AT34C02B-10TU-1.7 [ATMEL]
Two-wire Serial EEPROM with Permanent and Reversible Software Write Protect; 两线串行EEPROM与永久及可逆软件写保护
| 型号： | AT34C02B-10TU-1.7 |
| 厂家： | 
ATMEL |
| 描述： | Two-wire Serial EEPROM with Permanent and Reversible Software Write Protect |
| 文件： | 总21页 (文件大小：467K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
• Permanent and Reversible Software Write Protection for the First-half of the Array
– Software Procedure to Verify Write Protect Status
• Hardware Write Protection for the Entire Array
• Low-voltage and Standard-voltage Operation
– 1.7 (VCC = 1.7V to 3.6V)
• Internally Organized 256 x 8
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 100 kHz (1.7V) and 400 kHz (2.7V and 3.6V) Compatibility
• 16-byte Page Write Modes
• Partial Page Writes Are Allowed
• Self-timed Write Cycle (5 ms max)
Two-wire Serial
EEPROM
• High-reliability
with Permanent
and Reversible
Software Write
Protect
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
• 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 8-lead TSSOP, and 8-ball
dBGA2 Packages
Description
The AT34C02B provides 2048 bits of serial electrically-erasable and programmable
read only memory (EEPROM) organized as 256 words of 8 bits each. The first-half of
the device incorporates a permanent and a reversible software write protection feature
while hardware write protection for the entire array is available via an external pin.
Once the permanent software write protection is enabled, by sending a special com-
mand to the device, it cannot be reversed. However, the reversible software write
protection is enabled and can be reversed by sending a special command. The hard-
ware write protection is controlled with the WP pin and can be used to protect the
entire array, whether or not the software write protection has been enabled. This
allows the user to protect none, first-half, or all of the array depending on the applica-
tion. The device is optimized for use in many industrial and commercial applications
where low-power and low-voltage operations are essential. The AT34C02B is avail-
able in space saving 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 8-lead
TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial interface.
It is available in 1.7V (1.7V to 3.6V).
2K (256 x 8)
AT34C02B
Note: Not recommended for new
design; please refer to
AT34C02C datasheet.
8-ball dBGA2
8-lead Ultra Thin Mini-MAP
Table 1. Pin Configurations
Pin Name
A0 - A2
SDA
Function
8
7
6
5
1
2
3
4
1
2
3
4
VCC
WP
8
7
6
5
A0
A1
A0
VCC
WP
A1
Address Inputs
Serial Data
SCL
SDA
A2
GND
A2
SCL
SDA
GND
SCL
Serial Clock Input
Write Protect
(MLP 2x3)
Bottom View
WP
Bottom View
8-lead SOIC
8-lead TSSOP
A0
A1
1
2
3
4
8
VCC
A0
A1
A2
1
2
3
4
8
7
6
5
VCC
WP
7
6
5
WP
A2
SCL
SDA
SCL
SDA
GND
GND
Rev. 3417E–SEEPR–1/07
Absolute Maximum Ratings*
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Operating Temperature..................................–55°C to +125°C
Storage Temperature.....................................–65°C to +150°C
Voltage on Any Pin
with Respect to Ground....................................–1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 1. Block Diagram
VCC
GND
WP
START
STOP
LOGIC
SCL
SDA
SERIAL
CONTROL
LOGIC
EN
H.V. PUMP/TIMING
DATA RECOVERY
WRITE PROTECT
CIRCUITRY
LOAD
COMP
DEVICE
ADDRESS
COMPARATOR
SOFTWARE WRITE
PROTECTED AREA
(00H - 7FH)
LOAD
INC
A2
A1
A0
R/W
DATA WORD
ADDR/COUNTER
EEPROM
Y DEC
SERIAL MUX
DIN
DOUT/ACK
LOGIC
DOUT
2
AT34C02B
3417E–SEEPR–1/07
AT34C02B
Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each
EEPROM device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is
open-drain driven and may be wire-ORed with any number of other open-drain or open
collector devices.
DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1, and A0 pins are device
address inputs that are hardwired (directly to GND or to Vcc) for compatibility with other
AT24Cxx devices. When the pins are hardwired, as many as eight 2K devices may be
addressed on a single bus system. (Device addressing is discussed in detail under
“Device Addressing,” page 9.) A device is selected when a corresponding hardware and
software match is true. If these pins are left floating, the A2, A1, and A0 pins will be
internally pulled down to GND. However, due to capacitive coupling that may appear
during customer applications, Atmel recommends always connecting the address pins
to a known state. When using a pull-up resistor, Atmel recommends using 10kΩ or less.
WRITE PROTECT (WP): The write protect input, when connected to GND, allows nor-
mal write operations. When WP is connected directly to Vcc, all write operations to the
memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down
to GND. However, due to capacitive coupling that may appear during customer applica-
tions, Atmel recommends always connecting the WP pins to a known state. When using
a pull-up resistor, Atmel recommends using 10kΩ or less.
Table 2. AT34C02B Write Protection Modes
Permanent Write Protect
Reversible Write Protect
Register
Part of the Array Write
Protected
WP Pin Status
Register
VCC
–
–
Full Array (2K)
GND or Floating
Not Programmed
Not Programmed
Normal Read/Write
First-Half of Array
(1K: 00H - 7FH)
GND or Floating
GND or Floating
Programmed
–
–
First-Half of Array
(1K: 00H - 7FH)
Programmed
Table 3. Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 100 kHz, VCC = +1.7V
Symbol
CI/O
Test Condition
Max
8
Units
pF
Conditions
Input/Output Capacitance (SDA)
Input Capacitance (A0, A1, A2, SCL)
VI/O = 0V
VIN = 0V
CIN
6
pF
Note:
1. This parameter is characterized and is not 100% tested.
3
3417E–SEEPR–1/07
Table 4. DC Characteristics
Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = +1.7V to +3.6V, (unless otherwise noted)
Symbol
VCC1
ICC
Parameter
Test Condition
Min
Typ
Max
3.6
Units
V
Supply Voltage
1.7
Supply Current VCC = 3.6V
Supply Current VCC = 3.6V
Standby Current VCC = 1.7V
Standby Current VCC = 3.6V
Input Leakage Current
Output Leakage Current
Input Low Level(1)
READ at 100 kHz
WRITE at 100 kHz
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VOUT = VCC or VSS
0.4
2.0
1.0
mA
mA
µA
µA
µA
µA
V
ICC
3.0
ISB1
ISB2
ILI
0.6
3.0
1.6
4.0
0.10
0.05
3.0
ILO
3.0
VIL
–0.6
VCC x 0.3
VCC + 0.5
0.4
VIH
Input High Level(1)
VCC x 0.7
V
VOL2
VOL1
Output Low Level VCC = 3.0V
Output Low Level VCC = 1.7V
IOL = 2.1 mA
V
IOL = 0.15 mA
0.2
V
Note:
1. VIL min and VIH max are reference only and are not tested.
4
AT34C02B
3417E–SEEPR–1/07
AT34C02B
Table 5. AC Characteristics
Applicable over recommended operating range from TAI = –40°C to +85°C, VCC = +1.7V to +3.6V, CL = 1 TTL Gate and
100 pF (unless otherwise noted)
1.7V
2.7V, 3.6V
Symbol
fSCL
Parameter
Min
Max
Min
Max
Units
kHz
µs
Clock Frequency, SCL
Clock Pulse Width Low
Clock Pulse Width High
Noise Suppression Time(1)
Clock Low to Data Out Valid
100
400
tLOW
tHIGH
tI
4.7
4.0
1.2
0.6
µs
100
4.5
50
ns
tAA
0.1
4.7
0.1
1.2
0.9
µs
Time the bus must be free before a new
transmission can start(1)
µs
tBUF
tHD.STA
tSU.STA
tHD.DAT
tSU.DAT
tR
Start Hold Time
4.0
4.7
0
0.6
0.6
0
µs
µs
µs
ns
µs
ns
µs
ns
ms
Start Set-up Time
Data In Hold Time
Data In Set-up Time
Inputs Rise Time(1)
Inputs Fall Time(1)
Stop Set-up Time
Data Out Hold Time
Write Cycle Time
200
100
1.0
0.3
tF
300
300
tSU.STO
tDH
4.7
0.6
50
100
tWR
5
5
Write
Cycles
1M
1M
Endurance(1)
25°C, Page Mode
Note:
1. This parameter is characterized and is not 100% tested.
5
3417E–SEEPR–1/07
Memory Organization AT34C02B, 2K Serial EEPROM: The 2K is internally organized with 16 pages of 16
bytes each. Random word addressing requires a 8-bit data word address.
