AT32UC3L0256-D3HES [ATMEL]
32-bit Atmel AVR Microcontroller; 32位爱特梅尔AVR微控制器型号: | AT32UC3L0256-D3HES |
厂家: | ATMEL |
描述: | 32-bit Atmel AVR Microcontroller |
文件: | 总96页 (文件大小:1716K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Features
• High-performance, Low-power 32-bit Atmel® AVR® Microcontroller
– Compact Single-cycle RISC Instruction Set Including DSP Instructions
– Read-modify-write Instructions and Atomic Bit Manipulation
– Performance
• Up to 64DMIPS Running at 50MHz from Flash (1 Flash Wait State)
• Up to 36DMIPS Running at 25MHz from Flash (0 Flash Wait State)
– Memory Protection Unit (MPU)
• Secure Access Unit (SAU) providing User-defined Peripheral Protection
• picoPower® Technology for Ultra-low Power Consumption
• Multi-hierarchy Bus System
– High-performance Data Transfers on Separate Buses for Increased Performance
– 12 Peripheral DMA Channels Improve Speed for Peripheral Communication
• Internal High-speed Flash
32-bit Atmel
AVR
Microcontroller
– 256Kbytes and 128Kbytes Versions
– Single-cycle Access up to 25MHz
AT32UC3L0256
AT32UC3L0128
– FlashVault Technology Allows Pre-programmed Secure Library Support for End
User Applications
– Prefetch Buffer Optimizing Instruction Execution at Maximum Speed
– 100,000 Write Cycles, 15-year Data Retention Capability
– Flash Security Locks and User-defined Configuration Area
• Internal High-speed SRAM, Single-cycle Access at Full Speed
– 32Kbytes
Summary
• Interrupt Controller (INTC)
– Autovectored Low-latency Interrupt Service with Programmable Priority
• External Interrupt Controller (EIC)
• Peripheral Event System for Direct Peripheral to Peripheral Communication
• System Functions
– Power and Clock Manager
– SleepWalking Power Saving Control
– Internal System RC Oscillator (RCSYS)
– 32KHz Oscillator
– Multipurpose Oscillator, Phase Locked Loop (PLL), and Digital Frequency Locked
Loop (DFLL)
• Windowed Watchdog Timer (WDT)
• Asynchronous Timer (AST) with Real-time Clock Capability
– Counter or Calendar Mode Supported
• Frequency Meter (FREQM) for Accurate Measuring of Clock Frequency
• Six 16-bit Timer/Counter (TC) Channels
– External Clock Inputs, PWM, Capture, and Various Counting Capabilities
• PWM Channels on All I/O Pins (PWMA)
– 8-bit PWM with a Source Clock up to 150MHz
• Four Universal Synchronous/Asynchronous Receiver/Transmitters (USART)
– Independent Baudrate Generator, Support for SPI
– Support for Hardware Handshaking
• One Master/Slave Serial Peripheral Interface (SPI) with Chip Select Signals
– Up to 15 SPI Slaves can be Addressed
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• Two Master and Two Slave Two-wire Interfaces (TWI), 400kbit/s I2C-compatible
• One 8-channel Analog-to-digital Converter (ADC) with up to 12 Bits Resolution
– Internal Temperature Sensor
• Eight Analog Comparators (AC) with Optional Window Detection
• Capacitive Touch (CAT) Module
– Hardware-assisted Atmel® AVR® QTouch® and Atmel® AVR® QMatrix Touch Acquisition
– Supports QTouch and QMatrix Capture from Capacitive Touch Sensors
• QTouch Library Support
– Capacitive Touch Buttons, Sliders, and Wheels
– QTouch and QMatrix Acquisition
• On-chip Non-intrusive Debug System
– Nexus Class 2+, Runtime Control, Non-intrusive Data and Program Trace
– aWire Single-pin Programming Trace and Debug Interface Muxed with Reset Pin
– NanoTrace Provides Trace Capabilities through JTAG or aWire Interface
• 48-pin TQFP/QFN/TLLGA (36 GPIO Pins)
• Five High-drive I/O Pins
• Single 1.62-3.6 V Power Supply
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1. Description
The Atmel® AVR® AT32UC3L0128/256 is a complete system-on-chip microcontroller based on
the AVR32 UC RISC processor running at frequencies up to 50MHz. AVR32 UC is a high-per-
formance 32-bit RISC microprocessor core, designed for cost-sensitive embedded applications,
with particular emphasis on low power consumption, high code density, and high performance.
The processor implements a Memory Protection Unit (MPU) and a fast and flexible interrupt con-
troller for supporting modern and real-time operating systems. The Secure Access Unit (SAU) is
used together with the MPU to provide the required security and integrity.
Higher computation capability is achieved using a rich set of DSP instructions.
The AT32UC3L0128/256 embeds state-of-the-art picoPower technology for ultra-low power con-
sumption. Combined power control techniques are used to bring active current consumption
down to 174µA/MHz, and leakage down to 220nA while still retaining a bank of backup regis-
ters. The device allows a wide range of trade-offs between functionality and power consumption,
giving the user the ability to reach the lowest possible power consumption with the feature set
required for the application.
The Peripheral Direct Memory Access (DMA) controller enables data transfers between periph-
erals and memories without processor involvement. The Peripheral DMA controller drastically
reduces processing overhead when transferring continuous and large data streams.
The AT32UC3L0128/256 incorporates on-chip Flash and SRAM memories for secure and fast
access. The FlashVault technology allows secure libraries to be programmed into the device.
The secure libraries can be executed while the CPU is in Secure State, but not read by non-
secure software in the device. The device can thus be shipped to end customers, who will be
able to program their own code into the device to access the secure libraries, but without risk of
compromising the proprietary secure code.
The External Interrupt Controller (EIC) allows pins to be configured as external interrupts. Each
external interrupt has its own interrupt request and can be individually masked.
The Peripheral Event System allows peripherals to receive, react to, and send peripheral events
without CPU intervention. Asynchronous interrupts allow advanced peripheral operation in low
power sleep modes.
The Power Manager (PM) improves design flexibility and security. The Power Manager supports
SleepWalking functionality, by which a module can be selectively activated based on peripheral
events, even in sleep modes where the module clock is stopped. Power monitoring is supported
by on-chip Power-on Reset (POR), Brown-out Detector (BOD), and Supply Monitor (SM). The
device features several oscillators, such as Phase Locked Loop (PLL), Digital Frequency
Locked Loop (DFLL), Oscillator 0 (OSC0), and system RC oscillator (RCSYS). Either of these
oscillators can be used as source for the system clock. The DFLL is a programmable internal
oscillator from 20 to 150MHz. It can be tuned to a high accuracy if an accurate reference clock is
running, e.g. the 32KHz crystal oscillator.
The Watchdog Timer (WDT) will reset the device unless it is periodically serviced by the soft-
ware. This allows the device to recover from a condition that has caused the system to be
unstable.
The Asynchronous Timer (AST) combined with the 32KHz crystal oscillator supports powerful
real-time clock capabilities, with a maximum timeout of up to 136 years. The AST can operate in
counter mode or calendar mode.
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The Frequency Meter (FREQM) allows accurate measuring of a clock frequency by comparing it
to a known reference clock.
The device includes six identical 16-bit Timer/Counter (TC) channels. Each channel can be inde-
pendently programmed to perform frequency measurement, event counting, interval
measurement, pulse generation, delay timing, and pulse width modulation.
The Pulse Width Modulation controller (PWMA) provides 8-bit PWM channels which can be syn-
chronized and controlled from a common timer. One PWM channel is available for each I/O pin
on the device, enabling applications that require multiple PWM outputs, such as LCD backlight
control. The PWM channels can operate independently, with duty cycles set individually, or in
interlinked mode, with multiple channels changed at the same time.
The AT32UC3L0128/256 also features many communication interfaces, like USART, SPI, and
TWI, for communication intensive applications. The USART supports different communication
modes, like SPI Mode and LIN Mode.
A general purpose 8-channel ADC is provided, as well as eight analog comparators (AC). The
ADC can operate in 10-bit mode at full speed or in enhanced mode at reduced speed, offering
up to 12-bit resolution. The ADC also provides an internal temperature sensor input channel.
The analog comparators can be paired to detect when the sensing voltage is within or outside
the defined reference window.
The Capacitive Touch (CAT) module senses touch on external capacitive touch sensors, using
the QTouch technology. Capacitive touch sensors use no external mechanical components,
unlike normal push buttons, and therefore demand less maintenance in the user application.
The CAT module allows up to 17 touch sensors, or up to 16 by 8 matrix sensors to be interfaced.
All touch sensors can be configured to operate autonomously without software interaction,
allowing wakeup from sleep modes when activated.
Atmel offers the QTouch library for embedding capacitive touch buttons, sliders, and wheels
functionality into AVR microcontrollers. The patented charge-transfer signal acquisition offers
robust sensing and includes fully debounced reporting of touch keys as well as Adjacent Key
Suppression® (AKS®) technology for unambiguous detection of key events. The easy-to-use
QTouch Suite toolchain allows you to explore, develop, and debug your own touch applications.
The AT32UC3L0128/256 integrates a class 2+ Nexus 2.0 On-chip Debug (OCD) System, with
non-intrusive real-time trace and full-speed read/write memory access, in addition to basic run-
time control. The NanoTrace interface enables trace feature for aWire- or JTAG-based
debuggers. The single-pin aWire interface allows all features available through the JTAG inter-
face to be accessed through the RESET pin, allowing the JTAG pins to be used for GPIO or
peripherals.
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2. Overview
2.1
Block Diagram
Figure 2-1. Block Diagram
MCKO
MDO[5..0]
MSEO[1..0]
EVTI_N
LOCAL BUS
LOCAL BUS
INTERFACE
AVR32UC CPU
EVTO_N
NEXUS
CLASS 2+
OCD
TCK
TDO
MEMORY PROTECTION UNIT
JTAG
32 KB
SRAM
TDI
TMS
INTERFACE
INSTR
INTERFACE
DATA
INTERFACE
DATAOUT
aWire
RESET_N
M
M
M
S
128/256 KB
FLASH
HIGH SPEED
BUS MATRIX
S/M
SAU
S
S
S
M
CONFIGURATION
REGISTERS BUS
PERIPHERAL
DMA
CONTROLLER
HSB-PB
BRIDGE A
HSB-PB
BRIDGE B
DIS
VDIVEN
CSA[16:0]
CSB[16:0]
SMP
POWER MANAGER
CAPACITIVE TOUCH
MODULE
CLOCK
CONTROLLER
PA
PB
SYNC
SLEEP
CONTROLLER
USART0
USART1
USART2
USART3
RXD
TXD
CLK
RESET
CONTROLLER
RTS, CTS
SCK
GCLK_IN[1..0]
GCLK[4..0]
MISO, MOSI
SPI
NPCS[3..0]
RCSYS
RC32OUT
RC32K
RC120M
OSC32K
OSC0
TWCK
PA
PB
TWI MASTER 0
TWI MASTER 1
TWD
SYSTEM CONTROL
INTERFACE
XIN32
XOUT32
TWALM
XIN0
XOUT0
TWCK
TWI SLAVE 0
TWI SLAVE 1
TWD
DFLL
TWALM
PLL
ADP[1..0]
TRIGGER
INTERRUPT
CONTROLLER
8-CHANNEL ADC
INTERFACE
AD[8..0]
ADVREFP
EXTINT[5..1]
NMI
EXTERNAL INTERRUPT
CONTROLLER
A[2..0]
TIMER/COUNTER 0
TIMER/COUNTER 1
B[2..0]
PWMA[35..0]
PWM CONTROLLER
CLK[2..0]
ASYNCHRONOUS
TIMER
ACBP[3..0]
ACBN[3..0]
ACAP[3..0]
ACAN[3..0]
ACREFN
AC INTERFACE
WATCHDOG
TIMER
FREQUENCY METER
OUT[1:0]
IN[7..0]
GLUE LOGIC
CONTROLLER
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2.2
Configuration Summary
Table 2-1.
Feature
Flash
Configuration Summary
AT32UC3L0256
AT32UC3L0128
256KB
128KB
SRAM
32KB
GPIO
36
5
High-drive pins
External Interrupts
TWI
6
2
USART
4
Peripheral DMA Channels
Peripheral Event System
SPI
12
1
1
Asynchronous Timers
Timer/Counter Channels
PWM channels
1
6
36
1
Frequency Meter
Watchdog Timer
Power Manager
Secure Access Unit
Glue Logic Controller
1
1
1
1
Digital Frequency Locked Loop 20-150 MHz (DFLL)
Phase Locked Loop 40-240 MHz (PLL)
Crystal Oscillator 0.45-16 MHz (OSC0)
Crystal Oscillator 32 KHz (OSC32K)
RC Oscillator 120MHz (RC120M)
Oscillators
RC Oscillator 115 kHz (RCSYS)
RC Oscillator 32 kHz (RC32K)
ADC
8-channel 12-bit
Temperature Sensor
Analog Comparators
Capacitive Touch Module
JTAG
1
8
1
1
aWire
1
Max Frequency
Packages
50 MHz
TQFP48/QFN48/TLLGA48
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3. Package and Pinout
3.1
Package
The device pins are multiplexed with peripheral functions as described in Section 3.2.1.
Figure 3-1. TQFP48/QFN48 Pinout
PA15
PA16
PA17
PA19
PA18
VDDIO
GND
PB11
GND
PA10
PA12
VDDIO
37
38
39
40
41
42
43
44
45
46
47
48
24
23
22
21
20
19
18
17
16
15
14
13
PA21
PB10
RESET_N
PB04
PB05
GND
VDDCORE
VDDIN
PB01
PA07
PA01
PA02
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Figure 3-2. TLLGA48 Pinout
24
23
22
21
20
19
18
17
16
15
14
PA21
PB10
RESET_N
PB04
PB05
PA16
PA17
PA19
PA18
VDDIO
GND
PB11
GND
PA10
PA12
VDDIO
38
39
40
41
42
43
44
45
46
47
48
GND
VDDCORE
VDDIN
PB01
PA07
PA01
3.2
Peripheral Multiplexing on I/O Lines
3.2.1
Multiplexed Signals
Each GPIO line can be assigned to one of the peripheral functions. The following table
describes the peripheral signals multiplexed to the GPIO lines.
Table 3-1.
GPIO Controller Function Multiplexing
G
P
I
GPIO Function
48-
Pin
pin
PIN
O
Supply
Type
A
B
C
D
E
F
G
H
Normal
I/O
U S A R T 0
TXD
U S A R T 1
RTS
S P I
NPCS[2]
P W M A
PWMA[0]
S C I F
GCLK[0]
C AT
CSA[2]
11
PA00
PA01
0
1
VDDIO
Normal
I/O
U S A R T 0
RXD
U S A R T 1
CTS
S P I
NPCS[3]
U S A R T 1
CLK
P W M A
PWMA[1]
ACIFB
ACAP[0]
T W I M S 0
TWALM
C AT
CSA[1]
14
VDDIO
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Table 3-1.
GPIO Controller Function Multiplexing
High-
drive I/O
U S A R T 0
RTS
A D C I F B
TRIGGER
U S A R T 2
TXD
T C 0
A0
P W M A
PWMA[2]
ACIFB
ACBP[0]
U S A R T 0
CLK
C AT
CSA[3]
13
PA02
2
3
4
5
VDDIO
VDDIO
VDDIO
VDDIO
Normal
I/O
U S A R T 0
CTS
S P I
NPCS[1]
U S A R T 2
TXD
T C 0
B0
P W M A
PWMA[3]
ACIFB
ACBN[3]
U S A R T 0
CLK
C AT
CSB[3]
4
PA03
PA04
PA05
Normal
I/O
S P I
MISO
T W I M S 0
TWCK
U S A R T 1
RXD
T C 0
B1
P W M A
PWMA[4]
ACIFB
ACBP[1]
C AT
CSA[7]
28
12
Normal
I/O (TWI)
S P I
MOSI
T W I M S 1
TWCK
U S A R T 1
TXD
T C 0
A1
P W M A
PWMA[5]
ACIFB
ACBN[0]
T W I M S 0
TWD
C AT
CSB[7]
High-
drive I/O,
5V
S P I
SCK
U S A R T 2
TXD
U S A R T 1
CLK
T C 0
B0
P W M A
PWMA[6]
EIC
EXTINT[2]
S C I F
GCLK[1]
C AT
CSB[1]
10
15
PA06
PA07
6
7
VDDIO
VDDIO
tolerant
E I C
NMI
(EXTINT[0])
Normal
I/O (TWI)
S P I
NPCS[0]
U S A R T 2
RXD
T W I M S 1
TWALM
T W I M S 0
TWCK
P W M A
PWMA[7]
ACIFB
ACAN[0]
C AT
CSB[2]
High-
drive I/O
U S A R T 1
TXD
S P I
NPCS[2]
T C 0
A2
A D C I F B
ADP[0]
P W M A
PWMA[8]
C AT
CSA[4]
3
PA08
PA09
PA10
PA11
PA12
PA13
PA14
PA15
PA16
PA17
PA18
PA19
PA20
8
VDDIO
VDDIO
VDDIO
VDDIN
VDDIO
VDDIN
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIN
High-
drive I/O
U S A R T 1
RXD
S P I
NPCS[3]
T C 0
B2
A D C I F B
ADP[1]
P W M A
PWMA[9]
SCIF
GCLK[2]
E I C
EXTINT[1]
C AT
CSB[4]
2
9
Normal
I/O
T W I M S 0
TWD
T C 0
A0
P W M A
PWMA[10]
ACIFB
ACAP[1]
S C I F
GCLK[2]
C AT
CSA[5]
46
27
47
26
36
37
38
39
41
40
25
10
11
12
13
14
15
16
17
18
19
20
Normal
I/O
P W M A
PWMA[11]
Normal
I/O
U S A R T 2
CLK
T C 0
CLK1
C AT
SMP
P W M A
PWMA[12]
ACIFB
ACAN[1]
S C I F
GCLK[3]
C AT
CSB[5]
Normal
I/O
G L O C
OUT[0]
G L O C
IN[7]
T C 0
A0
S C I F
GCLK[2]
P W M A
PWMA[13]
CAT
SMP
E I C
EXTINT[2]
C AT
CSA[0]
Normal
I/O
A D C I F B
AD[0]
T C 0
CLK2
U S A R T 2
RTS
C AT
SMP
P W M A
PWMA[14]
S C I F
GCLK[4]
C AT
CSA[6]
Normal
I/O
A D C I F B
AD[1]
T C 0
CLK1
G L O C
IN[6]
P W M A
PWMA[15]
CAT
SYNC
E I C
EXTINT[3]
C AT
CSB[6]
Normal
I/O
A D C I F B
AD[2]
T C 0
CLK0
G L O C
IN[5]
P W M A
PWMA[16]
ACIFB
ACREFN
E I C
EXTINT[4]
C AT
CSA[8]
Normal
I/O (TWI)
T C 0
A1
U S A R T 2
CTS
T W I M S 1
TWD
P W M A
PWMA[17]
CAT
SMP
C AT
DIS
C AT
CSB[8]
Normal
I/O
A D C I F B
AD[4]
T C 0
B1
G L O C
IN[4]
P W M A
PWMA[18]
CAT
SYNC
E I C
EXTINT[5]
C AT
CSB[0]
Normal
I/O
A D C I F B
AD[5]
T C 0
A2
T W I M S 1
TWALM
P W M A
PWMA[19]
SCIF
GCLK_IN[0]
C AT
SYNC
C AT
CSA[10]
Normal
I/O
U S A R T 2
TXD
T C 0
A1
G L O C
IN[3]
P W M A
PWMA[20]
SCIF
RC32OUT
C AT
CSA[12]
Normal
I/O (TWI,
5V
tolerant,
SMBus)
U S A R T 2
RXD
T W I M S 0
TWD
T C 0
B1
A D C I F B
TRIGGER
P W M A
PWMA[21]
P WM A
PWMAOD[21]
S C I F
GCLK[0]
C AT
SMP
24
PA21
21
VDDIN
Normal
I/O
U S A R T 0
CTS
U S A R T 2
CLK
T C 0
B2
C AT
SMP
P W M A
PWMA[22]
ACIFB
ACBN[2]
C AT
CSB[10]
9
6
PA22
PB00
PB01
PB02
22
32
33
34
VDDIO
VDDIO
VDDIO
VDDIO
Normal
I/O
U S A R T 3
TXD
A D C I F B
ADP[0]
S P I
NPCS[0]
T C 0
A1
P W M A
PWMA[23]
ACIFB
ACAP[2]
T C 1
A0
C AT
CSA[9]
High-
drive I/O
U S A R T 3
RXD
A D C I F B
ADP[1]
S P I
SCK
T C 0
B1
P W M A
PWMA[24]
T C 1
A1
C AT
CSB[9]
16
7
Normal
I/O
U S A R T 3
RTS
U S A R T 3
CLK
S P I
MISO
T C 0
A2
P W M A
PWMA[25]
ACIFB
ACAN[2]
S C I F
GCLK[1]
C AT
CSB[11]
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Table 3-1.
