CY2283PVC-1 [CYPRESS]
PentiumII, K6, 6x86 100-MHz Clock Synthesizer/Driver for Desktop PCs with ALI or VIA Chipsets, AGP and 3 DIMMs; PentiumII , K6 , 6X86 100 MHz的时钟合成器/驱动器,用于台式电脑与ALI或VIA芯片组, AGP和3个DIMM内存模块![CY2283PVC-1](http://pdffile.icpdf.com/pdf1/p00023/img/icpdf/CY2283_115035_icpdf.jpg)
型号: | CY2283PVC-1 |
厂家: | ![]() |
描述: | PentiumII, K6, 6x86 100-MHz Clock Synthesizer/Driver for Desktop PCs with ALI or VIA Chipsets, AGP and 3 DIMMs |
文件: | 总12页 (文件大小:221K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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PRELIMINARY
CY2283
Pentium®/II, K6, 6x86 100-MHz Clock Synthesizer/Driver for
Desktop PCs with ALI or VIA Chipsets, AGP and 3 DIMMs
SDRAM outputs in place of the CY2283 and can be placed in
Features
close proximity to the SDRAM modules.
• Mixed 2.5V and 3.3V operation
The CY2283 possesses power-down, CPU stop, and PCI stop
pins for power management control. These inputs are multi-
plexed with SDRAM clock outputs, and are selected when the
MODE pin is driven LOW. Additionally, the signals are synchro-
nized on-chip, and ensure glitch-free transitions on the out-
puts. When the CPU_STOP input is asserted, the CPU clock
outputs are driven LOW. When the PCI_STOP input is assert-
ed, the PCI clock outputs (except the free-running PCI clock)
are driven LOW. When the PWR_DWN pin is asserted, the
reference oscillator and PLLs are shut down, and all outputs
are driven LOW.
• Complete clock solution for Pentium® /II, Cyrix 6x86,
and AMD K6 processor-based motherboards
— Four CPU clocks at 2.5V or 3.3V
[1]
— Twelve 3.3V SDRAM clocks
— Five synchronous PCI clocks, one free-running
— One 3.3V 48 MHz USB clock
— One 3.3V Ref. clock at 14.318 MHz
— Two AGP clocks at 3.3V
• Support for ALI (-1 option) and VIA (-2 option)
2
• I C™ Serial Configuration Interface
• Full EMI control with factory-EPROM programmable
output drive and slew rate
• Factory-EPROM programmable CPU clock frequencies
for custom configurations
The CY2283 outputs are designed for low EMI emissions.
Controlled rise and fall times, unique output driver circuits and
factory-EPROM programmable output drive and slew-rate en-
able optimal configurations for EMI control.
• Power-down, CPU stop, and PCI stop pins
• Available in space-saving 48-pin SSOP package
CY2283 Selector Guide
Functional Description
The CY2283 is a clock Synthesizer/Driver for Pentium, Cyrix,
or AMD processor-based PCs using the ALI Aladdin V (-1 op-
tion) or VIA MVP3 (-2 option) chipset.
Clock Outputs
CPU (66.6, 75, 83.3, 100MHz)
SDRAM
-1 (ALI V) -2 (VIA MVP3)
4
4
[1]
12
12
[2]
[2]
The CY2283 outputs four CPU clocks at 2.5V or 3.3V. There
are five PCI clocks, running at 30 or 33.3 MHz. One of the PCI
clocks is free-running. Additionally, the part outputs twelve
3.3V SDRAM clocks , one 3.3V USB clock at 48 MHz, and
one 3.3V reference clock at 14.318 MHz. Finally, the part out-
puts two AGP clocks running at 66.66 MHz or 60 MHz.