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-
nal device. Data on the SDA pin may change only during SCL low time periods (see
Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop
condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition
which must precede any other command (see Figure 5 on page 8).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition.
After a read sequence, the stop command will place the EEPROM in a standby power
mode (see Figure 5 on page 8).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from
the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has
received each word. This happens during the ninth clock cycle.
STANDBY MODE: The AT34C02B features a low-power standby mode which is
enabled: (a) upon power-up or (b) after the receipt of the STOP bit and the completion of
any internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any
Two-wire part can be reset by following these steps:
(a) Clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then
(c) create a start condition.
6
AT34C02B
3417E–SEEPR–1/07
AT34C02B
Figure 2. Bus Timing SCL: Serial Clock SDA: Serial Data I/O
Figure 3. Write Cycle Timing SCL: Serial Clock SDA: Serial Data I/O
SCL
SDA
ACK
8th BIT
WORDn
(1)
wr
t
START
STOP
CONDITION
CONDITION
Note:
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.
Figure 4. Data Validity
7
3417E–SEEPR–1/07
Figure 5. Start and Stop Condition
Figure 6. Output Acknowledge
8
AT34C02B
3417E–SEEPR–1/07
AT34C02B
Device Addressing
The 2K EEPROM device requires an 8-bit device address word following a start condi-
tion to enable the chip for a read or write operation (see Figure 10 on page 13).
The device address word consists of a mandatory one-zero sequence for the first four
most-significant bits (1010) for normal read and write operations and 0110 for writing to
the write protect register.
The next 3 bits are the A2, A1 and A0 device address bits for the AT34C02B EEPROM.
These 3 bits must compare to their corresponding hard-wired input pins.
The eighth bit of the device address is the read/write operation select bit. A read opera-
tion is initiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is
not made, the chip will return to a standby state. The device will not acknowledge if the
write protect register has been programmed and the control code is 0110.
Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the
device address word and acknowledgment. Upon receipt of this address, the EEPROM
will again respond with a zero and then clock in the first 8-bit data word. Following
receipt of the 8-bit data word, the EEPROM will output a zero and the addressing
device, such as a microcontroller, must terminate the write sequence with a stop condi-
tion. At this time the EEPROM enters an internally-timed write cycle, tWR, to the
nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will
not respond until the write is complete (see Figure 11 on page 13).
The device will acknowledge a write command, but not write the data, if the software or
hardware write protection has been enabled. The write cycle time must be observed
even when the write protection is enabled.
PAGE WRITE: The 2K device is capable of 16-byte page write.
A page write is initiated the same as a byte write, but the microcontroller does not send
a stop condition after the first data word is clocked in. Instead, after the EEPROM
acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen
more data words. The EEPROM will respond with a zero after each data word received.
The microcontroller must terminate the page write sequence with a stop condition (see
Figure 12 on page 14).
The data word address lower four bits are internally incremented following the receipt of
each data word. The higher data word address bits are not incremented, retaining the
memory page row location. When the word address, internally generated, reaches the
page boundary, the following byte is placed at the beginning of the same page. If more
than sixteen data words are transmitted to the EEPROM, the data word address will “roll
over” and previous data will be overwritten. The address “roll over” during write is from
the last byte of the current page to the first byte of the same page.
The device will acknowledge a write command, but not write the data, if the software or
hardware write protection has been enabled. The write cycle time must be observed
even when the write protection is enabled.
ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves send-
ing a start condition followed by the device address word. The read/write bit is
representative of the operation desired. Only if the internal write cycle has completed
will the EEPROM respond with a zero allowing the read or write sequence to continue.
9
3417E–SEEPR–1/07
Write Protection
The software write protection, once enabled, write protects only the first-half of the array
(00H - 7FH) while the hardware write protection, via the WP pin, is used to protect the
entire array.
