TISP4115H3BJR-STISP4115H3BJR-S [BOURNS]

Silicon Surge Protector, 115V V(BO) Max, 60A, DO-214AA, ROHS COMPLIANT, PLASTIC, SMB, 2 PIN;
TISP4115H3BJR-STISP4115H3BJR-S
型号: TISP4115H3BJR-STISP4115H3BJR-S
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

Silicon Surge Protector, 115V V(BO) Max, 60A, DO-214AA, ROHS COMPLIANT, PLASTIC, SMB, 2 PIN

光电二极管
文件: 总13页 (文件大小:386K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TISP4070H3BJ THRU TISP4115H3BJ,  
TISP4125H3BJ THRU TISP4220H3BJ,  
TISP4240H3BJ THRU TISP4400H3BJ  
T
N
A
I
L
P
M
O
C
S
H
o
R
*
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS  
TISP4xxxH3BJ Overvoltage Protector Series  
TISP4xxxH3BJ Overview  
®
This TISP device series protects central office, access and customer premise equipment against overvoltages on the telecom line. The  
TISP4xxxH3BJ is available in a wide range of voltages and has a high current capability, allowing minimal series resistance to be used. These  
protectors have been specified mindful of the following standards and recommendations: GR-1089-CORE, FCC Part 68, UL1950, EN 60950,  
IEC 60950, ITU-T K.20, K.21 and K.45. The TISP4350H3BJ meets the FCC Part 68 “B” ringer voltage requirement and survives the Type A and  
B impulse tests. These devices are housed in a surface mount SMB (DO-214AA) package.  
Summary Electrical Characteristics  
V
V
V @ I  
T
I
I
I
I
H
C @ -2 V  
o
Functionally  
Replaces  
DRM  
V
(BO)  
V
T
DRM  
µA  
(BO)  
T
Part #  
V
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
mA  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
A
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
mA  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
pF  
120  
120  
120  
120  
65  
TISP4070H3  
TISP4080H3  
TISP4095H3  
TISP4115H3  
TISP4125H3  
TISP4145H3  
TISP4165H3  
TISP4180H3  
TISP4200H3  
TISP4220H3  
TISP4240H3  
TISP4250H3  
TISP4265H3  
TISP4290H3  
TISP4300H3  
TISP4350H3  
TISP4395H3  
TISP4400H3  
58  
65  
75  
90  
70  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
P0640SC†  
P0720SC†  
P0900SC†  
P1100SC†  
80  
95  
115  
125  
145  
165  
180  
200  
220  
240  
250  
265  
290  
300  
350  
395  
400  
100  
120  
135  
145  
155  
160  
180  
190  
200  
220  
230  
275  
320  
300  
65  
P1300SC†  
P1500SC  
P1800SC  
P2300SC†  
P2600SC†  
65  
65  
65  
65  
55  
55  
55  
55  
55  
55  
P3100SC  
P3500SC  
55  
55  
† Bourns part has an improved protection voltage  
Summary Current Ratings  
I
I
di/dt  
A/µs  
TSP  
A
TSM  
A
Parameter  
Waveshape  
Value  
2/10  
500  
1.2/50, 8/20  
300  
10/160  
250  
5/320  
200  
10/560  
160  
10/1000  
100  
1 cycle 60 Hz 2/10 Wavefront  
60 400  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
ITU-T K.20/21 Rating . . . . . . . . . . . . . 8 kV 10/700, 200 A 5/310  
SMBJ Package (Top View)  
Ion-Implanted Breakdown Region  
Precise and Stable Voltage  
Low Voltage Overshoot under Surge  
1
2
T(A)  
R(B)  
V
V
DRM  
V
(BO)  
V
Device  
MDXXBG  
‘4070  
‘4080  
‘4095  
‘4115  
‘4125  
‘4145  
‘4165  
‘4180  
‘4200  
‘4220  
‘4240  
‘4250  
‘4265  
‘4290  
‘4300  
‘4350  
‘4395  
‘4400  
58  
65  
75  
90  
70  
80  
Device Symbol  
95  
115  
125  
145  
165  
180  
200  
220  
240  
250  
265  
290  
300  
350  
395  
400  
T
100  
120  
135  
145  
155  
160  
180  
190  
200  
220  
230  
275  
320  
300  
SD4XAA  
R
Terminals T and R correspond to the  
alternative line designators of A and B  
Rated for International Surge Wave Shapes  
I
TSP  
Waveshape  
Standard  
A
2/10 µs  
8/20 µs  
GR-1089-CORE  
IEC 61000-4-5  
FCC Part 68  
500  
300  
250  
200  
160  
100  
10/160 µs  
10/700 µs  
10/560 µs  
10/1000 µs  
Low Differential Capacitance ...................................67 pF max.  
