TISP4600F3LMFRS [BOURNS]
HIGH VOLTAGE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS; 高压的双向晶闸管过电压保护
| 型号： | TISP4600F3LMFRS |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | HIGH VOLTAGE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| 文件： | 总11页 (文件大小：348K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TISP4600F3, TISP4700F3
HIGH VOLTAGE
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
TISP4600F3, TISP4700F3
Ion-Implanted Breakdown Region
Precise and Stable Voltage
LM Package (Top View)
Low Voltage Overshoot under Surge
T(A)
NC
R(B)
1
2
3
V
DRM
V
V
(BO)
V
Device
MD4XATA
‘4600
‘4700
420
500
600
700
NC - No internal connection on pin 2
Rated for International Surge Wave Shapes
LMF Package (LM Pkg. with Formed Leads) (Top View)
I
TSP
A
T(A)
Wave Shape
Standard
1
2
3
NC
2/10
8/20
GR-1089-CORE
IEC 61000-4-5
FCC Part 68
190
175
110
R(B)
MD4XAKC
10/160
NC - No internal connection on pin 2
Device Symbol
FCC Part 68
10/700
70
ITU-T K.20/21
10/560
FCC Part 68
50
45
T
10/1000
GR-1089-CORE
.......................................UL Recognized Component
Description
These devices are designed to limit overvoltages between a system
and the protective ground. The TISP4700F3 is designed for insulation
protection of systems such as LANs, and allows a float voltage of
500 V without clipping. IEC 60950 and UL 1950 have certain require-
ments for incoming lines of telephone network voltage (TNV). Any pro-
R
SD4XAA
Terminals T and R correspond to the
alternative line designators of A and B
tector from the line to ground must have a voltage rating of 1.6 times the equipment rated voltage. International and European equip-
ment usually have maximum rated voltages of 230 V rms, 240 V rms or 250 V rms. Multiplying the 250 V value by 1.6 gives a protector
VDRM value of 400 V. Allowing for operation down to 0 °C gives a VDRM value of 420 V at 25 °C. This need is met by the TISP4600F3.
The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping
until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state
causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents
d.c. latchup as the diverted current subsides. A single device provides 2-point protection. Combinations of devices can be used for multi-
point protection (e.g. 3-point protection between Ring, Tip and Ground).
The TISP4x00F3 is guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. This protection
device is in a DO-92 (LM) cylindrical plastic package.
How To Order
For Standard
For Lead Free
Termination Finish Termination Finish
Device
Package
Carrier
Order As
Order As
TISP4x00F3 LM, Straight Lead DO-92
TISP4x00F3 LM, Straight Lead DO-92
TISP4x00F3 LMF, Formed Lead DO-92
Bulk Pack
TISP4x00F3LM
TISP4x00F3LM-S
Tape And Reel
Tape And Reel
TISP4x00F3LMR TISP4x00F3LMR-S
TISP4x00F3LMFR TISP4x00F3LMFRS
Insert x = 6 for TISP4600F3 and x= 7 for TISP4700F3
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
Absolute Maximum Ratings, T = 25 °C (Unless Otherwise Noted)
A
Rating
Symbol
Value
Unit
TISP4600F3
TISP4700F3
± 420
± 500
Repetitive peak off-state voltage
V
V
DRM
Non-repetitive peak on-state pulse current (see Notes 1 and 2)
2/10 (Telcordia GR-1089-CORE, 2/10 voltage wave shape)
190
100
175
110
95
1/20 (ITU-T K.22, 1.2/50 voltage wave shape, 25
Ω resistor)
8/20 (IEC 61000-4-5, combination wave generator, 1.2/50 voltage wave shape)
10/160 (FCC Part 68, 10/160 voltage wave shape)
4/250 (ITU-T K.20/21, 10/700 voltage wave shape, simultaneous)
5/310 (ITU-T K.20/21, 10/700 voltage wave shape, single)
5/320 (FCC Part 68, 9/720 voltage wave shape, single)
10/560 (FCC Part 68, 10/560 voltage wave shape)
10/1000 (Telcordia GR-1089-CORE, 10/1000 voltage wave shape)
Non-repetitive peak on-state current (see Notes 1 and 2)
50/60 Hz, 1 s
I
A
PPSM
70
70
50
45
I
6
A
TSM
Initial rate of rise of on-state current, Linear current ramp, Maximum ramp value < 38 A
Junction temperature
di /dt
250
A/µs
°C
T
T
-40 to +150
-65 to +150
J
Storage temperature range
T
°C
stg
NOTES: 1. Initially, the TISP must be in thermal equilibrium with T = 25 °C.
J
2. These non-repetitive rated currents are peak values of either polarirty. The surge may be repeated after the TISP returns to its
initial conditions.
