PS7241E-1A-E4 [CEL]
NECs 4-PIN SOP 400 V BREAK DOWN VOLTAGE 1-CH OPTICALLY COUPLED MOS FET; NEC的4 -PIN SOP 400 V击穿电压1 - CH光耦合MOS场效应管
| 型号： | PS7241E-1A-E4 |
| 厂家： | 
CALIFORNIA EASTERN LABS |
| 描述： | NECs 4-PIN SOP 400 V BREAK DOWN VOLTAGE 1-CH OPTICALLY COUPLED MOS FET |
| 文件： | 总7页 (文件大小：365K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NEC's 4-PIN SOP
400 V BREAK DOWN VOLTAGE
PS7241E-1A
1-CH OPTICALLY COUPLED MOS FET
FEATURES
DESCRIPTION
NEC's PS7241E-1A is an optically coupled solid state relay
that combines a GaAs infrared LED on the input side with
a normally-open MOS FET on the output side to realize an
excellent cost performance.
•
SMALL AND THIN PACKAGE:
4-pin SOP, Height = 2.1 mm
•
•
•
•
1 CHANNEL TYPE (1 A OUTPUT)
DESIGNED FOR AC/DC SWITCHING LINE CHANGER
LOW OFFSET VOLTAGE
The small, thin package and high sensitivity of this relay
makes it ideal for battery-driven mobile devices, and its
small offset voltage at power-on and good linearity are also
make it suitable for controlling micro analog signals.
ORDERING NUMBER OF TAPING PRODUCT:
PS7241E-1A-E3, E4, F3, F4
•
•
UL AWAITING APPROVAL
BSI AWAITING APPROVAL
APPLICATIONS
•
•
•
•
Laptop PC, PDA
Modem card
Telephone, FAX
Measurement equipment
California Eastern Laboratories
PS7241E-1A
PACKAGE DIMENSIONS (UNIT: mm)
4.0±0.5
TOP VIEW
4
1
3
1. LED Anode
2. LED Cathode
3. MOS FET
4. MOS FET
2
7.0±0.3
4.4
0.5±0.3
2.54
+0.10
0.25 M
0.40
-0.05
PS7241E-1A
ORDERING INFORMATION
Part Number
Package
Packing Style
Application Part
*1
Number
PS7241E-1A
4-pin SOP
Magazine case 100 pcs
PS7241E-1A
PS7241E-1A-E3
PS7241E-1A-E4
PS7241E-1A-F3
PS7241E-1A-F4
Embossed Tape 900 pcs/reel
Embossed Tape 3 500 pcs/reel
*1 For the application of the Safety Standard, following part number should be used
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
PARAMETER
SYMBOL
RATINGS
UNIT
mA
V
Diode
Forward Current (DC)
Reverse Voltage
IF
50
VR
5.0
Power Dissipation
PD
IFP
50
1
mW
A
Peak Forward Current *1
MOS FET Break Down Voltage
Continuous Load Current
VL
IL
400
120
V
mA
Pulse Load Current*2
(AC/DC Connection)
ILP
240
mA
Power Dissipation
PD
300
mW
Isolation Voltage *3
BV
PT
1 500
350
Vr.m.s.
mW
°C
Total Power Dissipation
Operating Ambient Temperature
Storage Temperature
TA
−40 to +85
−40 to +100
Tstg
°C
*1 PW = 100 μs, Duty Cycle = 1%
*2 PW = 100 ms, 1 shot
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
PS7241E-1A
RECOMMENDED OPERATING CONDITIONS (TA = 25ºC)
PARAMETER
LED Operating Current
LED Off Voltage
SYMBOL
MIN.
TYP.
MAX.
20
UNIT
mA
V
IF
4
0
10
VF
0.5
ELECTRICAL CHARACTERISTICS (TA = 25ºC)
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Diode
Forward Voltage
Reverse Current
VF
IR
IF = 10 mA
VR = 5 V
1.2
1.4
5.0
1.0
V
μA
μA
pF
mA
Ω
MOS FET Off-state Leakage Current
Output Capacitance
ILoff
Cout
IFon
Ron1
Ron2
ton
VD = 400 V
VD = 0 V, f = 1 MHz
IL = 120 mA
18
Coupled
LED On-state Current
On-state Resistance
4.0
35
IF = 10 mA, IL = 10 mA
22
17
IF = 10 mA, IL = 120 mA, t ≤ 10 ms
IF = 10 mA, VO = 5 V, RL = 500 Ω,
PW ≥ 10 ms
23
Turn-on Time*1
0.5
0.07
1.0
0.2
ms
Turn-off Time*1
toff
109
Ω
Isolation Resistance
Isolation Capacitance
RI-O
CI-O
VI-O = 1.0 kVDC
V = 0 V, f = 1 MHz
0.5
pF
*1 Test Circuit for Switching Time
50%
Input
IF
Pulse Input
VL
0
V
O
= 5 V
90%
Output
Input monitor
VO monitor
10%
Rin
RL
ton
toff
PS7241E-1A
TAPING SPECIFICATIONS (Units in mm)
Outline and Dimensions (Tape)
2.0±0.05
+0.1
4.0±0.1
2.9 MAX.
2.4±0.1
1.5
-0
1.55±0.1
4.6±0.1
8.0±0.1
0.3
Tape Direction
PS7241E-1A-E3
PS7241E-1A-E4
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
φ
φ
R 1.0
φ
21.0±0.8
13.5±1.0
17.5±1.0
11.9 to 15.4
Outer edge of
Packing: 900 pcs/reel
flange
PS7241E-1A
TAPING SPECIFICATIONS (Units in mm)
Outline and Dimensions (Tape)
2.0±0.05
+0.1
4.0±0.1
2.9 MAX.
2.4±0.1
1.5
-0
1.55±0.1
4.6±0.1
8.0±0.1
0.3
Tape Direction
PS7241E-1A-F4
PS7241E-1A-F3
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
R 1.0
φ
φ
21.0±0.8
φ
φ
13.5±1.0
17.5±1.0
11.9 to 15.4
Outer edge of
Packing: 3 500 pcs/reel
flange
PS7241E-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
• Time of temperature higher than 220°C
10 seconds or less
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260ºC MAX.
220ºC
to 60 s
180ºC
120ºC
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt% is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
12/02/2004
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
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