GPIO Controller Function Multiplexing
Normal
I/O
U S A R T 3
CTS
U S A R T 3
CLK
S P I
MOSI
T C 0
B2
P W M A
PWMA[26]
ACIFB
ACBP[2]
T C 1
A2
C AT
CSA[11]
8
PB03
35
VDDIO
Normal
I/O (TWI,
5V
tolerant,
SMBus)
T C 1
A0
U S A R T 1
RTS
U S A R T 1
CLK
T W I M S 0
TWALM
P W M A
PWMA[27]
P WM A
PWMAOD[27]
T W I M S 1
TWCK
C AT
CSA[14]
21
PB04
36
VDDIN
Normal
I/O (TWI,
5V
tolerant,
SMBus)
T C 1
B0
U S A R T 1
CTS
U S A R T 1
CLK
T W I M S 0
TWCK
P W M A
PWMA[28]
P WM A
PWMAOD[28]
S C I F
GCLK[3]
C AT
CSB[14]
20
30
PB05
PB06
37
38
VDDIN
VDDIO
E I C
NMI
(EXTINT[0])
Normal
I/O
T C 1
A1
U S A R T 3
TXD
A D C I F B
AD[6]
G L O C
IN[2]
P W M A
PWMA[29]
ACIFB
ACAN[3]
C AT
CSB[13]
Normal
I/O
T C 1
B1
U S A R T 3
RXD
A D C I F B
AD[7]
G L O C
IN[1]
P W M A
PWMA[30]
ACIFB
ACAP[3]
E I C
EXTINT[1]
C AT
CSA[13]
31
32
29
23
44
5
PB07
PB08
PB09
PB10
PB11
PB12
39
40
41
42
43
44
VDDIO
VDDIO
VDDIO
VDDIN
VDDIO
VDDIO
Normal
I/O
T C 1
A2
U S A R T 3
RTS
A D C I F B
AD[8]
G L O C
IN[0]
P W M A
PWMA[31]
CAT
SYNC
E I C
EXTINT[2]
C AT
CSB[12]
Normal
I/O
T C 1
B2
U S A R T 3
CTS
U S A R T 3
CLK
P W M A
PWMA[32]
ACIFB
ACBN[1]
E I C
EXTINT[3]
C AT
CSB[15]
Normal
I/O
T C 1
CLK0
U S A R T 1
TXD
U S A R T 3
CLK
G L O C
OUT[1]
P W M A
PWMA[33]
SCIF
GCLK_IN[1]
E I C
EXTINT[4]
C AT
CSB[16]
Normal
I/O
T C 1
CLK1
U S A R T 1
RXD
A D C I F B
TRIGGER
P W M A
PWMA[34]
CAT
VDIVEN
E I C
EXTINT[5]
C AT
CSA[16]
Normal
I/O
T C 1
CLK2
T W I M S 1
TWALM
C AT
SYNC
P W M A
PWMA[35]
ACIFB
ACBP[3]
S C I F
GCLK[4]
C AT
CSA[15]
See Section 3.3 for a description of the various peripheral signals.
Refer to ”Electrical Characteristics” on page 41 for a description of the electrical properties of the
pin types used.
3.2.2
TWI, 5V Tolerant, and SMBUS Pins
Some normal I/O pins offer TWI, 5V tolerance, and SMBUS features. These features are only
available when either of the TWI functions or the PWMAOD function in the PWMA are selected
for these pins.
Refer to the ”TWI Pin Characteristics(1)” on page 48 for a description of the electrical properties
of the TWI, 5V tolerance, and SMBUS pins.
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3.2.3
Peripheral Functions
Each GPIO line can be assigned to one of several peripheral functions. The following table
describes how the various peripheral functions are selected. The last listed function has priority
in case multiple functions are enabled on the same pin.
Table 3-2.
Function
Peripheral Functions
Description
GPIO Controller Function multiplexing
Nexus OCD AUX port connections
aWire DATAOUT
GPIO and GPIO peripheral selection A to H
OCD trace system
aWire output in two-pin mode
JTAG debug port
JTAG port connections
Oscillators
OSC0, OSC32
3.2.4
JTAG Port Connections
If the JTAG is enabled, the JTAG will take control over a number of pins, irrespectively of the I/O
Controller configuration.
Table 3-3.
JTAG Pinout
48-pin
Pin name
PA00
JTAG pin
TCK
11
14
13
4
PA01
TMS
PA02
TDO
PA03
TDI
3.2.5
Nexus OCD AUX Port Connections
If the OCD trace system is enabled, the trace system will take control over a number of pins, irre-
spectively of the I/O Controller configuration. Two different OCD trace pin mappings are
possible, depending on the configuration of the OCD AXS register. For details, see the AVR32
UC Technical Reference Manual.
Table 3-4.
Pin
Nexus OCD AUX Port Connections
AXS=1
PA05
PA10
PA18
PA17
PA16
PA15
PA14
AXS=0
PB08
PB00
PB04
PB05
PB03
PB02
PB09
EVTI_N
MDO[5]
MDO[4]
MDO[3]
MDO[2]
MDO[1]
MDO[0]
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Table 3-4.
Pin
Nexus OCD AUX Port Connections
AXS=1
PA04
PA06
PA07
PA11
AXS=0
PA04
EVTO_N
MCKO
PB01
PB11
PB12
MSEO[1]
MSEO[0]
3.2.6
Oscillator Pinout
The oscillators are not mapped to the normal GPIO functions and their muxings are controlled
by registers in the System Control Interface (SCIF). Please refer to the SCIF chapter for more
information about this.
Table 3-5.
Oscillator Pinout
48-pin
Pin Name
PA08
Oscillator Pin
XIN0
3
46
26
2
PA10
XIN32
PA13
XIN32_2
XOUT0
PA09
47
25
PA12
XOUT32
XOUT32_2
PA20
3.2.7
Other Functions
The functions listed in Table 3-6 are not mapped to the normal GPIO functions. The aWire DATA
pin will only be active after the aWire is enabled. The aWire DATAOUT pin will only be active
after the aWire is enabled and the 2_PIN_MODE command has been sent. The WAKE_N pin is
always enabled. Please refer to Section 6.1.4 on page 40 for constraints on the WAKE_N pin.
Table 3-6.
Other Functions
48-pin
Pin
PA11
Function
WAKE_N
27
22
11
RESET_N
PA00
aWire DATA
aWire DATAOUT
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3.3
Signal Descriptions
The following table gives details on signal names classified by peripheral.
Table 3-7.
Signal Descriptions List
Function
Active
Level
Signal Name
Type
Comments
Analog Comparator Interface - ACIFB
ACAN3 - ACAN0
ACAP3 - ACAP0
ACBN3 - ACBN0
ACBP3 - ACBP0
ACREFN
Negative inputs for comparators "A"
Positive inputs for comparators "A"
Negative inputs for comparators "B"
Positive inputs for comparators "B"
Common negative reference
Analog
Analog
Analog
Analog
Analog
ADC Interface - ADCIFB
AD8 - AD0
ADP1 - ADP0
TRIGGER
Analog Signal
Analog
Output
Input
Drive Pin for resistive touch screen
External trigger
aWire - AW
DATA
aWire data
I/O
I/O
DATAOUT
aWire data output for 2-pin mode
Capacitive Touch Module - CAT
CSA16 - CSA0
CSB16 - CSB0
DIS
Capacitive Sense A
Capacitive Sense B
I/O
I/O
Discharge current control
SMP signal
Analog
Output
Input
SMP
SYNC
Synchronize signal
Voltage divider enable
VDIVEN
Output
External Interrupt Controller - EIC
NMI (EXTINT0)
Non-Maskable Interrupt
Input
EXTINT5 - EXTINT1
External interrupt
Input
Glue Logic Controller - GLOC
Input
IN7 - IN0
Inputs to lookup tables
OUT1 - OUT0
Outputs from lookup tables
Output
JTAG module - JTAG
TCK
TDI
Test Clock
Input
Input
Test Data In
TDO
TMS
Test Data Out
Test Mode Select
Output
Input
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Table 3-7.
Signal Descriptions List
Reset
Power Manager - PM
Input
Pulse Width Modulation Controller - PWMA
RESET_N
Low
PWMA35 - PWMA0
PWMA channel waveforms
Output
Output
PWMAOD35 -
PWMAOD0
PWMA channel waveforms, open drain
mode
Not all channels support open
drain mode
System Control Interface - SCIF
GCLK4 - GCLK0
Generic Clock Output
Output
Input
GCLK_IN1 - GCLK_IN0 Generic Clock Input
RC32OUT
XIN0
RC32K output at startup
Output
Analog/
Digital
Crystal 0 Input
Analog/
Digital
XIN32
Crystal 32 Input (primary location)
Crystal 32 Input (secondary location)
Analog/
Digital
XIN32_2
XOUT0
Crystal 0 Output
Analog
Analog
Analog
XOUT32
XOUT32_2
Crystal 32 Output (primary location)
Crystal 32 Output (secondary location)
Serial Peripheral Interface - SPI
MISO
Master In Slave Out
Master Out Slave In
I/O
I/O
MOSI
NPCS3 - NPCS0
SCK
SPI Peripheral Chip Select
Clock
I/O
Low
I/O
Timer/Counter - TC0, TC1
A0
Channel 0 Line A
Channel 1 Line A
Channel 2 Line A
Channel 0 Line B
Channel 1 Line B
Channel 2 Line B
I/O
I/O
I/O
I/O
I/O
I/O
A1
A2
B0
B1
B2
CLK0
CLK1
CLK2
Channel 0 External Clock Input
Channel 1 External Clock Input
Channel 2 External Clock Input
Input
Input
Input
Two-wire Interface - TWIMS0, TWIMS1
TWALM
TWCK
TWD
SMBus SMBALERT
I/O
I/O
I/O
Low
Two-wire Serial Clock
Two-wire Serial Data
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Table 3-7.
Signal Descriptions List
Universal Synchronous Asynchronous Receiver Transmitter - USART0, USART1, USART2, USART3
CLK
CTS
RTS
RXD
TXD
Clock
I/O
Clear To Send
Request To Send
Receive Data
Transmit Data
Input
Low
Low
Output
Input
Output
Note:
1. ADCIFB: AD3 does not exist.
Table 3-8.
Signal Description List, Continued
Active
Level
Signal Name
Function
Type
Comments
Power
Power
Input/Output
VDDCORE
VDDIO
Core Power Supply / Voltage Regulator Output
I/O Power Supply
1.62V to 1.98V
1.62V to 3.6V. VDDIO should
always be equal to or lower than
VDDIN.
Power Input
VDDANA
ADVREFP
VDDIN
Analog Power Supply
Analog Reference Voltage
Voltage Regulator Input
Analog Ground
Power Input
Power Input
Power Input
Ground
1.62V to 1.98V
1.62V to 1.98V
1.62V to 3.6V (1)
GNDANA
GND
Ground
Ground
Auxiliary Port - AUX
MCKO
Trace Data Output Clock
Trace Data Output
Trace Frame Control
Event In
Output
Output
Output
Input
MDO5 - MDO0
MSEO1 - MSEO0
EVTI_N
Low
Low
EVTO_N
Event Out
Output
General Purpose I/O pin
PA22 - PA00
PB12 - PB00
Parallel I/O Controller I/O Port 0
Parallel I/O Controller I/O Port 1
I/O
I/O
1.
See Section 6.1 on page 36
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3.4
I/O Line Considerations
3.4.1
JTAG Pins
The JTAG is enabled if TCK is low while the RESET_N pin is released. The TCK, TMS, and TDI
pins have pull-up resistors when JTAG is enabled. The TCK pin always has pull-up enabled dur-
ing reset. The TDO pin is an output, driven at VDDIO, and has no pull-up resistor. The JTAG
pins can be used as GPIO pins and multiplexed with peripherals when the JTAG is disabled.
Please refer to Section 3.2.4 on page 11 for the JTAG port connections.
3.4.2
3.4.3
PA00
Note that PA00 is multiplexed with TCK. PA00 GPIO function must only be used as output in the
application.
RESET_N Pin
The RESET_N pin is a schmitt input and integrates a permanent pull-up resistor to VDDIN. As
the product integrates a power-on reset detector, the RESET_N pin can be left unconnected in
case no reset from the system needs to be applied to the product.
The RESET_N pin is also used for the aWire debug protocol. When the pin is used for debug-
ging, it must not be driven by external circuitry.
3.4.4
TWI Pins PA21/PB04/PB05
When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation and
inputs with spike filtering. When used as GPIO pins or used for other peripherals, the pins have
the same characteristics as other GPIO pins. Selected pins are also SMBus compliant (refer to
Section 3.2.1 on page 8). As required by the SMBus specification, these pins provide no leakage
path to ground when the AT32UC3L0128/256 is powered down. This allows other devices on
the SMBus to continue communicating even though the AT32UC3L0128/256 is not powered.
After reset a TWI function is selected on these pins instead of the GPIO. Please refer to the
GPIO Module Configuration chapter for details.
3.4.5
TWI Pins PA05/PA07/PA17
When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation and
inputs with spike filtering. When used as GPIO pins or used for other peripherals, the pins have
the same characteristics as other GPIO pins.
After reset a TWI function is selected on these pins instead of the GPIO. Please refer to the
GPIO Module Configuration chapter for details.
3.4.6
3.4.7
GPIO Pins
All the I/O lines integrate a pull-up resistor. Programming of this pull-up resistor is performed
independently for each I/O line through the GPIO Controllers. After reset, I/O lines default as
inputs with pull-up resistors disabled, except PA00 which has the pull-up resistor enabled. PA20
selects SCIF-RC32OUT (GPIO Function F) as default enabled after reset.
High-drive Pins
The five pins PA02, PA06, PA08, PA09, and PB01 have high-drive output capabilities. Refer to
Section 7. on page 41 for electrical characteristics.
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3.4.8
RC32OUT Pin
3.4.8.1
Clock output at startup
After power-up, the clock generated by the 32kHz RC oscillator (RC32K) will be output on PA20,
even when the device is still reset by the Power-On Reset Circuitry. This clock can be used by
the system to start other devices or to clock a switching regulator to rise the power supply volt-
age up to an acceptable value.
The clock will be available on PA20, but will be disabled if one of the following conditions are
true:
• PA20 is configured to use a GPIO function other than F (SCIF-RC32OUT)
• PA20 is configured as a General Purpose Input/Output (GPIO)
• The bit FRC32 in the Power Manager PPCR register is written to zero (refer to the Power
Manager chapter)
The maximum amplitude of the clock signal will be defined by VDDIN.
Once the RC32K output on PA20 is disabled it can never be enabled again.
3.4.8.2
XOUT32_2 function
PA20 selects RC32OUT as default enabled after reset. This function is not automatically dis-
abled when the user enables the XOUT32_2 function on PA20. This disturbs the oscillator and
may result in the wrong frequency. To avoid this, RC32OUT must be disabled when XOUT32_2
is enabled.
3.4.9
ADC Input Pins
These pins are regular I/O pins powered from the VDDIO. However, when these pins are used
for ADC inputs, the voltage applied to the pin must not exceed 1.98V. Internal circuitry ensures
that the pin cannot be used as an analog input pin when the I/O drives to VDD. When the pins
are not used for ADC inputs, the pins may be driven to the full I/O voltage range.
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4. Processor and Architecture
Rev: 2.1.2.0
This chapter gives an overview of the AVR32UC CPU. AVR32UC is an implementation of the
AVR32 architecture. A summary of the programming model, instruction set, and MPU is pre-
sented. For further details, see the AVR32 Architecture Manual and the AVR32UC Technical
Reference Manual.
4.1
Features
• 32-bit load/store AVR32A RISC architecture
– 15 general-purpose 32-bit registers
– 32-bit Stack Pointer, Program Counter and Link Register reside in register file
– Fully orthogonal instruction set
– Privileged and unprivileged modes enabling efficient and secure operating systems
– Innovative instruction set together with variable instruction length ensuring industry leading
code density
– DSP extension with saturating arithmetic, and a wide variety of multiply instructions
• 3-stage pipeline allowing one instruction per clock cycle for most instructions
– Byte, halfword, word, and double word memory access
– Multiple interrupt priority levels
• MPU allows for operating systems with memory protection
• Secure State for supporting FlashVault technology
4.2
AVR32 Architecture
AVR32 is a new, high-performance 32-bit RISC microprocessor architecture, designed for cost-
sensitive embedded applications, with particular emphasis on low power consumption and high
code density. In addition, the instruction set architecture has been tuned to allow a variety of
microarchitectures, enabling the AVR32 to be implemented as low-, mid-, or high-performance
processors. AVR32 extends the AVR family into the world of 32- and 64-bit applications.
Through a quantitative approach, a large set of industry recognized benchmarks has been com-
piled and analyzed to achieve the best code density in its class. In addition to lowering the
memory requirements, a compact code size also contributes to the core’s low power characteris-
tics. The processor supports byte and halfword data types without penalty in code size and
performance.
Memory load and store operations are provided for byte, halfword, word, and double word data
with automatic sign- or zero extension of halfword and byte data. The C-compiler is closely
linked to the architecture and is able to exploit code optimization features, both for size and
speed.
In order to reduce code size to a minimum, some instructions have multiple addressing modes.
As an example, instructions with immediates often have a compact format with a smaller imme-
diate, and an extended format with a larger immediate. In this way, the compiler is able to use
the format giving the smallest code size.
