CM1208-08MS [CALMIRCO]

7 & 8-Channel High-Speed ESD Protection Arrays; 7 & 8通道高速ESD保护阵列
CM1208-08MS
型号: CM1208-08MS
厂家: CALIFORNIA MICRO DEVICES CORP    CALIFORNIA MICRO DEVICES CORP
描述:

7 & 8-Channel High-Speed ESD Protection Arrays
7 & 8通道高速ESD保护阵列

瞬态抑制器 二极管 光电二极管 局域网
文件: 总6页 (文件大小:154K)
中文:  中文翻译
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CM1208-07/08  
7 & 8-Channel High-Speed ESD Protection Arrays  
Features  
Product Description  
Seven or eight channels of high-speed ESD pro-  
tection  
The CM1208-07/CM1208-08 is a diode array designed  
to provide either 7 or 8 channels of ESD protection for  
electronic components or sub-systems. Each channel  
consists of a pair of diodes, which steers the ESD cur-  
rent pulse to either the positive (VP) or negative (VN)  
supply. The CM1208-07/08 devices will protect against  
ESD pulses up to 15kV contact discharge per the Inter-  
national Standard IEC61000-4-2.  
Meets IEC-61000-4-2 Level 4 ESD protection  
requirements (+8kV contact discharge)  
Meets IEC-61000-4-2 +15kV air discharge  
requirements  
Low loading capacitance at 3pF typical  
Low supply and leakage currents – ideal for bat-  
tery-powered devices  
These devices are particularly well-suited for portable  
electronics (e.g.handheld and notebook computers)  
because of its small package footprint, high ESD pro-  
tection level, and low loading capacitance. They are  
also suitable for protecting video output lines and I/O  
ports in computers, set top boxes, digital TVs and  
peripheral equipment.  
Small MSOP-10 package  
Lead-free versions available  
Applications  
High speed data line ESD protection  
DVI ports  
High resolution video (e.g. VGA ports)  
Expansion ports for Notebook/Handheld  
Computers  
The CM1208-07/CM1208-08 is housed in a 10 pin  
MSOP package and is available with optional lead-free  
finishing.  
5V pseudo RS-232 ports  
Electrical Schematics  
V
CH7  
V
CH6  
CH5  
CH8  
CH7  
V
P
CH6  
CH5  
N
P
CH1 CH2  
CH3 CH4  
V
CH1 CH2  
CH3  
CM1208-08  
CH4  
V
N
N
CM1208-07  
© 2004 California Micro Devices Corp. All rights reserved.  
02/02/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112  
L
Tel: 408.263.3214  
L
Fax: 408.263.7846  
L
www.calmicro.com  
1
CM1208-07/08  
PACKAGE / PINOUT DIAGRAMS  
Top View  
Top View  
CH1  
CH2  
CH3  
CH4  
VN  
1
2
3
4
5
10  
9
CH8  
CH7  
VP  
CH1  
CH2  
CH3  
CH4  
VN  
1
2
3
4
5
10  
9
VN  
CH7  
VP  
8
8
7
CH6  
CH5  
7
CH6  
CH5  
6
6
10-pin MSOP  
CM1208-08MS  
CM1208-08MR  
10-pin MSOP  
CM1208-07MS  
CM1208-07MR  
Note: These drawings are not to scale.  
PIN DESCRIPTIONS  
DEVICE  
-07,-08  
-07,-08  
-07,-08  
-07,-08  
-07,-08  
PIN  
1
NAME  
CH 1  
CH 2  
CH 3  
CH 4  
VN  
TYPE  
I/O  
DESCRIPTION  
ESD Channel  
ESD Channel  
ESD Channel  
ESD Channel  
2
I/O  
3
I/O  
4
I/O  
5
GND  
Negative voltage supply rail or ground reference rail  
-07,-08  
-07,-08  
-07,-08  
6
7
8
CH 5  
CH 6  
VP  
I/O  
I/O  
ESD Channel  
ESD Channel  
Supply  
Positive voltage supply rail  
-07,-08  
-07  
9
CH 7  
VN  
I/O  
ESD Channel  
10  
GND  
Negative voltage supply rail or ground reference rail  
-08  
10  
CH 8  
I/O  
ESD Channel  
Ordering Information  
PART NUMBERING INFORMATION  
Standard Finish  
Lead-free Finish  
Ordering Part  
Number1  
Ordering Part  
Number1  
Pins  
10  
Package  
MSOP  
Part Marking  
0807  
Part Marking  
807R  
CM1208-07MS  
CM1208-08MS  
CM1208-07MR  
CM1208-08MR  
10  
MSOP  
0808  
808R  
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.  