PCI (30, 33.3 MHz)
USB (48MHz)
5
5
1
1
[1]
AGP (66.6, 60MHz)
Ref. (14.318 MHz)
CPU-PCI delay
2
1
2
1
2.5−5.5 ns
2.5−5.5 ns
The CY2283 has the flexibility to work as either a one-chip or
as part of a two-chip clocking solution. In 100-MHz board de-
signs based on the ALI Aladdin V chipset, it is recommended
that the CY2283 be used with an external SDRAM buffer so-
lution such as the CY2318NZ or CY2314NZ. In this configura-
tion the SDRAM outputs on the CY2283 must be either turned
AGP clock
In phase
with PCI
In phase
with CPU
Notes:
1. SDRAM clocks available up to 83.3MHz. In 100-MHz designs based on the
ALI V chipset, an external CY231xNZ buffer should be used.
2. One free-running PCI clock
2
off using I C or left floating. The CY231xNZ family provides the
Pin Configuration (48 SSOP)
Logic Block Diagram
REF0 (14.318 MHz)
XTALIN
AV
DD
V
1
2
3
4
48
47
46
14.318
DDQ3
MHz
REF0
USBCLK
SEL1
OSC.
XTALOUT
V
SS
STOP
CPU
PLL
CPUCLK [0-3]
VDDCPU
LOGIC
XTALIN
45
44
43
42
41
V
SS
5
6
7
XTALOUT
CPUCLK0
CPUCLK1
V
V
DDQ3
PCICLK_F
PCICLK0
DDCPU
SEL0
SEL1
SDRAM5/PWR_DWN
SDRAM [0-4],[8-11]
EPROM
CPUCLK2
CPUCLK3
8
V
SS
9
40
39
38
10
11
12
PCICLK1
PCICLK2
PCICLK3
SDRAM6/CPU_STOP
V
SS
MODE
SDRAM0
SDRAM1
V
37
36
35
34
Delay (-2 option)
13
AGP0
DDQ3
SDRAM7/PCI_STOP
AGP
SYS PLL
V
DDQ3
14
15
16
17
18
SDRAM2
SDRAM3
/1, /1.25, /1.5
Delay (-1 option)
/2
AGP1
V
33
32
31
30
29
28
27
26
25
SS
V
SS
SDRAM11
SDRAM10
SDRAM4
SDRAM5/PWR_DWN
STOP
LOGIC
PCI [0-3]
PCICLK_F
USBCLK
V
19
20
21
22
23
24
DDQ3
V
DDQ3
SDRAM9
SDRAM6/CPU_STOP
SDRAM7/PCI_STOP
SDRAM8
SERIAL
SCLK
V
SS
V
INTERFACE
CONTROL
LOGIC
SS
SDATA
SCLK
SEL0
SDATA
MODE
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
October 12, 1998
PRELIMINARY
CY2283
Pin Summary
Name
Pins
Description
V
V
6, 14, 19, 30, 36, 48 3.3V Digital voltage supply
DDQ3
42
1
CPU Digital voltage supply, 2.5V or 3.3V
Analog voltage supply, 3.3V
DDCPU
AV
DD
V
3, 9, 16, 22, 27, 33, Ground
39, 45
SS
[3]
XTALIN
XTALOUT
4
5
Reference crystal input
Reference crystal feedback
[3]
SDRAM7/ PCI_STOP 28
SDRAM6/CPU_STOP 29
SDRAM5/ PWR_DWN 31
SDRAM clock output. Also, active LOW control input to stop PCI clocks, enabled
when MODE is LOW.
SDRAM clock output. Also, active LOWcontrol input to stop CPU clocks, enabled
when MODE is LOW.
SDRAM clock output. Also, active LOW control input to power down device,
enabled when MODE is LOW.
SDRAM[0:4],[8:11]
38, 37, 35, 34, 32, SDRAM clock outputs
21, 20, 18, 17
SEL0
26
CPU frequency select input, bit 0 (see table below)
CPU frequency select input, bit 0 (see table below)
CPU clock outputs
SEL1
46
CPUCLK[0:3]
PCICLK[0:3]
PCICLK_F
AGP[0:1]
REF0
44, 43, 41, 40
8, 10, 11, 12
PCI clock outputs, at one-half the CPU frequency.