Another feature of the instruction set is that frequently used instructions, like add, have a com-
pact format with two operands as well as an extended format with three operands. The larger
format increases performance, allowing an addition and a data move in the same instruction in a
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single cycle. Load and store instructions have several different formats in order to reduce code
size and speed up execution.
The register file is organized as sixteen 32-bit registers and includes the Program Counter, the
Link Register, and the Stack Pointer. In addition, register R12 is designed to hold return values
from function calls and is used implicitly by some instructions.
4.3
The AVR32UC CPU
The AVR32UC CPU targets low- and medium-performance applications, and provides an
advanced On-Chip Debug (OCD) system, no caches, and a Memory Protection Unit (MPU).
Java acceleration hardware is not implemented.
AVR32UC provides three memory interfaces, one High Speed Bus master for instruction fetch,
one High Speed Bus master for data access, and one High Speed Bus slave interface allowing
other bus masters to access data RAMs internal to the CPU. Keeping data RAMs internal to the
CPU allows fast access to the RAMs, reduces latency, and guarantees deterministic timing.
Also, power consumption is reduced by not needing a full High Speed Bus access for memory
accesses. A dedicated data RAM interface is provided for communicating with the internal data
RAMs.
A local bus interface is provided for connecting the CPU to device-specific high-speed systems,
such as floating-point units and I/O controller ports. This local bus has to be enabled by writing a
one to the LOCEN bit in the CPUCR system register. The local bus is able to transfer data
between the CPU and the local bus slave in a single clock cycle. The local bus has a dedicated
memory range allocated to it, and data transfers are performed using regular load and store
instructions. Details on which devices that are mapped into the local bus space is given in the
CPU Local Bus section in the Memories chapter.
Figure 4-1 on page 20 displays the contents of AVR32UC.
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Figure 4-1. Overview of the AVR32UC CPU
Power/
Reset
control
OCD
system
AVR32UC CPU pipeline
MPU
Data memory controller
Instruction memory controller
High Speed Bus master
High
Speed
CPU Local
Bus
High Speed
Bus master
CPU RAM
Bus slave
master
4.3.1
Pipeline Overview
AVR32UC has three pipeline stages, Instruction Fetch (IF), Instruction Decode (ID), and Instruc-
tion Execute (EX). The EX stage is split into three parallel subsections, one arithmetic/logic
(ALU) section, one multiply (MUL) section, and one load/store (LS) section.
Instructions are issued and complete in order. Certain operations require several clock cycles to
complete, and in this case, the instruction resides in the ID and EX stages for the required num-
ber of clock cycles. Since there is only three pipeline stages, no internal data forwarding is
required, and no data dependencies can arise in the pipeline.
Figure 4-2 on page 21 shows an overview of the AVR32UC pipeline stages.
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Figure 4-2. The AVR32UC Pipeline
MUL
Multiply unit
ALU unit
Regfile
Read
Regfile
write
IF
ID
ALU
LS
Prefetch unit
Decode unit
Load-store
unit
4.3.2
AVR32A Microarchitecture Compliance
AVR32UC implements an AVR32A microarchitecture. The AVR32A microarchitecture is tar-
geted at cost-sensitive, lower-end applications like smaller microcontrollers. This
microarchitecture does not provide dedicated hardware registers for shadowing of register file
registers in interrupt contexts. Additionally, it does not provide hardware registers for the return
address registers and return status registers. Instead, all this information is stored on the system
stack. This saves chip area at the expense of slower interrupt handling.
4.3.2.1
Interrupt Handling
Upon interrupt initiation, registers R8-R12 are automatically pushed to the system stack. These
registers are pushed regardless of the priority level of the pending interrupt. The return address
and status register are also automatically pushed to stack. The interrupt handler can therefore
use R8-R12 freely. Upon interrupt completion, the old R8-R12 registers and status register are
restored, and execution continues at the return address stored popped from stack.
The stack is also used to store the status register and return address for exceptions and scall.
Executing the rete or rets instruction at the completion of an exception or system call will pop
this status register and continue execution at the popped return address.
4.3.2.2
4.3.2.3
Java Support
AVR32UC does not provide Java hardware acceleration.
Memory Protection
The MPU allows the user to check all memory accesses for privilege violations. If an access is
attempted to an illegal memory address, the access is aborted and an exception is taken. The
MPU in AVR32UC is specified in the AVR32UC Technical Reference manual.
4.3.2.4
Unaligned Reference Handling
AVR32UC does not support unaligned accesses, except for doubleword accesses. AVR32UC is
able to perform word-aligned st.d and ld.d. Any other unaligned memory access will cause an
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address exception. Doubleword-sized accesses with word-aligned pointers will automatically be
performed as two word-sized accesses.
The following table shows the instructions with support for unaligned addresses. All other
instructions require aligned addresses.
Table 4-1.
Instruction
ld.d
Instructions with Unaligned Reference Support
Supported Alignment
Word
Word
st.d
4.3.2.5
Unimplemented Instructions
The following instructions are unimplemented in AVR32UC, and will cause an Unimplemented
Instruction Exception if executed:
• All SIMD instructions
• All coprocessor instructions if no coprocessors are present
• retj, incjosp, popjc, pushjc
• tlbr, tlbs, tlbw
• cache
4.3.2.6
CPU and Architecture Revision
Three major revisions of the AVR32UC CPU currently exist. The device described in this
datasheet uses CPU revision 3.
The Architecture Revision field in the CONFIG0 system register identifies which architecture
revision is implemented in a specific device.
AVR32UC CPU revision 3 is fully backward-compatible with revisions 1 and 2, ie. code compiled
for revision 1 or 2 is binary-compatible with revision 3 CPUs.
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4.4
Programming Model
4.4.1
Register File Configuration
The AVR32UC register file is shown below.
Figure 4-3. The AVR32UC Register File
Supervisor
INT0
Bit 31
INT1
Bit 31
INT2
Bit 31
INT3
Bit 31
Exception
NMI
Secure
Bit 31
Application
Bit 31
Bit 0
Bit 31
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 31
Bit 0
Bit 31
Bit 0
Bit 0
PC
LR
PC
LR
PC
LR
PC
LR
PC
LR
PC
LR
PC
LR
PC
LR
PC
LR
SP_APP
R12
SP_SYS
R12
SP_SYS
R12
SP_SYS
R12
SP_SYS
R12
SP_SYS
R12
SP_SYS
R12
SP_SYS
R12
SP_SEC
R12
R11
R11
R11
R11
R11
R11
R11
R11
R11
R10
R10
R10
R10
R10
R10
R10
R10
R10
R9
R9
R9
R9
R9
R9
R9
R9
R9
R8
R8
R8
R8
R8
R8
R8
R8
R8
R7
R6
R5
R4
R3
R7
R6
R5
R4
R3
R7
R6
R5
R4
R3
R7
R6
R5
R4
R3
R7
R6
R5
R4
R3
R7
R6
R5
R4
R3
R7
R6
R5
R4
R3
R7
R6
R5
R4
R3
R7
R6
R5
R4
R3
R2
R2
R2
R2
R2
R2
R2
R2
R2
R1
R1
R1
R1
R1
R1
R1
R1
R1
R0
R0
R0
R0
R0
R0
R0
R0
R0
SR
SR
SR
SR
SR
SR
SR
SR
SR
SS_STATUS
SS_ADRF
SS_ADRR
SS_ADR0
SS_ADR1
SS_SP_SYS
SS_SP_APP
SS_RAR
SS_RSR
4.4.2
Status Register Configuration
The Status Register (SR) is split into two halfwords, one upper and one lower, see Figure 4-4
and Figure 4-5. The lower word contains the C, Z, N, V, and Q condition code flags and the R, T,
and L bits, while the upper halfword contains information about the mode and state the proces-
sor executes in. Refer to the AVR32 Architecture Manual for details.
Figure 4-4. The Status Register High Halfword
Bit 31
Bit 16
-
SS
-
-
DM
0
D
0
-
M2
0
M1
0
M0
1
EM
1
I3M I2M I1M I0M GM
Bit name
0
0
0
0
0
0
0
0
0
1
Initial value
Global Interrupt Mask
Interrupt Level 0 Mask
Interrupt Level 1 Mask
Interrupt Level 2 Mask
Interrupt Level 3 Mask
Exception Mask
Mode Bit 0
Mode Bit 1
Mode Bit 2
Reserved
Debug State
Debug State Mask
Reserved
Secure State
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Figure 4-5. The Status Register Low Halfword
Bit 15
Bit 0
-
T
0
-
-
-
-
-
-
-
-
L
0
Q
0
V
0
N
0
Z
0
C
0
Bit name
0
0
0
0
0
0
0
0
0
Initial value
Carry
Zero
Sign
Overflow
Saturation
Lock
Reserved
Scratch
Reserved
4.4.3
Processor States
4.4.3.1
Normal RISC State
The AVR32 processor supports several different execution contexts as shown in Table 4-2.
Table 4-2.
Overview of Execution Modes, their Priorities and Privilege Levels.
Priority
Mode
Security
Description
1
Non Maskable Interrupt
Exception
Privileged
Privileged
Privileged
Privileged
Privileged
Privileged
Privileged
Unprivileged
Non Maskable high priority interrupt mode
Execute exceptions
2
3
Interrupt 3
General purpose interrupt mode
General purpose interrupt mode
General purpose interrupt mode
General purpose interrupt mode
Runs supervisor calls
4
Interrupt 2
5
Interrupt 1
6
Interrupt 0
N/A
N/A
Supervisor
Application
Normal program execution mode
Mode changes can be made under software control, or can be caused by external interrupts or
exception processing. A mode can be interrupted by a higher priority mode, but never by one
with lower priority. Nested exceptions can be supported with a minimal software overhead.
When running an operating system on the AVR32, user processes will typically execute in the
application mode. The programs executed in this mode are restricted from executing certain
instructions. Furthermore, most system registers together with the upper halfword of the status
register cannot be accessed. Protected memory areas are also not available. All other operating
modes are privileged and are collectively called System Modes. They have full access to all priv-
ileged and unprivileged resources. After a reset, the processor will be in supervisor mode.
4.4.3.2
Debug State
The AVR32 can be set in a debug state, which allows implementation of software monitor rou-
tines that can read out and alter system information for use during application development. This
implies that all system and application registers, including the status registers and program
counters, are accessible in debug state. The privileged instructions are also available.
All interrupt levels are by default disabled when debug state is entered, but they can individually
be switched on by the monitor routine by clearing the respective mask bit in the status register.
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Debug state can be entered as described in the AVR32UC Technical Reference Manual.
Debug state is exited by the retd instruction.
4.4.3.3
Secure State
The AVR32 can be set in a secure state, that allows a part of the code to execute in a state with
higher security levels. The rest of the code can not access resources reserved for this secure
code. Secure State is used to implement FlashVault technology. Refer to the AVR32UC Techni-
cal Reference Manual for details.
4.4.4
System Registers
The system registers are placed outside of the virtual memory space, and are only accessible
using the privileged mfsr and mtsr instructions. The table below lists the system registers speci-
fied in the AVR32 architecture, some of which are unused in AVR32UC. The programmer is
responsible for maintaining correct sequencing of any instructions following a mtsr instruction.
For detail on the system registers, refer to the AVR32UC Technical Reference Manual.
Table 4-3.
System Registers
Reg #
0
Address
0
Name
Function
SR
Status Register
1
4
EVBA
Exception Vector Base Address
Application Call Base Address
CPU Control Register
Exception Cause Register
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Return Status Register for Debug mode
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
Return Address Register for Debug mode
Unused in AVR32UC
Unused in AVR32UC
Unused in AVR32UC
2
8
ACBA
3
12
16
20
24
28
32
36
40
44
48
52
56
60
64
68
72
76
80
84
88
92
CPUCR
4
ECR
5
RSR_SUP
RSR_INT0
RSR_INT1
RSR_INT2
RSR_INT3
RSR_EX
RSR_NMI
RSR_DBG
RAR_SUP
RAR_INT0
RAR_INT1
RAR_INT2
RAR_INT3
RAR_EX
RAR_NMI
RAR_DBG
JECR
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
JOSP
JAVA_LV0
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Table 4-3.
Reg #
24
System Registers (Continued)
Address
96
Name
Function
JAVA_LV1
JAVA_LV2
JAVA_LV3
JAVA_LV4
JAVA_LV5
JAVA_LV6
JAVA_LV7
JTBA
Unused in AVR32UC
25
100
104
108
112
116
120
124
128
132-252
256
260
264
268
272
276
280
284
288
292
296
300
304
308
312
316
320
324
328
332
336
340
344
348
352
356
Unused in AVR32UC
26
Unused in AVR32UC
27
Unused in AVR32UC
28
Unused in AVR32UC
29
Unused in AVR32UC
30
Unused in AVR32UC
31
Unused in AVR32UC
32
JBCR
Unused in AVR32UC
33-63
64
Reserved
CONFIG0
CONFIG1
COUNT
Reserved for future use
Configuration register 0
Configuration register 1
Cycle Counter register
65
66
67
COMPARE
TLBEHI
Compare register
68
Unused in AVR32UC
69
TLBELO
PTBR
Unused in AVR32UC
70
Unused in AVR32UC
71
TLBEAR
MMUCR
TLBARLO
TLBARHI
PCCNT
Unused in AVR32UC
72
Unused in AVR32UC
73
Unused in AVR32UC
74
Unused in AVR32UC
75
Unused in AVR32UC
76
PCNT0
Unused in AVR32UC
77
PCNT1
Unused in AVR32UC
78
PCCR
Unused in AVR32UC
79
BEAR
Bus Error Address Register
MPU Address Register region 0
MPU Address Register region 1
MPU Address Register region 2
MPU Address Register region 3
MPU Address Register region 4
MPU Address Register region 5
MPU Address Register region 6
MPU Address Register region 7
MPU Privilege Select Register region 0
MPU Privilege Select Register region 1
80
MPUAR0
MPUAR1
MPUAR2
MPUAR3
MPUAR4
MPUAR5
MPUAR6
MPUAR7
MPUPSR0
MPUPSR1
81
82
83
84
85
86
87
88
89
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Table 4-3.
Reg #
90
System Registers (Continued)
Address
360
Name
Function
MPUPSR2
MPUPSR3
MPUPSR4
MPUPSR5
MPUPSR6
MPUPSR7
MPUCRA
MPUCRB
MPUBRA
MPUBRB
MPUAPRA
MPUAPRB
MPUCR
MPU Privilege Select Register region 2
MPU Privilege Select Register region 3
MPU Privilege Select Register region 4
MPU Privilege Select Register region 5
MPU Privilege Select Register region 6
MPU Privilege Select Register region 7
Unused in this version of AVR32UC
Unused in this version of AVR32UC
Unused in this version of AVR32UC
Unused in this version of AVR32UC
MPU Access Permission Register A
MPU Access Permission Register B
MPU Control Register
91
364
92
368
93
372
94
376
95
380
96
384
97
388
98
392
99
396
100
101
102
103
104
105
106
107
108
109
110
111
112-191
192-255
400
404
408
412
SS_STATUS
SS_ADRF
SS_ADRR
SS_ADR0
SS_ADR1
SS_SP_SYS
SS_SP_APP
SS_RAR
Secure State Status Register
416
Secure State Address Flash Register
Secure State Address RAM Register
Secure State Address 0 Register
Secure State Address 1 Register
Secure State Stack Pointer System Register
Secure State Stack Pointer Application Register
Secure State Return Address Register
Secure State Return Status Register
Reserved for future use
420
424
428
432
436
440
444
SS_RSR
448-764
768-1020
Reserved
IMPL
IMPLEMENTATION DEFINED
4.5
Exceptions and Interrupts
In the AVR32 architecture, events are used as a common term for exceptions and interrupts.
AVR32UC incorporates a powerful event handling scheme. The different event sources, like Ille-
gal Op-code and interrupt requests, have different priority levels, ensuring a well-defined
behavior when multiple events are received simultaneously. Additionally, pending events of a
higher priority class may preempt handling of ongoing events of a lower priority class.
When an event occurs, the execution of the instruction stream is halted, and execution is passed
to an event handler at an address specified in Table 4-4 on page 31. Most of the handlers are
placed sequentially in the code space starting at the address specified by EVBA, with four bytes
between each handler. This gives ample space for a jump instruction to be placed there, jump-
ing to the event routine itself. A few critical handlers have larger spacing between them, allowing
the entire event routine to be placed directly at the address specified by the EVBA-relative offset
generated by hardware. All interrupt sources have autovectored interrupt service routine (ISR)
addresses. This allows the interrupt controller to directly specify the ISR address as an address
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relative to EVBA. The autovector offset has 14 address bits, giving an offset of maximum 16384
bytes. The target address of the event handler is calculated as (EVBA | event_handler_offset),
not (EVBA + event_handler_offset), so EVBA and exception code segments must be set up
appropriately. The same mechanisms are used to service all different types of events, including
interrupt requests, yielding a uniform event handling scheme.
An interrupt controller does the priority handling of the interrupts and provides the autovector off-
set to the CPU.
4.5.1
System Stack Issues
Event handling in AVR32UC uses the system stack pointed to by the system stack pointer,
SP_SYS, for pushing and popping R8-R12, LR, status register, and return address. Since event
code may be timing-critical, SP_SYS should point to memory addresses in the IRAM section,
since the timing of accesses to this memory section is both fast and deterministic.
The user must also make sure that the system stack is large enough so that any event is able to
push the required registers to stack. If the system stack is full, and an event occurs, the system
will enter an UNDEFINED state.
4.5.2
Exceptions and Interrupt Requests
When an event other than scall or debug request is received by the core, the following actions
are performed atomically:
1. The pending event will not be accepted if it is masked. The I3M, I2M, I1M, I0M, EM, and
GM bits in the Status Register are used to mask different events. Not all events can be
masked. A few critical events (NMI, Unrecoverable Exception, TLB Multiple Hit, and
Bus Error) can not be masked. When an event is accepted, hardware automatically
sets the mask bits corresponding to all sources with equal or lower priority. This inhibits
acceptance of other events of the same or lower priority, except for the critical events
listed above. Software may choose to clear some or all of these bits after saving the
necessary state if other priority schemes are desired. It is the event source’s respons-
ability to ensure that their events are left pending until accepted by the CPU.
2. When a request is accepted, the Status Register and Program Counter of the current
context is stored to the system stack. If the event is an INT0, INT1, INT2, or INT3, reg-
isters R8-R12 and LR are also automatically stored to stack. Storing the Status
Register ensures that the core is returned to the previous execution mode when the
current event handling is completed. When exceptions occur, both the EM and GM bits
are set, and the application may manually enable nested exceptions if desired by clear-
ing the appropriate bit. Each exception handler has a dedicated handler address, and
this address uniquely identifies the exception source.
3. The Mode bits are set to reflect the priority of the accepted event, and the correct regis-
ter file bank is selected. The address of the event handler, as shown in Table 4-4 on
page 31, is loaded into the Program Counter.
The execution of the event handler routine then continues from the effective address calculated.
The rete instruction signals the end of the event. When encountered, the Return Status Register
and Return Address Register are popped from the system stack and restored to the Status Reg-
ister and Program Counter. If the rete instruction returns from INT0, INT1, INT2, or INT3,
registers R8-R12 and LR are also popped from the system stack. The restored Status Register
contains information allowing the core to resume operation in the previous execution mode. This
concludes the event handling.