PERMANENT SOFTWARE WRITE PROTECTION: The software write protection is
enabled by sending a command, similar to a normal write command, to the device which
programs the permanent write protect register. This must be done with the WP pin low.
The write protect register is programmed by sending a write command with the device
address of 0110 instead of 1010 with the address and data bit being don’t cares (see
Figure 7 on page 10). Once the software write protection has been enabled, the device
will no longer acknowledge the 0110 control byte. The software write protection cannot
be reversed even if the device is powered down. The write cycle time must be observed.
REVERSIBLE SOFTWARE WRITE PROTECTION: The reversible software write pro-
tection is enabled by sending a command, similar to a normal write command, to the
device which programs the reversible write protect register. This must be done with the
WP pin low. The write protect register is programmed by sending a write command
01100010 with pins A2 and A1 tied to ground or don't connect and pin A0 connected to
VHV (see Figure 8). The reversible write protection can be reversed by sending a com-
mand 01100110 with pin A2 tied to ground or no connect, pin A1 tied to VCC and pin A0
tied to VHV (see Figure 9).
HARDWARE WRITE PROTECTION: The WP pin can be connected to VCC, GND, or
left floating. Connecting the WP pin to VCC will write protect the entire array, regardless
of whether or not the software write protection has been enabled. The software write
protection register cannot be programmed when the WP pin is connected to VCC. If the
WP pin is connected to GND or left floating, the write protection mode is determined by
the status of the software write protect register.
Figure 7. Setting Permanent Write Protect Register (PSWP)
S
CONTROL
BYTE
WORD
ADDRESS
T
A
R
T
S
T
DATA
DATA
DATA
O
P
SDA LINE
0 1
1 0 A2 A1 A0 0
A
C
K
A
C
K
A
C
K
= Don't Care
Figure 8. Setting Reversible Write Protect Register (RSWP)
S
CONTROL
BYTE
WORD
ADDRESS
T
A
R
T
S
T
O
P
SDA LINE
0 1
1 0 0 0 1 0
A
C
K
A
C
K
A
C
K
= Don't Care
Figure 9. Clearing Reversible Write Protect Register (RSWP)
S
CONTROL
BYTE
WORD
ADDRESS
T
A
R
T
S
T
O
P
SDA LINE
0 1
1 0 0 1 1 0
A
C
K
A
C
K
A
C
K
= Don't Care
10
AT34C02B
3417E–SEEPR–1/07
AT34C02B
Table 6. Write Protection
Pin
A1
Preamble
RW
Command
Set PSWP
Set RSWP
Clear RSWP
A2
A2
0
A0
A0
B7
0
B6
1
B5
1
B4
0
B3
A2
0
B2
A1
0
B1
A0
1
B0
0
A1
0
VHV
VHV
0
1
1
0
0
0
1
0
1
1
0
0
1
1
0
Table 7. VHV
Min
Max
10
Units
VHV
7
V
Note:
VHV - VCC > 4.8V
Table 8. WP Connected to GND or Floating
WP Connected to GND or Floating
Permanent Write
Protect Register
Reversible Write
Protect Register
RSWP
Acknowledgment
from Device
Command
1010
R/W Bit
PSWP
Action from Device
R
W
W
W
X
Programmed
X
X
X
ACK
ACK
ACK
ACK
1010
Can write to second Half (80H - FFH) only
Can write to second Half (80H - FFH) only
Can write to full array
1010
Programmed
Not Programmed
1010
Not Programmed
STOP - Indicates permanent write protect register is
programmed
Read PSWP
Read PSWP
Set PSWP
Set PSWP
R
R
Programmed
Not Programmed
Programmed
X
X
X
X
No ACK
ACK
Read out data don't care. Indicates PSWP register
is not programmed
STOP - Indicates permanent write protect register is
programmed
W
W
No ACK
ACK
Program permanent write protect register
(irreversible)
Not Programmed
STOP - Indicates reversible write protect register is
programmed
Read RSWP
Read RSWP
R
R
X
X
Programmed
No ACK
ACK
Read out data don't care. Indicates RSWP register
is not programmed
Not Programmed
STOP - Indicates reversible write protect register is
programmed
Set RSWP
Set RSWP
Clear RSWP
W
W
W
X
X
Programmed
Not Programmed
X
No ACK
ACK
Program reversible write protect register (reversible)
STOP - Indicates permanent write protect register is
programmed
Programmed
No ACK
Clear (unprogram) reversible write protect register
(reversible)
Clear RSWP
W
Not Programmed
X
ACK
11
3417E–SEEPR–1/07
Table 9. WP Connected to Vcc
WP Connected to Vcc
Permanent Write
Protect Register
PSWP
Reversible Write
