ACPL-563XL [AVAGO]

Low power consumption;
ACPL-563XL
型号: ACPL-563XL
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

Low power consumption

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ACPL-267XL, ACPL-268KL, ACPL-560XL,  
ACPL-563XL, 5962-08242*  
Hermetically Sealed, 3.3V High Speed, High CMR,  
Logic Gate Optocouplers  
Data Sheet  
*See Selection Guide for full matrix of part numbers.  
Description  
Features  
These units are single and dual channel, hermetically Low power consumption  
sealed optocouplers. The products are capable of opera-  
tion and storage over the full military temperature range  
and can be purchased as either standard commercial  
product or with full MIL-PRF-38534 Class Level H or K  
3.3V supply voltages  
Dual marked with device part number and DLA draw-  
ing number  
testing or from DLA Drawing 5962-08242. All devices are Manufactured and tested on a MIL-PRF-38534  
manufactured and tested on a MIL-PRF-38534 certified  
line and are included in the DLA Qualified Manufacturers  
List QML-38534 for Hybrid Microcircuits.  
Certified Line  
QML-38534, Class H and K  
Three hermetically sealed package configurations  
Truth Table (Positive Logic)  
Multichannel Devices  
Performance guaranteed over full military  
temperature range: -55°C to +125°C  
Input  
On (H)  
Off (L)  
Output  
High speed: 10 Mbd typical  
L
CMR: > 10,000 V/μs typical  
H
1500 Vdc withstand test voltage  
TTL circuit compatibility  
Single Channel DIP  
HCPL-260L/060L/263L/063L function compatibility  
Input  
On (H)  
Off (L)  
On (H)  
Off (L)  
Enable  
Output  
H
H
L
L
Applications  
H
H
H
Military and aerospace  
High reliability systems  
Transportation, medical, and life critical systems  
Line receiver  
L
Functional Diagram  
Multiple channel devices available  
Voltage level shifting  
Isolated input line receiver  
Isolated output line driver  
Logic ground isolation  
Harsh industrial environments  
V
CC  
V
E
V
OUT  
Isolation for computer, communication, and test  
equipment systems  
GND  
The connection of a 0.1 μF bypass capacitor between VCC and GND is recommended.  
CAUTION: It is advised that normal static precautions be taken in handling and assembly  
of this component to prevent damage and/or degradation which may be induced by ESD.  
Each channel contains a GaAsP light emitting diode Because the same electrical die (emitters and detectors)  
which is optically coupled to an integrated high speed are used for each channel of each device listed in this  
photon detector. The output of the detector is an open data sheet, absolute maximum ratings, recommended  
collector Schottky clamped transistor. Internal shields operating conditions, electrical specifications, and per-  
provide a guaranteed common mode transient immu- formance characteristics shown in the figures are iden-  
nity specification of 1000 V/μs. Package styles for these tical for all parts. Occasional exceptions exist due to  
parts are 8 and 16 pin DIP through hole (case outlines  
P and E respectively). Devices may be purchased with a  
package variations and limitations, and are as noted.  
Additionally, the same package assembly processes and  
variety of lead bend and plating options. See Selection materials are used in all devices.  
Guide Table for details. Standard Microcircuit Drawing  
(SMD) parts are available for each package and lead  
style.  