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4.5.3
4.5.4
4.5.5
Supervisor Calls
The AVR32 instruction set provides a supervisor mode call instruction. The scall instruction is
designed so that privileged routines can be called from any context. This facilitates sharing of
code between different execution modes. The scall mechanism is designed so that a minimal
execution cycle overhead is experienced when performing supervisor routine calls from time-
critical event handlers.
The scall instruction behaves differently depending on which mode it is called from. The behav-
iour is detailed in the instruction set reference. In order to allow the scall routine to return to the
correct context, a return from supervisor call instruction, rets, is implemented. In the AVR32UC
CPU, scall and rets uses the system stack to store the return address and the status register.
Debug Requests
The AVR32 architecture defines a dedicated Debug mode. When a debug request is received by
the core, Debug mode is entered. Entry into Debug mode can be masked by the DM bit in the
status register. Upon entry into Debug mode, hardware sets the SR.D bit and jumps to the
Debug Exception handler. By default, Debug mode executes in the exception context, but with
dedicated Return Address Register and Return Status Register. These dedicated registers
remove the need for storing this data to the system stack, thereby improving debuggability. The
Mode bits in the Status Register can freely be manipulated in Debug mode, to observe registers
in all contexts, while retaining full privileges.
Debug mode is exited by executing the retd instruction. This returns to the previous context.
Entry Points for Events
Several different event handler entry points exist. In AVR32UC, the reset address is
0x80000000. This places the reset address in the boot flash memory area.
TLB miss exceptions and scall have a dedicated space relative to EVBA where their event han-
dler can be placed. This speeds up execution by removing the need for a jump instruction placed
at the program address jumped to by the event hardware. All other exceptions have a dedicated
event routine entry point located relative to EVBA. The handler routine address identifies the
exception source directly.
AVR32UC uses the ITLB and DTLB protection exceptions to signal a MPU protection violation.
ITLB and DTLB miss exceptions are used to signal that an access address did not map to any of
the entries in the MPU. TLB multiple hit exception indicates that an access address did map to
multiple TLB entries, signalling an error.
All interrupt requests have entry points located at an offset relative to EVBA. This autovector off-
set is specified by an interrupt controller. The programmer must make sure that none of the
autovector offsets interfere with the placement of other code. The autovector offset has 14
address bits, giving an offset of maximum 16384 bytes.
Special considerations should be made when loading EVBA with a pointer. Due to security con-
siderations, the event handlers should be located in non-writeable flash memory, or optionally in
a privileged memory protection region if an MPU is present.
If several events occur on the same instruction, they are handled in a prioritized way. The priority
ordering is presented in Table 4-4 on page 31. If events occur on several instructions at different
locations in the pipeline, the events on the oldest instruction are always handled before any
events on any younger instruction, even if the younger instruction has events of higher priority
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than the oldest instruction. An instruction B is younger than an instruction A if it was sent down
the pipeline later than A.
The addresses and priority of simultaneous events are shown in Table 4-4 on page 31. Some of
the exceptions are unused in AVR32UC since it has no MMU, coprocessor interface, or floating-
point unit.
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Table 4-4.
Priority and Handler Addresses for Events
Priority
1
Handler Address
0x80000000
Provided by OCD system
EVBA+0x00
EVBA+0x04
EVBA+0x08
EVBA+0x0C
EVBA+0x10
Autovectored
Autovectored
Autovectored
Autovectored
EVBA+0x14
EVBA+0x50
EVBA+0x18
EVBA+0x1C
EVBA+0x20
EVBA+0x24
EVBA+0x28
EVBA+0x2C
EVBA+0x30
EVBA+0x100
EVBA+0x34
EVBA+0x38
EVBA+0x60
EVBA+0x70
EVBA+0x3C
EVBA+0x40
EVBA+0x44
Name
Event source
External input
OCD system
Internal
Stored Return Address
Reset
Undefined
2
OCD Stop CPU
Unrecoverable exception
TLB multiple hit
First non-completed instruction
PC of offending instruction
PC of offending instruction
First non-completed instruction
First non-completed instruction
First non-completed instruction
First non-completed instruction
First non-completed instruction
First non-completed instruction
First non-completed instruction
PC of offending instruction
PC of offending instruction
PC of offending instruction
First non-completed instruction
PC of offending instruction
PC of offending instruction
PC of offending instruction
3
4
MPU
5
Bus error data fetch
Bus error instruction fetch
NMI
Data bus
Data bus
External input
External input
External input
External input
External input
CPU
6
7
8
Interrupt 3 request
Interrupt 2 request
Interrupt 1 request
Interrupt 0 request
Instruction Address
ITLB Miss
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
MPU
ITLB Protection
MPU
Breakpoint
OCD system
Instruction
Instruction
Instruction
UNUSED
Instruction
Instruction
CPU
Illegal Opcode
Unimplemented instruction
Privilege violation
Floating-point
Coprocessor absent
Supervisor call
PC of offending instruction
PC(Supervisor Call) +2
Data Address (Read)
Data Address (Write)
DTLB Miss (Read)
DTLB Miss (Write)
DTLB Protection (Read)
DTLB Protection (Write)
DTLB Modified
PC of offending instruction
PC of offending instruction
PC of offending instruction
PC of offending instruction
PC of offending instruction
PC of offending instruction
CPU
MPU
MPU
MPU
MPU
UNUSED
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5. Memories
5.1
Embedded Memories
• Internal high-speed flash
– 256Kbytes (AT32UC3L0256)
– 128Kbytes (AT32UC3L0128)
• 0 wait state access at up to 25MHz in worst case conditions
• 1 wait state access at up to 50MHz in worst case conditions
• Pipelined flash architecture, allowing burst reads from sequential flash locations, hiding
penalty of 1 wait state access
• Pipelined flash architecture typically reduces the cycle penalty of 1 wait state operation
to only 8% compared to 0 wait state operation
• 100 000 write cycles, 15-year data retention capability
• Sector lock capabilities, bootloader protection, security bit
• 32 fuses, erased during chip erase
• User page for data to be preserved during chip erase
• Internal high-speed SRAM, single-cycle access at full speed
– 32Kbytes
5.2
Physical Memory Map
The system bus is implemented as a bus matrix. All system bus addresses are fixed, and they
are never remapped in any way, not even during boot. Note that AVR32 UC CPU uses unseg-
mented translation, as described in the AVR32 Architecture Manual. The 32-bit physical address
space is mapped as follows:
Table 5-1.
AT32UC3L0128/256 Physical Memory Map
Size
Device
Start Address
AT32UC3L0256
32Kbytes
256Kbytes
256 bytes
64Kbytes
64Kbytes
AT32UC3L0128
32Kbytes
128Kbytes
256 bytes
64Kbytes
64Kbytes
Embedded SRAM
Embedded Flash
SAU Channels
0x00000000
0x80000000
0x90000000
0xFFFE0000
0xFFFF0000
HSB-PB Bridge B
HSB-PB Bridge A
Table 5-2.
Flash Memory Parameters
Number of pages
Page size
Part Number
Flash Size (FLASH_PW)
(FLASH_P)
(FLASH_W)
AT32UC3L0256
AT32UC3L0128
256Kbytes
128Kbytes
512
512bytes
512bytes
256
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5.3
Peripheral Address Map
Table 5-3.
Peripheral Address Mapping
Address
Peripheral Name
0xFFFE0000
FLASHCDW
Flash Controller - FLASHCDW
0xFFFE0400
0xFFFE0800
0xFFFF0000
0xFFFF1000
0xFFFF1400
0xFFFF1800
0xFFFF1C00
0xFFFF2000
0xFFFF2400
0xFFFF2800
0xFFFF2C00
0xFFFF3000
0xFFFF3400
0xFFFF3800
0xFFFF3C00
0xFFFF4000
0xFFFF4400
HMATRIX
SAU
HSB Matrix - HMATRIX
Secure Access Unit - SAU
PDCA
INTC
Peripheral DMA Controller - PDCA
Interrupt controller - INTC
PM
Power Manager - PM
SCIF
System Control Interface - SCIF
Asynchronous Timer - AST
AST
WDT
Watchdog Timer - WDT
EIC
External Interrupt Controller - EIC
Frequency Meter - FREQM
FREQM
GPIO
General-Purpose Input/Output Controller - GPIO
Universal Synchronous Asynchronous Receiver
Transmitter - USART0
USART0
USART1
USART2
USART3
SPI
Universal Synchronous Asynchronous Receiver
Transmitter - USART1
Universal Synchronous Asynchronous Receiver
Transmitter - USART2
Universal Synchronous Asynchronous Receiver
Transmitter - USART3
Serial Peripheral Interface - SPI
TWIM0
Two-wire Master Interface - TWIM0
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Table 5-3.
Peripheral Address Mapping
0xFFFF4800
TWIM1
Two-wire Master Interface - TWIM1
0xFFFF4C00
0xFFFF5000
0xFFFF5400
0xFFFF5800
0xFFFF5C00
0xFFFF6000
0xFFFF6400
0xFFFF6800
0xFFFF6C00
0xFFFF7000
TWIS0
TWIS1
PWMA
TC0
Two-wire Slave Interface - TWIS0
Two-wire Slave Interface - TWIS1
Pulse Width Modulation Controller - PWMA
Timer/Counter - TC0
TC1
Timer/Counter - TC1
ADCIFB
ACIFB
CAT
ADC Interface - ADCIFB
Analog Comparator Interface - ACIFB
Capacitive Touch Module - CAT
Glue Logic Controller - GLOC
aWire - AW
GLOC
AW
5.4
CPU Local Bus Mapping
Some of the registers in the GPIO module are mapped onto the CPU local bus, in addition to
being mapped on the Peripheral Bus. These registers can therefore be reached both by
accesses on the Peripheral Bus, and by accesses on the local bus.
Mapping these registers on the local bus allows cycle-deterministic toggling of GPIO pins since
the CPU and GPIO are the only modules connected to this bus. Also, since the local bus runs at
CPU speed, one write or read operation can be performed per clock cycle to the local bus-
mapped GPIO registers.
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The following GPIO registers are mapped on the local bus:
Table 5-4.
Local Bus Mapped GPIO Registers
Local Bus
Port
Register
Mode
WRITE
SET
Address
Access
0
Output Driver Enable Register (ODER)
Output Value Register (OVR)
0x40000040
0x40000044
0x40000048
0x4000004C
0x40000050
0x40000054
0x40000058
0x4000005C
0x40000060
0x40000140
0x40000144
0x40000148
0x4000014C
0x40000150
0x40000154
0x40000158
0x4000015C
0x40000160
Write-only
Write-only
Write-only
Write-only
Write-only
Write-only
Write-only
Write-only
Read-only
Write-only
Write-only
Write-only
Write-only
Write-only
Write-only
Write-only
Write-only
Read-only
CLEAR
TOGGLE
WRITE
SET
CLEAR
TOGGLE
-
Pin Value Register (PVR)
1
Output Driver Enable Register (ODER)
WRITE
SET
CLEAR
TOGGLE
WRITE
SET
Output Value Register (OVR)
Pin Value Register (PVR)
CLEAR
TOGGLE
-
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6. Supply and Startup Considerations
6.1
Supply Considerations
6.1.1
Power Supplies
The AT32UC3L0128/256 has several types of power supply pins:
•VDDIO: Powers I/O lines. Voltage is 1.8 to 3.3V nominal.
•VDDIN: Powers I/O lines and the internal regulator. Voltage is 1.8 to 3.3V nominal.
•VDDANA: Powers the ADC. Voltage is 1.8V nominal.
•VDDCORE: Powers the core, memories, and peripherals. Voltage is 1.8V nominal.
The ground pins GND are common to VDDCORE, VDDIO, and VDDIN. The ground pin for
VDDANA is GNDANA.
When VDDCORE is not connected to VDDIN, the VDDIN voltage must be higher than 1.98V.
Refer to Section 7. on page 41 for power consumption on the various supply pins.
For decoupling recommendations for the different power supplies, please refer to the schematic
checklist.
Refer to Section 3.2 on page 8 for power supply connections for I/O pins.
6.1.2
Voltage Regulator
The AT32UC3L0128/256 embeds a voltage regulator that converts from 3.3V nominal to 1.8V
with a load of up to 60mA. The regulator supplies the output voltage on VDDCORE. The regula-
tor may only be used to drive internal circuitry in the device. VDDCORE should be externally
connected to the 1.8V domains. See Section 6.1.3 for regulator connection figures.
Adequate output supply decoupling is mandatory for VDDCORE to reduce ripple and avoid
oscillations. The best way to achieve this is to use two capacitors in parallel between VDDCORE
and GND as close to the device as possible. Please refer to Section 7.8.1 on page 55 for decou-
pling capacitors values and regulator characteristics.
Figure 6-1. Supply Decoupling
3.3V
VDDIN
C
C
C
IN1
IN3
IN2
1.8V
Regulator
1.8V
VDDCORE
C
C
OUT2
OUT1
The voltage regulator can be turned off in the shutdown mode to power down the core logic and
keep a small part of the system powered in order to reduce power consumption. To enter this
mode the 3.3V supply mode, with 1.8V regulated I/O lines power supply configuration must be
used.
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6.1.3
Regulator Connection
The AT32UC3L0128/256 supports three power supply configurations:
• 3.3V single supply mode
– Shutdown mode is not available
• 1.8V single supply mode
– Shutdown mode is not available
• 3.3V supply mode, with 1.8V regulated I/O lines
– Shutdown mode is available
6.1.3.1
3.3V Single Supply Mode
In 3.3V single supply mode the internal regulator is connected to the 3.3V source (VDDIN pin)
and its output feeds VDDCORE. Figure 6-2 shows the power schematics to be used for 3.3V
single supply mode. All I/O lines will be powered by the same power (VDDIN=VDDIO).
Figure 6-2. 3.3V Single Supply Mode
+
1.98-3.6V
-
VDDIN
VDDIO
GND
I/O Pins
I/O Pins
OSC32K_2,
AST, Wake,
Regulator
control
OSC32K,
RC32K,
POR33,
SM33
VDDCORE
VDDANA
Linear
regulator
CPU,
Peripherals,
Memories,
SCIF, BOD,
RCSYS,
ADC
DFLL, PLL
GNDANA
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6.1.3.2
1.8 V Single Supply Mode
In 1.8V single supply mode the internal regulator is not used, and VDDIO and VDDCORE are
powered by a single 1.8 V supply as shown in Figure 6-3. All I/O lines will be powered by the
same power (VDDIN = VDDIO = VDDCORE).
Figure 6-3. 1.8V Single Supply Mode.
+
1.62-1.98V
-
VDDIN
VDDIO
GND
I/O Pins
I/O Pins
OSC32K_2,
AST, Wake,
Regulator
control
OSC32K,
RC32K,
POR33,
SM33
VDDCORE
VDDANA
CPU,
Peripherals,
Memories,
SCIF, BOD,
RCSYS,
ADC
DFLL, PLL
GNDANA
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6.1.3.3
3.3V Supply Mode with 1.8V Regulated I/O Lines
In this mode, the internal regulator is connected to the 3.3V source and its output is connected
to both VDDCORE and VDDIO as shown in Figure 6-4. This configuration is required in order to
use Shutdown mode.
Figure 6-4. 3.3V Supply Mode with 1.8V Regulated I/O Lines
+
1.98-3.6V
-
VDDIO
GND
VDDIN
I/O Pins
I/O Pins
OSC32K_2,
AST, Wake,
Regulator
control
OSC32K,
RC32K,
POR33,
SM33
VDDCORE
Linear
regulator
CPU,
Peripherals,
Memories,
SCIF, BOD,
RCSYS,
ADC
VDDANA
DFLL, PLL
GNDANA
In this mode, some I/O lines are powered by VDDIN while other I/O lines are powered by VDDIO.
Refer to Section 3.2.1 on page 8 for description of power supply for each I/O line.
Refer to the Power Manager chapter for a description of what parts of the system are powered in
Shutdown mode.
Important note: As the regulator has a maximum output current of 60mA, this mode can only be
used in applications where the maximum I/O current is known and compatible with the core and
peripheral power consumption. Typically, great care must be used to ensure that only a few I/O
lines are toggling at the same time and drive very small loads.
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6.1.4
Power-up Sequence
6.1.4.1
Maximum Rise Rate
To avoid risk of latch-up, the rise rate of the power supplies must not exceed the values
described in Table 7-3 on page 42.
Recommended order for power supplies is also described in this chapter.
6.1.4.2
Minimum Rise Rate
The integrated Power-on Reset (POR33) circuitry monitoring the VDDIN powering supply
requires a minimum rise rate for the VDDIN power supply.
See Table 7-3 on page 42 for the minimum rise rate value.
If the application can not ensure that the minimum rise rate condition for the VDDIN power sup-
ply is met, one of the following configurations can be used:
• A logic “0” value is applied during power-up on pin PA11 (WAKE_N) until VDDIN rises above
1.2V.
• A logic “0” value is applied during power-up on pin RESET_N until VDDIN rises above 1.2V.
6.2
Startup Considerations
This chapter summarizes the boot sequence of the AT32UC3L0128/256. The behavior after
power-up is controlled by the Power Manager. For specific details, refer to the Power Manager
chapter.
6.2.1
Starting of Clocks
After power-up, the device will be held in a reset state by the Power-on Reset (POR18 and
POR33) circuitry for a short time to allow the power to stabilize throughout the device. After
reset, the device will use the System RC Oscillator (RCSYS) as clock source. Please refer to
Table 7-17 on page 54 for the frequency for this oscillator.
On system start-up, all high-speed clocks are disabled. All clocks to all modules are running. No
clocks have a divided frequency; all parts of the system receive a clock with the same frequency
as the System RC Oscillator.
When powering up the device, there may be a delay before the voltage has stabilized, depend-
ing on the rise time of the supply used. The CPU can start executing code as soon as the supply
is above the POR18 and POR33 thresholds, and before the supply is stable. Before switching to
a high-speed clock source, the user should use the BOD to make sure the VDDCORE is above
the minimum level (1.62V).
6.2.2
Fetching of Initial Instructions
After reset has been released, the AVR32 UC CPU starts fetching instructions from the reset
address, which is 0x80000000. This address points to the first address in the internal Flash.
The code read from the internal flash is free to configure the clock system and clock sources.
Please refer to the PM and SCIF chapters for more details.
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7. Electrical Characteristics
7.1
Absolute Maximum Ratings*
Table 7-1.
Absolute Maximum Ratings
*NOTICE:
Stresses beyond those listed under
“Absolute Maximum Ratings” may cause
permanent damage to the device. This is
a stress rating only and functional opera-
tion of the device at these or other condi-
tions beyond those indicated in the
operational sections of this specification is
not implied. Exposure to absolute maxi-
mum rating conditions for extended peri-
ods may affect device reliability.
Operating temperature..................................... -40°C to +85°C
Storage temperature...................................... -60°C to +150°C
Voltage on input pins (except for 5V pins) with respect to ground
.................................................................-0.3V to VVDD(2)+0.3V
Voltage on 5V tolerant(1) pins with respect to ground ...............