............................................... UL Recognized Component  
ITU-T K.20/21  
FCC Part 68  
GR-1089-CORE  
Description  
These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by a.c. power system or lightning  
flash disturbances which are induced or conducted on to the telephone line. A single device provides 2-point protection and is typically used  
for the protection of 2-wire telecommunication equipment (e.g. between the Ring and Tip wires for telephones and modems). Combinations of  
devices can be used for multi-point protection (e.g. 3-point protection between Ring, Tip and Ground).  
The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until  
the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the  
current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current helps prevent d.c. latchup as  
the diverted current subsides.  
This TISP4xxxH3BJ range consists of eighteen voltage variants to meet various maximum system voltage levels (58 V to 320 V). They are  
guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. These high (H) current protection devices  
are in a plastic package SMBJ (JEDEC DO-214AA with J-bend leads) and supplied in embossed carrier reel pack. For alternative voltage and  
holding current values, consult the factory. For lower rated impulse currents in the SMB package, the 50 A 10/1000 TISP4xxxM3BJ series is  
available.  
How To Order  
Device  
Package  
Carrier  
Embossed Tape Reeled  
Bulk Pack  
Order As  
TISP4xxxH3BJR-S  
TISP4xxxH3BJ-S  
TISP4xxxH3BJ BJ (J-Bend DO-214AA/SMB)  
Insert xxx value corresponding to protection voltages of 070, 080, 095, 115 etc.  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
Absolute Maximum Ratings, T = 25 °C (Unless Otherwise Noted)  
A
Rating  
Symbol  
Value  
± 58  
Unit  
‘4070  
‘4080  
‘4095  
‘4115  
‘4125  
‘4145  
‘4165  
‘4180  
‘4200  
‘4220  
‘4240  
‘4250  
‘4265  
‘4290  
‘4300  
‘4350  
‘4395  
‘4400  
± 65  
± 75  
± 90  
±100  
±120  
±135  
±145  
±155  
±160  
±180  
±190  
±200  
±220  
±230  
±275  
±320  
±300  
Repetitive peak off-state voltage, (see Note 1)  
V
V
DRM  
Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4)  
2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape)  
500  
300  
250  
220  
200  
200  
200  
160  
100  
8/20 µs (IEC 61000-4-5, 1.2/50 µs voltage, 8/20 current combination wave generator)  
10/160 µs (FCC Part 68, 10/160 µs voltage wave shape)  
5/200 µs (VDE 0433, 10/700 µs voltage wave shape)  
0.2/310 µs (I3124, 0.5/700 µs voltage wave shape)  
5/310 µs (ITU-T K.20/21, 10/700 µs voltage wave shape)  
5/310 µs (FTZ R12, 10/700 µs voltage wave shape)  
10/560 µs (FCC Part 68, 10/560 µs voltage wave shape)  
10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape)  
Non-repetitive peak on-state current (see Notes 2, 3 and 5)  
20 ms (50 Hz) full sine wave  
I
A
TSP  
55  
60  
I
A
16.7 ms (60 Hz) full sine wave  
TSM  
2.1  
1000 s 50 Hz/60 Hz a.c.  
Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 200 A  
Junction temperature  
di /dt  
400  
A/µs  
°C  
T
T
-40 to +150  
-65 to +150  
J
Storage temperature range  
T
°C  
stg  
NOTES: 1. See Applications Information and Figure 10 for voltage values at lower temperatures.  
