CM1206-16CP [CALMIRCO]
ESD Protection Arrays, Chip Scale Package; ESD保护阵列，芯片级封装
| 型号： | CM1206-16CP |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | ESD Protection Arrays, Chip Scale Package |
| 文件： | 总7页 (文件大小：222K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CM1206
ESD Protection Arrays, Chip Scale Package
Product Description
Features
•
•
•
•
Functionally and pin compatible with CMD’s
The CM1206 family of transient voltage suppressor
arrays provides a very high level of protection for sensi-
tive electronic components that may be subjected to
ESD. The back-to-back Zener connections provide
ESD protection in cases where nodes with AC signals
are present.
PACDN2404C/08C/16C family of devices
OptiGuard™ coated for improved reliability at
assembly
4, 8, or 16 transient voltage suppressors in a single
package
In-system Electrostatic Discharge (ESD) protection
to +18kV contact discharge per IEC 61000-4-2
international standard
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard. All I/Os are rated at +18kV
using the IEC 61000-4-2 contact discharge method.
Using the MIL-STD-883D (Method 3015) specification
for Human Body Model (HBM) ESD, all pins are pro-
tected for contact discharges to greater than +30kV.
•
•
Supports AC signal applications
Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
Lead-free versions available
•
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill.
Applications
•
•
ESD protection for sensitive electronic equipment
I/O port, keypad and button circuitry protection for
portable devices
•
•
•
•
•
•
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Cameras and Camcorders
Notebooks
The CM1206 incorporates OptiGuard™ coating which
results in improved reliability at assembly. The CM1206
is also available with optional lead-free finishing.
Desktop PCs
Electrical Schematic
B1
B2
B3
D1 D2 D3
D4 D5
B1 B2
B4 B5
B3
A3
A1 A2
A4 A5
A1
A2
A3
C1 C2 C3
C4 C5
B4 B5
CM1206-04CS/CP
CM1206-08CS/CP
B1 B2
B3
A1 A2
A3
A4 A5
CM1206-16CS/CP
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
CM1206
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
1
2
3
(see note 2)
B1
A1
B2
A2
B3
A3
A
B
L06
CM1206-04
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
1
2
3
4
5
(see note 2)
B1
A1
B2
A2
B3
A3
B4
A4
B5
A5
A
B
120608
CM1206-08
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
1
2
3
4
5
(see note 2)
D1
C1
B1
A1
D2
C2
B2
A2
D3
C3
B3
A3
D4
C4
B4
A4
D5
C5
B5
A5
A
B
C
D
CM1206
16
CM1206-16
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Number1
Ordering Part
Number1
Bumps
Package
CSP
Part Marking
L06
Part Marking
L06
6
CM1206-04CS
CM1206-08CS
CM1206-16CS
CM1206-04CP
CM1206-08CP
CM1206-16CP
10
20
CSP
120608
120608
CSP
CM120616
CM120616
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark
© 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/28/04
CM1206
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
°C
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VREV
ILEAK
VSIG
Reverse Standoff Voltage
IDIODE=10µA
5.9
V
Leakage Current
VIN=3.3V DC
ILOAD = 10mA
100
nA
Signal Clamp Voltage
Positive Clamp
6.0
-9.2
7.6
-7.6
9.2
-6.0
V
V
Negative Clamp
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2 & 3
+30
+18
kV
kV
b) Contact Discharge per IEC 61000-4-2
Level 4
VCL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2 & 3
+14
-14
V
V
Negative Transients
C
Channel Capacitance
At 2.5V DC, f = 1MHz
39
47
pF
Note 1: TA=25°C unless otherwise specified. GND in this document refers to the lower supply voltage.
Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground.
Note 3: These parameters are guaranteed by design and characterization.
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
3
CM1206
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
0.300mm
Round
Pad Size on PCB
Pad Shape
Pad Definition
Non-Solder Mask defined pads
0.350mm Round
0.125 - 0.150mm
0.360mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50µm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.300mm DIA.
Solder Stencil Opening
0.360mm DIA.
Solder Mask Opening
0.350mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/28/04
CM1206
Mechanical Details
The CM1206 devices are packaged in custom Chip
Scale Packages (CSP).