.............................................................................-0.3V to 5.5V
Total DC output current on all I/O pins - VDDIO ........... 120mA
Total DC output current on all I/O pins - VDDIN ............. 36mA
Maximum operating voltage VDDCORE......................... 1.98V
Maximum operating voltage VDDIO, VDDIN .................... 3.6V
Notes: 1. 5V tolerant pins, see Section 3.2 ”Peripheral Multiplexing on I/O Lines” on page 8
2. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2 on page 8 for details.
7.2
Supply Characteristics
The following characteristics are applicable to the operating temperature range: TA=-40°C to
85°C, unless otherwise specified and are valid for a junction temperature up to TJ=100°C.
Please refer to Section 6. ”Supply and Startup Considerations” on page 36
Table 7-2.
Supply Characteristics
Voltage
Max
Symbol
Parameter
Min
Unit
VVDDIO
DC supply peripheral I/Os
1.62
3.6
V
DC supply peripheral I/Os, 1.8V
single supply mode
1.62
1.98
1.98
3.6
V
V
VVDDIN
DC supply peripheral I/Os and
internal regulator, 3.3V supply
mode
VVDDCORE
VVDDANA
DC supply core
1.62
1.62
1.98
1.98
V
V
Analog supply voltage
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Table 7-3.
Supply Rise Rates and Order(1)
Rise Rate
Symbol
Parameter
Min
Max
Unit
Comment
VVDDIO
DC supply peripheral I/Os
0
2.5
V/µs
Slower rise time requires
external power-on reset
circuit.
DC supply peripheral I/Os
and internal regulator
VVDDIN
0.002
2.5
V/µs
Rise before or at the same
time as VDDIO
VVDDCORE
VVDDANA
Note:
DC supply core
0
0
2.5
2.5
V/µs
V/µs
Rise together with
VDDCORE
Analog supply voltage
1. These values are based on simulation and characterization of other AVR microcontrollers
manufactured in the same process technology. These values are not covered by test limits in
production.
7.3
Maximum Clock Frequencies
These parameters are given in the following conditions:
• VVDDCORE = 1.62V to 1.98V
• Temperature = -40°C to 85°C
Table 7-4.
Symbol Parameter
fCPU CPU clock frequency
fPBA
Clock Frequencies
Description
Min Max Units
50
50
50
50
PBA clock frequency
PBB clock frequency
fPBB
fGCLK0
GCLK0 clock frequency DFLLIF main reference, GCLK0 pin
DFLLIF dithering and SSG reference,
fGCLK1
GCLK1 clock frequency
GCLK1 pin
50
20
fGCLK2
fGCLK3
fGCLK4
fGCLK5
fGCLK6
fGCLK7
fGCLK8
fGCLK9
GCLK2 clock frequency AST, GCLK2 pin
GCLK3 clock frequency PWMA, GCLK3 pin
GCLK4 clock frequency CAT, ACIFB, GCLK4 pin
GCLK5 clock frequency GLOC
MHz
140
50
80
GCLK6 clock frequency
50
GCLK7 clock frequency
50
GCLK8 clock frequency PLL source clock
GCLK9 clock frequency FREQM, GCLK0-8
50
150
7.4
Power Consumption
The values in Table 7-5 are measured values of power consumption under the following condi-
tions, except where noted:
• Operating conditions, internal core supply (Figure 7-1) - this is the default configuration
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– VVDDIN = 3.0V
– VVDDCORE = 1.62V, supplied by the internal regulator
– Corresponds to the 3.3V supply mode with 1.8V regulated I/O lines, please refer to
the Supply and Startup Considerations section for more details
• Equivalent to the 3.3V single supply mode
• Consumption in 1.8V single supply mode can be estimated by subtracting the regula-
tor static current
• Operating conditions, external core supply (Figure 7-2) - used only when noted
– VVDDIN = VVDDCORE = 1.8V
– Corresponds to the 1.8V single supply mode, please refer to the Supply and Startup
Considerations section for more details
• TA = 25°C
• Oscillators
– OSC0 (crystal oscillator) stopped
– OSC32K (32KHz crystal oscillator) running with external 32KHz crystal
– DFLL running at 50MHz with OSC32K as reference
• Clocks
– DFLL used as main clock source
– CPU, HSB, and PBB clocks undivided
– PBA clock divided by 4
– The following peripheral clocks running
• PM, SCIF, AST, FLASHCDW, PBA bridge
– All other peripheral clocks stopped
• I/Os are inactive with internal pull-up
• Flash enabled in high speed mode
• POR18 enabled
• POR33 disabled
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Table 7-5.
Mode
Power Consumption for Different Operating Modes
Conditions
Measured on
Consumption Typ
Unit
CPU running a recursive Fibonacci algorithm
CPU running a division algorithm
300
174
96
Active(1)
Idle(1)
µA/MHz
Frozen(1)
Standby(1)
Stop
57
46
38
DeepStop
25
-OSC32K and AST stopped
-Internal core supply
14
7.3
6.7
Amp0
µA
nA
-OSC32K running
Static
-AST running at 1KHz
-External core supply (Figure 7-2)
-OSC32K and AST stopped
-External core supply (Figure 7-2)
-OSC32K running
800
220
-AST running at 1KHz
Shutdown
AST and OSC32K stopped
Note:
1. These numbers are valid for the measured condition only and must not be extrapolated to other frequencies.
Figure 7-1. Measurement Schematic, Internal Core Supply
VDDIN
Amp0
VDDIO
VDDCORE
VDDANA
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Figure 7-2. Measurement Schematic, External Core Supply
VDDIN
VDDIO
Amp0
VDDCORE
VDDANA
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7.5
I/O Pin Characteristics
Table 7-6.
Symbol
Normal I/O Pin Characteristics(1)
Parameter
Condition
Min
75
Typ
Max
145
Units
RPULLUP
Pull-up resistance
100
kOhm
V
VDD = 3.0V
VVDD = 1.62V
VDD = 3.6V
VVDD = 1.98V
VDD = 3.0V, IOL = 3mA
VVDD = 1.62V, IOL = 2mA
VDD = 3.0V, IOH = 3mA
-0.3
0.3*VVDD
0.3*VVDD
VVDD + 0.3
VVDD + 0.3
0.4
VIL
Input low-level voltage
Input high-level voltage
Output low-level voltage
Output high-level voltage
Output frequency(2)
Rise time(2)
V
V
-0.3
V
0.7*VVDD
0.7*VVDD
VIH
V
VOL
VOH
fMAX
tRISE
V
0.4
V
VVDD - 0.4
VVDD - 0.4
V
VVDD = 1.62V, IOH = 2mA
VVDD = 3.0V, load = 10pF
VVDD = 3.0V, load = 30pF
VVDD = 3.0V, load = 10pF
45
23
MHz
4.7
11.5
4.8
12
V
VDD = 3.0V, load = 30pF
VVDD = 3.0V, load = 10pF
VDD = 3.0V, load = 30pF
ns
tFALL
ILEAK
Fall time(2)
V
Input leakage current
Pull-up resistors disabled
TQFP48 package
QFN48 package
1
µA
1.4
1.1
1.1
2.7
2.4
2.4
3.8
3.5
3.5
Input capacitance, all
normal I/O pins except
PA05, PA07, PA17, PA20,
PA21, PB04, PB05
CIN
CIN
CIN
TLLGA48 package
TQFP48 package
QFN48 package
Input capacitance, PA20
pF
TLLGA48 package
TQFP48 package
QFN48 package
Input capacitance, PA05,
PA07, PA17, PA21, PB04,
PB05
TLLGA48 package
Notes: 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2.1 on page 8 for
details.
2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Table 7-7.
Symbol
High-drive I/O Pin Characteristics(1)
Parameter
Condition
Min
30
Typ
50
Max
110
145
45
Units
PA06
RPULLUP
Pull-up resistance
PA02, PB01, RESET
PA08, PA09
75
100
20
kOhm
10
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Table 7-7.
Symbol
High-drive I/O Pin Characteristics(1)
Parameter
Condition
VDD = 3.0V
VVDD = 1.62V
VDD = 3.6V
VVDD = 1.98V
VDD = 3.0V, IOL = 6mA
VVDD = 1.62V, IOL = 4mA
VDD = 3.0V, IOH = 6mA
Min
-0.3
Typ
Max
0.3*VVDD
0.3*VVDD
VVDD + 0.3
VVDD + 0.3
0.4
Units
V
VIL
Input low-level voltage
V
-0.3
V
0.7*VVDD
0.7*VVDD
VIH
Input high-level voltage
Output low-level voltage
Output high-level voltage
V
V
V
VOL
VOH
fMAX
tRISE
tFALL
fMAX
tRISE
0.4
V
VVDD-0.4
VVDD-0.4
V
VVDD = 1.62V, IOH = 4mA
VVDD = 3.0V, load = 10pF
VVDD = 3.0V, load = 30pF
VVDD = 3.0V, load = 10pF
45
23
Output frequency, all High-drive I/O
pins, except PA08 and PA09(2)
MHz
4.7
11.5
4.8
12
Rise time, all High-drive I/O pins,
except PA08 and PA09(2)
V
VDD = 3.0V, load = 30pF
VVDD = 3.0V, load = 10pF
VDD = 3.0V, load = 30pF
ns
Fall time, all High-drive I/O pins,
except PA08 and PA09(2)
V
VVDD = 3.0V, load = 10pF
VVDD = 3.0V, load = 30pF
VVDD = 3.0V, load = 10pF
54
Output frequency, PA08 and
PA09(2)
MHz
40
2.8
4.9
2.4
4.6
1
Rise time, PA08 and PA09(2)
V
VDD = 3.0V, load = 30pF
VVDD = 3.0V, load = 10pF
VDD = 3.0V, load = 30pF
ns
tFALL
ILEAK
Fall time, PA08 and PA09(2)
Input leakage current
V
Pull-up resistors disabled
TQFP48 package
QFN48 package
µA
2.2
2.0
2.0
7.0
6.7
6.7
Input capacitance, all High-drive I/O
pins, except PA08 and PA09
CIN
TLLGA48 package
TQFP48 package
QFN48 package
pF
CIN
Input capacitance, PA08 and PA09
TLLGA48 package
Notes: 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2.1 on page 8 for
details.
2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Table 7-8.
Symbol
High-drive I/O, 5V Tolerant, Pin Characteristics(1)
Parameter
Condition
Min
30
Typ
Max
110
Units
RPULLUP
Pull-up resistance
50
kOhm
V
VDD = 3.0V
-0.3
-0.3
0.3*VVDD
0.3*VVDD
VIL
Input low-level voltage
V
VVDD = 1.62V
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Table 7-8.
Symbol
High-drive I/O, 5V Tolerant, Pin Characteristics(1)
Parameter
Condition
VDD = 3.6V
VVDD = 1.98V
VDD = 3.0V, IOL = 6mA
VVDD = 1.62V, IOL = 4mA
VDD = 3.0V, IOH = 6mA
Min
Typ
Max
5.5
5.5
0.4
0.4
Units
V
0.7*VVDD
0.7*VVDD
VIH
Input high-level voltage
V
V
VOL
VOH
fMAX
tRISE
Output low-level voltage
Output high-level voltage
Output frequency(2)
Rise time(2)
V
V
V
VVDD-0.4
VVDD-0.4
VVDD = 1.62V, IOH = 4mA
VVDD = 3.0V, load = 10pF
VVDD = 3.0V, load = 30pF
VVDD = 3.0V, load = 10pF
87
58
MHz
2.3
4.3
1.9
3.7
10
VVDD = 3.0V, load = 30pF
ns
VVDD = 3.0V, load = 10pF
VVDD = 3.0V, load = 30pF
5.5V, pull-up resistors disabled
TQFP48 package
tFALL
ILEAK
Fall time(2)
Input leakage current
µA
pF
4.5
4.2
4.2
CIN
Input capacitance
QFN48 package
TLLGA48 package
Notes: 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2.1 on page 8 for
details.
2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Table 7-9.
Symbol
TWI Pin Characteristics(1)
Parameter
Condition
Min
25
Typ
Max
Units
RPULLUP
Pull-up resistance
35
60
kOhm
V
VDD = 3.0V
VVDD = 1.62V
VDD = 3.6V
-0.3
0.3*VVDD
VIL
Input low-level voltage
Input high-level voltage
V
V
-0.3
0.3*VVDD
V
0.7*VVDD
0.7*VVDD
0.7*VVDD
0.7*VVDD
VVDD + 0.3
VVDD = 1.98V
VVDD + 0.3
VIH
VVDD = 3.6V
5.5
5.5
0.4
1
Input high-level voltage, 5V tolerant
SMBUS compliant pins
V
V
VVDD = 1.98V
VOL
ILEAK
IIL
Output low-level voltage
Input leakage current
Input low leakage
IOL = 3mA
Pull-up resistors disabled
1
µA
pF
IIH
Input high leakage
1
TQFP48 package
QFN48 package
TLLGA48 package
3.8
3.5
3.5
CIN
Input capacitance
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Table 7-9.
Symbol
TWI Pin Characteristics(1)
Parameter
Condition
Min
Typ
250
470
Max
Units
ns
Cbus = 400pF, VVDD > 2.0V
Cbus = 400pF, VVDD > 1.62V
Cbus = 400pF, VVDD > 2.0V
tFALL
Fall time
fMAX
Max frequency
400
kHz
Note:
1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2.1 on page 8 for
details.
7.6
Oscillator Characteristics
Oscillator 0 (OSC0) Characteristics
Digital Clock Characteristics
7.6.1
7.6.1.1
The following table describes the characteristics for the oscillator when a digital clock is applied
on XIN.
Table 7-10. Digital Clock Characteristics
Symbol
fCPXIN
Parameter
Conditions
Min
Typ
Max
50
60
Units
MHz
XIN clock frequency
XIN clock duty cycle(1)
Startup time
tCPXIN
40
%
tSTARTUP
0
cycles
TQFP48 package
QFN48 package
TLLGA48 package
7.0
6.7
6.7
CIN
XIN input capacitance
pF
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
7.6.1.2
Crystal Oscillator Characteristics
The following table describes the characteristics for the oscillator when a crystal is connected
between XIN and XOUT as shown in Figure 7-3. The user must choose a crystal oscillator
where the crystal load capacitance CL is within the range given in the table. The exact value of CL
can be found in the crystal datasheet. The capacitance of the external capacitors (CLEXT) can
then be computed as follows:
CLEXT = 2(CL – Ci) – CPCB
where CPCB is the capacitance of the PCB and Ci is the internal equivalent load capacitance.
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Table 7-11. Crystal Oscillator Characteristics
Symbol
fOUT
Parameter
Conditions
Min
0.45
6
Typ
Max
16
Unit
Crystal oscillator frequency(3)
Crystal load capacitance(3)
Internal equivalent load capacitance
Startup time
10
MHz
CL
18
pF
Ci
2
tSTARTUP
SCIF.OSCCTRL.GAIN = 2(1)
30 000(2)
cycles
Active mode, f = 0.45MHz,
SCIF.OSCCTRL.GAIN = 0
30
IOSC
Current consumption
µA
Active mode, f = 10MHz,
SCIF.OSCCTRL.GAIN = 2
220
Notes: 1. Please refer to the SCIF chapter for details.
2. Nominal crystal cycles.
3. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Figure 7-3. Oscillator Connection
CLEXT
XOUT
UC3L
Ci
CL
XIN
CLEXT
7.6.2
32KHz Crystal Oscillator (OSC32K) Characteristics
Figure 7-3 and the equation above also applies to the 32KHz oscillator connection. The user
must choose a crystal oscillator where the crystal load capacitance CL is within the range given
in the table. The exact value of CL can then be found in the crystal datasheet.
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Table 7-12. 32 KHz Crystal Oscillator Characteristics
Symbol
fOUT
Parameter
Conditions
Min
Typ
Max
Unit
Hz
Crystal oscillator frequency
32 768
30 000(1)
tSTARTUP
CL
Startup time
RS = 60kOhm, CL = 9pF
cycles
Crystal load capacitance(2)
6
12.5
pF
Internal equivalent load
capacitance
Ci
2
IOSC32
RS
Current consumption
0.6
µA
Equivalent series resistance(2)
32 768Hz
35
85
kOhm
Notes: 1. Nominal crystal cycles.
2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
7.6.3
Phase Locked Loop (PLL) Characteristics
Table 7-13. Phase Locked Loop Characteristics
Symbol
fOUT
Parameter
Conditions
Min
40
4
Typ
Max
240
16
Unit
MHz
Output frequency(1)
Input frequency(1)
Current consumption
fIN
IPLL
8
µA/MHz
Startup time, from enabling
the PLL until the PLL is
locked
fIN= 4MHz
200
tSTARTUP
µs
fIN= 16MHz
155
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
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7.6.4
Digital Frequency Locked Loop (DFLL) Characteristics
Table 7-14. Digital Frequency Locked Loop Characteristics
Symbol
fOUT
Parameter
Conditions
Min
20
8
Typ
Max
150
150
Unit
MHz
kHz
%
Output frequency(2)
Reference frequency(2)
FINE resolution step
fREF
FINE > 100, all COARSE values (3)
Open loop mode
0.38
Frequency drift over voltage
and temperature
See
Figure 7-4
FINE lock, fREF = 32kHz, SSG disabled
0.1
0.5
0.5
ACCURATE lock, fREF = 32kHz, dither clk
RCSYS/2, SSG disabled
0.06
Accuracy(2)
%
FINE lock, fREF = 8-150kHz, SSG
disabled
0.2
1
1
ACCURATE lock, fREF = 8-150kHz,
dither clk RCSYS/2, SSG disabled
0.1
25
IDFLL
Power consumption
Startup time(2)
µA/MHz
µs
tSTARTUP
Within 90% of final values
100
fREF = 32kHz, FINE lock, SSG disabled
8
tLOCK
Lock time
ms
f
REF = 32kHz, ACCURATE lock, dithering
28
clock = RCSYS/2, SSG disabled
Notes: 1. Spread Spectrum Generator (SSG) is disabled by writing a zero to the EN bit in the DFLL0SSG register.
2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
3. The FINE and COARSE values are selected by wrirting to the DFLL0VAL.FINE and DFLL0VAL.COARSE field respectively.
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Figure 7-4. DFLL Open Loop Frequency Variation(1)(2)
DFLL Open Loop Frequency variation
160
150
140
130
120
1,98V
1,8V
1.62V
110
100
90
80
-40
-20
0
20
40
60
80
Temperature
Notes: 1. The plot shows a typical open loop mode behavior with COARSE= 99 and FINE= 255
2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
7.6.5
120MHz RC Oscillator (RC120M) Characteristics
Table 7-15. Internal 120MHz RC Oscillator Characteristics
Symbol
fOUT
Parameter
Conditions
Min
Typ
120
1.2
3
Max
Unit
MHz
mA
Output frequency(1)
Current consumption
Startup time(1)
88
152
IRC120M
tSTARTUP
VVDDCORE = 1.8V
µs
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
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7.6.6
32kHz RC Oscillator (RC32K) Characteristics
Table 7-16. 32kHz RC Oscillator Characteristics
Symbol
fOUT
Parameter
Conditions
Min
Typ
32
Max
Unit
kHz
µA
Output frequency(1)
Current consumption
Startup time(1)
20
44
IRC32K
0.7
100
tSTARTUP
µs
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
7.6.7
System RC Oscillator (RCSYS) Characteristics
Table 7-17. System RC Oscillator Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fOUT
Output frequency
Calibrated at 85°C
111.6
115
118.4
kHz
7.7
Flash Characteristics
Table 7-18 gives the device maximum operating frequency depending on the number of flash
wait states and the flash read mode. The FSW bit in the FLASHCDW FSR register controls the
number of wait states used when accessing the flash memory.