Selection Guide – Package Styles and Lead Configuration Options  
Package  
16 Pin DIP  
Through Hole  
2
8 Pin DIP  
Through Hole  
1
8 Pin DIP  
Through Hole  
2
Lead Style  
Channels  
Common Channel Wiring  
Withstand Test Voltage  
Avago Part # & Options  
Standard Commercial  
MIL-PRF-38534, Class H  
MIL-PRF-38534, Class K  
Standard Lead Finish  
Solder Dipped*  
VCC, GND  
1500 Vdc  
None  
VCC, GND  
1500 Vdc  
1500 Vdc  
ACPL-2670L  
ACPL-2672L  
ACPL-268KL  
Gold Plate  
ACPL-5600L  
ACPL-5601L  
ACPL-560KL  
Gold Plate  
ACPL-5630L  
ACPL-5631L  
ACPL-563KL  
Gold Plate  
Option -200  
Option -100  
Option -300  
Option -200  
Option -100  
Option -300  
Option -200  
Option -100  
Option -300  
Butt Cut/Gold Plate  
Gull Wing/Soldered*  
Class H SMD Part #  
Prescript for all below  
Gold Plate  
5962-  
5962-  
5962-  
0824203HEC  
0824203HEA  
0824203HUC  
0824203HUA  
0824203HTA  
0824201HPC  
0824201HPA  
0824201HYC  
0824201HYA  
0824201HXA  
0824202HPC  
0824202HPA  
0824202HYC  
0824202HYA  
0824202HXA  
Solder Dipped*  
Butt Cut/Gold Plate  
Butt Cut/Soldered*  
Gull Wing/Soldered*  
Class K SMD Part #  
Prescript for all below  
Gold Plate  
5962-  
5962-  
5962-  
0824203KEC  
0824203KEA  
0824203KUC  
0824203KUA  
0824203KTA  
0824201KPC  
0824201KPA  
0824201KYC  
0824201KYA  
0824201KXA  
0824202KPC  
0824202KPA  
0824202KYC  
0824202KYA  
0824202KXA  
Solder Dipped*  
Butt Cut/Gold Plate  
Butt Cut/Soldered*  
Gull Wing/Soldered*  
* Solder contains lead.  
2
Functional Diagrams  
16 Pin DIP  
8 Pin DIP  
8 Pin DIP  
Through Hole  
2 Channels  
Through Hole  
1 Channel  
Through Hole  
2 Channels  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
V
1
2
8
7
6
5
1
V
8
CC  
CC  
V
CC  
V
V
O1  
O2  
V
V
E
O1  
2
3
4
7
6
5
V
OUT  
3
4
V
O2  
GND  
GND  
GND  
Note: Dual channel devices have common VCC and ground. Single channel DIP has an  
enable pin 7. All diagrams are “top view.”  
Outline Drawings  
16 Pin DIP Through Hole, 2 Channels  
20.06 (0.790)  
20.83 (0.820)  
8.13 (0.320)  
MAX.  
0.89 (0.035)  
1.65 (0.065)  
4.45 (0.175)  
MAX.  
0.51 (0.020)  
MIN.  
3.81 (0.150)  
MIN.  
0.20 (0.008)  
0.33 (0.013)  
7.36 (0.290)  
7.87 (0.310)  
2.29 (0.090)  
2.79 (0.110)  
0.51 (0.020)  
MAX.  
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).  
8 Pin DIP Through Hole, 1 and 2 Channels  
Device Marking  
9.40 (0.370)  
8.13 (0.320)  
MAX.  
Avago LOGO  
Avago P/N  
DLA SMD [1]  
DLA SMD [1]  
PIN ONE/  
A QYYWWZ  
XXXXXX  
XXXXXXX  
XXX XXX  
* 50434  
COMPLIANCE INDICATOR, [1]  
9.91 (0.390)  
DATE CODE, SUFFIX (IF NEEDED)  
0.76 (0.030)  
1.27 (0.050)  
7.16 (0.282)  
7.57 (0.298)  
COUNTRY OF MFR.  
Avago CAGE CODE [1]  
4.32 (0.170)  
MAX.  
ESD IDENT  
Note 1. Qualified parts only  
3.81 (0.150)  
MIN.  
0.51 (0.020)  
MIN.  
0.20 (0.008)  
0.33 (0.013)  
7.36 (0.290)  
7.87 (0.310)  
0.51 (0.020)  
MAX.  
2.29 (0.090)  
2.79 (0.110)  
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).  
3
Hermetic Optocoupler Options  
Option  
Description  
100  
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available  
on standard commercial, class H & class K product in 8 and 16 pin DIP (see drawings below for details).  
