PS7241E-1B [NEC]
4-PIN SOP 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 1-ch Optical Coupled MOS FET; 4 -PIN SOP 400 V击穿电压常闭型1路光耦合MOS场效应管
| 型号： | PS7241E-1B |
| 厂家： | 
NEC |
| 描述： | 4-PIN SOP 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 1-ch Optical Coupled MOS FET |
| 文件： | 总9页 (文件大小：176K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRELIMINARY DATA SHEET
Solid State Relay
OCMOS FET
PS7241E-1B
4-PIN SOP 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE
1-ch Optical Coupled MOS FET
DESCRIPTION
The PS7241E-1B is an optically coupled element that combines a GaAs infrared LED on the input side with a
normally close MOS FET on the output side to realize an excellent cost performance.
The small, thin package and high sensitivity of this element makes it ideal for battery-driven mobile devices, and its
small offset voltage at power-on and good linearity also make it suitable for controlling micro analog signals.
FEATURES
PIN CONNECTION
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Small and thin package (4-pin SOP, Height = 2.1 mm)
1 channel type (1 b output)
(Top View)
4
1
3
Designed for AC/DC switching line changer
Low offset voltage
1. LED Anode
Ordering number of taping product: PS7241E-1B-E3, E4, F3, F4
Pb-Free product
2. LED Cathode
3. MOS FET
4. MOS FET
UL awaiting approval
BSI awaiting approval
2
APPLICATIONS
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Laptop PC, PDA
Modem card
Telephone, FAX
Measurement equipment
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PN10552EJ01V0DS (1st edition)
Date Published February 2005 CP(K)
Printed in Japan
©
NEC Compound Semiconductor Devices, Ltd. 2005
PS7241E-1B
PACKAGE DIMENSIONS (UNIT: mm)
4.0±0.5
7.0±0.3
4.4
0.5±0.3
2.54
+0.10
–0.05
0.25 M
0.40
2
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
Application Part
Number*1
PS7241E-1B
PS7241E-1B-A
Pb-Free*2
Magazine case 100 pcs
UL and BSI
PS7241E-1B
awaiting approval
PS7241E-1B-E3
PS7241E-1B-E4
PS7241E-1B-F3
PS7241E-1B-F4
PS7241E-1B-E3-A
PS7241E-1B-E4-A
PS7241E-1B-F3-A
PS7241E-1B-F4-A
Embossed Tape 900 pcs/reel
Embossed Tape 3 500 cs/reel
*1 For the application of the Safety Standard, following part number should be used.
*2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your
nearby sales office.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
IF
Ratings
50
Unit
mA
V
Diode
Forward Current (DC)
Reverse Voltage
Power Dissipation
Peak Forward Current *1
VR
5.0
PD
50
mW
A
IFP
1
MOS FET Break Down Voltage
Continuous Load Current
VL
400
120
240
V
IL
mA
mA
Pulse Load Current*2
(AC/DC Connection)
ILP
Power Dissipation
Isolation Voltage *3
PD
BV
PT
300
1 500
mW
Vr.m.s.
mW
°C
Total Power Dissipation
Operating Ambient Temperature
Storage Temperature
350
TA
−40 to +85
−40 to +100
Tstg
°C
*1 PW = 100 µs, Duty Cycle = 1%
*2 PW = 100 ms, 1 shot
*3 AC voltage for 1 minute at TA = 25 °C, RH = 60% between input and output
Pins 1-2 shorted together, 3-4 shorted together.
3
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameter
LED Operating Current
LED Off Voltage
Symbol
MIN.
TYP.
10
MAX.
20
Unit
mA
V
IF
3
0
VF
0.5
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
1.2
MAX.
1.4
Unit
V
Diode
Forward Voltage
Reverse Current
IF = 10 mA
VR = 5 V
IR
5.0
µA
µA
MOS FET Off-state Leakage
Current
ILoff
IF = 10 mA, VD = 400 V
1.0
Output Capacitance
Cout
IFoff
Ron1
Ron2
ton
IF = 10 mA, VD = 0 V, f = 1 MHz
IL = 120 mA
206
pF
mA
Ω
Coupled
LED Off-state Current
On-state Resistance
3.0
35
IF = 0 mA, IL = 10 mA
22
17
IF = 0 mA, IL = 120 mA, t ≤ 10 ms
24
Turn-on Time*1
IF = 10 mA, VO = 5 V, RL = 500 Ω,
PW ≥ 10 ms
0.07
1.0
0.2
3.0
ms
Turn-off Time*1
toff
Isolation Resistance
Isolation Capacitance
RI-O
CI-O
VI-O = 1.0 kVDC
109
Ω
V = 0 V, f = 1 MHz
0.5
pF
*1 Test Circuit for Switching Time
I
F
Input
50%
Pulse Input
V
L
0
V
O
= 5 V
90%
10%
Input monitor
VO
monitor
Output
Rin
RL
t
off
t
on
4
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.0±0.05
4.0±0.1
+0.1
–0
2.9 MAX.
1.5
1.55±0.1
2.4±0.1
0.3
4.6±0.1
8.0±0.1
Tape Direction
PS7241E-1B-E3
PS7241E-1B-E4
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
φ
φ
R 1.0
φ
21.0±0.8
13.5±1.0
17.5±1.0
11.9 to 15.4
Outer edge of
flange
Packing: 900 pcs/reel
5
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
Outline and Dimensions (Tape)
2.0±0.05
+0.1
–0
4.0±0.1
2.9 MAX.
1.5
1.55±0.1
2.4±0.1
0.3
4.6±0.1
8.0±0.1
Tape Direction
PS7241E-1B-F4
PS7241E-1B-F3
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
φ
R 1.0
φ
φ
φ
21.0±0.8
13.5±1.0
17.5±1.0
11.9 to 15.4
Outer edge of
flange
Packing: 3 500 pcs/reel
6
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
10 seconds or less
• Time of peak reflow temperature
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
7
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
•
The information in this document is current as of February, 2005. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
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Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
8
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
This product uses gallium arsenide (GaAs).
Caution GaAs Products
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0406
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4-PIN SOP 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 1-ch Optical Coupled MOS FET
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