Recommended Operating Conditions
Component
Series resistor for GR-1089-CORE first-level surge survival
Series resistor for ITU-T recommendation K.20 and K.21
Series resistor for FCC Part 68 9/720 survival
Min
15
0
Typ
Max
Unit
R1, R2
Ω
0
Series resistor for FCC Part 68 10/160, 10/560 survival
10
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted)
A
Parameter
Test Conditions
Min
Typ
Max
Unit
Repetitive peak off-
state current
I
V
= ±V
DRM
±5
µA
DRM
D
TISP4600F3
TISP4700F3
±600
±700
V
Breakover voltage
dv/dt = ±700 V/ms,
dv/dt = ±700 V/ms,
R
R
= 300
= 300
Ω
Ω
V
(BO)
SOURCE
SOURCE
I
Breakover current
Holding current
±0.1
A
A
(BO)
I
I = ±5 A, di/dt = +/-30 mA/ms
±0.15
±5
H
T
Critical rate of rise of
off-state voltage
dv/dt
Linear voltage ramp, Maximum ramp value < 0.85V
kV/µs
µA
DRM
I
Off-state current
V
= ±50 V
±10
D
D
f = 100 kHz,
f = 100 kHz,
V
V
= 1 V rms, V = 0,
44
11
74
20
d
d
D
C
Off-state capacitance
pF
off
= 1 V rms,
= -50 V
V
D
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
Thermal Characteristics
Parameter
Test Conditions
EIA/JESD51-3 PCB, I = I
Min
Typ
Max
Unit
,
TSM(1000)
T
120
T = 25 °C, (see Note 3)
A
RθJA Junction to free air thermal resistance
°C/W
265 mm x 210 mm populated line card,
4-layer PCB, I = I ,T = 25 °C
57
T
TSM(1000)
A
NOTE 3: EIA/JESD51-2 environment and PCB has standardfootprint dimensions connected with 5 A rated printed wiring track widths.
Parameter Measurement Information
+i
Quadrant I
Switching
ITSP
Characteristic
ITSM
V
(BO)
I(BO)
IH
IDRM
ID
VDRM
VD
+v
-v
VDRM
ID
VD
IDRM
IH
I(BO)
V(BO)
ITSM
Quadrant III
I
ITSP
Switching
Characteristic
-i
PMXXAJA
Figure 1. Voltage-CurrentCharacteristic for R-T Terminal Pair
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
Typical Characteristics
OFF-STATE CURRENT
vs
NORMALIZED BREAKOVER VOLTAGE
vs
JUNCTION TEMPERATURE
TC3MAIA
JUNCTION TEMPERATURE
1.10
1.05
1.00
0.95
TC3LAF
100
10
1
VD = 50 V
0·1
VD = -50 V
0·01
-25
0
25
50
75
100
125
150
0·001
-25
0
25
50
75
100 125 150
T - Junction Temperature - °C
J
T - Junction Temperature - °C
J
Figure 3.
Figure 2.
HOLDING CURRENT
vs
JUNCTION TEMPERATURE
TC3LAHA
0.5
0.4
0.3
0.2
0.1
-25
0
25
50
75
100
125
150
T - Junction Temperature - °C
J
Figure 4.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
Thermal Information
NON-REPETITIVE PEAK ON-STATE CURRENT
vs
CURRENT DURATION
TI4FAB
15
VGEN = 1500 Vrms, 50/60 Hz
GEN = 1.4*VGEN/I
R
TSM(t)
10
9
8
7
6
EIA/JESD51-2 ENVIRONMENT
EIA/JESD51-3 PCB
TA = 25 °C
5
4
3
2
1.5
0·1
1
10
100
1000
t - Current Duration - s
Figure 5.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
APPLICATIONS INFORMATION
IEC 60950, EN 60950, UL 1950 and CSA 22.2 No.950
The ‘950 family of standards have certain requirements for equipment (EUT) with incoming lines of telecommunication network voltage (TNV).
Any protector from a TNV conductor to protective ground must have a voltage rating of at least 1.6 times the equipment rated supply voltage
(Figure 6). The intent is to prevent the possibility of the a.c. mains supply voltage from feeding into the telecommunication network and
creating a safety hazard. International and European equipment usually have maximum rated voltages of 230 V rms, 240 V rms or 250 V rms.