4.32 (0.170)  
MAX.  
0.51 (0.020)  
1.14 (0.045)  
MIN.  
1.40 (0.055)  
2.29 (0.090)  
2.79 (0.110)  
0.51 (0.020)  
MAX.  
4.32 (0.170)  
MAX.  
0.51 (0.020)  
MIN.  
1.14 (0.045)  
1.40 (0.055)  
0.20 (0.008)  
0.33 (0.013)  
2.29 (0.090)  
2.79 (0.110)  
0.51 (0.020)  
MAX.  
7.36 (0.290)  
7.87 (0.310)  
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).  
200  
300  
Lead finish is solder dipped rather than gold plated. This option is available on standard commercial, class H  
and class K products in 8 and 16 pin DIP. DLA Drawing part numbers contain provisions for lead finish.  
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is avail-  
able on standard commercial, class H & class K product in 8 and 16 pin DIP (see drawings below for details).  
This option has solder dipped leads.  
4.57 (0.180)  
MAX.  
0.51 (0.020)  
1.40 (0.055)  
1.65 (0.065)  
MIN.  
2.29 (0.090)  
2.79 (0.110)  
0.51 (0.020)  
MAX.  
4.57 (0.180)  
MAX.  
4.57 (0.180)  
MAX.  
0.20 (0.008)  
0.33 (0.013)  
0.51 (0.020)  
MIN.  
5° MAX.  
1.40 (0.055)  
1.07 (0.042)  
1.32 (0.052)  
1.65 (0.065)  
9.65 (0.380)  
9.91 (0.390)  
2.29 (0.090)  
2.79 (0.110)  
0.51 (0.020)  
MAX.  
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).  
Solder contains lead.  
4
Absolute Maximum Ratings  
No derating required up to +125°C.  
Parameter  
Symbol  
Min.  
-65  
-55  
Max.  
Units  
°C  
Storage Temperature  
Operating Temperature  
Case Temperature  
TS  
TA  
TC  
TJ  
+150  
+125  
°C  
+170  
°C  
Junction Temperature  
Lead Solder Temperature  
+175  
°C  
260 for 10 sec  
40  
°C  
Peak Forward Input Current  
(each channel, ≤1 ms duration)  
IF(PEAK)  
IF(AVG)  
mA  
Average Input Forward Current (each channel)  
Input Power Dissipation (each channel)  
Reverse Input Voltage (each channel  
Supply Voltage (1 minute maximum)  
Output Current (each channel)  
20  
35  
5
mA  
mW  
V
VR  
VCC  
IO  
7.0  
25  
7
V
mA  
V
Output Voltage (each channel)  
VO  
PO  
PD  
Output Power Dissipation (each channel)  
Package Power Dissipation (each channel)  
40  
200  
mW  
mW  
Single Channel Product Only  
Enable Input Voltage  
VE  
3.6  
V
8 Pin Ceramic DIP Single Channel Schematic  
Note enable pin 7. An external 0.01 μF to 0.1 μF bypass capacitor must  
be connected between VCC and ground for each package type.  
ESD Classification  
MIL-PRF-38534 and MIL-STD-883, Method 3015  
ACPL-560L/01L/0KL, 5962-0824201  
ACPL-5630L/31L/3KL, 5962-0824202  
ACPL-2670L/72L/268KL, 5962-0824203  
(B), Class 1B  
(A), Class 3A  
(), Class 2  
Recommended Operating Conditions  
Parameter  
Symbol  
IFL  
Min.  
0
Max.  
250  
20  
Units  
μA  
Input Current, Low Level, Each Channel  
Input Current, High Level, Each Channel  
Supply Voltage, Output  
IFH  
10  
3.0  
mA  
V
VCC  
N
3.6  
6
Fan Out (TTL Load) Each Channel  
5
Recommended Operating Conditions (cont’d.)  