2. Initially, the TISP4xxxH3BJ must be in thermal equilibrium with T = 25 °C.  
J
3. The surge may be repeated after the TISP4xxxH3BJ returns to its initial conditions.  
4. See Applications Information and Figure 11 for current ratings at other temperatures.  
5. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring  
track widths. See Figure 8 for the current ratings at other durations. Derate current values at -0.61 %/°C for ambient  
temperatures above 25 °C.  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted)  
A
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
±5  
±10  
Unit  
Repetitive peak off-  
state current  
T = 25 °C  
A
I
V
= V  
DRM  
µA  
DRM  
D
T = 85 °C  
A
‘4070  
‘4080  
‘4095  
‘4115  
‘4125  
‘4145  
‘4165  
‘4180  
‘4200  
‘4220  
‘4240  
‘4250  
‘4265  
‘4290  
‘4300  
‘4350  
‘4395  
‘4400  
‘4070  
‘4080  
‘4095  
‘4115  
‘4125  
‘4145  
‘4165  
‘4180  
‘4200  
‘4220  
‘4240  
‘4250  
‘4265  
‘4290  
‘4300  
‘4350  
‘4395  
‘4400  
±70  
±80  
±95  
±115  
±125  
±145  
±165  
±180  
±200  
±220  
±240  
±250  
±265  
±290  
±300  
±350  
±395  
±400  
±78  
V
Breakover voltage  
dv/dt = ±750 V/ms,  
R
= 300  
V
(BO)  
SOURCE  
±88  
±103  
±124  
±134  
±154  
±174  
±189  
±210  
±230  
±250  
±261  
±276  
±301  
±311  
±362  
±408  
±413  
±0.6  
±3  
dv/dt ±1000 V/µs, Linear voltage ramp,  
Maximum ramp value = ±500 V  
di/dt = ±20 A/µs, Linear current ramp,  
Maximum ramp value = ±10 A  
Impulse breakover  
voltage  
V
V
(BO)  
I
Breakover current  
On-state voltage  
Holding current  
dv/dt = ±750 V/ms,  
R
= 300  
±0.15  
A
V
A
(BO)  
SOURCE  
V
I = ±5 A, t = 100 µs  
T
T
W
I
I = ±5 A, di/dt = - /+30 mA/ms  
±0.15  
±5  
±0.6  
H
T
Critical rate of rise of  
off-state voltage  
Off-state current  
dv/dt  
Linear voltage ramp, Maximum ramp value < 0.85V  
kV/µs  
µA  
DRM  
I
V
= ±50 V  
T = 85 °C  
±10  
D
D
A
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted) (continued)  
A
Parameter  
Test Conditions  
f = 100 kHz, V = 1 V rms, V = 0,  
Min.  
Typ.  
145  
80  
70  
130  
71  
60  
120  
65  
55  
62  
Max.  
170  
90  
84  
150  
79  
67  
140  
74  
62  
73  
Unit  
‘4070 thru ‘4115  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
‘4070 thru ‘4115  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
‘4070 thru ‘4115  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
‘4070 thru ‘4115  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
d
D
f = 100 kHz, V = 1 V rms, V = -1 V  
d
D
f = 100 kHz, V = 1 V rms, V = -2 V  
d
D
C
Off-state capacitance  
pF  
off  
f = 100 kHz, V = 1 V rms, V = -50 V  
d
D
30  
24  
28  
22  
35  
28  
33  
26  
f = 100 kHz, V = 1 V rms, V = -100 V  
d
D
(see Note 6)  
NOTE 6: To avoid possible voltage clipping, the ‘4125 is tested with V = -98 V.  
D
Thermal Characteristics  
Parameter  
Test Conditions  
EIA/JESD51-3 PCB, I = I  
Min.  
Typ.  
Max.  
Unit  
,
TSM(1000)  
T
113  
T = 25 °C, (see Note 7)  
A
R
Junction to free air thermal resistance  
°C/W  
θJA  
265 mm x 210 mm populated line card,  
4-layer PCB, I = I , T = 25 °C  
50  
T
TSM(1000)  
A
NOTE 7: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
Parameter Measurement Information  
+i  
Quadrant I  
Switching  
ITSP  
Characteristic  
ITSM  
IT  
V(BO)  
VT  
I(BO)  
IH  
IDRM  
ID  
VDRM  
VD  
+v  
-v  
ID  
VD  
VDRM  
IDRM  
IH  
I(BO)  
VT  
V(BO)  
IT  
ITSM  
Quadrant III  
ITSP  
Switching  
Characteristic  
-i  
PMXXAAB  
Figure 1. Voltage-current Characteristic for T and R Terminals  
All Measurements are Referenced to the R Terminal  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
Typical Characteristics  
NORMALIZED BREAKOVER VOLTAGE  
vs  
OFF-STATE CURRENT  
vs  
JUNCTION TEMPERATURE  
JUNCTION TEMPERATURE  
TC4HAF  
TCHAG  
1.10  
100  
VD = ±50 V  
10  
1.05  
1
0·1  
1.00  
0·01  
0.95  
0·001  
-25  
0
25  
50  
75  
100 125 150  
-25  
0
25  
50  
75  
100 125 150  
TJ - Junction Temperature - °C  
TJ - Junction Temperature - °C  
Figure 2.  