Multiplying the 250 V value by 1.6 gives a protector V
420 V at 25 °C. This need is met by the TISP4600F3.
value of 400 V. Allowing for operation down to 0 °C gives a V
requirement of
DRM
DRM
Overvoltage Protectors
bridging insulation
AC SUPPLY
Telecommunication
network connection
EUT
Insulation
Th1
Th2
Protective ground
connection
2 x TISP
4600F3
AI4XAI
Figure 6. ’950 TNV NetworkInsulation fromProtective Ground
LAN Insulation Protection
In Figure 7, a low-voltage protector, Th1, from the TISP40xxL1 series limits the inter-conductor voltage of the LAN and the high-voltage
protector, Th2, limits the insulation stress to 700 V. The four diode bridge, D1 through D4, reduces the capacitive loading of the protectors on
the LAN and means that only one TISP4700F3 is needed to be used for insulation protection of both LAN conductors. Low voltage diodes can
be used as the maximum reverse voltage stress is limited to the V
voltage.
value of the TISP40xxL1 protector plus the diode forward recovery
(BO)
D3
D4
D1
TISP
40xxL1
Th1
D2
Th2
TISP
4700F3
LAN
CONDUCTORS
AI4XAJ
Figure 7. LAN Protection
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
Device Symbolization Code
Devices will be coded as follows:
Symbolization
Device
Code
TISP4600F3
TISP4700F3
4600F3
4700F3
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
LM002 (DO-92) 2-Pin Cylindrical Plastic Package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
LM002 Package (DO-92)
4.44 - 5.21
(.175 - .205)
3.17 - 4.19
(.125 - .165)
3.43
MIN.
(.135)
2.03 - 2.67
(.080 - .105)
2.03 - 2.67
(.080 - .105)
4.32 - 5.34
(.170 - .210)
2.20
(.086)
MAX.
A
2
2
12.7
(0.5)
MIN.
0.40 - 0.56
(.016 - .022)
1
3
3
1
VIEW A
0.35 - 0.41
(.014 - .016)
1.14 - 1.40
(.045 - .055)
2.41 - 2.67
(.095 - .105)
MILLIMETERS
(INCHES)
DIMENSIONS ARE:
MD4XARA
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
LM002 (DO-92) - Formed Leads Version - 2-Pin Cylindrical Plastic Package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
LMF002 (DO-92
)
- Formed Leads Version of LM002
4.44 - 5.21
(.175 - .205)
3.17 - 4.19
(.125 - .165)
3.43
MIN.
(.135)
2.03 - 2.67
2.03 - 2.67
(.080 - .105)
(.080 - .105)
4.32 - 5.34
(.170 - .210)
2.20
MAX.
4.00
MAX.
(.086)
(.157)
A
2
2
0.40 - 0.56
(.016 - .022)
1
3
3
1
VIEW A
2.40 - 2.90
0.35 - 0.41
(.014 - .016)
(.094 - .114)
2.40 - 2.90
(.094 - .114)
MILLIMETERS
(INCHES)
DIMENSIONS ARE:
MD4XASA
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
LM Tape Dimensions
LM002 Package (Straight Lead DO-92) Tape
LM002 Tape Dimensions Conform to
the Requirements ofEIA-468-B
11.70 - 13.70
(.461 - .539)
Body Indent Visible
2.50
(.098)
0.00 - 0.50
(.000 - .020)
23.00 - 32.00
(.906 - 1.260)
MIN.
17.66 - 27.68
(.695 - 1.090)
8.50 - 11.00
(.335 - .433)
8.50 - 9.75
(.335 - .384)
5.50 - 19.00
(.217 - .748)
17.50 - 19.00
(.689 - .748)
2.14 - 3.14
(.084 - .124)
3.70 - 4.30
(.146 - .169)
Adhesive Tape on Reverse
Side - Shown Dashed
VIEW A
4.68 - 5.48
(.184 - .216)
12.40 - 13.00
(.488 - .512)
Tape Section
Shown in
View A
Flat of DO-92 Body
Towards Reel Axis
Direction of Feed
MILLIMETERS
(INCHES)
DIMENSIONS ARE:
MD4XAPD
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4600F3, TISP4700F3
MECHANICAL DATA
LMF Tape Dimensions
LMF002 Package (Formed Lead DO-92) Tape
LMF002 Tape Dimensions Confor
mto
the Requirements of EIA-468-B
11.70 - 13.70
(.461 - .539)
Body Indent Visible
2.50
(.098)
0.00 - 0.50
(0.00 - .020)
23.00 - 32.00
(.906 - 1.260)
MIN.
17.66 - 27.68
(.695 -1.090)
15.50 - 16.53
(.610 - .650)
8.50 - 11.00
(.335 - .433)
8.50 - 9.75
(.335 - .384)
5.50 - 19.00
(.217 - .748)
17.50 - 19.00
(.689 - .748)
4.88 - 5.28
(.192 - .208)
3.70 - 4.30
(.146 - .169)
DIA.
Adhesive Tape on Reverse
Side - Shown Dashed
VIEW A
3.41 - 4.21
(.134 - .166)
12.40 - 13.00
(.488 - .512)
Tape Section
Shown in
View A
Flat of DO-92 Body
TowardsReel Axis
Direction of Feed
MILLIMETERS
(INCHES)
DIMENSIONS ARE:
MD4XAQC
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
相关型号：
TISP4A265H3BJR-S
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BOURNS
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