Free-running PCI clock output
7
13, 15
2
AGP clock outputs
3.3V Reference clock output
USBCLK
SDATA
47
23
24
25
USB Clock output
Serial data input for serial configuration port
Serial clock input for serial configuration port
Mode Select pin for enabling power management features
SCLK
MODE
Note:
3. For best accuracy, use a parallel-resonant crystal, CLOAD = 18 pF.
Function Table
CPU/PCI
Ratio
CPUCLK[0:3]
SDRAM[0:11]
PCICLK[0:3]
PCICLK_F
SEL1 SEL0
AGP[0:1]
66.66 MHz
66.66 MHz
66.66 MHz
60.0 MHz
REF0
14.318 MHz
14.318 MHz
14.318 MHz
14.318 MHz
USBCLK
48 MHz
0
0
1
1
0
1
0
1
2.5
83.33 MHz
66.67 MHz
100.0 MHz
75.0 MHz
33.33 MHz
33.33 MHz
33.33 MHz
30.0 MHz
2
48 MHz
48 MHz
48 MHz
3.0
2.5
2
PRELIMINARY
CY2283
Actual Clock Frequency Values
CPU and PCI Clock Driver Strengths
Target
Frequency
(MHz)
Actual
Frequency
(MHz)
• Matched impedances on both rising and falling edges on
the output drivers
• Output impedance: 25Ω (typical) measured at 1.5V
Clock Output
CPUCLK
CPUCLK
CPUCLK
CPUCLK
USBCLK
PPM
–2346
66.67
75.0
66.51
75.0
0
83.33
100.0
48.0
83.14
99.77
48.01
-2346
-2346
167
Power Management Logic[4] - Active when MODE pin is held ‘LOW’
Other
PCICLK_F Clocks
CPU_STOP PCI_STOP PWR_DWN
CPUCLK
PCICLK
Low
Osc.
Stopped Off
PLLs
Off
X
0
0
1
1
X
0
1
0
1
0
1
1
1
1
Low
Low
Low
Stopped
Running
Running
Running
Running
Low
Running Running Running
Running Running Running
Running Running Running
Running Running Running
33/30 MHz
Low
66/75/83/100MHz
66/75/83/100MHz
30/33.3 MHz
Serial Configuration Map
Byte 0: Functional and Frequency Select Clock
Register (1 = Enable, 0 = Disable)
• The Serial bits will be read by the clock driverin the following
order:
Bit Pin #
Bit 7 --
Bit 6 --
Bit 5 --
Bit 4 --
Bit 3 --
Bit 2 --
Description
(Reserved) drive to ‘0’
Byte 0 - Bits 7, 6, 5, 4, 3, 2, 1, 0
Byte 1 - Bits 7, 6, 5, 4, 3, 2, 1, 0
(Reserved) drive to ‘0’
(Reserved) drive to ‘0’
(Reserved) drive to ‘0’
(Reserved) drive to ‘0’
(Reserved) drive to ‘0’
Bit 1 Bit 0
.
.
Byte N - Bits 7, 6, 5, 4, 3, 2, 1, 0
• Reserved and unused bits should be programmed to “0”.
2
• I C Address for the CY2283 is:
Bit 1 --
Bit 0
A6
A5
A4
A3
A2
A1
A0
R/W
1
1
0
0
1 - Three-State
0 - N/A
1
1
0
1
0
0
1
----
1 - Testmode
0 - Normal Operation
Select Functions
Outputs
SDRAM
Functional Description
CPU
PCI, PCI_F
Hi-Z
TCLK/4
Ref
IOAPIC
Hi-Z
TCLK
USBCLK
Hi-Z
TCLK/2
AGP
Hi-Z
TCLK/2
Three-State
Hi-Z
Hi-Z
Hi-Z
[6]
[5]
Test Mode
TCLK/2
TCLK/2
TCLK
Notes:
4. AGP clocks are free-running and stop only when the PWR_DWN pin is asserted. The frequency of the AGP clocks is as shown in the Function Table.