Figure 3.  
NORMALIZED HOLDING CURRENT  
vs  
ON-STATE CURRENT  
vs  
ON-STATE VOLTAGE  
JUNCTION TEMPERATURE  
TC4HAD  
TC4HACB  
2.0  
1.5  
200  
150  
TA = 25 °C  
tW = 100 µs  
100  
70  
50  
40  
30  
1.0  
0.9  
20  
15  
0.8  
0.7  
'4125  
THRU  
'4220  
10  
7
5
4
3
0.6  
0.5  
'4070  
THRU  
'4115  
'4240  
THRU  
'4400  
2
1.5  
0.4  
1
-25  
0
25  
50  
75  
100 125 150  
0.7  
1
1.5  
2
3
4
5
7
10  
TJ - Junction Temperature - °C  
VT - On-State Voltage - V  
Figure 4.  
Figure 5.  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
Typical Characteristics  
DIFFERENTIAL OFF-STATE CAPACITANCE  
vs  
NORMALIZED CAPACITANCE  
vs  
RATED REPETITIVE PEAK OFF-STATE VOLTAGE  
OFF-STATE VOLTAGE  
TCHAEB  
TC4HABB  
75  
70  
65  
60  
55  
50  
45  
40  
35  
30  
1
0.9  
TJ = 25 °C  
0.8  
0.7  
Vd = 1 Vrms  
0.6  
0.5  
C =Coff(-2 V) - Coff(-50 V)  
'4070 THRU '4115  
0.4  
0.3  
'4125 THRU '4220  
'4240 THRU '4400  
0.2  
0.5  
1
2
3
5
10  
20 30 50  
100150  
50 60 70 80 90100  
150  
200 250 300  
VD - Off-state Voltage - V  
VDRM - Repetitive Peak Off-State Voltage - V  
Figure 6.  
Figure 7.  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
Rating and Thermal Information  
THERMAL IMPEDANCE  
vs  
NON-REPETITIVE PEAK ON-STATE CURRENT  
vs  
POWER DURATION  
CURRENT DURATION  
TI4HAC  
TI4HAE  
30  
150  
VGEN = 600 Vrms, 50/60 Hz  
100  
70  
RGEN = 1.4*VGEN/ITSM(t)  
20  
15  
EIA/JESD51-2 ENVIRONMENT  
EIA/JESD51-3 PCB  
TA = 25 °C  
50  
40  
30  
10  
9
20  
15  
8
7
6
10  
7
5
4
5
4
ITSM(t) APPLIED FOR TIME t  
3
3
EIA/JESD51-2 ENVIRONMENT  
EIA/JESD51-3 PCB  
TA = 25 °C  
2
2
1.5  
1.5  
0·1  
1
0·1  
1
10  
100  
1000  
1
10  
100  
1000  
t - Current Duration - s  
t - Power Duration - s  
Figure 8.  
Figure 9.  
V
DERATING FACTOR  
DRM  
IMPULSE RATING  
vs  
vs  
MINIMUM AMBIENT TEMPERATURETI4HADB  
AMBIENT TEMPERATURE  
TC4HAA  
700  
1.00  
0.99  
0.98  
0.97  
0.96  
0.95  
0.94  
0.93  
600  
500  
BELLCORE 2/10  
400  
IEC 1.2/50, 8/20  
300  
250  
FCC 10/160  
ITU-T 10/700  
FCC 10/560  
'4070 THRU '4115  
200  
150  
120  
'4125 THRU '4220  
BELLCORE 10/1000  
100  
90  
'4240 THRU '4440  
-40 -35 -30 -25 -20 -15 -10 -5  
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80  
0
5
10 15 20 25  
TA - Ambient Temperature - °C  
TAMIN - Minimum Ambient Temperature - °C  
Figure 10.  
Figure 11.  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
APPLICATIONS INFORMATION  
Deployment  
These devices are two terminal overvoltage protectors. They may be used either singly to limit the voltage between two conductors (Figure 12)  
or in multiples to limit the voltage at several points in a circuit (Figure 13).  