© 2004 California Micro Devices Corp. All rights reserved.  
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112  
L
Tel: 408.263.3214  
L
Fax: 408.263.7846  
L
www.calmicro.com  
02/02/04  
CM1208-07/08  
Specifications  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
RATING  
UNITS  
Supply Voltage (VP - VN)  
6.0  
V
Diode Forward DC Current (Note 1)  
Operating Temperature Range  
Storage Temperature Range  
20  
mA  
°C  
°C  
V
-40 to +85  
-65 to +150  
DC Voltage at any channel input  
(VN - 0.5) to (VP + 0.5)  
Package Power Rating  
MSOP Package  
300  
mW  
Note 1: Only one diode conducting at a time.  
STANDARD OPERATING CONDITIONS  
PARAMETER  
RATING  
-40 to +85  
0 to 5.5  
UNITS  
°C  
Operating Temperature Range  
Operating Supply Voltage (VP - VN)  
V
© 2004 California Micro Devices Corp. All rights reserved.  
02/02/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214  
L
Fax: 408.263.7846  
L
www.calmicro.com  
3
CM1208-07/08  
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)  
SYMBOL PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
IP  
Supply Current  
(VP-VN)=5.0V  
10  
µA  
VF  
Diode Forward Voltage  
Top Diode  
IF = 20mA; TA=25°C  
0.60  
0.65  
0.7  
0.8  
0.95  
0.95  
V
V
Bottom Diode  
ILEAK  
CIN  
Channel Leakage Current  
Channel Input Capacitance  
TA=25°C  
0.1  
3
1.0  
5
µA  
At 1 MHz, OSC Level =  
30mV, VP=5V, VN=0V,  
pF  
VCH=2.5V;  
Note 2 applies  
VESD  
ESD Protection  
Peak Discharge Voltage at any chan-  
nel input  
a) Contact discharge per  
IEC 61000-4-2 standard  
b) Human Body Model, MIL-  
STD-883, Method 3015  
Notes 2, 3 & 5  
Notes 2, 3 & 4  
8
kV  
kV  
15  
VCL  
Channel Clamp Voltage  
At 8kV ESD HBM;  
TA=25°C; Note 2, 3 & 4  
Positive Transients  
Negative Transients  
VP + 5.0  
VN - 5.0  
V
V
Note 1: All parameters specified at T =-40 to +85°C unless otherwise noted.  
A
Note 2: These parameters guaranteed by design and characterization.  
Note 3: From I/O pins to V or V only. A bypass capacitor between V  
V is required. It is recommended that V be bypassed  
N P  
P
N
P and  
to V with a 0.2µF ceramic capacitor.  
N
Note 4: Human Body Model per MIL-STD-883, Method 3015, C  
= 100pF, R  
= 1.5K, V = 5.0V, V grounded.  
Discharge  
Discharge  
P
N
Note 5: Standard IEC 61000-4-2 with C  
= 150pF, R  
= 330, V = 5.0V, V grounded.  
Discharge P N  
Discharge  
Performance Information  
Typical Channel Input Capacitance vs. Channel Input Voltage at TA=25°C  
5
4
3
T y p ic a l V a r ia t io n o f C  
vs. V  
IN  
IN  
2
1
0
(V = 5V, V = 0V, 0.2  
µ
F chip capacitor between V and V )  
P
N
P
N
0
1
2
3
4
5
Input Voltage  
© 2004 California Micro Devices Corp. All rights reserved.  
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112  
L
Tel: 408.263.3214  
L
Fax: 408.263.7846  
L
www.calmicro.com  
02/02/04  
CM1208-07/08  
Application Information  
Design Considerations  
In order to realize the maximum protection against  
ESD pulses, care must be taken in the PCB layout to  
minimize parasitic series inductances on the Supply/  
Ground rails as well as the signal trace segment  
between the signal input (typically a connector) and the  
ESD protection device. Refer to Figure 1, which illus-  
trates an example of a positive ESD pulse striking an  
input channel. The parasitic series inductance back to  
the power supply is represented by L1 and L2. The volt-  
age VCL on the line being protected is:  
ance of the power supply respectively. As an example,  
a ROUT of 1 ohm would result in a 10V increment in  
V
CL for a peak IESD of 10A.  
