout  
and Termination Techniques for Cypress Clock Generators” for more details.  
• If a Ferrite Bead is used, a 10 µF– 22 µF tantalum bypass capacitor should be placed close to the Ferrite Bead. This capacitor  
prevents power supply droop during current surges.  
10  
PRELIMINARY  
CY2283  
Test Circuit  
V
DDQ3  
1
48  
0.1 µF  
0.1 µF  
0.1 µF  
0.1 µF  
3
6
45  
42  
V
DDCPU  
9
39  
36  
14  
0.1 µF  
0.1 µF  
0.1 µF  
16  
19  
33  
30  
0.1 µF  
22  
27  
OUTPUTS  
C
LOAD  
Note: All Capacitors must be placed as close to the pins as is possible  
Ordering Information  
Package  
Operating  
Range  
Ordering Code  
CY2283PVC–1  
CY2283PVC–2  
Name  
Package Type  
48-Pin SSOP  
48-Pin SSOP  
O48  
Commercial  
Commercial  
O48  
Document #: 38–00685–A  
2
Intel and Pentium are registered trademarks of Intel Corporation. I C is a trademark of Philips Corporation.  
11  
PRELIMINARY  
CY2283  
Package Diagram  
48-Lead Shrunk Small Outline Package O48  
51-85061-B  
© Cypress Semiconductor Corporation, 1998. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize  
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.  

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