Th3  
Th1  
Th1  
Th2  
Figure 12. Two Point Protection  
Figure 13. Multi-point Protection  
In Figure 12, protector Th1 limits the maximum voltage between the two conductors to ±V  
circuits without a ground reference, such as modems. In Figure 13, protectors Th2 and Th3 limit the maximum voltage between each conduc-  
. This configuration is normally used to protect  
(BO)  
tor and ground to the ±V  
of the individual protector. Protector Th1 limits the maximum voltage between the two conductors to its ±V  
(BO)  
(BO)  
value. If the equipment being protected has all its vulnerable components connected between the conductors and ground, then protector Th1  
is not required.  
Impulse Testing  
To verify the withstand capability and safety of the equipment, standards require that the equipment is tested with various impulse wave forms.  
The table below shows some common values.  
Voltage  
Peak Voltage  
Peak Current  
Current  
Waveform  
µs  
TISP4xxxH3  
25 °C Rating  
A
Series  
Resistance  
Standard  
Setting  
V
Value  
A
Waveform  
µs  
2500  
1000  
1500  
800  
2/10  
500  
100  
200  
100  
37.5  
25  
2/10  
500  
100  
250  
160  
200  
200  
200  
GR-1089-CORE  
0
10/1000  
10/160  
10/560  
9/720 †  
9/720 †  
0.5/700  
10/1000  
10/160  
10/560  
5/320 †  
5/320 †  
0.2/310  
0
0
0
0
0
FCC Part 68  
(March 1998)  
1500  
1000  
1500  
1500  
4000  
I3124  
37.5  
37.5  
100  
ITU-T K.20/K.21  
10/700  
5/310  
200  
0
† FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K.21 10/700 impulse generator  
If the impulse generator current exceeds the protector’s current rating, then a series resistance can be used to reduce the current to the  
protector’s rated value to prevent possible failure. The required value of series resistance for a given waveform is given by the following  
calculations. First, the minimum total circuit impedance is found by dividing the impulse generator’s peak voltage by the protector’s rated  
current. The impulse generator’s fictive impedance (generators peak voltage divided by peak short circuit current) is then subtracted from the  
minimum total circuit impedance to give the required value of series resistance. In some cases, the equipment will require verification over a  
temperature range. By using the rated waveform values from Figure 11, the appropriate series resistor value can be calculated for ambient  
temperatures in the range of -40 °C to 85 °C.  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
APPLICATIONS INFORMATION  
AC Power Testing  
The protector can withstand currents applied for times not exceeding those shown in Figure 8. Currents that exceed these times must be  
terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) resistors and fusible resistors are overcurrent  
protection devices which can be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to one ampere.  
In some cases, it may be necessary to add some extra series resistance to prevent the fuse opening during impulse testing. The current versus  
time characteristic of the overcurrent protector must be below the line shown in Figure 8. In some cases, there may be a further time limit  
imposed by the test standard (e.g. UL 1459 wiring simulator failure).  
Capacitance  
The protector characteristic off-state capacitance values are given for d.c. bias voltage, V , values of 0, -1 V, -2 V and -50 V. Where possible,  
D
values are also given for -100 V. Values for other voltages may be calculated by multiplying the V = 0 capacitance value by the factor given in  
D
Figure 6. Up to 10 MHz, the capacitance is essentially independent of frequency. Above 10 MHz, the effective capacitance is strongly  
dependent on connection inductance. In many applications, such as Figure 15 and Figure 17, the typical conductor bias voltages will be about  
-2 V and -50 V. Figure 7 shows the differential (line unbalance) capacitance caused by biasing one protector at -2 V and the other at -50 V.  
Normal System Voltage Levels  
The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as ringing without the  
line connected, some degree of clipping is permissible. Under this condition, about 10 V of clipping is normally possible without activating the  
ring trip circuit.  