Protect Register
RSWP
Acknowledgment
from Device
Command
1010
R/W Bit
Action from Device
Read array
R
X
X
X
X
ACK
ACK
1010
W
Device Write Protect
Read
PSWP
STOP - Indicates permanent write protect register is
programmed
R
R
Programmed
X
X
No ACK
ACK
Read
PSWP
Read out data don't care. Indicates PSWP register is
not programmed
Not Programmed
STOP - Indicates permanent write protect register is
programmed
Set PSWP
Set PSWP
W
W
Programmed
X
X
No ACK
ACK
Not Programmed
Cannot program write protect registers
Read
RSWP
STOP - Indicates reversible write protect register is
programmed
R
R
X
X
Programmed
No ACK
ACK
Read
RSWP
Read out data don't care. Indicates RSWP register is
not programmed
Not Programmed
STOP - Indicates reversible write protect register is
programmed
Set RSWP
Set RSWP
W
W
W
X
X
Programmed
Not Programmed
X
No ACK
ACK
Cannot program write protect registers
Clear
RSWP
STOP - Indicates permanent write protect register is
programmed
Programmed
No ACK
Clear
RSWP
W
Not Programmed
X
ACK
Cannot write to write protect registers
Read Operations
Read operations are initiated the same way as write operations with the exception that
the read/write select bit in the device address word is set to one. There are three read
operations: current address read, random address read and sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the
last address accessed during the last read or write operation, incremented by one. This
address stays valid between operations as long as the chip power is maintained. The
address “roll over” during read is from the last byte of the last memory page to the first
byte of the first page.
Once the device address with the read/write select bit set to one is clocked in and
acknowledged by the EEPROM, the current address data word is serially clocked out.
To end the command, the microcontroller does not respond with an input zero but does
generate a following stop condition (see Figure 13 on page 14).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the
data word address. Once the device address word and data word address are clocked
in and acknowledged by the EEPROM, the microcontroller must generate another start
condition. The microcontroller now initiates a current address read by sending a device
address with the read/write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word. To end the command, the microcontroller
12
AT34C02B
3417E–SEEPR–1/07
AT34C02B
does not respond with a zero but does generate a following stop condition (see Figure
14 on page 14).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or
a random address read. After the microcontroller receives a data word, it responds with
an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to
increment the data word address and serially clock out sequential data words. When the
memory address limit is reached, the data word address will “roll over” and the sequen-
tial read will continue. The sequential read operation is terminated when the
microcontroller does not respond with a zero but does generate a following stop condi-
tion (see Figure 15 on page 14).
PERMANENT WRITE PROTECT REGISTER (PSWP) STATUS: To find out if the regis-
ter has been programmed, the same procedure is used as to program the register
except that the R/W bit is set to 1. If the device sends an acknowledge, then the perma-
nent write protect register has not been programmed. Otherwise, it has been
programmed and the device is permanently write protected at the first half of the array.
Table 10. PSWP Status
Pin
A1
Preamble
RW
B0
1
Command
A2
A0
B7
B6
B5
B4
B3
B2
B1
Read PSWP
A2
A1
A0
0
1
1
0
A2
A1
A0
REVERSIBLE WRITE PROTECT REGISTER(RSWP) STATUS: To find out if the regis-
ter has been programmed, the same procedure is used as to program the register
except that the R/W bit is set to 1. If the sends an device acknowledge, then the revers-
ible write protect register has not been programmed. Otherwise, it has been
programmed and the device is write protected (reversible) at the first half of the array.