Single Channel Product Only[10]  
Parameter  
Symbol  
VEH  
Min.  
2.0  
0
Max.  
VCC  
Units  
High Level Enable Voltage  
Low Level Enable Voltage  
V
V
VEL  
0.8  
Electrical Characteristics (TA = -55°C to +125°C, unless otherwise specified)  
Group  
A[13]  
Limits  
Sub-  
groups  
Parameter  
Symbol Test Conditions  
Min.  
Typ.*  
Max.  
Units  
Fig.  
Note  
High Level  
Output Current  
IOH  
VCC = 3.3 V, VO = 3.3 V,  
IF = 250 μA  
1, 2, 3  
6
250  
μA  
1
1
Low Level  
Output Voltage  
VOL  
VCC = 3.3 V, IF = 10 mA,  
IOL (Sinking) = 10 mA  
1, 2, 3  
1, 2, 3  
1, 2, 3  
0.3  
0.6  
V
2
1, 8  
1
Current Transfer  
Ratio  
hF CTR  
ICCH  
VO = 0.6 V, IF = 10 mA,  
VCC = 3.3 V  
100  
%
Logic  
High  
Supply  
Current  
Single  
Channel  
VCC = 3.3 V, IF = 0 mA  
5
10  
6
11  
22  
15  
30  
mA  
mA  
mA  
mA  
V
1
Dual  
Channel  
VCC = 3.3 V,  
IF1 = IF2 = 0 mA  
Logic  
low  
Supply  
Current  
Single  
Channel  
ICCL  
VCC = 3.3 V,  
IF = 20 mA  
1, 2, 3  
1
1
Dual  
Channel  
VCC = 3.3 V,  
IF1 = IF2 = 20 mA  
12  
1.55  
Input Forward  
Voltage  
VF  
IF = 20 mA  
1, 2  
3
1.75  
1.85  
3
Input Reverse  
Breakdown Voltage  
BVR  
II-O  
IR = 10 μA  
1, 2, 3  
5
V
1
Input-Output  
Leakage Current  
RH ≤ 65%, TA = 25°C  
t = 5 s, VI-O = 1500 Vdc  
1
4
1.0  
4.0  
μA  
pF  
2, 7  
Capacitance Between CI-O  
Input/ Output  
f = 1 MHz, TC = 25°C  
1.0  
1, 3,  
13  
*All typical values are at VCC = 3.3 V, TA = 25°C.  
6
Electrical Characteristics (cont’d) TA = -55°C to +125°C unless otherwise specified  
Group A[13]  
Limits  
Typ.*  
43  
Parameter  
Symbol Test Conditions  
Subgroups Min.  
Max.  
100  
140  
Units  
Fig.  
Note  
Propagation Delay  
Time to High Output  
Level  
tPLH  
V
CC = 3.3 V, RL = 510 Ω,  
9
ns  
4, 5, 6  
1, 5  
CL = 50 pF, IF = 13 mA  
10, 11  
Propagation Delay  
Time to Low Output  
Level  
tPHL  
9
54  
100  
120  
ns  
10, 11  
Output Rise Time  
Output Fall Time  
tLH  
RL = 510 Ω, CL = 50 pF,  
IF = 13 mA  
9, 10, 11  
20  
8
90  
40  
ns  
1
tHL  
Common Mode  
Transient  
Immunity at  
High Output  
Level  
|CMH|  
VCM = 50 V (PEAK),  
VCC = 3.3 V,  
VO (min.) = 2 V,  
RL = 510 Ω, IF = 0 mA  
9, 10, 11  
9, 10, 11  
1000  
1000  
>10000  
V/μs  
7
7
1, 6,  
13  
Common Mode  
Transient  
Immunity at Low  
Output Level  
|CML|  
VCM = 50 V (PEAK),  
VCC = 3.3 V,  
VO (max.) = 0.8 V,  
RL = 510 Ω, IF = 10 mA  
>10000  
-0.54  
V/μs  
1, 6,  
13  
Single Channel Product Only  
Low Level  
Enable Current  
IEL  
VCC = 3.3 V,  
VE = 0.5 V  
1, 2, 3  
1, 2, 3  
1, 2, 3  
-2.0  
2.0  
mA  
V
High Level  
Enable Voltage  
VEH  
VEL  
9
Low Level  
0.8  
V
Enable Voltage  
*All typical values are at VCC = 3.3 V, TA = 25°C.  