Figure 10 allows the calculation of the protector V  
maximum normal system voltages. The TISP4265H3BJ, with a V  
DRM  
100 V r.m.s. of ring on a battery voltage of -58 V (Th2 and Th3 in Figure 17). The peak ring voltage will be 58 + 1.414*100 = 199.4 V. However,  
this is the open circuit voltage and the connection of the line, and its equipment will reduce the peak voltage. In the extreme case of an  
unconnected line, clipping the peak voltage to 190 V should not activate the ring trip. This level of clipping would occur at the temperature  
value at temperatures below 25 °C. The calculated value should not be less than the  
of 200 V, can be used for the protection of ring generators producing  
DRM  
when the V  
has reduced to 190/200 = 0.95 of its 25 °C value. Figure 10 shows that this condition will occur at an ambient temperature of  
DRM  
-22 °C. In this example, the TISP4265H3BJ will allow normal equipment operation provided that the minimum expected ambient temperature  
does not fall below -22 °C.  
JESD51 Thermal Measurement Method  
To standardize thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard  
3
3
(JESD51-2, 1995) describes the test environment. This is a 0.0283 m (1 ft ) cube which contains the test PCB (Printed Circuit Board)  
horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for  
packages smaller than 27 mm (1.06 ’’) on a side and the other for packages up to 48 mm (1.89 ’’). The SMBJ measurements used the smaller  
76.2 mm x 114.3 mm (3.0 ’’ x 4.5 ’’) PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high thermal resis-  
tance) and represent a worse case condition. The PCBs used in the majority of applications will achieve lower values of thermal resistance and  
so can dissipate higher power levels than indicated by the JESD51 values.  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
Typical Circuits  
MODEM  
TIP  
RING  
WIRE  
FUSE  
R1a  
RING DETECTOR  
HOOK SWITCH  
D.C. SINK  
Th3  
Th2  
PROTECTED  
EQUIPMENT  
Th1  
E.G. LINE CARD  
TISP4350  
SIGNAL  
R1b  
RING  
WIRE  
AI6XBK  
TIP  
AI6XBMA  
Figure 14. Modem Inter-wire Protection  
R1a  
Figure 15. Protection Module  
Th3  
Th2  
SIGNAL  
Th1  
R1b  
AI6XBL  
D.C.  
Figure 16. ISDN Protection  
OVER-  
CURRENT  
PROTECTION  
SLIC  
PROTECTION  
RING/TEST  
PROTECTION  
TEST  
RELAY  
RING  
RELAY  
SLIC  
RELAY  
TIP  
WIRE  
S3a  
R1a  
Th4  
Th5  
Th3  
S1a  
S2a  
SLIC  
Th1  
Th2  
R1b  
RING  
WIRE  
S3b  
TISP6xxxx,  
TISPPBLx,  
1/2TISP6NTP2  
S1b  
S2b  
VBAT  
C1  
220 nF  
TEST  
EQUIP-  
MENT  
RING  
GENERATOR  
AI6XBJ  
Figure 17. Line Card Ring/Test Protection  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxH3BJ Overvoltage Protector Series  
MECHANICAL DATA  
Recommended Printed Wiring Footprint  
SMB Pad Size  
2.54  
(0.10)  
METRIC  
(INCHES)  
2.40  
(0.09)  
DIMENSIONS ARE:  
2.16  
(0.09)  
MDXXBI  
Device Symbolization Code  
Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified.  
Symbolization  
Device  
Code  
TISP4070H3BJ  
TISP4080H3BJ  
TISP4095H3BJ  
TISP4115H3BJ  
TISP4125H3BJ  
TISP4145H3BJ  
TISP4165H3BJ  
TISP4180H3BJ  
TISP4200H3BJ  
TISP4220H3BJ  
TISP4240H3BJ  
TISP4250H3BJ  
TISP4265H3BJ  
TISP4290H3BJ  
TISP4300H3BJ  
TISP4350H3BJ  
TISP4395H3BJ  
TISP4400H3BJ  
4070H3  
4080H3  
4095H3  
4115H3  
4125H3  
4145H3  
4165H3  
4180H3  
4200H3  
4220H3  
4240H3  
4250H3  
4265H3  
4290H3  
4300H3  
4350H3  
4395H3  
4400H3  
Carrier Information  
Devices are shipped in one of the carriers below. Unless a specific method of shipment is specified by the customer, devices will be shipped in  
the most practical carrier. For production quantities, the carrier will be embossed tape reel pack. Evaluation quantities may be shipped in bulk  
pack or embossed tape.  
Carrier  
Embossed Tape Reeled  
Bulk Pack  
Order As  
TISP4xxxH3BJR-S  
TISP4xxxH3BJ-S  
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.  
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.  
NOVEMBER 1997 - REVISED JANUARY 2007  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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