Table 7-18. Maximum Operating Frequency
Flash Wait States
Read Mode
Maximum Operating Frequency
1
0
1
0
50MHz
25MHz
30MHz
15MHz
High speed read mode
Normal read mode
Table 7-19. Flash Characteristics
Symbol
tFPP
Parameter
Conditions
Min
Typ
5
Max
Unit
Page programming time
Page erase time
tFPE
5
fCLK_HSB = 50MHz
tFFP
Fuse programming time
Full chip erase time (EA)
JTAG chip erase time (CHIP_ERASE)
1
ms
tFEA
6
tFCE
fCLK_HSB = 115kHz
310
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Table 7-20. Flash Endurance and Data Retention
Symbol
NFARRAY
NFFUSE
tRET
Parameter
Conditions
Min
100k
10k
15
Typ
Max
Unit
cycles
years
Array endurance (write/page)
General Purpose fuses endurance (write/bit)
Data retention
7.8
Analog Characteristics
7.8.1
Voltage Regulator Characteristics
Table 7-21. VREG Electrical Characteristics
Symbol
Parameter
Condition
Min
Typ
3.3
1.8
Max
Units
VVDDIN
Input voltage range
1.98
3.6
V
VVDDCORE Output voltage, calibrated value
Output voltage accuracy(1)
VVDDIN >= 1.98V
IOUT = 0.1mA to 60mA,
VVDDIN > 1.98V
2
4
%
IOUT = 0.1mA to 60mA,
VVDDIN < 1.98V
Normal mode
60
1
IOUT
DC output current(1)
mA
µA
Low power mode
Normal mode
13
4
IVREG
Note:
Static current of internal regulator
Low power mode
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Table 7-22. Decoupling Requirements
Symbol
CIN1
Parameter
Condition
Typ
33
Techno.
Units
Input regulator capacitor 1
Input regulator capacitor 2
Input regulator capacitor 3
Output regulator capacitor 1
nF
CIN2
100
10
CIN3
µF
nF
COUT1
100
Tantalum
COUT2
Output regulator capacitor 2
2.2
µF
0.5<ESR<10Ohm
Note:
1. Refer to Section 6.1.2 on page 36.
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7.8.2
Power-on Reset 18 Characteristics
Table 7-23. POR18 Characteristics
Symbol
VPOT+
Parameter
Condition
Min
Typ
1.45
Max
Units
Voltage threshold on VVDDCORE rising
Voltage threshold on VVDDCORE falling
1.58
V
VPOT-
1.2
1.32
Time with VDDCORE < VPOT-
necessary to generate a reset
signal
tDET
Detection time(1)
460
µs
IPOR18
Current consumption
Startup time(1)
4
6
µA
µs
tSTARTUP
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Figure 7-5. POR18 Operating Principle
VPOT+
VPOT-
Time
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7.8.3
Power-on Reset 33 Characteristics
Table 7-24. POR33 Characteristics
Symbol
VPOT+
Parameter
Condition
Min
Typ
1.49
Max
Units
Voltage threshold on VVDDIN rising
Voltage threshold on VVDDIN falling
1.58
V
VPOT-
1.3
1.45
Time with VDDIN < VPOT-
necessary to generate a reset
signal
tDET
Detection time(1)
460
µs
IPOR33
Current consumption
Startup time(1)
20
µA
µs
tSTARTUP
400
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Figure 7-6. POR33 Operating Principle
VPOT+
VPOT-
Time
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7.8.4
Brown Out Detector Characteristics
The values in Table 7-25 describe the values of the BODLEVEL in the flash General Purpose
Fuse register.
Table 7-25. BODLEVEL Values
BODLEVEL Value
Min
Typ
Max
Units
011111 binary (31) 0x1F
100111 binary (39) 0x27
1.60
1.69
V
Table 7-26. BOD Characteristics
Symbol
Parameter
Condition
T = 25°C
Min
Typ
Max
Units
mV
VHYST
BOD hysteresis
10
Time with VDDCORE <
BODLEVEL necessary to
generate a reset signal
tDET
Detection time
1
µs
IBOD
Current consumption
Startup time
7
5
µA
µs
tSTARTUP
7.8.5
Supply Monitor 33 Characteristics
Table 7-27. SM33 Characteristics
Symbol
Parameter
Condition
Min
Typ
Max
Units
VTH
Voltage threshold
Calibrated(1), T = 25°C
1.675
1.75
1.825
V
Step size, between adjacent values
in SCIF.SM33.CALIB(2)
11
30
mV
VHYST
tDET
Hysteresis(2)
Time with VDDIN < VTH
necessary to generate a reset
signal
Detection time
280
µs
ISM33
Current consumption
Startup time
Normal mode
Normal mode
17
µA
µs
tSTARTUP
140
Notes: 1. Calibration value can be read from the SM33.CALIB field. This field is updated by the flash fuses after a reset. Refer to SCIF
chapter for details.
2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
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7.8.6
Analog to Digital Converter Characteristics
Table 7-28. ADC Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
fADC
ADC clock frequency
12-bit resolution mode
10-bit resolution mode
8-bit resolution mode
Return from Idle Mode
fADC = 6MHz
6
6
6
MHz
fADC
ADC clock frequency
MHz
tSTARTUP
tCONV
Startup time
15
µs
Conversion time (latency)
11
26
28
cycles
VVDD > 3.0V, fADC = 6MHz,
Throughput rate
12-bit resolution mode,
low impedance source
kSPS
VVDD > 3.0V, fADC = 6MHz,
10-bit resolution mode,
low impedance source
460
Throughput rate
kSPS
VVDD > 3.0V, fADC = 6MHz,
8-bit resolution mode,
low impedance source
460
VADVREFP
IADC
Reference voltage range
VADVREFP = VVDDANA
ADC Clock = 6MHz
1.62
1.98
V
Current consumption on VVDDANA
350
150
µA
Current consumption on ADVREFP
pin
IADVREFP
fADC = 6MHz
Note:
These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process
technology. These values are not covered by test limits in production.
7.8.6.1
Inputs and Sample and Hold Acquisition Times
Table 7-29. Analog Inputs
Symbol
Parameter
Conditions
12-bit mode
10-bit mode
8-bit mode
Min
Typ
Max
Units
V
VADn
Input Voltage Range
Internal Capacitance(1)
Internal Resistance(1)
0
VADVREFP
CONCHIP
22.5
3.15
55.9
pF
VVDDIO = 3.0V to 3.6V,
VVDDCORE = 1.8V
RONCHIP
kOhm
VVDDIO = VVDDCORE = 1.62V to 1.98V
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
The analog voltage source must be able to charge the sample and hold (S/H) capacitor in the
ADC in order to achieve maximum accuracy. Seen externally the ADC input consists of a resis-
tor (RONCHIP ) and a capacitor (CONCHIP ). In addition, the resistance (RSOURCE ) and capacitance
(CSOURCE ) of the PCB and source must be taken into account when calculating the required
sample and hold time. Figure 7-7 shows the ADC input channel equivalent circuit.
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Figure 7-7. ADC Input
Positive Input
RSOURCE
RONCHIP
CSOURCE
CONCHIP
ADCVREFP/2
VIN
The minimum sample and hold time (in ns) can be found using this formula:
tSAMPLEHOLD ≥ (RONCHIP + RSOURCE) × (CONCHIP + CSOURCE) × ln(2n + 1
)
Where n is the number of bits in the conversion. tSAMPLEHOLD is defined by the SHTIM field in the
ADCIFB ACR register. Please refer to the ADCIFB chapter for more information.
7.8.6.2
Applicable Conditions and Derating Data
Table 7-30. Transfer Characteristics 12-bit Resolution Mode(1)
Parameter
Conditions
Min
Typ
Max
Units
Resolution
12
Bit
ADC clock frequency = 6MHz,
+/-4
Input Voltage Range = 0 - VADVREFP
Integral non-linearity
ADC clock frequency = 6MHz,
+/-2
Input Voltage Range = (10% VADVREFP) -
LSB
(90% VADVREFP
)
Differential non-linearity
Offset error
-1.5
1.5
ADC clock frequency = 6MHz
+/-3
+/-5
Gain error
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Table 7-31. Transfer Characteristics, 10-bit Resolution Mode(1)
Parameter
Conditions
Min
Typ
10
Max
Units
Resolution
Bit
Integral non-linearity
Differential non-linearity
Offset error
+/-1
-1
1
ADC clock frequency = 6MHz
LSB
+/-1
+/-2
Gain error
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Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Table 7-32. Transfer Characteristics, 8-bit Resolution Mode(1)
Parameter
Conditions
Min
Typ
8
Max
Units
Resolution
Bit
Integral non-linearity
Differential non-linearity
Offset error
+/-0.5
-0.3
0.3
ADC clock frequency = 6MHz
LSB
+/-1
+/-1
Gain error
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
7.8.7
Temperature Sensor Characteristics
Table 7-33. Temperature Sensor Characteristics(1)
Symbol
Parameter
Condition
Min
Typ
1
Max
Units
mV/°C
Gradient
ITS
Current consumption
Startup time
1
µA
µs
tSTARTUP
0
Note:
1. The Temperature Sensor is not calibrated. The accuracy of the Temperature Sensor is governed by the ADC accuracy.
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7.8.8
Analog Comparator Characteristics
Table 7-34. Analog Comparator Characteristics
Symbol
Parameter
Condition
Min
Typ
Max
Units
Positive input
-0.2
VVDDIO + 0.3
voltage range(3)
V
Negative input
voltage range(3)
-0.2
VVDDIO - 0.6
VACREFN = 1.0V,
fAC = 12MHz,
Statistical offset(3)
20
mV
filter length = 2,
hysteresis = 0(1)
Clock frequency for
GCLK4(3)
fAC
12
MHz
Comparisons
per second
Throughput rate(3)
fAC = 12MHz
12 000 000
Delay from input
change to
Interrupt Status
Register Changes
⎛
⎝
1
⎞
Propagation delay
+ 3 × tCLKACIFB
ns
----------------------------------------
tCLKACIFB × fAC
⎠
All channels,
VDDIO = 3.3V,
Current
IAC
420
µA
consumption(3)
fA = 3MHz
tSTARTUP
Startup time
3
cycles
Input current per
pin(3)
0.2
µA/MHz(2)
Notes: 1. AC.CONFn.FLEN and AC.CONFn.HYS fields, refer to the Analog Comparator Interface chapter.
2. Referring to fAC
.
3. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
7.8.9
Capacitive Touch Characteristics
7.8.9.1
Discharge Current Source
Table 7-35. DICS Characteristics
Symbol
RREF
k
Parameter
Min
Typ
170
0.7
Max
Unit
kOhm
%
Internal resistor
Trim step size(1)
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
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7.8.9.2
Strong Pull-up Pull-down
Table 7-36. Strong Pull-up Pull-down
Parameter
Min
Typ
Max
Unit
Pull-down resistor
1
1
kOhm
Pull-up resistor
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7.9
Timing Characteristics
7.9.1
Startup, Reset, and Wake-up Timing
The startup, reset, and wake-up timings are calculated using the following formula:
t = t
+ N
× t
CONST
CPU
CPU
Where t
and N
are found in Table 7-37. t
is the period of the CPU clock. If a
CPU
CONST
CPU
clock source other than RCSYS is selected as the CPU clock, the oscillator startup time,
, must be added to the wake-up time from the stop, deepstop, and static sleep
t
OSCSTART
modes. Please refer to the source for the CPU clock in the ”Oscillator Characteristics” on page
49 for more details about oscillator startup times.
Table 7-37. Maximum Reset and Wake-up Timing(1)
Parameter
Measuring
Max t
(in µs) Max N
CONST
CPU
Time from VDDIN crossing the VPOT+ threshold of
POR33 to the first instruction entering the decode
stage of CPU. VDDCORE is supplied by the internal
regulator.
Startup time from power-up, using
regulator
2210
0
Time from VDDIN crossing the VPOT+ threshold of
POR33 to the first instruction entering the decode
stage of CPU. VDDCORE is connected to VDDIN.
Startup time from power-up, no
regulator
1810
170
0
0
Time from releasing a reset source (except POR18,
POR33, and SM33) to the first instruction entering
the decode stage of CPU.
Startup time from reset release
Idle
0
0
0
19
Frozen
110
110
116
116
116
From wake-up event to the first instruction of an
interrupt routine entering the decode stage of the
CPU.
Standby
Wake-up
Stop
27 + t
27 + t
97 + t
OSCSTART
OSCSTART
OSCSTART
Deepstop
Static
From wake-up event to the first instruction entering
the decode stage of the CPU.
Wake-up from shutdown
1180
0
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
7.9.2
RESET_N Timing
Table 7-38. RESET_N Waveform Parameters(1)
Symbol
Parameter
Conditions
Min
10
Max
Units
ns
tRESET
RESET_N minimum pulse length
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
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7.9.3
USART in SPI Mode Timing
7.9.3.1
Master mode
Figure 7-8. USART in SPI Master Mode with (CPOL= CPHA= 0) or (CPOL= CPHA= 1)
SPCK
MISO
USPI0
USPI1
MOSI
USPI2
Figure 7-9. USART in SPI Master Mode with (CPOL= 0 and CPHA= 1) or (CPOL= 1 and
CPHA= 0)
SPCK
MISO
USPI3
USPI4
MOSI
USPI5
Table 7-39. USART in SPI Mode Timing, Master Mode(1)
Symbol
USPI0
USPI1
USPI2
USPI3
USPI4
USPI5
Parameter
Conditions
Min
Max
16.5
Units
(2)
(2)
MISO setup time before SPCK rises
MISO hold time after SPCK rises
SPCK rising to MOSI delay
MISO setup time before SPCK falls
MISO hold time after SPCK falls
SPCK falling to MOSI delay
28.7 + tSAMPLE
0
VVDDIO from
3.0V to 3.6V,
maximum
external
capacitor =
40pF
ns
25.8 + tSAMPLE
0
21.19
Notes: 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
tSPCK
1
2
⎛
⎞
2. Where: tSAMPLE = tSPCK
–
-- × tCLKUSART
------------------------------------
⎝
⎠
2 × tCLKUSART
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Maximum SPI Frequency, Master Output
The maximum SPI master output frequency is given by the following formula:
× 2
f
1
SPIn
CLKSPI
f
= MIN(f
,------------ , ----------------------------)
PINMAX
SPCKMAX
9
Where SPIn is the MOSI delay, USPI2 or USPI5 depending on CPOL and NCPHA. fPINMAX is
the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for
the maximum frequency of the pins. fCLKSPI is the maximum frequency of the CLK_SPI. Refer
to the SPI chapter for a description of this clock.
Maximum SPI Frequency, Master Input
The maximum SPI master input frequency is given by the following formula:
f
× 2
1
CLKSPI
f
= MIN(-----------------------------------,----------------------------)
SPCKMAX
SPIn + t
9
VALID
Where SPIn is the MISO setup and hold time, USPI0 + USPI1 or USPI3 + USPI4 depending on
CPOL and NCPHA.TVALID is the SPI slave response time. Please refer to the SPI slave
datasheet for TVALID .fCLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chap-
ter for a description of this clock.
7.9.3.2
Slave mode
Figure 7-10. USART in SPI Slave Mode with (CPOL= 0 and CPHA= 1) or (CPOL= 1 and
CPHA= 0)
SPCK
MISO
USPI6
MOSI
USPI7
USPI8
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Figure 7-11. USART in SPI Slave Mode with (CPOL= CPHA= 0) or (CPOL= CPHA= 1)
SPCK
MISO
USPI9
MOSI
USPI10
USPI11
Figure 7-12. USART in SPI Slave Mode, NPCS Timing
USPI12
USPI13
USPI15
SPCK, CPOL=0
SPCK, CPOL=1
USPI14
NSS
Table 7-40. USART in SPI mode Timing, Slave Mode(1)
Symbol
Parameter
Conditions
Min
Max
Units
USPI6
SPCK falling to MISO delay
37.3
(2)
2.6 + tSAMPLE
+
+
USPI7
MOSI setup time before SPCK rises
tCLK_USART
USPI8
USPI9
MOSI hold time after SPCK rises
SPCK rising to MISO delay
0
VVDDIO from
3.0V to 3.6V,
maximum
external
37.0
(2)
2.6 + tSAMPLE
tCLK_USART
USPI10
MOSI setup time before SPCK falls
ns
capacitor =
40pF
USPI11
USPI12
USPI13
USPI14
USPI15
MOSI hold time after SPCK falls
NSS setup time before SPCK rises
NSS hold time after SPCK falls
NSS setup time before SPCK falls
NSS hold time after SPCK rises
0
27.2
0
27.2
0
Notes: 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
tSPCK
1
2
⎛
⎞
2. Where: tSAMPLE = tSPCK
–
+ -- × tCLKUSART
------------------------------------
⎝
⎠
2 × tCLKUSART
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Maximum SPI Frequency, Slave Input Mode
The maximum SPI slave input frequency is given by the following formula:
× 2
f
1
SPIn
CLKSPI
f
= MIN(----------------------------,------------ )
SPCKMAX
9
Where SPIn is the MOSI setup and hold time, USPI7 + USPI8 or USPI10 + USPI11 depending
on CPOL and NCPHA. fCLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI
chapter for a description of this clock.
Maximum SPI Frequency, Slave Output Mode
The maximum SPI slave output frequency is given by the following formula:
f
× 2
1
CLKSPI
f
= MIN(----------------------------, f
,------------------------------------ )
SPCKMAX
PINMAX
9
SPIn + t
SETUP
Where SPIn is the MISO delay, USPI6 or USPI9 depending on CPOL and NCPHA. TSETUP is
the SPI master setup time. Please refer to the SPI master datasheet for TSETUP . fCLKSPI is the
maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this
clock.fPINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteris-
tics section for the maximum frequency of the pins.
7.9.4
SPI Timing
7.9.4.1
Master mode
Figure 7-13. SPI Master Mode with (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1)
SPCK
MISO
SPI0
SPI1
MOSI
SPI2
68
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Figure 7-14. SPI Master Mode with (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0)
SPCK
MISO
SPI3
SPI4
MOSI
SPI5
Table 7-41. SPI Timing, Master Mode(1)
Symbol
SPI0
SPI1
SPI2
SPI3
SPI4
SPI5
Parameter
Conditions
Min
Max
7.1
Units
MISO setup time before SPCK rises
MISO hold time after SPCK rises
SPCK rising to MOSI delay
33.4 + (tCLK_SPI)/2
0
VVDDIO from
3.0V to 3.6V,
maximum
external
capacitor =
40pF
ns
MISO setup time before SPCK falls
MISO hold time after SPCK falls
SPCK falling to MOSI delay
29.2 + (tCLK_SPI)/2
0
8.63
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Maximum SPI Frequency, Master Output
The maximum SPI master output frequency is given by the following formula:
1
f
= MIN(f
,------------ )
PINMAX
SPCKMAX
SPIn
Where SPIn is the MOSI delay, SPI2 or SPI5 depending on CPOL and NCPHA. fPINMAX is the
maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the
maximum frequency of the pins.