Typical Characteristics, T = 25°C, V = 3.3 V  
A
CC  
Parameter  
Sym.  
CIN  
Typ.  
60  
Units  
Test Conditions  
Fig.  
Note  
Input Capacitance  
pF  
VF = 0 V, f = 1 MHz  
IF = 20 mA  
1
1
Input Diode Temperature  
Coefficient  
ΔVF  
-1.5  
mV/°C  
ΔT  
A
Resistance (Input-Output)  
RI-O  
1012  
Ω
VI-O = 500 V  
2
Single Channel Product Only  
Propagation Delay Time of  
Enable from VEH to VEL  
tELH  
tEHL  
32  
28  
ns  
ns  
RL = 510 Ω, CL = 50 pF  
IF = 13 mA, VEH = 3 V,  
8, 9  
1, 10  
1, 11  
V
EL = 0V  
Propagation Delay Time of  
Enable from VEL to VEH  
Dual Channel Product Only  
Input-Input  
Leakage Current  
II-I  
0.5  
nA  
Relative Humidity ≤ 65%  
4
V = 500 V, t = 5 s  
I-I  
Resistance (Input-Input)  
Capacitance (Input-Input)  
RI-I  
CI-I  
1012  
0.55  
Ω
VI-I = 500 V  
f = 1 MHz  
4
4
pF  
7
Notes:  
1. Each channel.  
2. All devices are considered two-terminal devices; II-O is measured between all input leads or terminals shorted together and all output  
leads or terminals shorted together.  
3. Measured between each input pair shorted together and all output connections for that channel shorted together.  
4. Measured between adjacent input pairs shorted together for each multichannel device.  
5. tPHL propagation delay is measured from the 50% point on the leading edge of the input pulse to the 1.5 V point on the leading edge of  
the output pulse. The tPLH propagation delay is measured from the 50% point on the trailing edge of the input pulse to the 1.5 V point  
on the trailing edge of the output pulse.  
6. CML is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic low state  
(VO <0.8 V). CMH is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic  
high state (VO > 2.0 V).  
7. This is a momentary withstand test, not an operating condition.  
8. It is essential that a bypass capacitor (0.01 to 0.1 μF, ceramic) be connected from VCC to ground. Total lead length between both ends of  
this external capacitor and the isolator connections should not exceed 20 mm.  
9. No external pull up is required for a high logic state on the enable input.  
10. The tELH enable propagation delay is measured from the 1.5 V point on the trailing edge of the enable input pulse to the 1.5 V point on  
the trailing edge of the output pulse.  
11. The tEHL enable propagation delay is measured from the 1.5 V point on the leading edge of the enable input pulse to the 1.5 V point on  
the leading edge of the output pulse.  
12. Standard commercial parts receive 100% testing at 25°C (Subgroups 1 and 9). Class H and K parts receive 100% testing at 25, 125, and  
-55°C (Subgroups 1 and 9, 2 and 10, 3 and 11, respectively).  
13. Parameters are tested as part of device initial characterization and after design and process changes. Parameters are guaranteed to limits  
specified for all lots not specifically tested.  
100  
80  
60  
40  
20  
0
5
4
3
2
1
0
VCC = 3.3 V  
TA = 25 °C  
VCC = 3.3 V  
VO = 3.3 V  
IF = 250 μA  
RL  
510 Ω  
1 kΩ  
4 kΩ  
-60 -40 -20  
0
20 40 60 80 100 120 140  
1
2
3
4
5
6
7
TA - TEMPERATURE - °C  
IF - INPUT DIODE FORWARD CURRENT - mA  
Figure 1. High Level Output Current vs. Tempera- Figure 2. Input-Output Characteristics.  
ture.  