Figure 10. Device Address
Figure 11. Byte Write
13
3417E–SEEPR–1/07
Figure 12. Page Write
Figure 13. Current Address Read
Figure 14. Random Read
Figure 15. Sequential Read
14
AT34C02B
3417E–SEEPR–1/07
AT34C02B
AT34C02B Ordering Information(1)
Ordering Code
Package
Operation Range
AT34C02BN-10SU-1.7(2)
AT34C02B-10TU-1.7(2)
AT34C02BY6-10YH-1.7(3)
AT34C02BU3-10UU-1.7(2)
8S1
8A2
Lead-free/Halogen-free/
Industrial Temperature
8Y6
(–40°C to 85°C)
8U3-1
Notes: 1. Not Recommended for new design; Please refer to AT34C02C datasheet.
2. “U” designates Green package + RoHS compliant.
3. “H” designates Green package + RoHS compliant, with NiPdAu Lead Finish.
Package Type
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8A2
8Y6
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
8U3-1
8-ball, die Ball Grid Array Package (dBGA2)
Options
–1.7
Low Voltage (1.7V to 3.6V)
15
3417E–SEEPR–1/07
Packaging Information
8S1 – JEDEC SOIC
C
1
E
E1
L
N
∅
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
MIN
1.35
0.10
MAX
1.75
0.25
NOM
NOTE
SYMBOL
A1
A
–
–
A1
b
0.31
0.17
4.80
3.81
5.79
–
0.51
0.25
5.00
3.99
6.20
C
D
E1
E
–
–
D
–
–
Side View
e
1.27 BSC
L
0.40
0˚
–
–
1.27
8˚
∅
Note:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03
REV.
TITLE
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
8S1
B
R
Small Outline (JEDEC SOIC)
16
AT34C02B
3417E–SEEPR–1/07
AT34C02B
8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
3.00
NOTE
SYMBOL
D
2.90
3.10
2, 5
A
b
E
6.40 BSC
4.40
E1
A
4.30
–
4.50
1.20
1.05
0.30
3, 5
4
–
A2
b
0.80
0.19
1.00
e
A2
–
D
e
0.65 BSC
0.60
L
0.45
0.75
Side View
L1
1.00 REF
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
DRAWING NO.
TITLE
REV.
2325 Orchard Parkway
San Jose, CA 95131
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
B
8A2
R
17
3417E–SEEPR–1/07
8Y6 – Mini-MAP
A
D2
b
(8X)
Pin 1
Index
Area
Pin 1 ID
L (8X)
D
e (6X)
A2
A1
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
2.00 BSC
3.00 BSC
1.50
NOTE
SYMBOL
D
E
D2
E2
A
1.40
1.60
1.40
0.60
0.05
0.55
-
-
-
-
A1
A2
A3
L
0.0
-
0.02
-
0.20 REF
0.30
0.20
0.20
0.40
0.30
e
0.50 BSC
0.25
b
2
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
8/26/05
DRAWING NO. REV.
TITLE
2325 Orchard Parkway
San Jose, CA 95131
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
Dual No Lead Package (DFN) ,(MLP 2x3)
8Y6
C
R
18
AT34C02B
3417E–SEEPR–1/07
AT34C02B
8U3-1 – dBGA2
E
D
1.
b
A1
PIN 1 BALL PAD CORNER
A2
Top View
A
PIN 1 BALL PAD CORNER
Side View
1
2
3
4
(d1)
d
7
6
5
8
e
COMMON DIMENSIONS
(Unit of Measure = mm)
(e1)
MIN
0.71
0.10
0.40
0.20
MAX
0.91
0.20
0.50
0.30
NOM
0.81
NOTE
SYMBOL
Bottom View
8 SOLDER BALLS
A
A1
A2
b
0.15
0.45
0.25
2
D
1.50 BSC
2.00 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter
E
e
e1
d
d1
6/24/03
TITLE
REV.
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
PO8U3-1
A
R
Small Die Ball Grid Array Package (dBGA2)
19
3417E–SEEPR–1/07
Revision History
Doc. Rev.
Date
Comments
3417E
1/2007
Revision History Implemented.
Pg 1: Added note: Not Recommended for new design; Please
refer to AT34C02C datasheet.
20
AT34C02B
3417E–SEEPR–1/07
Atmel Corporation
Atmel Operations
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
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3417E–SEEPR–1/07
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