5. TCLK supplied on the XTALIN pin in Test Mode.
6. Valid only for SEL1=0.
3
PRELIMINARY
CY2283
Byte 1: CPU Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Byte 2: PCI Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Pin #
47
Description
Bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Pin #
Description
(Reserved) drive to ‘0’
USBCLK
--
7
N/A
N/A
N/A
40
(Reserved) drive to ‘0’
PCICLK_F (Active/Inactive)
AGP1 (Active/Inactive)
(Reserved) drive to ‘0’
15
14
12
11
10
8
Not used - drive to ‘0’
AGP0 (Active/Inactive)
CPUCLK3 (Active/Inactive)
CPUCLK2 (Active/Inactive)
CPUCLK1 (Active/Inactive)
CPUCLK0 (Active/Inactive)
PCICLK3 (Active/Inactive)
PCICLK2 (Active/Inactive)
PCICLK1 (Active/Inactive)
PCICLK0 (Active/Inactive)
41
43
44
Byte 3: SDRAM Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Byte 4: SDRAM Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Bit Pin #
Bit 7 28
Bit 6 29
Bit 5 31
Bit 4 32
Bit 3 34
Bit 2 35
Bit 1 37
Bit 0 38
Description
SDRAM7 (Active/Inactive)
SDRAM6 (Active/Inactive)
SDRAM5 (Active/Inactive)
SDRAM4 (Active/Inactive)
SDRAM3 (Active/Inactive)
SDRAM2 (Active/Inactive)
SDRAM1 (Active/Inactive)
SDRAM0 (Active/Inactive)
Bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Pin #
N/A
Description
Not used - drive to ‘0’
N/A
N/A
N/A
17
Not used - drive to ‘0’
Not used - drive to ‘0’
Not used - drive to ‘0’
SDRAM11
18
SDRAM10
20
SDRAM9
21
SDRAM8
Byte 5: Peripheral Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Byte 6: Reserved, for future use
Bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Pin #
N/A
Description
(Reserved) drive to ‘0’
(Reserved) drive to ‘0’
(Reserved) drive to ‘0’
(Reserved), drive to ‘0’
(Reserved) drive to ‘0’
(Reserved) drive to ‘0’
(Reserved) drive to ‘0’
REF0 (Active/Inactive)
N/A
N/A
N/A
N/A
N/A
N/A
2
4
PRELIMINARY
CY2283
Storage Temperature (Non-Condensing) ... –65°C to +150°C
Max. Soldering Temperature (10 sec) ...................... +260°C
Junction Temperature............................................... +150°C
Package Power Dissipation .............................................. 1W
Static Discharge Voltage ........................................... >2000V
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Supply Voltage..................................................–0.5 to +7.0V
Input Voltage.............................................. –0.5V to V +0.5
DD
(per MIL-STD-883, Method 3015, like V pins tied together)
DD
Operating Conditions[7]
Parameter
AV , V
Description
Analog and Digital Supply Voltage
Min.
Max.
Unit
V
3.135
3.465
DD DDQ3
V
CPU Supply Voltage
2.375
3.135
2.9
3.465
V
DDCPU
T
Operating Temperature, Ambient
0
70
°C
A
C
Max. Capacitive Load on
CPUCLK, USBCLK, IOAPIC
PCICLK, AGP, SDRAM
REF0
pF
L
10
20
20
20
30
45
f
Reference Frequency, Oscillator Nominal Value
14.318
14.318
MHz
(REF)
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
Min. Max. Unit
V
High-level Input Voltage
Low-level Input Voltage
Low-level Input Voltage
High-level Output Voltage
Except Crystal Inputs
Except Crystal Inputs
2.0
V
V
V
V
IH
V
V
V
0.8
0.7
IL
2
I C inputs only
ILiic
OH
V
V
V
= V
= 2.375V
I
I
I
I
I
I
I
I
I
I
I
I
I
I
= 16 mA CPUCLK 2.0
= 18 mA IOAPIC
= 27 mA CPUCLK
= 29 mA IOAPIC
= 16 mA CPUCLK 2.4
= 36 mA SDRAM
= 32 mA PCICLK
= 26 mA USBCLK
= 36 mA REF0
DDCPU
DDCPU
DDQ2
DDQ2
OH
OH
OL
OL
OH
OH
OH
OH
OH
OL
OL
OL
OL
OL
V
Low-level Output Voltage
High-level Output Voltage
= V
= 2.375V
0.4
V
V
OL
V
, AV , V = 3.135V
DD DDCPU
OH
DDQ3
DDQ3
V
Low-level Output Voltage
V
, AV , V
= 3.135V
= 27 mA CPUCLK
= 29 mA SDRAM
= 26 mA PCICLK
= 21 mA USBCLK
= 29 mA REF0
0.4V
V
OL
DD DDCPU
I
I
I
I
Input High Current
Input Low Current
V
V
= V
DD
–10 +10 µA
10 µA
IH
IH
IL
= 0V
IL
Output Leakage Current
Three-state
= 3.465V, V = 0 or V , Loaded Outputs,
–10 +10 µA
OZ
DD
[8]
Power Supply Current
V
300 mA
DD
IN
DD
CPU clocks = 66.67 MHz
[8]
I
I
Power Supply Current
V
= 3.465V, V = 0 or V , Unloaded Outputs
120 mA
DD
DD
IN
DD
Power-down Current
Current draw in power-down state
500 µA
DDS
Notes:
7. Electrical parameters are guaranteed with these operating conditions.
8. Power supply current will vary with number of outputs that are running.
5
PRELIMINARY
CY2283
Switching Characteristics for CY2283-1[9, 10]
Parameter
Output
All
Description
Test Conditions
Min. Typ. Max. Unit
[11]
t
Output Duty Cycle
t = t ÷ t
1B
45
50
55
%
1
2
1
1A
t
t
t
t
t
t
t
t
t
t
CPUCLK
CPU Clock Rising and
Falling Edge Rate
Between 0.4V and 2.0V, V
Between 0.4V and 2.4V, V
= 2.5V 0.75
= 3.3V
4.0
V/ns
DDCPU
DDCPU
AGP,
REF0
AGP, REF0 Clock Rising
and Falling Edge Rate
Between 0.4V and 2.4V
0.85
4.0
4.0
V/ns
V/ns
ns
2
PCI
PCI Rising and Falling
Edge Rate
Between 0.4V and 2.4V
0.85
2
CPUCLK
CPUCLK
CPUCLK
CPU Clock Rise Time
CPU Clock Fall Time
CPU-CPU Clock Skew
Between 0.4V and 2.0V, V
Between 0.4V and 2.4V, V
= 2.5V 0.4
= 3.3V 0.5
2.13
2.67
3
DDCPU
DDCPU
Between 2.0V and 0.4V, V
Between 2.4V and 0.4V, V
= 2.5V 0.4
= 3.3V 0.5
2.13
2.67
ns
4
DDCPU
DDCPU
Measured at 1.25V, V
= 2.5V
100
3.5
500
ps
5
DDCPU
Measured at 1.5V, V
= 3.3V
DDCPU
CPUCLK, CPU-PCI Clock Skew
PCICLK
Measured at 1.25V for 2.5V clocks, and
at 1.5V for 3.3V clocks
2.5
5.5
ns
6
PCICLK,
PCICLK
PCI-PCI Clock Skew
PCI-AGP Clock Skew
Cycle-Cycle Clock Jitter
Measured at 1.5V
500
ps
8
PCICLK,
AGP
Measured at 1.5V
1,200
500
ps
9
CPUCLK
Measured at 1.25V for 2.5V clocks, and
at 1.5V for 3.3V clocks
ps
10
t
t
t
PCICLK
AGP
Cycle-Cycle Clock Jitter
Cycle-Cycle Clock Jitter
Measured at 1.5V
Measured at 1.5V
750
800
3
ps
ps
10
10
11
CPUCLK, Power-up Time
PCICLK,
AGP
CPU, PCI, AGP clock stabilization from
power-up
ms
Notes:
9. Guaranteed by Design and Characterization, not 100% tested in production.
10. Device characterized and parameters guaranteed with SDRAM outputs turned off. All other outputs at maximum load.
11. Duty cycle is measured at 1.5V when VDD = 3.3V. When VDDCPU = 2.5V, CPUCLK duty cycle is measured at 1.25V.
6
PRELIMINARY
CY2283
Switching Characteristics for CY2283-2
Parameter
Output
Description
Test Conditions
Min. Typ. Max. Unit
t
t
All
Output Duty Cycle
t = t ÷ t
1B
TBD TBD TBD
%
1
2
1
1A
CPUCLK
CPU Clock Rising and
Falling Edge Rate
Between 0.4V and 2.0V, V
Between 0.4V and 2.4V, V
= 2.5V TBD TBD TBD V/ns
= 3.3V
DDCPU
DDCPU
t
SDRAM,
SDRAM, AGP, REF0 Clock Between 0.4V and 2.4V
TBD TBD TBD V/ns
2
AGP, REF0
Rising and Falling Edge
Rate
t
t
t
t
t
t
t
t
t
PCI
PCI Rising and Falling
Edge Rate
Between 0.4V and 2.4V
TBD TBD TBD V/ns
2
CPUCLK
CPUCLK
CPUCLK
CPU Clock Rise Time
CPU Clock Fall Time
CPU-CPU Clock Skew
CPU-PCI Clock Skew
Between 0.4V and 2.0V, V
Between 0.4V and 2.4V, V
= 2.5V TBD TBD TBD
= 3.3V
ns
ns
ps
ns
ps
ps
ps
ps
3
DDCPU
DDCPU
Between 2.0V and 0.4V, V
Between 2.4V and 0.4V, V
= 2.5V TBD TBD TBD
= 3.3V
4
DDCPU
DDCPU
Measured at 1.25V, V
= 2.5V
DDCPU
TBD TBD TBD
5
Measured at 1.5V, V
= 3.3V
DDCPU
CPUCLK,
PCICLK
Measured at 1.25V for 2.5V clocks, and TBD TBD TBD
at 1.5V for 3.3V clocks
6
CPUCLK,
SDRAM
CPU-SDRAM Clock Skew Measured at 1.25V for 2.5V clocks, and TBD TBD TBD
at 1.5V for 3.3V clocks
7
PCICLK,
PCICLK
PCI-PCI Clock Skew
PCI-AGP Clock Skew
Cycle-Cycle Clock Jitter
Measured at 1.5V
TBD TBD TBD
8
PCICLK,
AGP
Measured at 1.5V
TBD TBD TBD
9
CPUCLK,
SDRAM
Measured at 1.25V for 2.5V clocks, and TBD TBD TBD
at 1.5V for 3.3V clocks
10
t
t
t
PCICLK
AGP
Cycle-Cycle Clock Jitter
Cycle-Cycle Clock Jitter
Power-up Time
Measured at 1.5V
Measured at 1.5V
TBD TBD TBD
TBD TBD TBD
ps
ps
10
10
11
CPUCLK,
PCICLK,
CPU, PCI, AGP, and SDRAM clock sta- TBD TBD TBD
bilization from power-up
ms
AGP,SDRAM
2
Timing Requirement for the I C Bus
Parameter
Description
Min.
0
Max.
Unit
t
t
t
t
t
t
t
SCLK Clock Frequency
100
kHz
µs
µs
µs
µs
µs
µs
12
13
14
15
16
17
18
Time the bus must be free before a new transmission can start
Hold time start condition. After this period the first clock pulse is generated.
The LOW period of the clock
4.7
4
4.7
4
The HIGH period of the clock
Set-up time for start condition. (Only relevant for a repeated start condition.)