CM1206-04 6-bump CSP Mechanical Specifications
The CM1206-04 devices are packaged in a 6-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Mechanical Package Diagrams
BOTTOM VIEW
A1
PACKAGE DIMENSIONS
OptiGuardTM
Coating
Package
Bumps
Custom CSP
6
C1
B1
Millimeters
Nom Max
Inches
Nom
3
2
1
Dim
Min
Min
Max
A1
A2
B1
B2
B3
C1
C2
D1
D2
1.109 1.154 1.199 0.0437 0.0454 0.0472
1.759 1.804 1.849 0.0693 0.0710 0.0728
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.638 0.707 0.776 0.0251 0.0278 0.0306
0.394 0.445 0.495 0.0155 0.0175 0.0195
A
B
SIDE
VIEW
D1
D2
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1206-04 6-bump Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
QTY
PER
REEL
POCKET SIZE (mm)
TAPE WIDTH
W
REEL
DIA.
B0 X A0 X K0
P0
P1
PART NUMBER
CHIP SIZE (mm)
CM1206-04
1.804 X 1.154 X 0.707
1.98 X 1.32 X 0.91
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
P
Center Lines
of Cavity
1
Concentric around B.
User Direction of Feed
Figure 4. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
CM1206
Mechanical Details (cont’d)
CM1206-08 10-bump CSP Mechanical Specifications
The CM1206-08 devices are packaged in a 6-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Mechanical Package Diagrams
BOTTOM VIEW
A1
PACKAGE DIMENSIONS
OptiGuardTM
Coating
Package
Bumps
Custom CSP
10
C1
B1
Millimeters
Nom Max
Inches
Nom
5
4
3
2
1
Dim
Min
Min
Max
A1
A2
B1
B2
C1
C2
D1
D2
1.109 1.154 1.199 0.0437 0.0454 0.0472
3.059 3.104 3.149 0.1204 0.1222 0.1240
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.638 0.707 0.776 0.0251 0.0278 0.0306
0.394 0.445 0.495 0.0155 0.0175 0.0195
A
B
SIDE
VIEW
D1
D2
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
# per tape and
reel
3500 pieces
DIMENSIONS IN MILLIMETERS
Controlling dimension: millimeters
Package Dimensions for
CM1206-08 10-bump Chip Scale Package
CSP Tape and Reel Specifications
QTY
PER
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
P0
P1
PART NUMBER
CHIP SIZE (mm)
DIAMETER REEL
CM1206-08
3.104 X 1.154 X 0.707
3.28 X 1.32 X 0.81
8mm
178mm (7") 3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
P
Center Lines
of Cavity
1
Concentric around B.
User Direction of Feed
Figure 5. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/28/04
CM1206
Mechanical Details (cont’d)
CM1206-16 20-bump CSP Mechanical Specifications
The CM1206-16 devices are packaged in a 20-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Mechanical Package Diagrams
BOTTOM VIEW
A1
PACKAGE DIMENSIONS
OptiGuardTM
Coating
Package
Bumps
Custom CSP
20
C1
B1
Millimeters
Nom Max
Inches
Nom
5
4
3
2
1
Dim
Min
Min
Max
A1
A2
B1
B2
C1
C2
D1
D2
2.409 2.454 2.499 0.0948 0.0966 0.0984
3.059 3.104 3.149 0.1204 0.1222 0.1240
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.638 0.707 0.776 0.0251 0.0278 0.0306
0.394 0.445 0.495 0.0155 0.0175 0.0195
B
SIDE
VIEW
D
C
A
D1
D2
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
# per tape and
reel
3500 pieces
DIMENSIONS IN MILLIMETERS
Controlling dimension: millimeters
Package Dimensions for
CM1206-16 20-bump Chip Scale Package
CSP Tape and Reel Specifications
QTY
PER
REEL
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
P0
P1
PART NUMBER
CHIP SIZE (mm)
CM1206-16
3.104 X 2.454 X 0.707
3.28 X 2.64 X 0.86
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
P
Center Lines
of Cavity
1
Concentric around B.
User Direction of Feed
Figure 6. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
7
相关型号：
©2020 ICPDF网 联系我们和版权申明