Figure 3. Input Diode Forward Characteristics.  
8
D.U.T.  
3.3 V  
120  
100  
80  
60  
40  
20  
0
V
CC  
PULSE  
GENERATOR  
VCC = 3.3 V  
RL = 510 Ω  
R
L
TA = 25°C  
I
F
V
O
Z
t
= 50Ω  
= 5 ns  
O
H
0.01 μF  
BYPASS  
V
O
C *  
L
INPUT  
MONITORING  
NODE  
GND  
tPLH  
Rm  
* C INCLUDES PROBE AND STRAY WIRING CAPACITANCE.  
L
tPHL  
10 11 12 13 14 15 16 17 18 19 20  
IF - PULSE INPUT CURRENT - mA  
Figure 5. Propagation Delay, tPHL and tPLH vs. Pulse Input  
Current, IFH.  
Figure 4. Test Circuit for tPHL and tPLH.*  
D.U.T.  
+3.3 V  
B
V
CC  
510  
Ω
I
I
A
OUTPUT V  
120  
O
MONITORING  
NODE  
VCC = 3.3 V  
IF = 13 mA  
RL = 510 Ω  
0.01 μF  
BYPASS  
100  
GND  
-
V
80  
FF  
V
CM  
tPLH  
+
60  
PULSE GEN.  
40  
tPHL  
20  
0
-60 -40 -20  
0
20 40 60 80 100 120 140  
TA - TEMPERATURE - °C  
Figure 6. Propagation Delay vs. Temperature.  
Figure 7. Test Circuit for Common Mode Transient Immunity and Typical  
Waveforms.  
9
80  
PULSE  
GENERATOR  
OUTPUT V  
MONITORING  
NODE  
V
CC = 3.3 V  
E
Z
= 50  
= 5 ns  
Ω
70 VEH = 3.0 V  
VEL = 0 V  
O
r
t
+3.3 V  
60  
50  
40  
30  
20  
10  
0
IF = 13 mA  
D.U.T.  
V
CC  
R
L
V
E
I
= 13 mA  
tELH  
F
V
OUT  
OUTPUT V  
MONITORING  
NODE  
O
0.01 μF  
BYPASS  
C *  
tEHL  
L
GND  
* C INCLUDES PROBE AND  
L
STRAY WIRING CAPACITANCE.  
-60 -40 -20  
0
20 40 60 80 100 120 140  
TA - TEMPERATURE - °C  
Figure 9. Enable Propagation Delay vs. Temperature.  
Figure 8. Test Circuit for tEHL and tELH.  
V
CC  
+5.5 V  
V
D.U.T.*  
OC  
+5.5 V  
V
CC  
(EACH INPUT)  
0.01 μF  
+
-
V
200  
Ω
200  
Ω
IN  
5.3 V  
(EACH OUTPUT)  
(EACH OUTPUT)  
GND  
CONDITIONS: I = 20 mA  
F
I
= 25 mA  
O
T
= +125 o  
C
A
* ALL CHANNELS TESTED SIMULTANEOUSLY.  
Figure 10. Operating Circuit for Burn-In and Steady State Life Tests.  
10  
MIL-PRF-38534 Class H, Class K, and  
DLA SMD Test Program  
Avago’s Hi-Rel Optocouplers are in compliance with MIL-  
PRF-38534 Classes H and K. Class H and Class K devices  
are also in compliance with DLA drawing 5962-08242.  
Testing consists of 100% screening and quality confor-  
mance inspection to MIL-PRF-38534.  
For product information and a complete list of distributors, please go to our website: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.  
Data subject to change. Copyright © 2005-2012 Avago Technologies Limited. All rights reserved.  
AV02-1327EN - October 2, 2012  

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