4.7
Hold time DATA
for CBUS compatible masters
for I C devices
5
0
2
t
t
t
t
DATA input set-up time
250
ns
µs
ns
µs
19
20
21
22
Rise time of both SDATA and SCLK inputs
Fall time of both SDATA and SCLK inputs
Set-up time for stop condition
1
300
4.0
7
PRELIMINARY
CY2283
Switching Waveforms
Duty Cycle Timing
t
1B
t
1A
OUTPUT
All Outputs Rise/Fall Time
VDD
0V
OUTPUT
t
2
t
3
t
2
t
4
CPU-CPU Clock Skew
CPUCLK
CPUCLK
t
5
CPU-SDRAM Clock Skew
CPUCLK
SDRAM
t
7
CPU-PCI Clock Skew
CPUCLK
PCICLK
t6
PCI-PCI Clock Skew
PCICLK
PCICLK
t
8
8
PRELIMINARY
CY2283
Switching Waveforms (continued)
AGP-PCI Clock Skew
AGPCLK
PCICLK
t9
[12, 13]
CPU_STOP
CPUCLK
(Internal)
PCICLK
(Internal)
PCICLK
(Free-Running)
CPU_STOP
CPUCLK
(External)
[14, 15]
PCI_STOP
CPUCLK
(Internal)
PCICLK
(Internal)
PCICLK
(Free-Running)
PCI_STOP
PCICLK
(External)
PWR_DOWN
CPUCLK
(Internal)
PCICLK
(Internal)
PWR_DWN
CPUCLK
(External)
PCICLK
(External)
VCO
Crystal
Shaded section on the VCO and Crystal waveforms indicates that the VCO and crystal oscillator are active, and there is a valid clock.
2
Timing Requirements for the I C Bus
SDA
t
t
t
21
13
t
14
20
SCL
t
14
t
t
17
22
t
t
t
19
t
16
15
18
Notes:
12. CPUCLK on and CPUCLK off latency is 2 or 3 CPUCLK cycles.
13. CPU_STOP may be applied asynchronously. It is synchronized internally.
14. PCICLK on and PCICLK off latency is 1 rising edge of the external PCICLK.
15. PCI_STOP may be applied asynchronously. It is synchronized internally.
9
PRELIMINARY
CY2283
Application Circuit
Clock traces must be terminated with either series or parallel termination, as they are normally done
Summary
• A parallel-resonant crystal should be used as the reference to the clock generator. The operating frequency and C
of
LOAD
this crystal should be as specified in the data sheet. Optional trimming capacitors may be needed if a crystal with a different
is used. Footprints must be laid out for flexibility.
C
LOAD
• Surface mount, low-ESR, ceramic capacitors should be used for filtering. Typically, these capacitors have a value of 0.1 µF.
In some cases, smaller value capacitors may be required.
• The value ofthe series terminating resistor satisfies the following equation, where R
is the loaded characteristic impedance
trace
ofthe trace, R is theoutputimpedanceofthe clockgenerator(specified in the datasheet), and R
is theseries terminating
out
series
resistor.
R
> R
– R
trace out
series
• Footprints must be laid out for optional EMI-reducing capacitors, which should be placed as close to the terminating resistor
as is physically possible. Typical values of these capacitors range from 4.7 pF to 22 pF.
• A Ferrite Bead may be used to isolate the Board V from the clock generator V island. Ensure that the Ferrite Bead offers
DD
DD
greater than 50Ω impedance at the clock frequency, under loaded DC conditions. Please refer to the application note “Layout
and Termination Techniques for Cypress Clock Generators” for more details.
• If a Ferrite Bead is used, a 10 µF– 22 µF tantalum bypass capacitor should be placed close to the Ferrite Bead. This capacitor
prevents power supply droop during current surges.
10
PRELIMINARY
CY2283
Test Circuit
V
DDQ3
1
48
0.1 µF
0.1 µF
0.1 µF
0.1 µF
3
6
45
42
V
DDCPU
9
39
36
14
0.1 µF
0.1 µF
0.1 µF
16
19
33
30
0.1 µF
22
27
OUTPUTS
C
LOAD
Note: All Capacitors must be placed as close to the pins as is possible
Ordering Information
Package
Operating
Range
Ordering Code
CY2283PVC–1
CY2283PVC–2
Name
Package Type
48-Pin SSOP
48-Pin SSOP
O48
Commercial
Commercial
O48
Document #: 38–00685–A
2
Intel and Pentium are registered trademarks of Intel Corporation. I C is a trademark of Philips Corporation.
11
PRELIMINARY
CY2283
Package Diagram
48-Lead Shrunk Small Outline Package O48
51-85061-B
© Cypress Semiconductor Corporation, 1998. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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