Maximum SPI Frequency, Master Input
The maximum SPI master input frequency is given by the following formula:
1
f
= -----------------------------------
SPCKMAX
SPIn + t
VALID
Where SPIn is the MISO setup and hold time, SPI0 + SPI1 or SPI3 + SPI4 depending on
CPOL and NCPHA. tVALID is the SPI slave response time. Please refer to the SPI slave
datasheet for tVALID
.
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7.9.4.2
Slave mode
Figure 7-15. SPI Slave Mode with (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0)
SPCK
MISO
SPI6
MOSI
SPI7
SPI8
Figure 7-16. SPI Slave Mode with (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1)
SPCK
MISO
SPI9
MOSI
SPI10
SPI11
Figure 7-17. SPI Slave Mode, NPCS Timing
SPI12
SPI13
SPI15
SPCK, CPOL=0
SPCK, CPOL=1
SPI14
NPCS
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Table 7-42. SPI Timing, Slave Mode(1)
Symbol
SPI6
Parameter
Conditions
Min
Max
Units
SPCK falling to MISO delay
29.4
SPI7
MOSI setup time before SPCK rises
MOSI hold time after SPCK rises
SPCK rising to MISO delay
0
SPI8
6.0
VVDDIO from
3.0V to 3.6V,
maximum
external
capacitor =
40pF
SPI9
29.0
SPI10
SPI11
SPI12
SPI13
SPI14
SPI15
MOSI setup time before SPCK falls
MOSI hold time after SPCK falls
NPCS setup time before SPCK rises
NPCS hold time after SPCK falls
NPCS setup time before SPCK falls
NPCS hold time after SPCK rises
0
ns
5.5
3.4
1.1
3.3
0.7
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Maximum SPI Frequency, Slave Input Mode
The maximum SPI slave input frequency is given by the following formula:
1
f
= MIN(f
,------------ )
CLKSPI
SPCKMAX
SPIn
Where SPIn is the MOSI setup and hold time, SPI7 + SPI8 or SPI10 + SPI11 depending on
CPOL and NCPHA. fCLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chap-
ter for a description of this clock.
Maximum SPI Frequency, Slave Output Mode
The maximum SPI slave output frequency is given by the following formula:
1
f
= MIN(f
,------------------------------------ )
PINMAX
SPCKMAX
SPIn + t
SETUP
Where SPIn is the MISO delay, SPI6 or SPI9 depending on CPOL and NCPHA. tSETUP is the
SPI master setup time. Please refer to the SPI master datasheet for tSETUP .fPINMAX is the max-
imum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the
maximum frequency of the pins.
7.9.5
TWIM/TWIS Timing
Figure 7-43 shows the TWI-bus timing requirements and the compliance of the device with
them. Some of these requirements (tr and tf) are met by the device without requiring user inter-
vention. Compliance with the other requirements (tHD-STA, tSU-STA, tSU-STO, tHD-DAT, tSU-DAT-TWI, tLOW-
TWI, tHIGH, and fTWCK) requires user intervention through appropriate programming of the relevant
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TWIM and TWIS user interface registers. Please refer to the TWIM and TWIS sections for more
information.
Table 7-43. TWI-Bus Timing Requirements
Minimum
Requirement
Maximum
Requirement
Symbol
tr
Parameter
Mode
Standard(1)
Fast(1)
Standard
Fast
Device
Device
Unit
-
1000
300
300
300
TWCK and TWD rise time
ns
20 + 0.1Cb
-
tf
TWCK and TWD fall time
(Repeated) START hold time
(Repeated) START set-up time
STOP set-up time
ns
μs
μs
μs
20 + 0.1Cb
Standard
Fast
4
tHD-STA
tSU-STA
tSU-STO
tHD-DAT
tclkpb
-
-
-
0.6
4.7
0.6
4.0
0.6
Standard
Fast
tclkpb
Standard
Fast
4tclkpb
Standard
Fast
3.45()
0.9()
Data hold time
0.3(2)
2tclkpb
15tprescaled + tclkpb μs
Standard
Fast
250
100
-
tSU-DAT-TWI Data set-up time
tSU-DAT
tLOW-TWI
tLOW
2tclkpb
tclkpb
4tclkpb
tclkpb
-
-
-
-
-
ns
-
-
Standard
Fast
4.7
1.3
-
TWCK LOW period
μs
-
-
Standard
Fast
4.0
0.6
tHIGH
TWCK HIGH period
TWCK frequency
8tclkpb
μs
Standard
Fast
100
400
1
fTWCK
-
-----------------------
kHz
12t
clkpb
Notes: 1. Standard mode: fTWCK ≤ 100 kHz ; fast mode: fTWCK > 100 kHz .
2. A device must internally provide a hold time of at least 300 ns for TWD with reference to the falling edge of TWCK.
Notations:
Cb = total capacitance of one bus line in pF
tclkpb = period of TWI peripheral bus clock
tprescaled = period of TWI internal prescaled clock (see chapters on TWIM and TWIS)
The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW-TWI
of TWCK.
)
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7.9.6
JTAG Timing
Figure 7-18. JTAG Interface Signals
JTAG2
TCK
JTAG0
JTAG1
TMS/TDI
JTAG3
JTAG4
TDO
JTAG5
JTAG6
Boundary
Scan Inputs
JTAG7
JTAG8
Boundary
Scan Outputs
JTAG9
JTAG10
Table 7-44. JTAG Timings(1)
Symbol
JTAG0
JTAG1
JTAG2
JTAG3
JTAG4
JTAG5
JTAG6
JTAG7
JTAG8
JTAG9
JTAG10
Parameter
Conditions
Min
21.8
8.6
Max
Units
TCK Low Half-period
TCK High Half-period
TCK Period
30.3
2.0
TDI, TMS Setup before TCK High
TDI, TMS Hold after TCK High
TDO Hold Time
VVDDIO from
3.0V to 3.6V,
maximum
external
capacitor =
40pF
2.3
9.5
ns
TCK Low to TDO Valid
21.8
32.2
Boundary Scan Inputs Setup Time
Boundary Scan Inputs Hold Time
Boundary Scan Outputs Hold Time
TCK to Boundary Scan Outputs Valid
0.6
6.9
9.3
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
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8. Mechanical Characteristics
8.1
Thermal Considerations
8.1.1
Thermal Data
Table 8-1 summarizes the thermal resistance data depending on the package.
Table 8-1.
Symbol
θJA
Thermal Resistance Data
Parameter
Condition
Package
TQFP48
TQFP48
QFN48
Typ
54.4
15.7
26.0
1.6
Unit
Junction-to-ambient thermal resistance Still Air
Junction-to-case thermal resistance
°C/W
θJC
θJA
Junction-to-ambient thermal resistance Still Air
Junction-to-case thermal resistance
°C/W
°C/W
θJC
QFN48
θJA
Junction-to-ambient thermal resistance Still Air
Junction-to-case thermal resistance
TLLGA48
TLLGA48
25.4
12.7
θJC
8.1.2
Junction Temperature
The average chip-junction temperature, TJ, in °C can be obtained from the following:
1. = T + (P × θ
T
)
JA
J
A
D
2. TJ = TA + (PD × (θHEATSINK + θJC ))
where:
• θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 8-1.
• θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
Table 8-1.
• θHEAT SINK = cooling device thermal resistance (°C/W), provided in the device datasheet.
• PD = device power consumption (W) estimated from data provided in Section 7.4 on page 42.
• TA = ambient temperature (°C).
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature TJ in °C.
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8.2
Package Drawings
Figure 8-1. TQFP-48 Package Drawing
Table 8-2.
Device and Package Maximum Weight
140
mg
Table 8-3.
Package Characteristics
Moisture Sensitivity Level
MSL3
Table 8-4.
Package Reference
JEDEC Drawing Reference
JESD97 Classification
MS-026
E3
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Figure 8-2. QFN-48 Package Drawing
Note:
The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 8-5.
Device and Package Maximum Weight
140
mg
Table 8-6.
Package Characteristics
Moisture Sensitivity Level
MSL3
Table 8-7.
Package Reference
JEDEC Drawing Reference
JESD97 Classification
M0-220
E3
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Figure 8-3. TLLGA-48 Package Drawing
Table 8-8.
Device and Package Maximum Weight
39.3
mg
Table 8-9.
Package Characteristics
Moisture Sensitivity Level
MSL3
Table 8-10. Package Reference
JEDEC Drawing Reference
JESD97 Classification
N/A
E4
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8.3
Soldering Profile
Table 8-11 gives the recommended soldering profile from J-STD-20.
Table 8-11. Soldering Profile
Profile Feature
Green Package
3°C/s max
150-200°C
60-150 s
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C 25°C
Time Maintained Above 217°C
Time within 5°C of Actual Peak Temperature
Peak Temperature Range
30 s
260°C
Ramp-down Rate
6°C/s max
8 minutes max
Time 25°C to Peak Temperature
A maximum of three reflow passes is allowed per component.
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9. Ordering Information
Table 9-1.
Ordering Information
Temperature Operating
Device
Ordering Code
Carrier Type
ES
Package
Package Type
Range
AT32UC3L0256-AUTES
AT32UC3L0256-AUT
AT32UC3L0256-AUR
AT32UC3L0256-ZAUTES
Tray
TQFP 48
Tape & Reel
ES
JESD97 Classification E3
AT32UC3L0256
AT32UC3L0256-ZAUT
AT32UC3L0256-ZAUR
AT32UC3L0256-D3HES
AT32UC3L0256-D3HT
AT32UC3L0256-D3HR
AT32UC3L0128-AUT
AT32UC3L0128-AUR
AT32UC3L0128-ZAUT
AT32UC3L0128-ZAUR
AT32UC3L0128-D3HT
AT32UC3L0128-D3HR
Tray
QFN 48
Tape & Reel
ES
Tray
TLLGA 48
JESD97 Classification E4 Industrial (-40°C to 85°C)
Tape & Reel
Tray
TQFP 48
QFN 48
Tape & Reel
Tray
JESD97 Classification E3
JESD97 Classification E4
AT32UC3L0128
Tape & Reel
Tray
TLLGA 48
Tape & Reel
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10. Errata
10.1 Rev. C
10.1.1
SCIF
1. The RC32K output on PA20 is not always permanently disabled
The RC32K output on PA20 may sometimes re-appear.
Fix/Workaround
Before using RC32K for other purposes, the following procedure has to be followed in order
to properly disable it:
- Run the CPU on RCSYS
- Disable the output to PA20 by writing a zero to PM.PPCR.RC32OUT
- Enable RC32K by writing a one to SCIF.RC32KCR.EN, and wait for this bit to be read as
one
- Disable RC32K by writing a zero to SCIF.RC32KCR.EN, and wait for this bit to be read as
zero.
2. PLLCOUNT value larger than zero can cause PLLEN glitch
Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN sig-
nal during asynchronous wake up.
Fix/Workaround
The lock-masking mechanism for the PLL should not be used.
The PLLCOUNT field of the PLL Control Register should always be written to zero.
3. Writing 0x5A5A5A5A to the SCIF memory range will enable the SCIF UNLOCK feature
The SCIF UNLOCK feature will be enabled if the value 0x5A5A5A5A is written to any loca-
tion in the SCIF memory range.
Fix/Workaround
None.
10.1.2
SPI
1. SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0
When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI
module will not start a data transfer.
Fix/Workaround
Disable mode fault detection by writing a one to MR.MODFDIS.
2. Disabling SPI has no effect on the SR.TDRE bit
Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered
when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is
disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer
is empty, and this data will be lost.
Fix/Workaround
Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the
SPI and PDCA.
3. SPI disable does not work in SLAVE mode
SPI disable does not work in SLAVE mode.
Fix/Workaround
Read the last received data, then perform a software reset by writing a one to the Software
Reset bit in the Control Register (CR.SWRST).
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4. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and
NCPHA=0
When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one
(CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0,
then an additional pulse will be generated on SCK.
Fix/Workaround
When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1
if CSRn.CPOL=1 and CSRn.NCPHA=0.
5. SPI mode fault detection enable causes incorrect behavior
When mode fault detection is enabled (MR.MODFDIS==0), the SPI module may not operate
properly.
Fix/Workaround
Always disable mode fault detection before using the SPI by writing a one to MR.MODFDIS.
6. SPI RDR.PCS is not correct
The PCS (Peripheral Chip Select) field in the SPI RDR (Receive Data Register) does not
correctly indicate the value on the NPCS pins at the end of a transfer.
Fix/Workaround
Do not use the PCS field of the SPI RDR.
10.1.3
TWI
1. SMBALERT bit may be set after reset
The SMBus Alert (SMBALERT) bit in the Status Register (SR) might be erroneously set after
system reset.
Fix/Workaround
After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer.
2. Clearing the NAK bit before the BTF bit is set locks up the TWI bus
When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Reg-
ister (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to
attempt to continue transmitting data, thus locking up the bus.
Fix/Workaround
Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been
set.
10.1.4
TC
1. Channel chaining skips first pulse for upper channel
When chaining two channels using the Block Mode Register, the first pulse of the clock
between the channels is skipped.
Fix/Workaround
Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle
for the upper channel. After the dummy cycle has been generated, indicated by the
SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real
values.
10.1.5
CAT
1. CAT QMatrix sense capacitors discharged prematurely
At the end of a QMatrix burst charging sequence that uses different burst count values for
different Y lines, the Y lines may be incorrectly grounded for up to n-1 periods of the periph-
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eral bus clock, where n is the ratio of the PB clock frequency to the GCLK_CAT frequency.
This results in premature loss of charge from the sense capacitors and thus increased vari-
ability of the acquired count values.
Fix/Workaround
Enable the 1kOhm drive resistors on all implemented QMatrix Y lines (CSA 1, 3, 5, 7, 9, 11,
13, and/or 15) by writing ones to the corresponding odd bits of the CSARES register.
2. Autonomous CAT acquisition must be longer than AST source clock period
When using the AST to trigger CAT autonomous touch acquisition in sleep modes where the
CAT bus clock is turned off, the CAT will start several acquisitions if the period of the AST
source clock is larger than one CAT acquisition. One AST clock period after the AST trigger,
the CAT clock will automatically stop and the CAT acquisition can be stopped prematurely,
ruining the result.
Fix/Workaround
Always ensure that the ATCFG1.max field is set so that the duration of the autonomous
touch acquisition is greater than one clock period of the AST source clock.
10.1.6
aWire
1. aWire MEMORY_SPEED_REQUEST command does not return correct CV
The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to
the formula in the aWire Debug Interface chapter.
Fix/Workaround
Issue
a
dummy read to address 0x100000000 before issuing the
MEMORY_SPEED_REQUEST command and use this formula instead:
7faw
fsab = ----------------
CV – 3
10.2 Rev. B
10.2.1
SCIF
1. The RC32K output on PA20 is not always permanently disabled
The RC32K output on PA20 may sometimes re-appear.
Fix/Workaround
Before using RC32K for other purposes, the following procedure has to be followed in order
to properly disable it:
- Run the CPU on RCSYS
- Disable the output to PA20 by writing a zero to PM.PPCR.RC32OUT
- Enable RC32K by writing a one to SCIF.RC32KCR.EN, and wait for this bit to be read as
one
- Disable RC32K by writing a zero to SCIF.RC32KCR.EN, and wait for this bit to be read as
zero.
2. PLLCOUNT value larger than zero can cause PLLEN glitch
Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN sig-
nal during asynchronous wake up.
Fix/Workaround
The lock-masking mechanism for the PLL should not be used.
The PLLCOUNT field of the PLL Control Register should always be written to zero.
3. Writing 0x5A5A5A5A to the SCIF memory range will enable the SCIF UNLOCK feature
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The SCIF UNLOCK feature will be enabled if the value 0x5A5A5A5A is written to any loca-
tion in the SCIF memory range.
Fix/Workaround
None.
10.2.2
WDT
1. WDT Control Register does not have synchronization feedback
When writing to the Timeout Prescale Select (PSEL), Time Ban Prescale Select (TBAN),
Enable (EN), or WDT Mode (MODE) fieldss of the WDT Control Register (CTRL), a synchro-
nizer is started to propagate the values to the WDT clcok domain. This synchronization
takes a finite amount of time, but only the status of the synchronization of the EN bit is
reflected back to the user. Writing to the synchronized fields during synchronization can lead
to undefined behavior.
Fix/Workaround
-When writing to the affected fields, the user must ensure a wait corresponding to 2 clock
cycles of both the WDT peripheral bus clock and the selected WDT clock source.
-When doing writes that changes the EN bit, the EN bit can be read back until it reflects the
written value.
10.2.3
SPI
1. SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0
When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI
module will not start a data transfer.
Fix/Workaround
Disable mode fault detection by writing a one to MR.MODFDIS.
2. Disabling SPI has no effect on the SR.TDRE bit
Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered
when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is
disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer
is empty, and this data will be lost.
Fix/Workaround
Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the
SPI and PDCA.
3. SPI disable does not work in SLAVE mode
SPI disable does not work in SLAVE mode.
Fix/Workaround
Read the last received data, then perform a software reset by writing a one to the Software
Reset bit in the Control Register (CR.SWRST).
4. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and
NCPHA=0
When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one
(CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0,
then an additional pulse will be generated on SCK.
Fix/Workaround
When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1
if CSRn.CPOL=1 and CSRn.NCPHA=0.
5. SPI mode fault detection enable causes incorrect behavior
When mode fault detection is enabled (MR.MODFDIS==0), the SPI module may not operate
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properly.
Fix/Workaround
Always disable mode fault detection before using the SPI by writing a one to MR.MODFDIS.
6. SPI RDR.PCS is not correct
The PCS (Peripheral Chip Select) field in the SPI RDR (Receive Data Register) does not
correctly indicate the value on the NPCS pins at the end of a transfer.
Fix/Workaround
Do not use the PCS field of the SPI RDR.
10.2.4
TWI
1. TWIS may not wake the device from sleep mode
If the CPU is put to a sleep mode (except Idle and Frozen) directly after a TWI Start condi-
tion, the CPU may not wake upon a TWIS address match. The request is NACKed.
Fix/Workaround
When using the TWI address match to wake the device from sleep, do not switch to sleep
modes deeper than Frozen. Another solution is to enable asynchronous EIC wake on the
TWIS clock (TWCK) or TWIS data (TWD) pins, in order to wake the system up on bus
events.
2. SMBALERT bit may be set after reset
The SMBus Alert (SMBALERT) bit in the Status Register (SR) might be erroneously set after
system reset.
Fix/Workaround
After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer.
3. Clearing the NAK bit before the BTF bit is set locks up the TWI bus
When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Reg-
ister (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to
attempt to continue transmitting data, thus locking up the bus.
Fix/Workaround
Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been
set.
10.2.5
PWMA
1. The SR.READY bit cannot be cleared by writing to SCR.READY
The Ready bit in the Status Register will not be cleared when writing a one to the corre-
sponding bit in the Status Clear register. The Ready bit will be cleared when the Busy bit is
set.