To mitigate these effects, a high frequency bypass  
capacitor should be connected between the VP pin of  
the ESD Protection Array and the ground plane. The  
value of this bypass capacitor should be chosen such  
that it will absorb the charge transferred by the ESD  
pulse with minimal change in VP. Typically a value in  
the 0.1µF to 0.2µF range is adequate for IEC-61000-4-  
2 level 4 contact discharge protection (8kV). For higher  
ESD voltages, the bypass capacitor should be  
increased accordingly. Ceramic chip capacitors  
mounted with short printed circuit board traces are  
good choices for this application. Electrolytic capaci-  
tors should be avoided as they have poor high fre-  
quency characteristics. For extra protection, connect a  
zener diode in parallel with the bypass capacitor to mit-  
igate the effects of the parasitic series inductance  
inherent in the capacitor. The breakdown voltage of the  
zener diode should be slightly higher than the maxi-  
mum supply voltage.  
V
= Fwd voltage drop of D + V  
+ L x d(I  
) / dt  
CL  
1
SUPPLY  
1
ESD  
+ L x d(I  
) / dt  
2
ESD  
where IESD is the ESD current pulse, and VSUPPLY is  
the positive supply voltage.  
An ESD current pulse can rise from zero to its peak  
value in a very short time. As an example, a level 4  
contact discharge per the IEC61000-4-2 standard  
results in a current pulse that rises from zero to 30  
Amps in 1ns. Here d(IESD)/dt can be approximated by  
IESD/t, or 30/(1x10-9). So just 10nH of series induc-  
tance (L1 and L2 combined) will lead to a 300V incre-  
ment in VCL  
!
As a general rule, the ESD Protection Array should be  
located as close as possible to the point of entry of  
expected electrostatic discharges. The power supply  
bypass capacitor mentioned above should be as close  
to the VP pin of the Protection Array as possible, with  
minimum PCB trace lengths to the power supply,  
ground planes and between the signal input and the  
ESD device to minimize stray series inductance.  
Similarly for negative ESD pulses, parasitic series  
inductance from the VN pin to the ground rail will lead  
to drastically increased negative voltage on the line  
being protected.  
Another consideration is the output impedance of the  
power supply for fast transient currents. Most power  
supplies exhibit a much higher output impedance to  
fast transient current spikes. In the VCL equation  
above, the VSUPPLY term, in reality, is given by (VDC  
IESD x ROUT), where VDC and ROUT are the nominal  
supply DC output voltage and effective output imped-  
Additional Information  
+
See also California Micro Devices Application Note  
AP209, “Design Considerations for ESD Protection.”  
L2  
POSITIVE SUPPLY RAIL  
VP  
PATH OF ESD CURRENT PULSE I  
ESD  
D1  
D2  
L1  
LINE BEING  
PROTECTED  
SYSTEM OR  
CIRCUITRY  
BEING  
ONE  
CHANNEL  
OF  
CHANNEL  
INPUT  
20A  
PROTECTED  
CM1208  
VCL  
0A  
GROUND RAIL  
VN  
CHASSIS GROUND  
Figure 1. Application of Positive ESD Pulse between Input Channel and Ground  
© 2004 California Micro Devices Corp. All rights reserved.  
02/02/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214  
L
Fax: 408.263.7846  
L
www.calmicro.com  
5
CM1208-07/08  
Mechanical Details  
MSOP Mechanical Specifications:  
Mechanical Package Diagrams  
CM1208-07/08 devices are packaged in 10-pin MSOP  
packages. Dimensions are presented below.  
TOP VIEW  
For complete information on the MSOP-10 package,  
see the California Micro Devices MSOP Package Infor-  
mation document.  
D
8
10  
9
7
6
PACKAGE DIMENSIONS  
Package  
Pins  
MSOP  
10  
E
H
Pin 1  
Marking  
Millimeters  
Inches  
Dimensions  
Min  
Max  
0.95  
0.15  
0.40  
Min  
Max  
0.038  
0.006  
0.016  
A
0.75  
0.05  
0.18  
0.028  
0.002  
0.006  
1
2
3
4
5
A1  
B
SIDE VIEW  
C
0.18  
0.007  
D
2.90  
2.90  
3.10  
3.10  
0.114  
0.114  
0.122  
0.122  
A
E
SEATING  
PLANE  
A1  
e
0.50 BSC  
0.0196 BSC  
B
e
H
L
4.76  
0.40  
5.00  
0.70  
0.187  
0.0137  
0.197  
0.029  
END VIEW  
# per tube  
80 pieces*  
4000  
# per tape  
and reel  
C
Controlling dimension: inches  
L
* This is an approximate number which may vary.  
Package Dimensions for MSOP-10  
© 2004 California Micro Devices Corp. All rights reserved.  
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112  
L
Tel: 408.263.3214  
L
Fax: 408.263.7846  
L
www.calmicro.com  
02/02/04  

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