Fix/Workaround
Disable the Ready interrupt in the interrupt handler when receiving the interrupt. When an
operation that triggers the Busy/Ready bit is started, wait until the ready bit is low in the Sta-
tus Register before enabling the interrupt.
10.2.6
TC
1. Channel chaining skips first pulse for upper channel
When chaining two channels using the Block Mode Register, the first pulse of the clock
between the channels is skipped.
Fix/Workaround
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Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle
for the upper channel. After the dummy cycle has been generated, indicated by the
SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real
values.
10.2.7
CAT
1. CAT QMatrix sense capacitors discharged prematurely
At the end of a QMatrix burst charging sequence that uses different burst count values for
different Y lines, the Y lines may be incorrectly grounded for up to n-1 periods of the periph-
eral bus clock, where n is the ratio of the PB clock frequency to the GCLK_CAT frequency.
This results in premature loss of charge from the sense capacitors and thus increased vari-
ability of the acquired count values.
Fix/Workaround
Enable the 1kOhm drive resistors on all implemented QMatrix Y lines (CSA 1, 3, 5, 7, 9, 11,
13, and/or 15) by writing ones to the corresponding odd bits of the CSARES register.
2. Autonomous CAT acquisition must be longer than AST source clock period
When using the AST to trigger CAT autonomous touch acquisition in sleep modes where the
CAT bus clock is turned off, the CAT will start several acquisitions if the period of the AST
source clock is larger than one CAT acquisition. One AST clock period after the AST trigger,
the CAT clock will automatically stop and the CAT acquisition can be stopped prematurely,
ruining the result.
Fix/Workaround
Always ensure that the ATCFG1.max field is set so that the duration of the autonomous
touch acquisition is greater than one clock period of the AST source clock.
3. CAT consumes unnecessary power when disabled or when autonomous touch not
used
A CAT prescaler controlled by the ATCFG0.DIV field will be active even when the CAT mod-
ule is disabled or when the autonomous touch feature is not used, thereby causing
unnecessary power consumption.
Fix/Workaround
If the CAT module is not used, disable the CLK_CAT clock in the PM module. If the CAT
module is used but the autonomous touch feature is not used, the power consumption of the
CAT module may be reduced by writing 0xFFFF to the ATCFG0.DIV field.
10.2.8
aWire
1. aWire MEMORY_SPEED_REQUEST command does not return correct CV
The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to
the formula in the aWire Debug Interface chapter.
Fix/Workaround
Issue
a
dummy read to address 0x100000000 before issuing the
MEMORY_SPEED_REQUEST command and use this formula instead:
7faw
fsab = ----------------
CV – 3
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10.3 Rev. A
10.3.1
Device
1. JTAGID is wrong
The JTAGID is 0x021DF03F.
Fix/Workaround
None.
10.3.2
FLASHCDW
1. General-purpose fuse programming does not work
The general-purpose fuses cannot be programmed and are stuck at 1. Please refer to the
Fuse Settings chapter in the FLASHCDW for more information about what functions are
affected.
Fix/Workaround
None.
2. Set Security Bit command does not work
The Set Security Bit (SSB) command of the FLASHCDW does not work. The device cannot
be locked from external JTAG, aWire, or other debug accesses.
Fix/Workaround
None.
3. Flash programming time is longer than specified
The flash programming time is now:
Table 10-1. Flash Characteristics
Symbol Parameter
Conditions
Min
Typ
7.5
7.5
1
Max
Unit
TFPP
TFPE
TFFP
TFEA
Page programming time
Page erase time
f
CLK_HSB= 50MHz
Fuse programming time
Full chip erase time (EA)
ms
9
JTAG chip erase time
(CHIP_ERASE)
TFCE
fCLK_HSB= 115kHz
250
Fix/Workaround
None.
10.3.3
Power Manager
1. Clock Failure Detector (CFD) can be issued while turning off the CFD
While turning off the CFD, the CFD bit in the Status Register (SR) can be set. This will
change the main clock source to RCSYS.
Fix/Workaround
Solution 1: Enable CFD interrupt. If CFD interrupt is issues after turning off the CFD, switch
back to original main clock source.
Solution 2: Only turn off the CFD while running the main clock on RCSYS.
2. Sleepwalking in idle and frozen sleep mode will mask all other PB clocks
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If the CPU is in idle or frozen sleep mode and a module is in a state that triggers sleep walk-
ing, all PB clocks will be masked except the PB clock to the sleepwalking module.
Fix/Workaround
Mask all clock requests in the PM.PPCR register before going into idle or frozen mode.
2. Unused PB clocks are running
Three unused PBA clocks are enabled by default and will cause increased active power
consumption.
Fix/Workaround
Disable the clocks by writing zeroes to bits [27:25] in the PBA clock mask register.
10.3.4
SCIF
1. The RC32K output on PA20 is not always permanently disabled
The RC32K output on PA20 may sometimes re-appear.
Fix/Workaround
Before using RC32K for other purposes, the following procedure has to be followed in order
to properly disable it:
- Run the CPU on RCSYS
- Disable the output to PA20 by writing a zero to PM.PPCR.RC32OUT
- Enable RC32K by writing a one to SCIF.RC32KCR.EN, and wait for this bit to be read as
one
- Disable RC32K by writing a zero to SCIF.RC32KCR.EN, and wait for this bit to be read as
zero.
2. PLL lock might not clear after disable
Under certain circumstances, the lock signal from the Phase Locked Loop (PLL) oscillator
may not go back to zero after the PLL oscillator has been disabled. This can cause the prop-
agation of clock signals with the wrong frequency to parts of the system that use the PLL
clock.
Fix/Workaround
PLL must be turned off before entering STOP, DEEPSTOP or STATIC sleep modes. If PLL
has been turned off, a delay of 30us must be observed after the PLL has been enabled
again before the SCIF.PLL0LOCK bit can be used as a valid indication that the PLL is
locked.
3. PLLCOUNT value larger than zero can cause PLLEN glitch
Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN sig-
nal during asynchronous wake up.
Fix/Workaround
The lock-masking mechanism for the PLL should not be used.
The PLLCOUNT field of the PLL Control Register should always be written to zero.
4. RCSYS is not calibrated
The RCSYS is not calibrated and will run faster than 115.2kHz. Frequencies around 150kHz
can be expected.
Fix/Workaround
If a known clock source is available the RCSYS can be runtime calibrated by using the fre-
quency meter (FREQM) and tuning the RCSYS by writing to the RCCR register in SCIF.
5. Writing 0x5A5A5A5A to the SCIF memory range will enable the SCIF UNLOCK feature
The SCIF UNLOCK feature will be enabled if the value 0x5A5A5A5A is written to any loca-
tion in the SCIF memory range.
Fix/Workaround
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None.
10.3.5
WDT
1. Clearing the Watchdog Timer (WDT) counter in second half of timeout period will
issue a Watchdog reset
If the WDT counter is cleared in the second half of the timeout period, the WDT will immedi-
ately issue a Watchdog reset.
Fix/Workaround
Use twice as long timeout period as needed and clear the WDT counter within the first half
of the timeout period. If the WDT counter is cleared after the first half of the timeout period,
you will get a Watchdog reset immediately. If the WDT counter is not cleared at all, the time
before the reset will be twice as long as needed.
2. WDT Control Register does not have synchronization feedback
When writing to the Timeout Prescale Select (PSEL), Time Ban Prescale Select (TBAN),
Enable (EN), or WDT Mode (MODE) fieldss of the WDT Control Register (CTRL), a synchro-
nizer is started to propagate the values to the WDT clcok domain. This synchronization
takes a finite amount of time, but only the status of the synchronization of the EN bit is
reflected back to the user. Writing to the synchronized fields during synchronization can lead
to undefined behavior.
Fix/Workaround
-When writing to the affected fields, the user must ensure a wait corresponding to 2 clock
cycles of both the WDT peripheral bus clock and the selected WDT clock source.
-When doing writes that changes the EN bit, the EN bit can be read back until it reflects the
written value.
10.3.6
GPIO
1. Clearing Interrupt flags can mask other interrupts
When clearing interrupt flags in a GPIO port, interrupts on other pins of that port, happening
in the same clock cycle will not be registered.
Fix/Workaround
Read the PVR register of the port before and after clearing the interrupt to see if any pin
change has happened while clearing the interrupt. If any change occurred in the PVR
between the reads, they must be treated as an interrupt.
10.3.7
SPI
1. SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0
When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI
module will not start a data transfer.
Fix/Workaround
Disable mode fault detection by writing a one to MR.MODFDIS.
2. Disabling SPI has no effect on the SR.TDRE bit
Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered
when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is
disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer
is empty, and this data will be lost.
Fix/Workaround
Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the
SPI and PDCA.
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3. SPI disable does not work in SLAVE mode
SPI disable does not work in SLAVE mode.
Fix/Workaround
Read the last received data, then perform a software reset by writing a one to the Software
Reset bit in the Control Register (CR.SWRST).
4. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and
NCPHA=0
When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one
(CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0,
then an additional pulse will be generated on SCK.
Fix/Workaround
When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1
if CSRn.CPOL=1 and CSRn.NCPHA=0.
5. SPI mode fault detection enable causes incorrect behavior
When mode fault detection is enabled (MR.MODFDIS==0), the SPI module may not operate
properly.
Fix/Workaround
Always disable mode fault detection before using the SPI by writing a one to MR.MODFDIS.
6. SPI RDR.PCS is not correct
The PCS (Peripheral Chip Select) field in the SPI RDR (Receive Data Register) does not
correctly indicate the value on the NPCS pins at the end of a transfer.
Fix/Workaround
Do not use the PCS field of the SPI RDR.
10.3.8
TWI
1. TWIS may not wake the device from sleep mode
If the CPU is put to a sleep mode (except Idle and Frozen) directly after a TWI Start condi-
tion, the CPU may not wake upon a TWIS address match. The request is NACKed.
Fix/Workaround
When using the TWI address match to wake the device from sleep, do not switch to sleep
modes deeper than Frozen. Another solution is to enable asynchronous EIC wake on the
TWIS clock (TWCK) or TWIS data (TWD) pins, in order to wake the system up on bus
events.
2. SMBALERT bit may be set after reset
The SMBus Alert (SMBALERT) bit in the Status Register (SR) might be erroneously set after
system reset.
Fix/Workaround
After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer.
3. Clearing the NAK bit before the BTF bit is set locks up the TWI bus
When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Reg-
ister (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to
attempt to continue transmitting data, thus locking up the bus.
Fix/Workaround
Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been
set.
4. TWIS stretch on Address match error
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When the TWIS stretches TWCK due to a slave address match, it also holds TWD low for
the same duration if it is to be receiving data. When TWIS releases TWCK, it releases TWD
at the same time. This can cause a TWI timing violation.
Fix/Workaround
None.
5. TWIM TWALM polarity is wrong
The TWALM signal in the TWIM is active high instead of active low.
Fix/Workaround
Use an external inverter to invert the signal going into the TWIM. When using both TWIM
and TWIS on the same pins, the TWALM cannot be used.
10.3.9
PWMA
1. The SR.READY bit cannot be cleared by writing to SCR.READY
The Ready bit in the Status Register will not be cleared when writing a one to the corre-
sponding bit in the Status Clear register. The Ready bit will be cleared when the Busy bit is
set.
Fix/Workaround
Disable the Ready interrupt in the interrupt handler when receiving the interrupt. When an
operation that triggers the Busy/Ready bit is started, wait until the ready bit is low in the Sta-
tus Register before enabling the interrupt.
10.3.10 TC
1. Channel chaining skips first pulse for upper channel
When chaining two channels using the Block Mode Register, the first pulse of the clock
between the channels is skipped.
Fix/Workaround
Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle
for the upper channel. After the dummy cycle has been generated, indicated by the
SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real
values.
10.3.11 ADCIFB
1. ADCIFB DMA transfer does not work with divided PBA clock
DMA requests from the ADCIFB will not be performed when the PBA clock is slower than
the HSB clock.
Fix/Workaround
Do not use divided PBA clock when the PDCA transfers from the ADCIFB.
10.3.12 CAT
1. CAT QMatrix sense capacitors discharged prematurely
At the end of a QMatrix burst charging sequence that uses different burst count values for
different Y lines, the Y lines may be incorrectly grounded for up to n-1 periods of the periph-
eral bus clock, where n is the ratio of the PB clock frequency to the GCLK_CAT frequency.
This results in premature loss of charge from the sense capacitors and thus increased vari-
ability of the acquired count values.
Fix/Workaround
Enable the 1kOhm drive resistors on all implemented QMatrix Y lines (CSA 1, 3, 5, 7, 9, 11,
13, and/or 15) by writing ones to the corresponding odd bits of the CSARES register.
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2. Autonomous CAT acquisition must be longer than AST source clock period
When using the AST to trigger CAT autonomous touch acquisition in sleep modes where the
CAT bus clock is turned off, the CAT will start several acquisitions if the period of the AST
source clock is larger than one CAT acquisition. One AST clock period after the AST trigger,
the CAT clock will automatically stop and the CAT acquisition can be stopped prematurely,
ruining the result.
Fix/Workaround
Always ensure that the ATCFG1.max field is set so that the duration of the autonomous
touch acquisition is greater than one clock period of the AST source clock.
3. CAT consumes unnecessary power when disabled or when autonomous touch not
used
A CAT prescaler controlled by the ATCFG0.DIV field will be active even when the CAT mod-
ule is disabled or when the autonomous touch feature is not used, thereby causing
unnecessary power consumption.
Fix/Workaround
If the CAT module is not used, disable the CLK_CAT clock in the PM module. If the CAT
module is used but the autonomous touch feature is not used, the power consumption of the
CAT module may be reduced by writing 0xFFFF to the ATCFG0.DIV field.
4. CAT module does not terminate QTouch burst on detect
The CAT module does not terminate a QTouch burst when the detection voltage is
reached on the sense capacitor. This can cause the sense capacitor to be charged more
than necessary. Depending on the dielectric absorption characteristics of the capacitor, this
can lead to unstable measurements.
Fix/Workaround
Use the minimum possible value for the MAX field in the ATCFG1, TG0CFG1, and
TG1CFG1 registers.
10.3.13 aWire
1. aWire MEMORY_SPEED_REQUEST command does not return correct CV
The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to
the formula in the aWire Debug Interface chapter.
Fix/Workaround
Issue
a
dummy read to address 0x100000000 before issuing the
MEMORY_SPEED_REQUEST command and use this formula instead:
7faw
fsab = ----------------
CV – 3
10.3.14 I/O Pins
1. PA05 is not 3.3V tolerant.
PA05 should be grounded on the PCB and left unused if VDDIO is above 1.8V.
Fix/Workaround
None.
2. No pull-up on pins that are not bonded
PB13 to PB27 are not bonded on UC3L0256/128, but has no pull-up and can cause current
consumption on VDDIO/VDDIN if left undriven.
Fix/Workaround
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Enable pull-ups on PB13 to PB27 by writing 0x0FFFE000 to the PUERS1 register in the
GPIO.
3. PA17 has low ESD tolerance
PA17 only tolerates 500V ESD pulses (Human Body Model).
Fix/Workaround
Care must be taken during manufacturing and PCB design.
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11. Datasheet Revision History
Please note that the referring page numbers in this section are referred to this document. The
referring revision in this section are referring to the document revision.
11.1 Rev. B – 01/2012
1.
Description: DFLL frequency is 20 to 150MHz, not 40 to 150MHz.
2.
3.
4.
Description: “One touch sensor can be configured to operate autonomously...” replaced by “All
touch sensors can be configured to operate autonomously...”.
Block Diagram: GCLK_IN is input, not output, and is 2 bits wide (GCLK_IN[1..0]). CAT SMP
corrected from I/O to output. SPI NPCS corrected from output to I/O.
Package and Pinout: PRND signal removed from Signal Descriptions List table and GPIO
Controller Function Multiplexing table.
5.
Supply and Startup Considerations: In 1.8V single supply mode figure, the input voltage is
1.62-1.98V, not 1.98-3.6V. “On system start-up, the DFLL is disabled” is replaced by “On
system start-up, all high-speed clocks are disabled”.
6.
7.
ADCIFB: PRND signal removed from block diagram.
Electrical Characteristics: Added PLL source clock in the Clock Frequencies table in the
Maximum Clock Frequencies section. Removed 64-pin package information from I/O Pin
Characteristics tables and Digital Clock Characteristics table.
8.
Electrical Characteristics: Removed USB Transceiver Characteristics, as the device contains
no USB.
9.
Mechanical Characteristics: Added notes to package drawings.
10.
Summary: Removed Programming and Debugging chapter, added Processor and Architecture
chapter.
11.
Datasheet Revision History: Corrected release date for datasheet rev. A; the correct date is
12/2011.
11.2 Rev. A – 12/2011
1.
Initial revision.
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Table of Contents
Features..................................................................................................... 1
Description ............................................................................................... 3
Overview ................................................................................................... 5
1
2
2.1
2.2
Block Diagram ...................................................................................................5
Configuration Summary .....................................................................................6
3
4
Package and Pinout ................................................................................. 7
3.1
3.2
3.3
3.4
Package .............................................................................................................7
Peripheral Multiplexing on I/O Lines ..................................................................8
Signal Descriptions ..........................................................................................13
I/O Line Considerations ...................................................................................16
Processor and Architecture .................................................................. 18
4.1
4.2
4.3
4.4
4.5
Features ..........................................................................................................18
AVR32 Architecture .........................................................................................18
The AVR32UC CPU ........................................................................................19
Programming Model ........................................................................................23
Exceptions and Interrupts ................................................................................27
5
Memories ................................................................................................ 32
5.1
5.2
5.3
5.4
Embedded Memories ......................................................................................32
Physical Memory Map .....................................................................................32
Peripheral Address Map ..................................................................................33
CPU Local Bus Mapping .................................................................................34
6
7
Supply and Startup Considerations ..................................................... 36
6.1
6.2
Supply Considerations .....................................................................................36
Startup Considerations ....................................................................................40
Electrical Characteristics ...................................................................... 41
7.1
7.2
7.3
7.4
7.5
7.6
7.7
Absolute Maximum Ratings* ...........................................................................41
Supply Characteristics .....................................................................................41
Maximum Clock Frequencies ..........................................................................42
Power Consumption ........................................................................................42
I/O Pin Characteristics .....................................................................................46
Oscillator Characteristics .................................................................................49
Flash Characteristics .......................................................................................54
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7.8
7.9
Analog Characteristics .....................................................................................55
Timing Characteristics .....................................................................................64
8
9
Mechanical Characteristics ................................................................... 74
8.1
8.2
8.3
Thermal Considerations ..................................................................................74
Package Drawings ...........................................................................................75
Soldering Profile ..............................................................................................78
Ordering Information ............................................................................. 79
10 Errata ....................................................................................................... 80
10.1
10.2
10.3
Rev. C ..............................................................................................................80
Rev. B ..............................................................................................................82
Rev. A ..............................................................................................................86
11 Datasheet Revision History .................................................................. 93
11.1
11.2
Rev. B – 01/2012 .............................................................................................93
Rev. A – 12/2011 .............................................................................................93
Table of Contents....................................................................................... i
ii
32145BS–01/2012
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